Wafer structure

By setting the test element group at least partially in the cross region in the wafer structure and adjusting its shape and size according to the width of the cutting channel, the TEG residue problem is solved, and smaller cutting residues and better product electrical properties are achieved.

CN222637274UActive Publication Date: 2025-03-18CHIPMORE TECH CORP LTD +1
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Patent Information

Application Number
CN202421290768.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-06
Publication Date
2025-03-18
Estimated Expiration
2034-06-06

AI Technical Summary

Technical Problem

In the prior art, the shape of the TEG is rectangular. When the width of the cutting path is smaller than the width of the TEG, there will be a large area of ​​TEG residue, which may lead to poor electrical properties of the product.

Method used

A wafer structure is designed in which the test element set is at least partially completely within a cross region formed by the junction position of the first cutting path and the second cutting path. The test element set can be round, rhombus or triangular in shape and its size can be adapted to the width of the cutting path to ensure complete removal.

Benefits of technology

By placing the test element group in the junction area of ​​the cutting channel, even if its size is larger than the size of the cutting channel, the cutting residue of TEG can be minimized and the product electrical properties can be improved.

✦ Generated by Eureka AI based on patent content.
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Abstract

The utility model provides a wafer structure, which comprises a wafer body, a plurality of crystal grain areas arranged in a matrix shape and cutting areas located among the plurality of crystal grain areas, the cutting areas are internally provided with first cutting channels and second cutting channels perpendicular to the first cutting channels, and the second cutting channels are provided with second cutting channels perpendicular to the second cutting channels. A cross area is formed at the junction position of the first cutting channel and the second cutting channel; and the plurality of test element groups are positioned in the cutting area, and at least part of the test element groups are completely positioned in the cross area. According to the utility model, a part of the test element group is arranged in the junction area of the cutting channels, so that even if the size of the test element group is larger than that of the cutting channels, the test element group can be completely cut off, and the cutting residue of the test element group is reduced to the greatest extent.
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