Independent crimping type buffer loop structure and power valve string

Abstract

The utility model discloses an independent crimping type buffer loop structure and a power valve string. The independent crimping type buffer loop structure comprises a power device, a heat dissipation cushion block, a press-fitting plate, a crimping type diode, a capacitor and a resistor, wherein the crimping type diode is of a single independent crimping structure; the power device is connected with the first heat dissipation cushion block; the crimping type diode is arranged between the press-fitting plate and the first heat dissipation cushion block; the capacitor is arranged on one side of the first heat dissipation cushion block, and the positive and negative electrodes of the capacitor are connected with the first heat dissipation cushion block through flat busbars; the resistor is arranged on the surface of the first heat dissipation cushion block and is electrically connected through the connecting busbar. The power valve string comprises supporting plates, a disc spring assembly, a traction rod and the buffering loop structure, the supporting plates, the disc spring assembly and the buffering loop structure are arranged in series, and the traction rod is located between the supporting plates at the two ends to achieve traction of the supporting plates at the two ends. The crimping type buffer loop structure is designed in a modularized mode, the requirement for large current passing through a power valve string is met, layout is reasonable, the structure is compact, overhaul and maintenance are convenient, and reliability is high.

Description

Technical Field

[0001] The utility model belongs to the field of power electronics, and particularly relates to an independent compression-connected buffer circuit structure and a power valve string. Background Art

[0002] In recent years, with the rapid development of power electronics technology, the voltage level of DC transmission has become higher and higher, and the demand for high-power devices has also increased year by year. The crimped power valve string has the advantages of strong flow capacity and compact structure, and is widely used in high-voltage and ultra-high-voltage fields. However, for the power valve string with buffer circuit, due to the large number of electronic components, there are still problems such as unreasonable layout of electronic components, low space utilization, and difficult maintenance.

[0003] Traditional power valve strings with buffer circuits mostly use a method of independently crimping crimped power devices and crimped diodes into strings, and multiple power devices share a large-capacity capacitor, which occupies a large overall space. The valve string must be disassembled as a whole to inspect and replace a single power device and crimped diode, which makes inspection and maintenance difficult. Once the capacitor is damaged, the entire valve string will not work normally, and the reliability is poor.

[0004] Therefore, it is necessary to develop a buffer circuit structure and a power valve string that are compact, easy to repair and maintain, and highly reliable, so as to ensure the overall operation of the power valve string. Utility Model Content

[0005] The utility model provides an independent crimping type buffer circuit structure and a power valve string. By modularizing the crimping type buffer circuit structure, the power valve string can pass a large current while having a reasonable layout, a compact structure, convenient repair and maintenance, and high reliability.

[0006] To achieve the above technical objectives and the above technical effects, the present invention is implemented through the following technical solutions:

[0007] The first aspect of the utility model provides an independent crimping buffer circuit structure,

[0008] It includes a power device, a first heat sink, a press-fit plate, a press-fit diode, a capacitor and a resistor;

[0009] Wherein, the crimping diode is a single independent crimping structure;

[0010] The power device is connected to the first heat dissipation pad; the press-fit diode is arranged between the press-fit plate and the first heat dissipation pad; the capacitor is arranged on one side of the first heat dissipation pad, and its positive and negative poles are respectively connected to the first heat dissipation pad through a flat busbar; the resistor is arranged on the surface of the first heat dissipation pad, and is electrically connected by connecting the busbar.

[0011] In a possible implementation, it also includes an insulating bolt, the press-fit plate is provided with through holes distributed around the press-fit diode, the first heat dissipation pad is provided with threaded holes at positions corresponding to the through holes, the insulating bolt is perpendicular to the press-fit plate, passes through the through holes of the press-fit plate and is connected to the threaded holes of the first heat dissipation pad;

[0012] The insulating bolts, the pressing plate and the first heat dissipation pad form a pressing frame which provides pressing force for the pressing diode.

[0013] In a possible implementation, the capacitor is a flat structure, there is at least one capacitor, and the thickness does not exceed the total thickness of the first heat dissipation pad and the power device.

[0014] In a possible implementation, the positive and negative leads of the capacitor are in a flat row structure, the lead direction is perpendicular to the narrow side of the capacitor facing the power device, and the flat row structure adopts an up-and-down staggered structure.

[0015] In a possible implementation, the first heat dissipation pad is provided with a positioning hole, and the positioning hole is installed with a positioning pin for providing positioning when installing a power device and a press-fit diode.

[0016] The heat dissipation pad is provided with a step surface, and the press-fit diode and the resistor are provided on the lower step surface of the first heat dissipation pad.

[0017] A weight-reducing heat dissipation hole is provided in the middle of the first heat dissipation pad, which runs through the middle and the middle, thereby reducing the weight and improving the heat dissipation effect.

[0018] The power devices include: press-fit IGBT, IGCT and diode.

[0019] The first heat dissipation pad is a second heat dissipation pad and a mounting back plate structure that are independent of each other. The press-fit diode is independently clamped and pressed by a press-fit plate and a mounting back plate. The mounting back plate is fixedly connected to the second heat dissipation pad via a fixed connector.

[0020] The second aspect of the utility model also proposes a multi-stage series power valve string, including a support plate, a disc spring assembly, a traction rod and the above-mentioned independent crimped buffer circuit structure, the support plate, the disc spring assembly and multiple independent crimped buffer circuit structures are arranged in series, and the traction rod is arranged between the support plates at both ends to achieve traction of the support plates at both ends.

[0021] After adopting the above technical structure, compared with the prior art, the beneficial effects of the utility model are as follows:

[0022] (1) The overall thickness of the buffer circuit structure does not exceed the total thickness of the power device and the heat sink, with high space utilization and compact structure, thereby achieving miniaturization of the power valve string;

[0023] (2) Modular design is adopted, and the assembly and maintenance process is simple;

[0024] (3) Unlike the structure of crimping multiple diodes into a string in the prior art, the crimped diodes of each level of the buffer circuit structure of the utility model are independent of each other, which can realize the individual replacement of the components and simplify the inspection and maintenance process;

[0025] (4) Each level of the buffer circuit structure is independently configured with capacitors. The damage of a single capacitor has little impact on the overall performance, thereby improving the overall reliability of the power valve string. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the structure of an independent crimping buffer circuit according to an embodiment of the utility model;

[0027] Figure 2 An exploded view of an independent crimping buffer circuit structure of an embodiment of the utility model;

[0028] Figure 3 This is a schematic diagram of the structure of a power valve string according to an embodiment of the utility model;

[0029] Figure 4 This is a schematic diagram of the structure of an independent crimping buffer circuit of another embodiment of the utility model;

[0030] Figure 5 The following are electrical topology diagrams of two embodiments of the present utility model.

[0031] Description of Figure Numbers:

[0032] 101: power device; 102: first heat sink; 103: positioning pin; 104: press-fit plate; 105: flat busbar; 106: capacitor;

[0033] 201: Insulation bolt; 202: Positioning hole; 203: Connecting busbar; 204: Press-fit diode; 205: Resistor;

[0034] 301: support plate; 302: disc spring assembly; 303: traction rod; 304: crimping buffer loop structure; 401: second heat dissipation pad; 402: mounting back plate; 403: fixed connector. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. The embodiments described in this application are only embodiments of a part of the utility model, not all embodiments. Based on the spirit of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the protection scope of the utility model.

[0036] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0037] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0038] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] Example 1

[0040] Figure 1 and Figure 2 The figure shows a schematic diagram and an exploded diagram of an independent press-fit buffer circuit structure provided by Example 1 of the utility model, including a power device 101, a first heat sink 102, a press-fit plate 104, a flat busbar 105, a capacitor 106, an insulating bolt 201, a connecting busbar 203, a press-fit diode 204, and a resistor 205.

[0041] In this embodiment, one side of the power device 101 is bonded to the surface of the first heat dissipation pad 102, and conductive silicone grease is applied to the bonding surface of the power device 101. In addition, the first heat dissipation pad 102 is provided with positioning holes 202 at corresponding positions, which are respectively located at the gravity bottom and both sides of the corresponding positions of the power device 101, and positioning pins 103 are installed to position the power device 101.

[0042] In the present embodiment, the crimping diode 204 is a single independent crimping structure; the crimping plate 104 and the first heat dissipation pad 102 sandwich the crimping diode 204, wherein the corresponding position of the crimping plate 104 is provided with a positioning hole, and the crimping diode 204 is positioned by the positioning pin 103; the crimping plate 104 is provided with 4 through holes, which are distributed around the crimping diode 204, and the first heat dissipation pad 102 is provided with a threaded hole at the corresponding position of the through hole, and the insulating bolt 201 passes through the through hole on the crimping plate 104 and is connected to the threaded hole of the first heat dissipation pad 102; the insulating bolt 201, the crimping plate 104, the crimping diode 204 and the first heat dissipation pad 102 form a crimping frame and provide the crimping force required for the crimping diode 204, specifically, by applying a torque to the insulating bolt 201, the crimping force is applied to the crimping diode 204;

[0043] In this embodiment, the capacitor 106 is a flat structure, the thickness of which does not exceed the total thickness of the heat sink and the power device, the positive and negative electrode output lines adopt a flat row structure, the output line direction is perpendicular to the narrow side of the capacitor facing the power device, and the positive and negative electrode output line flat row structure adopts an upper and lower staggered arrangement, and the positive and negative electrodes of the capacitor 106 are respectively connected to the two adjacent first heat sinks 102 through a flat busbar 105 to form an electrical connection;

[0044] In this embodiment, a plurality of resistors 205 are fixed to the surface of the first heat dissipation pad 102 by screws, and are electrically connected by a plurality of connecting busbars 203;

[0045] In this embodiment, the first heat dissipation pad 102 is provided with a step surface, and the press-fit diode 204 and the resistor 205 are placed on the lower step surface, thereby making full use of the space and making the structure more compact;

[0046] In this embodiment, the first heat dissipation pad 102 is provided with weight-reducing heat dissipation holes penetrating from top to bottom;

[0047] In this embodiment, the power device 101 includes but is not limited to: a press-fit IGBT, an IGCT, and a diode.

[0048] like Figure 3 As shown, the utility model also proposes a multi-stage series power valve string, including a support plate 301, a disc spring assembly 302, a traction rod 303 and the above-mentioned independent crimped buffer circuit structure 304, the support plate 301, the disc spring assembly 302 and the plurality of buffer circuit structures 303 are arranged in series, and the traction rod 303 is located between the support plates 301 at both ends to achieve traction of the support plates 301 at both ends.

[0049] The specific installation process of the independent compression-type buffer circuit structure and the power valve string described in the above embodiment is as follows:

[0050] (1) Apply conductive silicone grease to both sides of the crimped diode 204, install the positioning pins 103 in the corresponding positioning holes of the first heat sink 102, and then fit the crimped diode 204 to the surface of the first heat sink 102 after being positioned by the positioning pins 103, fit the press-fit plate 104 to the other side of the crimped diode 204, fix the press-fit plate 104 to the heat sink 102 by the insulating bolts 201, and apply the required torque;

[0051] (2) fixing a plurality of resistors 205 to the first heat dissipation pad 102 by screws, and installing a plurality of connecting busbars 203 between the plurality of resistors 205 and between the resistors 205 and the first heat dissipation pad 102 to achieve electrical connection according to the electrical topology;

[0052] (3) placing the capacitor 106 on one side of the first heat sink 102, installing flat busbars 105 on the input and output lines of the capacitor 106, and fixing the other end of one of the flat busbars 105 to the corresponding position of the first heat sink 102 by screws;

[0053] (4) Apply conductive silicone grease to both sides of the power device 101, install positioning pins 103 in the corresponding positioning holes of the first heat dissipation pad 102, and then position the power device 101 through the positioning pins 103 and fit it on the surface of the first heat dissipation pad 102;

[0054] (5) Place the two end support plates 301 on the installation tool and Figure 3The positional relationship of each device on the upper side is determined by sequentially placing the disc spring assembly 302 and a plurality of the above-assembled buffer circuit structures between the two end support plates 301, so that there is a power device 101 between the adjacent first heat dissipation pads 102, placing the traction rod between the two end support rods 301, and installing bolts to fix them, forming a preliminary multi-stage series power valve string, and then using a tool to apply a press force to the valve string;

[0055] (6) Another flat busbar connected to the capacitor 106 is fixed to the adjacent first heat dissipation pad 102 by screws.

[0056] Example 2

[0057] like Figure 4 As shown, the difference from Example 1 is that the first heat dissipation pad 102 is divided into two parts: a second heat dissipation pad 401 and a mounting back plate 402. The mounting back plate 402 is provided with threaded holes, and the press-fit plate 104 is connected to the mounting back plate 402 through insulating bolts 201, and the press-fit diode 204 is sandwiched in the middle;

[0058] In this embodiment, the capacitor 106 is connected to two adjacent mounting back plates 402 through the flat busbar 105 to form an electrical connection;

[0059] In this embodiment, a plurality of resistors 205 are fixed to the surface of the mounting back plate 402 by screws;

[0060] In this embodiment, the mounting back plate 402 and the second heat dissipation pad 401 are fixedly connected via a connecting fixture 403 .

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model is described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the utility model can still be modified or replaced by equivalents, and any modifications or equivalent replacements that do not depart from the spirit and scope of the utility model should be included in the scope of protection of the claims of the utility model.

Claims

1. An independent crimping buffer circuit structure, characterized in that: It comprises a power device (101), a first heat dissipation pad (102), a press-fit plate (104), a press-fit diode (204), a capacitor (106) and a resistor (205); Wherein, the crimping diode (204) is a single independent crimping structure; The power device (101) is connected to a first heat dissipation pad (102); the press-fit diode (204) is arranged between the press-fit plate (104) and the first heat dissipation pad (102); the capacitor (106) is arranged on one side of the first heat dissipation pad (102), and its positive and negative electrodes are respectively connected to the first heat dissipation pad (102) through a flat busbar (105); the resistor (205) is arranged on the surface of the first heat dissipation pad (102), and is electrically connected through a connecting busbar (203).

2. The independent crimping buffer circuit structure according to claim 1, characterized in that: It also includes an insulating bolt (201); the pressing plate (104) is provided with through holes distributed around the pressing diode (204); the first heat dissipation pad (102) is provided with threaded holes at positions corresponding to the through holes; the insulating bolt (201) is perpendicular to the pressing plate (104), passes through the through holes of the pressing plate (104) and is connected to the threaded holes of the first heat dissipation pad (102); The insulating bolts (201), the pressing plate (104) and the first heat dissipation pad (102) form a pressing frame that provides a pressing force for the pressing diode (204).

3. The independent crimping buffer circuit structure according to claim 1, characterized in that: The capacitor (106) is a flat structure, with at least one capacitor and a thickness not exceeding the total thickness of the first heat dissipation pad (102) and the power device (101).

4. The independent crimping buffer circuit structure according to claim 1, characterized in that: The positive and negative electrode output wires of the capacitor (106) are in a flat row structure, the output wire direction is perpendicular to the narrow side of the capacitor (106) facing the power device (101), and the flat row structure adopts an up-and-down staggered structure.

5. The independent crimping buffer circuit structure according to claim 1, characterized in that: The first heat dissipation pad (102) is provided with a positioning hole, and a positioning pin (103) is installed in the positioning hole.

6. The independent crimping buffer circuit structure according to claim 1, characterized in that: The first heat dissipation pad (102) is provided with a step surface, and the press-fit diode (204) and the resistor (205) are provided on the lower step surface of the first heat dissipation pad (102).

7. The independent crimping buffer circuit structure according to claim 1, characterized in that: A weight-reducing heat dissipation hole is provided in the middle of the first heat dissipation pad (102) and runs through the middle.

8. The independent crimping buffer circuit structure according to claim 1, characterized in that: The power device (101) comprises: a press-fit IGBT, an IGCT and / or a diode.

9. The independent crimping buffer circuit structure according to claim 1, characterized in that: The first heat dissipation pad (102) is a second heat dissipation pad (401) and a mounting back plate (402) structure that are independent of each other; the press-fit diode (204) is independently clamped and press-fitted by the pressing plate (104) and the mounting back plate (402); and the mounting back plate (402) is fixedly connected to the second heat dissipation pad (401) via a fixed connector (403).

10. A power valve train, characterized in that: It comprises a support plate (301), a disc spring assembly (302), a traction rod (303) and an independent crimping buffer circuit structure as described in any one of claims 1 to 9; The support plate (301), the disc spring assembly (302) and a plurality of independent crimp-type buffer loop structures are arranged in series, and the traction rod (303) is arranged between the support plates (301) at both ends.

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