Camera module and electronic equipment

Abstract

A camera module comprises a circuit board which comprises a substrate and at least one electronic component, the substrate is provided with a front face and a back face which are opposite to each other, and the at least one electronic component is arranged on the back face and electrically connected with the substrate; the photosensitive chip is arranged on the front surface and is electrically connected with the substrate; the molding part comprises a first molding part and a second molding part, the first molding part is arranged on the back surface and packages at least one electronic component, and the second molding part is arranged on the front surface and packages at least part of the non-photosensitive area of the photosensitive chip; the supporting piece is arranged on the side, away from the substrate, of the second molding part, an avoiding hole is formed in the supporting piece, and the avoiding hole is formed corresponding to the photosensitive area of the photosensitive chip; the light filtering piece is arranged in the avoiding hole and is connected with the supporting piece; and the lens is arranged at one end, far away from the second molding part, of the supporting piece and is arranged corresponding to the photosensitive area of the photosensitive chip. The camera module is thin in thickness and small in size, and the imaging quality can be guaranteed. The embodiment of the utility model further provides electronic equipment.

Description

Technical Field

[0001] The present application relates to the technical field of camera devices, and in particular to a camera module and electronic equipment. Background Art

[0002] At present, electronic devices are increasingly developing towards intelligence and thinness, which puts forward more stringent requirements on the size and imaging quality of camera modules, which are one of the standard configurations of electronic devices. In order to meet the development trend of intelligence and thinness of electronic devices, it is necessary to configure the camera module with a photosensitive element with a larger photosensitive area and a larger number of electronic components, which will undoubtedly increase the size of the camera module, which is not conducive to the thinness of electronic devices. Utility Model Content

[0003] In view of the above, it is necessary to propose a camera module and an electronic device to reduce the size of the camera module and improve the imaging quality.

[0004] An embodiment of the present application provides a camera module, comprising: a circuit board, comprising a substrate and at least one electronic component, the substrate having a relative front and back side, at least one of the electronic components being arranged on the back side and electrically connected to the substrate; a photosensitive chip, being arranged on the front side and electrically connected to the substrate; a molding, comprising a first molding portion and a second molding portion, the first molding portion being arranged on the back side and encapsulating at least one of the electronic components, the second molding portion being arranged on the front side and encapsulating at least part of a non-photosensitive area of ​​the photosensitive chip; a support member, being arranged on a side of the second molding portion away from the substrate, a avoidance hole being formed on the support member, the avoidance hole being arranged corresponding to the photosensitive area of ​​the photosensitive chip; a filter member, being arranged in the avoidance hole and connected to the support member; a lens, being arranged at one end of the support member away from the second molding portion, and being arranged corresponding to the photosensitive area of ​​the photosensitive chip.

[0005] In the above-mentioned camera module, since the photosensitive chip and the electronic components are respectively arranged on the front and back of the substrate, a photosensitive chip with a large photosensitive area and a large number of electronic components can be configured, thereby ensuring the imaging quality. In addition, the filter is arranged in the avoidance hole of the support member and connected to the support member, which can make the camera module thinner and smaller in size, which is conducive to the thinness of electronic equipment.

[0006] In some embodiments, the support member includes a connecting portion, two ends of which are respectively connected to the second molding portion and the lens, the avoidance hole is opened in the connecting portion, and the filter is connected to a hole wall of the avoidance hole.

[0007] In this way, the filter is arranged in the avoidance hole and connected to the connecting part, which can make the thickness of the camera module thinner and reduce the size of the camera module, which is conducive to the lightweight and thinning of the electronic equipment.

[0008] In some embodiments, the supporting member includes a connecting portion and an extending portion, one end of the connecting portion is connected to the second molded portion, the other end of the connecting portion extends back to the second molded portion and is connected to one end of the extending portion, the other end of the extending portion extends toward the optical axis of the lens, the avoidance hole is provided in the connecting portion and the extending portion, and the filter is connected to a side of the extending portion close to the second molded portion.

[0009] In this way, the filter is arranged in the avoidance hole and connected to the extension part, the installation of the filter is more convenient, and the thickness of the camera module can be made thinner, the size of the camera module can be reduced, and it is conducive to the lightweight and thinning of the electronic equipment.

[0010] In some embodiments, the filter element abuts against an inner side wall of the connecting portion.

[0011] In this way, the connection portion can limit the position of the filter and prevent the filter from shaking.

[0012] In some embodiments, the camera module further includes a first adhesive member connected between the connecting portion and the second molding portion.

[0013] In this way, the connecting part and the second molded part can be connected by bonding, which is simple to operate, low in cost, and has high connection stability.

[0014] In some embodiments, the camera module also includes a second adhesive member connected between the extension portion and the lens.

[0015] In this way, the extension part and the lens can be connected by bonding, which is simple to operate, low in cost, and has high connection stability.

[0016] In some embodiments, the camera module further includes a third adhesive component, wherein the third adhesive component is connected between the support component and the filter component.

[0017] In this way, the support member and the filter member can be connected by bonding, which is simple to operate, low in cost, and has high connection stability.

[0018] In some embodiments, the camera module further includes a conductive component, two ends of which are respectively connected to the photosensitive chip and the substrate so that the photosensitive chip and the substrate are electrically connected, and the second molding part encapsulates the conductive component.

[0019] In this way, the electrical connection between the photosensitive chip and the substrate can be achieved, and the second molding part encapsulates the conductive part, and the conductive part has better fixation.

[0020] In some embodiments, the filter element and the photosensitive chip are arranged in parallel.

[0021] In this way, the consistency of the filtering effect of the filter can be ensured, thereby ensuring the imaging quality of the camera module.

[0022] An embodiment of the present application also provides an electronic device, comprising a main body and the camera module as described above, wherein the camera module is disposed in the main body.

[0023] The electronic device includes a camera module. Since the photosensitive chip and electronic components in the camera module are respectively arranged on the front and back of the substrate, a photosensitive chip with a large photosensitive area and a large number of electronic components can be configured, thereby ensuring the imaging quality. In addition, the filter is arranged in the avoidance hole of the support and connected to the support, which can make the camera module thinner and smaller in size, which is conducive to the thinness of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of an electronic device proposed in one embodiment of the present application.

[0025] Figure 2 yes Figure 1 A schematic diagram of the three-dimensional structure of the camera module in the electronic device shown.

[0026] Figure 3 yes Figure 2 The cross-sectional structure diagram of the camera module along line AA is shown.

[0027] Figure 4 It is a schematic diagram of the cross-sectional structure of a camera module along line AA proposed in another embodiment of the present application.

[0028] Figure 5 This is a schematic diagram of the cross-sectional structure of a camera module along line AA proposed in another embodiment of the present application.

[0029] Main component symbols

[0030] Electronic devices 100

[0031] Body 10

[0032] Camera module 20

[0033] Circuit board 21

[0034] Substrate 211

[0035] Front

[0036] Back

[0037] Electronic components 212

[0038] Connector 213

[0039] Photosensitive chip 22

[0040] Molding 23

[0041] First molding part 231

[0042] Second molding part 232

[0043] Support 24

[0044] Avoidance hole 241

[0045] Connection part 242

[0046] Extension 243

[0047] Filter 25

[0048] Shot 26

[0049] First adhesive member 27

[0050] Second adhesive member 28

[0051] The third adhesive member 29

[0052] Conductive parts 31 DETAILED DESCRIPTION

[0053] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0054] The embodiments of the present application are further described below in conjunction with the accompanying drawings.

[0055] See also Figure 1 The embodiment of the present application provides an electronic device 100, including a body 10 and a camera module 20, wherein the camera module 20 is disposed in the body 10. The electronic device 100 may be a tablet computer, an electronic paper reader, an MP3 / 4 / 5, a personal digital assistant, a camera, a television, a washing machine, a refrigerator, etc.

[0056] See also Figure 2 and Figure 3The camera module 20 includes a circuit board 21, a photosensitive chip 22, a molding 23, a support 24, a filter 25 and a lens 26. The circuit board 21 includes a substrate 211 and at least one electronic component 212, the substrate 211 has a front side 2111 and a back side 2112 opposite to each other, at least one electronic component 212 is arranged on the back side 2112 and is electrically connected to the substrate 211. The photosensitive chip 22 is arranged on the front side 2111 and is electrically connected to the substrate 211. The molding 23 includes a first molding part 231 and a second molding part 232, the first molding part 231 is arranged on the back side 2112 and encapsulates at least one electronic component 212, and the second molding part 232 is arranged on the front side 2111 and encapsulates at least part of the non-photosensitive area of ​​the photosensitive chip 22. The support member 24 is disposed on a side of the second molding part 232 away from the substrate 211, and a avoidance hole 241 is provided on the support member 24, and the avoidance hole 241 is arranged corresponding to the photosensitive area of ​​the photosensitive chip 22. The filter 25 is arranged in the avoidance hole 241 and connected to the support member 24. The lens 26 is arranged at one end of the support member 24 away from the second molding part 232, and is arranged corresponding to the photosensitive area of ​​the photosensitive chip 22.

[0057] In this embodiment, the filter 25 can filter the stray light in the light entering the interior of the camera module 20 from the lens 26. In this way, the imaging quality of the camera module 20 can be improved. It is worth mentioning that the type of the filter 25 is not limited in the camera module 20 of the present utility model. For example, the filter 25 can be but not limited to an infrared cutoff filter, a visible spectrum filter, etc. The first molding part 231 and the second molding part 232 are both cured packaging resins (Epoxy Molding Compound). The electronic components 212 include components such as resistors, capacitors, and driver ICs, and the electronic components 212 are arranged at one end of the substrate 211, and a connector 213 is provided at the other end of the substrate 211. The lens 26 is a periscope lens 26, but is not limited to this.

[0058] Please continue to see Figure 3 In some embodiments, the support member 24 includes a connecting portion 242, which is a plate-like structure. The two ends of the connecting portion 242 are respectively connected to the second molded portion 232 and the lens 26. The avoidance hole 241 is opened in the connecting portion 242. At this time, the avoidance hole 241 is a rectangular through hole. The filter 25 is connected to the hole wall of the avoidance hole 241, for example, by an adhesive (not shown). In this way, the filter 25 is arranged in the avoidance hole 241 and connected to the connecting portion 242, which can make the thickness of the camera module 20 thinner, reduce the size of the camera module 20, and facilitate the thinness of the electronic device 100.

[0059] See also Figure 4In some embodiments, the support member 24 includes a connecting portion 242 and an extending portion 243, one end of the connecting portion 242 is connected to the second molded portion 232, the other end of the connecting portion 242 extends away from the second molded portion 232 and is connected to one end of the extending portion 243, and the other end of the extending portion 243 extends toward the optical axis of the lens 26, that is, the connecting portion 242 is vertically arranged with the second molded portion 232, and the extending portion 243 is vertically arranged with the optical axis of the lens 26, and the avoidance hole 241 is opened in the connecting portion 242 and the extending portion 243. At this time, the avoidance hole 241 is an inverted T-shaped through hole, and the filter 25 is connected to the side of the extending portion 243 close to the second molded portion 232, for example, it can be connected by an adhesive (not shown). In this way, the filter 25 is arranged in the avoidance hole 241 and connected to the extension part 243. The filter 25 is convenient to install and can make the thickness of the camera module 20 thinner, reduce the size of the camera module 20, and is conducive to the lightweight electronic device 100.

[0060] For further information, see Figure 5 , the filter 25 abuts against the inner side wall of the connecting portion 242. In this way, the connecting portion 242 can limit the position of the filter 25 and prevent the filter 25 from shaking.

[0061] Please continue to see Figure 5 In some embodiments, the camera module 20 further includes a first adhesive member 27, and the first adhesive member 27 is connected between the connecting portion 242 and the second molded portion 232. In this embodiment, the first adhesive member 27 is a connecting layer formed by an adhesive. In this way, the connecting portion 242 and the second molded portion 232 can be connected by using an adhesive method, which is simple to operate, low in cost, and has a high connection stability.

[0062] In some embodiments, the camera module 20 further includes a second adhesive member 28, which is connected between the extension portion 243 and the lens 26. In this embodiment, the second adhesive member 28 is a connection layer formed by an adhesive. In this way, the extension portion 243 and the lens 26 can be connected by using an adhesive, which is simple to operate, low in cost, and has a high connection stability.

[0063] In some embodiments, the camera module 20 further includes a third adhesive member 29, which is connected between the support member 24 and the filter member 25. In the present embodiment, the third adhesive member 29 is a connection layer formed by an adhesive, and the third adhesive member 29 is connected between the filter member 25 and the connection portion 242. It is understood that in other embodiments, the third adhesive member 29 is connected between the filter member 25 and the extension portion 243. It is understood that in other embodiments, the third adhesive member 29 is connected between the filter member 25 and the extension portion 243, and between the filter member 25 and the connection portion 242. In this way, the support member 24 and the filter member 25 can be connected by using an adhesive method, which is simple to operate, low in cost, and has high connection stability.

[0064] In some embodiments, the camera module 20 further includes a conductive member 31, the two ends of which are respectively connected to the photosensitive chip 22 and the substrate 211, so that the photosensitive chip 22 and the substrate 211 are electrically connected, and the second molding part 232 encapsulates the conductive member 31. In this embodiment, the conductive member 31 is a gold wire. In this way, the electrical connection between the photosensitive chip 22 and the substrate 211 can be achieved, and the second molding part 232 encapsulates the conductive member 31, and the fixation of the conductive member 31 is better.

[0065] In some embodiments, the filter 25 and the photosensitive chip 22 are arranged in parallel, so that the consistency of the filtering effect of the filter 25 can be ensured, thereby ensuring the imaging quality of the camera module 20.

[0066] The electronic device 100 of the embodiment of the present application includes a camera module 20. Since the photosensitive chip 22 and the electronic components 212 in the camera module 20 are respectively arranged on the front 2111 of the substrate 211 and the back 2112 of the substrate 211, a photosensitive chip 22 with a large photosensitive area and a large number of electronic components 212 can be configured, thereby ensuring the imaging quality. In addition, the filter 25 is arranged in the avoidance hole 241 of the support member 24 and connected to the support member 24, which can make the camera module 20 thinner and smaller in size, which is conducive to the thinness of the electronic device 100.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A camera module, characterized in that: include: A circuit board, comprising a substrate and at least one electronic component, wherein the substrate has a front side and a back side opposite to each other, and the at least one electronic component is arranged on the back side and is electrically connected to the substrate; A photosensitive chip, disposed on the front surface and electrically connected to the substrate; A molding, comprising a first molding part and a second molding part, wherein the first molding part is arranged on the back side and encapsulates at least one of the electronic components, and the second molding part is arranged on the front side and encapsulates at least a part of the non-photosensitive area of ​​the photosensitive chip; A support member is provided on a side of the second molding part away from the substrate, and a avoidance hole is provided on the support member, and the avoidance hole is provided corresponding to the photosensitive area of ​​the photosensitive chip; A filter element, disposed in the avoidance hole and connected to the support element; The lens is arranged at one end of the support member away from the second molding portion and is arranged corresponding to the photosensitive area of ​​the photosensitive chip.

2. The camera module according to claim 1, characterized in that: The support member comprises a connecting portion, two ends of which are respectively connected to the second molding portion and the lens, the avoidance hole is provided in the connecting portion, and the filter is connected to a hole wall of the avoidance hole.

3. The camera module according to claim 1, characterized in that: The supporting member includes a connecting portion and an extending portion, one end of the connecting portion is connected to the second molded portion, the other end of the connecting portion extends away from the second molded portion and is connected to one end of the extending portion, the other end of the extending portion extends toward the optical axis of the lens, the avoidance hole is provided in the connecting portion and the extending portion, and the filter is connected to a side of the extending portion close to the second molded portion.

4. The camera module according to claim 3, characterized in that: The filter element abuts against the inner side wall of the connecting portion.

5. The camera module according to any one of claims 2 to 4, characterized in that: The camera module also includes a first adhesive member connected between the connecting portion and the second molding portion.

6. The camera module according to claim 3, characterized in that: The camera module also includes a second adhesive member, which is connected between the extension portion and the lens.

7. The camera module according to claim 1, wherein: The camera module also includes a third adhesive component, which is connected between the support component and the filter component.

8. The camera module according to claim 1, wherein: The camera module also includes a conductive component, two ends of which are respectively connected to the photosensitive chip and the substrate to electrically connect the photosensitive chip and the substrate, and the second molding part encapsulates the conductive component.

9. The camera module according to claim 1, characterized in that: The optical filter and the photosensitive chip are arranged in parallel.

10. An electronic device, characterized in that: It comprises a main body and a camera module as described in any one of claims 1 to 9, wherein the camera module is arranged in the main body.

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