Heat dissipation piece, heat dissipation device and electrical equipment

By opening a spoiler gap on the heat sink fins, the problems of low heat dissipation efficiency and overall bulkiness of existing air-cooled radiators are solved, and more efficient heat dissipation performance and weight reduction effects are achieved.

CN222638916UActive Publication Date: 2025-03-18GUANGZHOU MIDEA HUALING REFRIGERATOR
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Patent Information

Application Number
CN202420046310.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-08
Publication Date
2025-03-18
Estimated Expiration
2034-01-08

AI Technical Summary

Technical Problem

The heat dissipation fin structure of the existing air-cooled radiator is a flat panel structure, which leads to low heat dissipation efficiency and is not conducive to overall weight loss.

Method used

A spoiler gap is opened on the heat dissipation fins to improve the shape complexity of the surface of the heat dissipation fins, increase the heat exchange area with the cooling airflow, and enhance the impact on the surface of the fin through the spoiler effect, thereby improving the heat dissipation efficiency.

Benefits of technology

By opening the spoiler gap, the heat dissipation efficiency of the heat dissipation parts is significantly improved and the weight reduction effect on the heat dissipation parts is achieved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a heat dissipation piece, a heat dissipation device and electrical equipment, and relates to the technical field of electrical equipment. The heat dissipation piece comprises a heat dissipation substrate and a plurality of heat dissipation fins, wherein the heat dissipation substrate comprises a first surface and a second surface which are arranged oppositely; the plurality of radiating fins are mounted on the first surface and are arranged at intervals along a first direction, and the first direction is parallel to the first surface; and at least one of the plurality of radiating fins is provided with a turbulent flow gap. The turbulent flow gaps are formed in the heat dissipation fins, the shape complexity of the surfaces of the heat dissipation fins is improved, the heat exchange area of the heat dissipation fins and cooling airflow is increased, the flowing state and speed of the cooling airflow are changed, the heat dissipation efficiency of the heat dissipation piece can be improved, and meanwhile the heat dissipation efficiency of the heat dissipation piece is improved. And due to the arrangement of the turbulent flow gaps, a certain weight reduction effect can be achieved on the heat dissipation piece.
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Description

Technical Field

[0001] The utility model relates to the technical field of electrical equipment, and in particular to a heat sink, a heat sink device and electrical equipment. Background Art

[0002] This section merely provides background information related to the present disclosure and is not necessarily prior art.

[0003] Refrigerators and other electrical appliances generate a lot of heat during operation. In order to maintain the stability of the internal temperature of the appliance and maintain good working performance, the heat needs to be removed through a radiator.

[0004] Air-cooled radiator is a common heat dissipation device used to help electrical equipment effectively dissipate the heat generated. It is usually composed of a heat sink and a fan. The heat dissipation efficiency of the heat sink directly affects the heat dissipation performance of the heat dissipation device. How to improve the heat dissipation efficiency of the heat sink has always been a concern in the research and development of electrical equipment. Utility Model Content

[0005] The purpose of the utility model is to at least solve the problem of improving the heat dissipation efficiency of the heat sink. This purpose is achieved through the following technical solutions:

[0006] The first aspect of the utility model proposes a heat sink, comprising: a heat sink substrate, comprising a first surface and a second surface arranged opposite to each other; a plurality of heat sink fins, mounted on the first surface, and the plurality of heat sink fins are arranged at intervals along a first direction, and the first direction is parallel to the first surface; wherein at least one of the plurality of heat sink fins is provided with a spoiler gap.

[0007] According to the heat sink of the utility model, spoiler gaps are provided on the heat sink fins, which increases the shape complexity of the heat sink fin surface. When air cooling is performed, the heat exchange area between the heat sink fins and the cooling airflow is increased. At the same time, the cooling airflow changes its flow state and speed when passing through the spoiler gaps of the heat sink, thereby enhancing the impact on the fin surface. The impact can transfer the heat of the heat sink fins to the cooling airflow more quickly, thereby improving the heat dissipation efficiency of the heat sink. In addition, due to the provision of spoiler gaps, a certain weight reduction effect can also be achieved on the heat sink.

[0008] In addition, the heat sink according to the utility model may also have the following additional technical features:

[0009] In some embodiments of the utility model, each of the heat dissipation fins is provided with a plurality of the spoiler gaps, and the plurality of the spoiler gaps are arranged on the heat dissipation fins at intervals along a second direction, and the second direction is parallel to the first surface and intersects with the first direction.

[0010] In some embodiments of the utility model, the heat dissipation fin includes a third surface and a fourth surface arranged opposite to each other, and the spoiler gap runs through the third surface and the fourth surface; the heat dissipation fin is provided with a first side wall surface and a second side wall surface at the spoiler gap, the first side wall surface and the second side wall surface are arranged opposite to each other in the second direction, and the spoiler gap is formed between the first side wall surface and the second side wall surface; on a cross section parallel to the first surface, and in a direction from the third surface to the fourth surface, the distance between the first side wall surface and the center line of the heat dissipation fin gradually decreases, and / or the distance between the second side wall surface and the center line of the heat dissipation fin gradually decreases.

[0011] In some embodiments of the utility model, the first side wall surface is located on the side of the spoiler gap away from the center line of the heat dissipation fin, and the second side wall surface is located on the side of the spoiler gap close to the center line of the heat dissipation fin; the fourth surface is provided with a tip portion extending in a direction away from the third surface, and the surface on one side of the tip portion is coplanar with the first side wall surface.

[0012] In some embodiments of the present invention, along the direction from the third surface to the fourth surface, the distance between the first side wall surface and the second side wall surface gradually decreases.

[0013] In some embodiments of the present invention, the length direction of the spoiler gap is arranged along a third direction, and the third direction is perpendicular to the first direction and the second direction.

[0014] In some embodiments of the present invention, along the second direction, the size of the spoiler gap is smaller than or equal to the size of the heat dissipation fin between two adjacent spoiler gaps.

[0015] In some embodiments of the present invention, the heat dissipation fin has a first end and a second end arranged opposite to each other, the first end is away from the heat dissipation substrate, and the second end is connected to the heat dissipation substrate, the spoiler gap has a third end away from the heat dissipation substrate and a fourth end close to the heat dissipation substrate, the third end is spaced apart from the first end, and the fourth end is flush with or spaced apart from the second end.

[0016] A second aspect of the utility model provides a heat dissipation device, comprising a heat dissipation fan and a heat dissipation element as described in any one of the above technical solutions.

[0017] A third aspect of the utility model provides an electrical device, comprising the above-mentioned heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not to be considered as limiting the present invention. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0019] Figure 1 Schematically shows a front view of a heat sink according to an embodiment of the utility model;

[0020] Figure 2 Schematically shows a side view of a heat sink according to an embodiment of the utility model;

[0021] Figure 3 for Figure 2 AA cross section in;

[0022] Figure 4 for Figure 3 Enlarged view of part a.

[0023] The reference numerals are as follows:

[0024] 100. Heat dissipation components;

[0025] 10. heat dissipation substrate; 11. first surface; 12. second surface;

[0026] 20, heat dissipation fin; 21, spoiler gap; 211, first side wall surface; 212, second side wall surface; 213, third end; 214, fourth end; 22, third surface; 23, fourth surface; 231, tip; 24, center line; 25, first end; 26, second end;

[0027] 200, cooling fan;

[0028] 300, heat dissipation parts;

[0029] X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0030] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0031] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0032] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0033] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, then the elements described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or in other directions) and the spatial relative descriptors used in the text are interpreted accordingly.

[0034] Electrical equipment generates a lot of heat during operation. Take the refrigerator as an example. The refrigeration system inside the refrigerator transfers heat from the inside of the refrigerator to the external environment through compression, evaporation and other working principles to achieve the effect of refrigeration and freezing. At the same time, these working processes will also cause the refrigeration system itself to generate heat. In order to maintain the stability of the temperature inside the refrigerator and the good working effect, the refrigerator needs to effectively dissipate the generated heat. If the refrigerator cannot dissipate heat effectively, the heat will not be discharged in time, which will cause the temperature inside the refrigerator to rise, reduce the effect of refrigeration and freezing, and even affect the normal operation of the refrigerator. Therefore, heat dissipation is an important link to ensure the normal operation of electrical equipment such as refrigerators.

[0035] Most electrical appliances such as refrigerators dissipate heat through air-cooled radiators. The air-cooled radiator includes a shell and a cooling fan and a heat sink mounted on the shell. The heat sink generally includes an integrally connected heat sink substrate and multiple heat sink fins. The heat sink substrate is used to connect to the device to be cooled. The heat sink fins are used to absorb the heat of the heat sink substrate and bring the heat out of the electrical appliance through the cooling fan.

[0036] However, the existing heat dissipation fin structures are all flat plate structures, and their heat dissipation efficiency needs to be improved. In addition, this flat plate structure is not conducive to the overall weight reduction design of the air-cooled radiator, resulting in the radiator being too bulky.

[0037] In view of this, the present embodiment provides a heat sink, which aims to improve the heat dissipation efficiency and reduce weight at the same time by improving the heat dissipation fin structure and providing spoiler gaps on the heat dissipation fins.

[0038] The following is combined with Figure 1-4 The structure of the heat sink of this embodiment is introduced.

[0039] Figure 1 The figure schematically shows a front view of a heat sink according to an embodiment of the present utility model. Figure 2 The side view of the heat sink according to the embodiment of the utility model is schematically shown. The dashed arrow in the figure points to the airflow direction.

[0040] Combined with Figure 1 and attached Figure 2 As shown in the figure, this embodiment proposes a heat sink 100, which includes a heat sink substrate 10 and a plurality of heat sink fins 20. The heat sink substrate 10 of this embodiment includes a first surface 11 and a second surface 12 disposed opposite to each other, and the plurality of heat sink fins 20 are mounted on the first surface 11, and the plurality of heat sink fins 20 are arranged at intervals along a first direction X in the figure, and the first direction X is parallel to the first surface 11. At least one of the plurality of heat sink fins 20 is provided with a spoiler gap 21.

[0041] The heat dissipation substrate 10 and the heat dissipation fins 20 of this embodiment can be an integrally formed structure to improve processing efficiency, that is, the two are integrally formed by casting, forging, extrusion, mold injection molding, etc. Of course, the heat dissipation substrate 10 and the heat dissipation fins 20 of this embodiment can also be assembled together by welding, plugging, etc. to form an integral connection structure, and do not have to be integrally formed.

[0042] The heat dissipation substrate 10 of this embodiment has a first surface 11 and a second surface 12. The first surface 11 is used to connect the heat dissipation fins 20, and the second surface is used to connect the heat dissipation component 300. The heat dissipation component 300 can be a chip of an electrical device or other structure. The first surface 11 and the second surface 12 can be a plane, a curved surface, or an inclined surface with a certain inclination. The first surface 11 and the second surface 12 are parallel to each other. It should be noted that in this embodiment, "parallel" here and in the following text refers to the parallel or nearly parallel surfaces on which the two surfaces are located, and it is not necessarily parallel between two planes in a strict sense.

[0043] The heat dissipation substrate 10 and the heat dissipation fins 20 of this embodiment can both be in plate or block shape, and the materials of both can be metal or other materials with high heat transfer efficiency, such as alumina ceramics, graphite, etc., which are not listed one by one in this embodiment.

[0044] In order to improve heat dissipation efficiency and reduce weight, in this embodiment, at least one of the multiple heat dissipation fins 20 is provided with a spoiler gap 21, that is, a portion of the multiple heat dissipation fins 20 may be provided with spoiler gaps 21, or all of the heat dissipation fins 20 may be provided with spoiler gaps 21. The spoiler gap 21 runs through the two opposite surfaces of the heat dissipation fin 20, and the spoiler gap 21 may be formed by stamping, injection molding, or the like.

[0045] The provision of the spoiler gap 21 increases the shape complexity of the surface of the heat sink fin 20, and increases the heat exchange area between the heat sink fin 20 and the cooling airflow during air cooling. At the same time, the cooling airflow changes its flow state and speed when passing through the spoiler gap 21 of the heat sink 100, forming a spoiler effect, thereby enhancing the impact on the fin surface. The impact can transfer the heat of the heat sink fin 20 to the cooling airflow more quickly, thereby improving the heat dissipation efficiency of the heat sink 100. In addition, the provision of the spoiler gap 21 can also achieve a certain weight reduction effect on the heat sink 100.

[0046] Combined with the attachment again Figure 2 As shown in , in some examples, optionally, there are multiple spoiler gaps 21 on each heat sink fin 20 of this embodiment, and the multiple spoiler gaps 21 are arranged on the heat sink fin 20 at intervals along the second direction Y, and the second direction Y is parallel to the first surface 11 and intersects with the first direction X.

[0047] The plurality of spoiler gaps 21 may be arranged at intervals along the second direction Y as follows: Figure 2 In the structural form, the length direction of the spoiler slot 21 of this structural form is arranged along the third direction Z perpendicular to the second direction Y and the first direction X. Of course, the length direction of the spoiler slot 21 can also be arranged directly along the second direction Y (this embodiment is not shown in the figure).

[0048] The more the number of spoiler gaps 21, the more complex the shape of the surface of the heat sink fin 20 is, thereby expanding the heat exchange area between the heat sink fin 20 and the cooling airflow, improving the spoiler effect, and further improving the heat dissipation efficiency of the heat sink 100. Of course, too many spoiler gaps 21 will have a certain impact on the structural strength of the heat sink fin 20. Therefore, while ensuring that the heat sink fin 20 meets the designed structural strength, the number of spoiler gaps 21 can be increased as much as possible.

[0049] The second direction Y may be perpendicular or approximately perpendicular to the first direction X. The airflow flowing in the first direction X and the second direction Y may evenly enter between the plurality of heat dissipation fins 20 and may generate a turbulent effect through the turbulent gaps 21 .

[0050] In addition, in some embodiments, optionally, a plurality of spoiler gaps 21 can be evenly spaced along the second direction Y, that is, along the second direction Y, the spacing between each group of two adjacent spoiler gaps 21 is equal or approximately equal, so that when the airflow is blown into the heat sink fins 20, it can evenly enter the plurality of spoiler gaps 21, and then a uniform spoiler is formed by the plurality of spoiler gaps 21, so that the airflow has consistency and uniformity in heat exchange at various locations of the heat sink fins 20.

[0051] Figure 3 for Figure 2 AA cross-section diagram in Figure 4 for Figure 3 Enlarged view of part a. Figure 3 The dashed arrow in the figure also indicates the airflow direction.

[0052] Combined with Figure 3 and attached Figure 4 As shown in, in some examples, the heat dissipation fin 20 of the present embodiment includes a third surface 22 and a fourth surface 23 arranged back to back, and the spoiler gap 21 runs through the third surface 22 and the fourth surface 23; the heat dissipation fin 20 is provided with a first side wall surface 211 and a second side wall surface 212 at the spoiler gap 21, and the spoiler gap 21 is formed between the first side wall surface 211 and the second side wall surface 212; on a cross section parallel to the first surface 11 and in a direction from the third surface 22 to the fourth surface 23, the distance between the first side wall surface 211 and the center line 24 of the heat dissipation fin 20 gradually decreases, and / or the distance between the second side wall surface 212 and the center line 24 of the heat dissipation fin 20 gradually decreases.

[0053] The third surface 22 and the fourth surface 23 are two opposite surfaces of the heat dissipation fin 20 in the aforementioned first direction X. The third surface 22 can be understood as the windward surface of the heat dissipation fin 20 when dissipating heat, and the fourth surface 23 can be understood as the windward surface of the heat dissipation fin 20 when dissipating heat. The spoiler gap 21 can be opened in the heat dissipation fin 20 along the first direction X in the figure, so the spoiler gap 21 can pass through the third surface 22 and the fourth surface 23.

[0054] After the spoiler gap 21 is provided, the heat dissipation fin 20 has two side wall surfaces at each spoiler gap 21, namely, a first side wall surface 211 and a second side wall surface 212 which are arranged opposite to each other along the second direction Y. Therefore, it can be understood that the spoiler gap 21 is formed between the first side wall surface 211 and the second side wall surface 212, and the heat dissipation fin 20 is parallel to the first surface 11 along the cross section. Figure 3 As shown in , it can be seen that the distance between the first side wall surface 211 and the center line 24 of the heat dissipation fin 20 of this embodiment gradually decreases, and the distance between the second side wall surface 212 and the center line 24 of the heat dissipation fin 20 gradually decreases. In this way, the penetration direction of the spoiler gap 21 can be inclined toward the center line 24 of the heat dissipation fin 20. This design takes into account that when the heat dissipation element 100 cooperates with the heat dissipation fan 200, the airflow generated by the heat dissipation fan 200 is also as follows Figure 3 As shown by the arrows in the figure, the air flows from both sides of the heat sink 100 to the center line 24 of the heat sink 100. Therefore, when the spoiler gap 21 has a flow direction similar to that of the airflow, the airflow can evenly enter the spoiler gap 21 of the heat sink 100 for spoilering, and then concentrate to enter another adjacent heat sink 100. At this time, the airflow diffuses again, which can further improve the spoiler effect.

[0055] In some examples, optionally, the first side wall surface 211 of the present embodiment is located on the side of the spoiler gap 21 away from the center line 24 of the heat sink fin 20, and the second side wall surface 212 is located on the side of the spoiler gap 21 close to the center line 24 of the heat sink fin 20; the fourth surface 23 is provided with a tip portion 231 extending in a direction away from the third surface 22, and the surface on one side of the tip portion 231 is coplanar with the first side wall surface 211.

[0056] The tip portion 231 may be a tip structure formed directly from the material originally located at the spoiler gap 21 when the spoiler gap 21 is formed by stamping. Figure 3 and Figure 4 It can be seen from the cross section in that the tip portion 231 is also inclined toward the center line 24 of the heat sink fin 20. The tip portion 231 can extend the dimension of the first side wall surface 211 in the first direction X. The presence of the tip portion 231 can increase the area of ​​separation between the heat sink fin 20 and the cooling airflow while further improving the turbulence effect, thereby improving the heat dissipation efficiency of the heat sink fin 20.

[0057] Combined with the attachment again Figure 4 As shown in , in some examples, optionally, along the direction from the third surface 22 to the fourth surface 23 , the distance between the first side wall surface 211 and the second side wall surface 212 gradually decreases.

[0058] The distance between the first side wall surface 211 and the second side wall surface 212 gradually decreases in the direction from the third surface 22 to the fourth surface 23, so that the spoiler gap 21 forms a closed airway in the cross section parallel to the first surface 11 in the figure. This structural form of the airway can prolong the time that the airflow stays in the spoiler gap 21, and can further change the direction of the airflow, thereby improving the spoiler effect and thereby improving the heat dissipation efficiency of the heat dissipation fins 20.

[0059] Combined with the attachment again Figure 2 As shown in the figure, along the second direction Y in the figure, the size of the spoiler gap 21 of this embodiment is less than or equal to the size of the heat dissipation fin 20 between two adjacent spoiler gaps 21.

[0060] The size of the spoiler slot 21 along the second direction Y can be understood as the width size. The width size of the spoiler slot 21 is less than or equal to the size of the adjacent portion of the heat sink fin 20 located between the two spoiler slots 21. This design purpose is to reduce the possibility of affecting the structural strength of the heat sink fin 20 due to the excessive width of the spoiler slot 21. Moreover, if the width of the spoiler slot 21 is too large, a good spoiler effect cannot be achieved when the airflow passes directly through it.

[0061] Furthermore, the size of the spoiler gap 21 may be designed to be a, and the size of the portion of the heat dissipation fins 20 between two adjacent spoiler gaps 21 may be designed to be b, where a≤0.2b.

[0062] Combined with the attachment again Figure 2 As shown in, in some examples, optionally, the heat dissipation fin 20 of the present embodiment has a first end 25 and a second end 26 arranged opposite to each other, the first end 25 is away from the heat dissipation substrate 10, and the second end 26 is connected to the heat dissipation substrate 10, and the spoiler gap 21 has a third end 213 away from the heat dissipation substrate 10 and a fourth end 214 close to the heat dissipation substrate 10, the third end 213 is spaced apart from the first end 25, and the fourth end 214 is flush with or spaced apart from the second end 26.

[0063] That is, when the length direction of the spoiler gap 21 of the present embodiment is set along the third direction Z in the figure, the end of the spoiler gap 21 of the present embodiment that is away from the heat dissipation substrate 10 in the third direction Z needs to have a distance from the end of the heat dissipation fin 20 that is away from the heat dissipation substrate 10. In this way, the structural strength of the heat dissipation fin 20 can be ensured and the possibility of deformation of the end of the heat dissipation fin 20 that is away from the heat dissipation substrate 10 can be reduced.

[0064] In another example, optionally, along a third direction Z perpendicular to the second direction Y and parallel to the first surface 11, multiple rows of spoiler slits 21 may be spaced apart (this embodiment is not shown in the figure), and each row has a plurality of spoiler slits 21 spaced apart along the second direction Y. In this embodiment, the length direction of the spoiler slits 21 may be arranged along the second direction Y or the third direction Z to form spoiler slits 21 that are approximately in a grid shape.

[0065] Of course, the arrangement of the spoiler slots 21 of this embodiment is not limited to any of the above, for example, the spoiler slots 21 can be designed to be encircling or arranged along a curve. In addition, the shape of the spoiler slots 21 is not limited to the long strip shape shown in the figure, and can also be C-shaped, S-shaped, etc., as long as it can improve the heat dissipation performance of the heat sink 100. This embodiment does not list them one by one.

[0066] Combined with the attachment again Figure 1 and attached Figure 2 As shown in the figure, based on the above-mentioned heat sink 100, this embodiment provides a heat dissipation device, including a heat dissipation fan 200 and a heat sink 100 as the above-mentioned technical solution. Of course, the heat dissipation device can also include a shell (not shown in the figure), and the heat dissipation fan 200 and the heat dissipation element 100 are both installed in the shell. The heat dissipation fan 200 introduces the airflow from the air inlet side (the third surface 22) of the heat dissipation fin 20 to the air outlet side (the fourth surface 23) through its own negative pressure. When the airflow passes through the heat dissipation fin 20, it takes away the heat of the heat dissipation fin 20 to dissipate heat.

[0067] In addition, this embodiment further provides an electrical device, including the above-mentioned heat dissipation device, and the electrical device may be a refrigerator, an air conditioner, a television, etc. For the structure of other parts of the electrical device, please refer to the prior art, and this application will not elaborate on them.

[0068] The above is only a preferred specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A heat sink, characterized in that: include: A heat dissipation substrate including a first surface; A plurality of heat dissipation fins are mounted on the first surface, and the plurality of heat dissipation fins are arranged at intervals along a first direction, and the first direction is parallel to the first surface; At least one of the plurality of heat dissipation fins is provided with a spoiler gap.

2. The heat sink according to claim 1, characterized in that: A plurality of the spoiler slots are provided on each of the heat dissipation fins, and the plurality of the spoiler slots are arranged on the heat dissipation fins at intervals along a second direction, and the second direction is parallel to the first surface and intersects with the first direction.

3. The heat sink according to claim 2, characterized in that: The heat dissipation fin comprises a third surface and a fourth surface which are arranged opposite to each other, and the spoiler gap runs through the third surface and the fourth surface; The heat dissipation fin is provided with a first side wall surface and a second side wall surface at the spoiler gap, the first side wall surface and the second side wall surface are arranged opposite to each other in the second direction, and the spoiler gap is formed between the first side wall surface and the second side wall surface; In a cross section parallel to the first surface and in a direction from the third surface to the fourth surface, a distance between the first side wall and a center line of the heat dissipating fin gradually decreases, and / or a distance between the second side wall and a center line of the heat dissipating fin gradually decreases.

4. The heat sink according to claim 3, characterized in that: The first side wall surface is located at a side of the spoiler gap away from the center line of the heat dissipation fin, and the second side wall surface is located at a side of the spoiler gap close to the center line of the heat dissipation fin; The fourth surface is provided with a tip portion extending in a direction away from the third surface, and a surface on one side of the tip portion is coplanar with the first side wall surface.

5. The heat sink according to claim 3 or 4, characterized in that: Along a direction from the third surface to the fourth surface, a distance between the first side wall surface and the second side wall surface gradually decreases.

6. The heat sink according to claim 2, characterized in that: The length direction of the spoiler gap is arranged along a third direction, and the third direction is perpendicular to the second direction and the first direction.

7. The heat sink according to claim 2, characterized in that: Along the second direction, the size of the spoiler gap is smaller than or equal to the size of the heat dissipation fin between two adjacent spoiler gaps.

8. The heat sink according to any one of claims 1 to 4, 6 and 7, characterized in that: The heat dissipation fin has a first end and a second end arranged opposite to each other, the first end is away from the heat dissipation substrate, and the second end is connected to the heat dissipation substrate. The spoiler gap has a third end away from the heat dissipation substrate and a fourth end close to the heat dissipation substrate, the third end is spaced apart from the first end, and the fourth end is flush with or spaced apart from the second end.

9. A heat dissipation device, characterized in that: It comprises a heat dissipation fan and a heat dissipation element as claimed in any one of claims 1 to 8.

10. An electrical device, characterized in that: Comprising the heat dissipation device as claimed in claim 9.

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