Structure for solving temperature rise of industrial control vehicle-mounted screen

By setting composite copper foil components and component areas on the lower part of the LCD of the industrial-controlled vehicle-mounted display module, the problem of excessive temperature caused by the heat dissipation of electronic components is solved, and a more effective heat dissipation effect is achieved, the product cost is reduced and the appearance is maintained.

CN222653214UActive Publication Date: 2025-03-21ZHEJIANG LIANXINKANG TECH CO LTD
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Patent Information

Application Number
CN202420704753.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-08
Publication Date
2025-03-21
Estimated Expiration
2034-04-08

AI Technical Summary

Technical Problem

The industrial-controlled vehicle-mounted screen display module has too high temperature due to the heat dissipation problem of electronic components. Increased heat dissipation measures will increase costs and affect the appearance of the product.

Method used

A structure including LCD, composite copper foil assembly and component area is designed. The composite copper foil assembly consists of a single-sided adhesive insulating film, a single-sided graphene, a single-sided adhesive conductive copper foil, a single-sided adhesive non-conductive copper foil and a lower release film PET. The structure is a stacked structure, and a single-sided adhesive non-conductive copper foil is pasted at the IC element to increase the heat dissipation area.

Benefits of technology

It effectively reduces the heating problem caused by power consumption at the IC. By increasing the heat dissipation area, the product temperature is controlled below 36 degrees, and the product heat dissipation effect and quality are improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

A structure for solving temperature rise of an industrial control vehicle-mounted screen comprises an LCD, a composite copper foil assembly and an element area, the element area is arranged on the lower portion of the LCD, and the structure is characterized in that the composite copper foil assembly is pasted on the surface of the element area, the composite copper foil assembly is of a stacked structure, and a protective film through hole notch is formed in one side of the composite copper foil assembly. According to the utility model, the composite copper foil assembly is arranged, so that the problem of temperature rise of the display module can be better solved, and heat dissipation of the display module is facilitated.
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Description

Technical Field

[0001] The utility model relates to the field of liquid crystal display modules, in particular to a structure for solving the temperature rise of an industrial control vehicle-mounted screen. Background Art

[0002] In the industrial control vehicle-mounted module industry, with the continuous development of science and technology, the increasing number of electronic products has put forward a test on production efficiency and production quality. In the field of LCD display, due to the brightness adjustment of the equipment, the display module often has the problem of over-temperature. In order to solve the problem of over-temperature, a series of heat dissipation measures are usually added, but the added materials will lead to an increase in equipment costs. At the same time, due to the additional heat dissipation equipment, the appearance of the product will be greatly reduced.

[0003] Based on this, in order to solve the problems of heat dissipation of electronic components of display module, product cost, product appearance, etc., this design proposes a structure to solve the temperature rise of industrial control vehicle screen. Utility Model Content

[0004] The utility model aims to provide a structure for solving the temperature rise of the industrial control vehicle-mounted screen.

[0005] A structure for solving the temperature rise of an industrial control vehicle-mounted screen, comprising: an LCD, a composite copper foil assembly, and a component area. The component area is arranged at the lower part of the LCD, and is characterized in that a composite copper foil assembly is pasted on the surface of the component area, the composite copper foil assembly structure is a stacked structure, and a protective film through-hole gap is opened on one side of the composite copper foil assembly.

[0006] Preferably, the composite copper foil assembly includes: a single-sided adhesive insulating film, a single-sided graphene, a single-sided adhesive conductive copper foil, a single-sided adhesive non-conductive copper foil, and a lower release film PET. The single-sided adhesive insulating film is located on the far left, the single-sided graphene is pasted on the right side of the single-sided adhesive insulating film, the single-sided adhesive conductive copper foil is pasted on the right side of the single-sided graphene, the single-sided adhesive non-conductive copper foil is pasted on the right side of the single-sided adhesive conductive copper foil, and the lower release film PET is pasted on the right side of the adhesive non-conductive copper foil.

[0007] Preferably, the single-sided adhesive non-conductive copper foil is divided into an upper part and a lower part, the upper part of the single-sided adhesive non-conductive copper foil is pasted on the IC component, and the lower part of the single-sided adhesive non-conductive copper foil is pasted on other electronic components, and the non-adhesive surface of the single-sided adhesive non-conductive copper foil is a wavy structure.

[0008] Preferably, the thickness of the single-sided adhesive insulating film is 0.012t, the thickness of the single-sided graphene is 0.04t, the thickness of the single-sided adhesive conductive copper foil is 0.03t, the thickness of the single-sided adhesive non-conductive copper foil is 0.03t, and the thickness of the lower release film PET is 0.06t.

[0009] The beneficial effects of the above scheme are:

[0010] 1. The combination of single-sided adhesive non-conductive copper foil and graphene added in this solution can solve the main heating problem caused by lighting the backlight LED light strip of the display module component. By sticking single-sided adhesive non-conductive copper foil on the IC part at the LCD, the serious heating problem caused by power consumption at the IC is greatly reduced.

[0011] 2. In this solution, one side of the single-sided non-conductive copper foil with adhesive is designed to be wavy, which can provide a larger heat dissipation area and more effectively solve the temperature rise of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structure of the utility model;

[0013] Figure 2 This is a schematic diagram of the structure of the composite copper foil of the utility model;

[0014] Figure 3 This is a schematic diagram of the side view structure of the composite copper foil of the utility model;

[0015] Figure 4 This is a schematic diagram of the decomposed structure of the composite copper foil of the utility model;

[0016] In the figure: 1. LCD; 2. Composite copper foil assembly; 21. Single-sided adhesive insulating film; 22. Single-sided graphene; 23. Single-sided adhesive conductive copper foil; 24. Single-sided adhesive non-conductive copper foil; 25. Lower release film PET; 3. Component area. DETAILED DESCRIPTION

[0017] The present invention is further explained in detail below in conjunction with the accompanying drawings of the specification, but the protection scope of the present invention is not limited thereto. Example

[0018] A structure for solving the temperature rise of an industrial control vehicle-mounted screen comprises: an LCD 1, a composite copper foil assembly 2, and a component area 3. The component area 3 is arranged at the lower part of the LCD 1, and is characterized in that a composite copper foil assembly 2 is pasted on the surface of the component area 3, the composite copper foil assembly 2 is a stacked structure, and a protective film through-hole notch is opened on one side of the composite copper foil assembly 2.

[0019] Specifically, the composite copper foil 2 includes: a single-sided adhesive insulating film 21, a single-sided graphene 22, a single-sided adhesive conductive copper foil 23, a single-sided adhesive non-conductive copper foil 24, and a lower release film PET25. The single-sided adhesive insulating film 21 is located on the far left, the single-sided graphene 22 is pasted on the right side of the single-sided adhesive insulating film 21, the single-sided adhesive conductive copper foil 23 is pasted on the right side of the single-sided graphene 22, the single-sided adhesive non-conductive copper foil 24 is pasted on the right side of the single-sided adhesive conductive copper foil 23, and the lower release film PET25 is pasted on the right side of the adhesive non-conductive copper foil 24.

[0020] Specifically, the single-sided adhesive non-conductive copper foil 24 is divided into an upper part and a lower part. The upper part of the single-sided adhesive non-conductive copper foil 24 is pasted on the IC component, and the lower part of the single-sided adhesive non-conductive copper foil 24 is pasted on other electronic components. The non-adhesive surface of the single-sided adhesive non-conductive copper foil 24 is a wavy structure.

[0021] Specifically, the thickness of the single-sided adhesive insulating film 21 is 0.012t, the thickness of the single-sided graphene 22 is 0.04t, the thickness of the single-sided adhesive conductive copper foil 23 is 0.03t, the thickness of the single-sided adhesive non-conductive copper foil 24 is 0.03t, and the thickness of the lower release film PET25 is 0.06t.

[0022] After the above improved structure, the temperature test results are as follows:

[0023] From the tests after the technical improvements, it can be seen that the measured temperature of each component position is controlled below 36 degrees. The technical improvements can greatly improve the heat dissipation of various parts of the display module, thereby improving product quality and enhancing customer experience.

[0024] Comparative Example

[0025] The comparative example does not use the heat dissipation structure in the embodiment. When performing the temperature test, the temperature test is as follows:

[0026] By comparing with the comparative example, it can be seen intuitively that the technical improvement in the embodiment can greatly solve the problem of temperature control of the product in actual production and can greatly reduce the temperature rise of the product.

Claims

1. A structure for solving the temperature rise of industrial control vehicle screen, comprising: An LCD (1), a composite copper foil assembly (2), and a component area (3), wherein the component area (3) is arranged at the bottom of the LCD (1), characterized in that a composite copper foil assembly (2) is adhered to the surface of the component area (3), the composite copper foil assembly (2) has a stacked structure, and a protective film through-hole notch is opened on one side of the composite copper foil assembly (2).

2. A structure for solving the temperature rise of industrial control vehicle-mounted screen as claimed in claim 1, characterized in that: The composite copper foil assembly (2) comprises: a single-sided adhesive insulating film (21), a single-sided graphene (22), a single-sided adhesive conductive copper foil (23), a single-sided adhesive non-conductive copper foil (24), and a lower release film PET (25), wherein the single-sided adhesive insulating film (21) is located at the far left, the single-sided graphene (22) is adhered to the right side of the single-sided adhesive insulating film (21), the single-sided adhesive conductive copper foil (23) is adhered to the right side of the single-sided graphene (22), the single-sided adhesive non-conductive copper foil (24) is adhered to the right side of the single-sided adhesive conductive copper foil (23), and the lower release film PET (25) is adhered to the right side of the adhesive non-conductive copper foil (24).

3. A structure for solving the temperature rise of industrial control vehicle-mounted screen as claimed in claim 2, characterized in that: The single-sided adhesive non-conductive copper foil (24) is divided into an upper part and a lower part. The upper part of the single-sided adhesive non-conductive copper foil (24) is adhered to the IC component, and the lower part of the single-sided adhesive non-conductive copper foil (24) is adhered to other electronic components. The non-adhesive surface of the single-sided adhesive non-conductive copper foil (24) is a wavy structure.

4. A structure for solving the temperature rise of industrial control vehicle-mounted screen as claimed in claim 2, characterized in that: The thickness of the single-sided adhesive insulating film (21) is 0.012t, the thickness of the single-sided graphene (22) is 0.04t, the thickness of the single-sided adhesive conductive copper foil (23) is 0.03t, the thickness of the single-sided adhesive non-conductive copper foil (24) is 0.03t, and the thickness of the lower release film PET (25) is 0.06t.