Electronic equipment

Abstract

The utility model relates to the technical field of communication, and discloses electronic equipment. Comprising a shell assembly, a circuit board, a heat dissipation supporting assembly and an antenna. A mounting space is formed in the shell assembly; the circuit board, the heat dissipation supporting assembly and the antenna are all arranged in the installation space. The heat dissipation supporting assembly is connected with the shell assembly and the circuit board. The antenna is installed on the heat dissipation supporting assembly and electrically connected with the circuit board. The heat dissipation supporting assembly is arranged in the installation space of the shell assembly and connected with the shell assembly and the circuit board, heat generated by the circuit board can be transmitted to the shell assembly, and heat dissipation is achieved; the antenna is connected with the heat dissipation supporting assembly, so that the heat dissipation holes formed in the shell assembly are not limited by the antenna; and the antenna is prevented from occupying the area of the circuit board, so that the antenna is far away from the circuit board, board-level interference is effectively weakened, the radiation performance of the antenna is improved, and the defects that a fixing mode of a built-in antenna in the prior art is not beneficial to heat dissipation and occupies the space of a mainboard are overcome.

Description

Technical Field

[0001] The utility model relates to the technical field of communications, and in particular to an electronic device. Background Art

[0002] With the increase in the number of home IoT devices, existing IoT products are expected to develop in the direction of miniaturization, integration, and intelligence. Antennas are an important part of wireless communication systems, so the requirements for antennas in home IoT devices are getting higher and higher. As one of the important members of IoT products, network camera products use two types of antennas: external and internal. External antennas are mostly used in outdoor products due to their long transmission distance and small size. Internal antennas are mostly used in smart home products such as WiFi and 4G network cameras due to their small size and beautiful appearance. However, the current mainstream internal antenna fixing method is not conducive to heat dissipation and occupies the motherboard space. Therefore, how to improve heat dissipation and reduce the space occupied by the motherboard is an urgent problem that the industry needs to solve. Utility Model Content

[0003] The utility model provides an electronic device, which is used to solve the defects of the fixing method of the built-in antenna in the prior art that the fixing method is not conducive to heat dissipation and occupies the mainboard space.

[0004] The utility model provides an electronic device, comprising:

[0005] A housing assembly, forming an installation space inside;

[0006] A circuit board is arranged in the installation space;

[0007] A heat dissipation support assembly is arranged in the installation space, and the heat dissipation support assembly is connected to the housing assembly and the circuit board;

[0008] The antenna is arranged in the installation space, the antenna is installed on the heat dissipation support assembly, and is electrically connected to the circuit board.

[0009] According to the electronic device provided by the utility model, the heat dissipation support assembly includes:

[0010] A heat dissipation plate, arranged along a first direction with the circuit board;

[0011] A first connecting member is disposed on a side of the heat sink away from the circuit board, and the first connecting member is connected to the heat sink and the housing assembly;

[0012] The second connector and the third connector are both arranged on a side of the heat sink facing the circuit board. The second connector is connected to the heat sink and the circuit board, and the third connector is connected to the heat sink and the antenna.

[0013] According to the electronic device provided by the utility model, the second connecting member and the third connecting member are arranged along a second direction, and the second direction intersects with the first direction.

[0014] The electronic device provided by the utility model further includes:

[0015] The barrier component is installed on a side of the antenna facing the circuit board.

[0016] According to the electronic device provided by the utility model, the barrier component includes barrier foam or rubber block.

[0017] According to the electronic device provided by the utility model, the antenna includes a PCB antenna.

[0018] According to the electronic device provided by the utility model, the PCB antenna includes:

[0019] An antenna substrate connected to the heat dissipation support assembly;

[0020] An antenna radiator is arranged on a side of the antenna substrate away from the circuit board;

[0021] An antenna feed line has one end connected to the antenna radiator and the other end electrically connected to the circuit board.

[0022] According to the electronic device provided by the utility model, the housing assembly includes:

[0023] A front face connected to the heat dissipation support assembly;

[0024] The rear shell has the installation space formed therein, the front face is arranged at the opening of the installation space, and the front face is connected to the rear shell to close the installation space.

[0025] The electronic device provided by the utility model further includes:

[0026] The image acquisition component is arranged between the front face and the heat dissipation support component and is connected to the front face.

[0027] According to the electronic device provided by the utility model, the electronic device includes a video camera, a still camera, a notebook computer, a mobile phone or a tablet computer.

[0028] The utility model provides an electronic device, which can transfer the heat generated by the circuit board to the shell component to achieve heat dissipation by arranging a heat dissipation support component in the installation space of the shell component, and the heat dissipation support component is connected to the shell component and the circuit board. By connecting the antenna to the heat dissipation support component, it is avoided to directly stick the antenna to the shell component. Compared with the direct sticking and fixing method in the prior art, the heat dissipation holes opened in the shell component are no longer restricted by the antenna, which helps to improve the heat dissipation efficiency. By connecting the antenna to the heat dissipation support component, it is possible to avoid the antenna occupying the circuit board area, keep the antenna away from the circuit board, effectively reduce board-level interference, improve the antenna radiation performance, and facilitate the miniaturization design of the product. Therefore, the utility model effectively solves the defects of the prior art that the fixing method of the built-in antenna is not conducive to heat dissipation and occupies the mainboard space. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 It is a schematic diagram of the exploded structure of the electronic equipment provided by the utility model;

[0031] Figure 2 This is one of the structural schematic diagrams of the heat dissipation support assembly of the electronic equipment provided by the utility model;

[0032] Figure 3 This is the second structural schematic diagram of the heat dissipation support assembly of the electronic device provided by the utility model;

[0033] Figure 4 The utility model is a schematic diagram of the assembly structure of a heat dissipation support component, a circuit board and an antenna of an electronic device provided by the utility model.

[0034] Reference numerals:

[0035] 100, housing assembly; 110, front face; 120, rear housing;

[0036] 200. Circuit board;

[0037] 300, heat dissipation support assembly; 310, heat dissipation plate; 320, first connecting member; 330, second connecting member; 340, third connecting member; 350, connecting column; 321, first connecting plate; 322, first mounting plate; 331, second connecting plate; 332, second mounting plate;

[0038] 400, antenna; 410, antenna substrate; 420, antenna radiator; 430, antenna feed line; 440, beam hole;

[0039] 500, barrier assembly;

[0040] 600. Image acquisition component. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be described clearly and completely in conjunction with the drawings in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0042] In the description of the embodiments of the present utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present utility model. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0043] In the description of the embodiments of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0044] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0045] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model embodiment. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0046] There are currently two mainstream ways to fix built-in antennas: direct pasting and snap-on. The direct pasting type is greatly affected by the shape of the shell. This method requires the bottom surface of the shell to be flat, and the pasting area cannot have heat dissipation holes, which affects the heat dissipation efficiency of the whole machine. The snap-on type requires the single board to reserve RF signal interfaces and ground interfaces, which will occupy the single board area and affect the layout and wiring of the components in the single board. In addition, the area where the antenna is located needs to have sufficient clearance, which is not conducive to the miniaturization design of the product.

[0047] In order to solve the defects of the prior art that the fixing method of the built-in antenna is not conducive to heat dissipation and occupies the mainboard space, the utility model provides an electronic device. Figures 1 to 4 The electronic device of the utility model is described in detail. Figure 1 It is a schematic diagram of the exploded structure of the electronic equipment provided by the utility model; Figure 2 This is one of the structural schematic diagrams of the heat dissipation support assembly of the electronic equipment provided by the utility model; Figure 3 This is the second structural schematic diagram of the heat dissipation support assembly of the electronic device provided by the utility model; Figure 4 The utility model is a schematic diagram of the assembly structure of a heat dissipation support component, a circuit board and an antenna of an electronic device provided by the utility model.

[0048] like Figure 1 As shown, in a specific embodiment of the present utility model, an electronic device is provided. The electronic device includes a housing component 100, a circuit board 200, a heat dissipation support component 300 and an antenna 400;

[0049] Among them, an installation space is formed inside the shell component 100; the circuit board 200, the heat dissipation support component 300 and the antenna 400 are all arranged in the installation space; the heat dissipation support component 300 is connected to the shell component 100 and the circuit board 200; the antenna 400 is installed on the heat dissipation support component 300 and is electrically connected to the circuit board 200.

[0050] In a specific embodiment of the utility model, by arranging a heat dissipation support assembly 300 in the installation space of the housing assembly 100, the heat dissipation support assembly 300 is connected to the housing assembly 100 and the circuit board 200, so that the heat generated by the circuit board 200 can be transferred to the housing assembly 100 to achieve heat dissipation. By connecting the antenna 400 to the heat dissipation support assembly 300, it is avoided to directly stick the antenna 400 to the housing assembly 100. Compared with the direct sticking and fixing method in the prior art, the heat dissipation hole opened in the housing assembly 100 is no longer restricted by the antenna 400, which helps to improve the heat dissipation efficiency. By connecting the antenna 400 to the heat dissipation support assembly 200, it is possible to avoid the antenna 400 occupying the area of ​​the circuit board 200, so that the antenna 400 is far away from the circuit board 200, effectively reducing the board-level interference, improving the radiation performance of the antenna 400, and facilitating the miniaturization design of the product. Therefore, this embodiment effectively solves the defects of the fixing method of the built-in antenna 400 in the prior art that is not conducive to heat dissipation and occupies the mainboard space.

[0051] In some embodiments, the housing assembly 100 is a shell structure made of plastic material, which can reduce the impact of the housing assembly 100 on the radiation performance of the antenna 400.

[0052] In some embodiments, the housing assembly 100 includes a front face 110 and a rear shell 120; the front face 110 is connected to the heat dissipation support assembly 300; an installation space is formed inside the rear shell 120, the front face 110 is arranged at the opening of the installation space, and the front face 110 is connected to the rear shell 120 to close the installation space. By providing the front face 110 and the rear shell 120, it is easy to process and shape, and the processing cost is reduced; at the same time, it is easy to assemble the circuit board 200, the heat dissipation support assembly 300 and the antenna 400, and the assembly efficiency is improved.

[0053] In a specific embodiment of the utility model, the electronic device further includes an image acquisition component 600; the image acquisition component 600 is disposed between the front face 110 and the heat dissipation support component 300, and is connected to the front face 110. Specifically, the heat dissipation support component 300 presses the image acquisition component 600 against the front face 110, thereby improving the installation stability of the image acquisition component 600. Because the heat dissipation support component 300 is connected to the image acquisition component 600, it can play a role in heat dissipation of the image acquisition component 600.

[0054] In some embodiments, the image acquisition component 600 includes an image sensor board and a camera; the camera is electrically connected to the image sensor board; and the image sensor board is in contact with the heat dissipation support component 300 .

[0055] In some embodiments, the heat dissipation support assembly 300 is a metal structure to improve heat dissipation performance.

[0056] In a specific embodiment of the present utility model, the heat dissipation support assembly 300 includes a heat dissipation plate 310, a first connecting member 320, a second connecting member 330 and a third connecting member 340;

[0057] Among them, the heat sink 310 and the circuit board 200 are arranged along a first direction; the first connecting member 320 is arranged on a side of the heat sink 310 away from the circuit board 200, and the first connecting member 320 is connected to the heat sink 310 and the shell assembly 100; the second connecting member 330 and the third connecting member 340 are both arranged on a side of the heat sink 310 facing the circuit board 200, the second connecting member 330 is connected to the heat sink 310 and the circuit board 200, and the third connecting member 340 is connected to the heat sink 310 and the antenna 400.

[0058] In the specific embodiment of the utility model, by providing the second connector 330, the circuit board 200 can be connected and supported; by providing the third connector 340, the antenna 400 can be connected and supported. The first connector 320 can be provided to transfer the heat of the circuit board 200 and the antenna 400 to the housing assembly 100. In addition, by providing the second connector 330 and the third connector 340, the spatial distance between the circuit board 200 and the antenna 400 can be increased, the influence of board-level interference and shielding on the antenna 400 can be reduced, and the radiation performance of the antenna 400 can be improved.

[0059] In a specific embodiment of the present invention, the second connector 330 and the third connector 340 are arranged along the second direction, and the second direction intersects the first direction, so that the layout of the circuit board 200 and the antenna 400 is more reasonable and the space utilization is improved.

[0060] It can be understood that the first direction includes but is not limited to the front-to-back direction as shown in the figure, and the second direction includes but is not limited to the up-down direction as shown in the figure.

[0061] like Figure 1As shown, in some embodiments, the heat sink 310 and the circuit board 200 are arranged along the front-to-back direction; the first connecting member 320 is arranged in front of the heat sink 310, one end of the first connecting member 320 is connected to the heat sink 310, and the other end is connected to the front face 110 of the shell assembly 100; the second connecting member 330 and the third connecting member 340 are arranged behind the heat sink 310, and the third connecting member 340 is located above the second connecting member 330; the heat sink 310 is connected to the circuit board 200 through the second connecting member 330, and the heat sink 310 is connected to the antenna 400 through the third connecting member 340. By setting a first connecting member 320 in front of the heat sink 310, and setting a second connecting member 330 and a third connecting member 340 behind the heat sink 310, it can play a role in supporting multiple components; by connecting the first connecting member 320 to the front face 110, by connecting the second connecting member 330 to the circuit board 200, and by connecting the third connecting member 340 to the antenna 400, the circuit board 200 and the antenna 400 can be quickly dissipated.

[0062] like Figure 2 and Figure 3 As shown, in some embodiments, the first connector 320 includes a first connecting plate 321 and a first mounting plate 322; the first connecting plate 321 is vertically mounted on the front side of the heat sink 310, the first mounting plate 322 is arranged parallel to the heat sink 310, one end of the first mounting plate 322 is connected to the end of the first connecting plate 321 away from the heat sink 310, and the first mounting plate 322 is provided with a first mounting hole along the front-to-back direction, and the first mounting hole is used for threading a screw. The heat sink 310 is threadedly assembled with the front face 110 of the housing assembly 100 by means of screws.

[0063] Specifically, there are two first connectors 320, which are respectively connected to the left edge and the right edge of the front side of the heat sink 310, so as to improve the connection stability between the heat sink support assembly 300 and the housing assembly 100. An accommodation space is formed between the two first connectors 320, and the image acquisition assembly 600 is embedded in the accommodation space. The heat sink 310 is used to press the image acquisition assembly 600 against the front face 110, and the image acquisition assembly 600 is connected to the front face 110, so as to improve the installation stability and heat dissipation of the image acquisition assembly 600.

[0064] It is understandable that in the specific embodiment of the present invention, there is no limitation on the number of the first connecting members 320 .

[0065] like Figure 2 and Figure 3As shown, in some embodiments, the second connecting member 330 includes a second connecting plate 331 and a second mounting plate 332; the second connecting plate 331 is vertically mounted on the lower edge of the rear side of the heat sink 310; the second mounting plate 332 is arranged parallel to the heat sink 310, and one end of the second mounting plate 332 is connected to the end of the second connecting plate 331 away from the heat sink 310; the second mounting plate 332 is provided with a second mounting hole along the front-to-back direction, and the second mounting hole is used for threaded connection of screws; the circuit board 200 is mounted on the second mounting plate 332 by screws, so that the circuit board 200 is close to the second mounting plate 332, thereby increasing the contact area between the circuit board 200 and the second mounting plate 332 and improving the heat dissipation efficiency.

[0066] In some embodiments, the area of ​​the second mounting plate 332 is larger than the area of ​​the first mounting plate 322 to improve heat dissipation efficiency.

[0067] like Figure 3 As shown, in some embodiments, a connecting column 350 is further provided on the rear side of the heat dissipation plate 310, and a fourth mounting hole is provided in the connecting column 350, and the fourth mounting hole is used for threaded connection of a screw. The circuit board 200 is connected to the connecting column 350 by screws, thereby improving the installation stability of the circuit board 200.

[0068] like Figure 2 and Figure 3 As shown, in some embodiments, the third connecting member 340 includes a third mounting plate; the third mounting plate is vertically mounted on the upper edge of the rear side of the heat sink 310, and the third mounting plate is provided with a third mounting hole along the up and down directions, and the antenna 400 is mounted on the third mounting plate by screws, so that the antenna 400 is located above the circuit board 200, thereby increasing the distance between the antenna 400 and the circuit board 200 and improving the radiation efficiency of the antenna 400.

[0069] In some embodiments, the number of third connectors 340 corresponds to the number of antennas 400. Specifically, there are two third connectors 340 and two antennas 400; the two antennas 400 are respectively mounted on the third connectors 340 in a one-to-one correspondence.

[0070] It is understandable that in the specific embodiment of the present invention, there is no limitation on the number of the third connecting members 340 .

[0071] In a specific embodiment of the present invention, the electronic device also includes a blocking component 500; the blocking component 500 is installed on a side of the antenna 400 facing the circuit board 200, and serves to block the tail wire of the circuit board 200, thereby reducing the impact of the tail wire on the radiation efficiency and receiving efficiency of the antenna 400.

[0072] In some embodiments, the barrier component 500 includes a barrier foam or a rubber block, which can reduce costs. Specifically, the barrier component 500 is a barrier foam, the thickness of the barrier foam is not less than 10 mm, and the barrier foam is attached to the side of the antenna 400 away from the circuit board 200 through the 3M adhesive carried by the barrier foam, thereby improving installation efficiency.

[0073] A pigtail is a short cable, either metal or optical, that is permanently attached to the end of a component and slants out at the other end for connecting the component to other equipment.

[0074] In a specific embodiment of the present invention, the antenna 400 includes a PCB antenna, which can reduce costs.

[0075] like Figure 4 As shown, in a specific embodiment of the utility model, the PCB antenna includes an antenna substrate 410, an antenna radiator 420 and an antenna feeder 430; the antenna substrate 410 is connected to the heat dissipation support assembly 300; the antenna radiator 420 is arranged on the side of the antenna substrate 410 away from the circuit board 200; one end of the antenna feeder 430 is connected to the antenna radiator 420, and the other end is electrically connected to the circuit board 200. Specifically, the antenna substrate 410 is mounted on the third mounting plate by screws, the antenna radiator 420 is arranged on the upper surface of the antenna substrate 410, a wire harness hole 440 is opened on the antenna substrate 410, one end of the antenna feeder 430 is welded and connected to the antenna radiator 420, and the other end passes through the wire harness hole 440 and is electrically connected to the RF connector base on the circuit board 200 through its own RF connector interface; the barrier foam is arranged on the lower surface of the antenna substrate 410 to block the tail line. By adopting a PCB antenna, the cost of the entire device can be reduced; by arranging the antenna radiator 420 on a side of the antenna substrate 410 away from the circuit board 200, board-level interference can be reduced and the radiation efficiency of the antenna 400 can be improved.

[0076] In a specific embodiment of the utility model, the electronic device includes a video camera, a camera, a notebook computer, a mobile phone or a tablet computer. Specifically, the electronic device is a video camera, and further, the video camera is a network camera.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. An electronic device, characterized in that: include: A housing assembly (100) having an installation space formed therein; A circuit board (200) is arranged in the installation space; A heat dissipation support component (300) is arranged in the installation space, and the heat dissipation support component (300) is connected to the housing component (100) and the circuit board (200); An antenna (400) is arranged in the installation space; the antenna (400) is installed on the heat dissipation support assembly (300) and is electrically connected to the circuit board (200).

2. The electronic device according to claim 1, characterized in that: The heat dissipation support assembly (300) comprises: A heat dissipation plate (310) arranged along a first direction with the circuit board (200); A first connecting member (320) is disposed on a side of the heat dissipation plate (310) away from the circuit board (200), and the first connecting member (320) is connected to the heat dissipation plate (310) and the housing assembly (100); The second connecting member (330) and the third connecting member (340) are both arranged on a side of the heat sink (310) facing the circuit board (200); the second connecting member (330) is connected to the heat sink (310) and the circuit board (200); and the third connecting member (340) is connected to the heat sink (310) and the antenna (400).

3. The electronic device according to claim 2, characterized in that: The second connecting member (330) and the third connecting member (340) are arranged along a second direction, and the second direction intersects with the first direction.

4. The electronic device according to claim 1, characterized in that: Also includes: A barrier component (500) is installed on a side surface of the antenna (400) facing the circuit board (200).

5. The electronic device according to claim 4, characterized in that: The barrier component (500) comprises barrier foam or rubber block.

6. The electronic device according to claim 1, characterized in that: The antenna (400) comprises a PCB antenna.

7. The electronic device according to claim 6, characterized in that: The PCB antenna comprises: An antenna substrate (410) connected to the heat dissipation support assembly (300); An antenna radiator (420) is arranged on a side of the antenna substrate (410) away from the circuit board (200); An antenna feed line (430) has one end connected to the antenna radiator (420) and the other end electrically connected to the circuit board (200).

8. The electronic device according to any one of claims 1 to 7, characterized in that: The housing assembly (100) comprises: A front face (110) connected to the heat dissipation support assembly (300); The rear shell (120) has the installation space formed therein, the front face (110) is arranged at the opening of the installation space, and the front face (110) is connected to the rear shell (120) to close the installation space.

9. The electronic device according to claim 8, characterized in that: Also includes: The image acquisition component (600) is arranged between the front face (110) and the heat dissipation support component (300), and is connected to the front face (110).

10. The electronic device according to claim 9, characterized in that: The electronic device includes a video camera, a still camera, a laptop computer, a mobile phone or a tablet computer.

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