An electronic module cover capable of identification
By integrating the identification chip and radio frequency antenna unit into the electronic module cover, the rapid identification and positioning of the electronic module is achieved, and the problem of wasting time is solved in the environment of a large number of electronic modules.
Patent Information
- Application Number
- CN202421536239.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-02
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-07-02
AI Technical Summary
In an environment where there are many electronic modules, checking the number or verifying the identification code one by one to obtain the target electronic module often wastes a lot of time.
An electronic module cover with an identification chip is designed, and the identity information and placement position information of the electronic module are pre-stored in the functional chip unit and connected with the general control Internet of Things unit through a radio frequency antenna unit to achieve rapid identification and positioning.
By pre-storing identity information and location information, the general control IoT unit can quickly screen and identify the target electronic module and its placement location, significantly reducing the time wasted by manpower and material resources.
Smart Images

Figure CN222705000U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic modules, in particular to an electronic module cover capable of identity recognition. Background Art
[0002] An electronic module can be defined as an electronic module assembly with wiring such as data transmission lines, which is usually installed by plugging along a preset guide rail, such as a modular storage assembly of a supercomputer. In some usage scenarios, the electronic module is equipped with a cover made of conductive material, and indicator lights and / or display components are provided on the cover to send signals under specific circumstances.
[0003] In order to identify electronic modules with similar appearance, people will use the method of numbering or printing identification codes on each electronic module. However, when there are a large number of electronic modules, checking the numbers or verifying the identification codes one by one to obtain the target electronic module often wastes a lot of time and brings a lot of inconvenience to the staff.
[0004] Therefore, it is urgent to propose an electronic module cover that can identify an identity, so as to solve the current technical problem that in an environment with a large number of electronic modules, checking the numbers or verifying the identification codes one by one to obtain the target electronic module often wastes a lot of time. Utility Model Content
[0005] Aiming at the technical problem in the prior art that in an environment where there are a large number of electronic modules, it often wastes a lot of time to check the numbers or verify the identification codes one by one to obtain the target electronic module, the utility model proposes an electronic module cover with an identification chip.
[0006] In a preferred embodiment of the present invention, an identifiable electronic module cover is provided, the electronic module cover comprising:
[0007] A cover body, wherein the cover body is made of a conductive material;
[0008] A function chip unit, in which the identity information and placement location information of the electronic module corresponding to the function chip unit are pre-stored, and the function chip unit has a data interface for communication connection with the master control Internet of Things unit;
[0009] A radio frequency antenna unit, wherein the radio frequency antenna unit is connected to the radio frequency transceiver interface of the master control Internet of Things unit; wherein,
[0010] The functional chip unit is packaged on the inner surface of the cover body, and the radio frequency antenna unit is packaged on the outer surface of the cover body.
[0011] Preferably, the functional chip unit is a SIM chip.
[0012] Preferably, the master control Internet of Things unit includes a master control Internet of Things chip and peripheral circuits.
[0013] Preferably, the master control Internet of Things chip is a CPU chip of MSP430G2001.
[0014] Preferably, the master control IoT chip is an EC618 chip for Cat.1bis.
[0015] Preferably, the data interface of the functional chip unit is an SPI interface.
[0016] Compared with the prior art, the utility model can achieve the following beneficial effects:
[0017] An identity-identifiable electronic module cover of the present application pre-stores the identity information and placement location information of the electronic module cover in a functional chip unit. When the electronic module with the identity information needs to be called, the master control Internet of Things unit can collect the identity information of the electronic modules pre-stored in the functional chip units in all the electronic module covers, and perform screening and identification to find the electronic module corresponding to the target identity information and its placement location, which is convenient and quick. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The preferred implementation scheme will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and their implementation methods.
[0019] Figure 1 A schematic diagram of an identifiable electronic module cover in one embodiment of the utility model is shown.
[0020] Figure 2 A schematic diagram of an identifiable electronic module cover in another embodiment of the present invention is shown. DETAILED DESCRIPTION
[0021] The various aspects of the utility model are further described in detail below.
[0022] Unless otherwise defined or indicated, all professional and scientific terms used herein have the same meanings as those familiar to those skilled in the art. In addition, any methods and materials similar or equivalent to those described herein can be applied to the present invention.
[0023] Unless otherwise clearly specified and limited, the "or" mentioned in the present invention includes the relationship of "and". The "and" is equivalent to the Boolean logic operator "AND", the "or" is equivalent to the Boolean logic operator "OR", and "AND" is a subset of "OR".
[0024] It is to be understood that although the terms "first", "second", etc. may be used herein to describe different elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Therefore, the first element may be referred to as the second element without departing from the teachings of the present invention.
[0025] In the present invention, the terms “mainly composed of” and “consisting of” are included in the terms “containing”, “including” or “comprising”.
[0026] Unless otherwise clearly specified and limited, the terms "connected", "connected" and "connection" in the present invention should be understood in a broad sense, for example, it can be a fixed connection, or it can be connected through an intermediary medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0027] For example, if an element (or component) is referred to as being on, coupled to, or connected to another element, the element may be directly formed on, coupled to, or connected to the other element, or there may be one or more intervening elements between them. In contrast, if the expressions "directly on," "directly coupled to," and "directly connected to" are used herein, then no intervening elements are indicated. Other words used to describe the relationship between elements should be similarly interpreted, such as "between" and "directly between," "attached" and "directly attached," "adjacent" and "directly adjacent," and the like.
[0028] It should also be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the drawings. The words "inner" and "outer" used refer to directions toward or away from the geometric center of a particular component, respectively. It can be understood that these terms are used here to describe the relationship of one element, layer or region relative to another element, layer or region as shown in the drawings. In addition to the orientations described in the drawings, these terms should also include other orientations of the device.
[0029] Other aspects of the present invention will be apparent to those skilled in the art from the disclosure herein.
[0030] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the specific implementation methods of the utility model will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.
[0031] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The drawings only show the components related to the present application and are not drawn according to the number, shape and size of the components in actual implementation. The type, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the component layout may also be more complicated. For example, the thickness of the components in the drawings may be exaggerated for the sake of clarity.
[0032] Example 1
[0033] As attached Figure 1 As shown, the utility model realizes an identifiable electronic module cover, and the electronic module cover comprises:
[0034] The cover body 1 is made of a conductive material, and the conductive material is preferably a metal material with corrosion resistance and oxidation resistance;
[0035] SIM function chip unit 2, wherein the identity information and placement location information of the electronic module corresponding thereto are pre-stored in the SIM function chip unit 2, the SIM function chip unit 2 having an SPI data interface for communication connection with a master control Internet of Things unit, the master control Internet of Things unit comprising a master control Internet of Things chip and peripheral circuits, the master control Internet of Things chip being a CPU chip of MSP430G2001;
[0036] The radio frequency antenna unit 3 is connected to the radio frequency transceiver interface of the master control Internet of Things unit; wherein,
[0037] The SIM function chip unit 2 is packaged on the inner surface of the cover body, and the radio frequency antenna unit is packaged on the outer surface of the cover body.
[0038] In actual operation, the master control Internet of Things unit can collect the identity information of the electronic modules pre-stored in the SIM function chip unit in all electronic module covers, and screen and identify it until the electronic module corresponding to the target identity information is found and its placement position is located, which is convenient and fast and avoids waste of manpower and material resources.
[0039] Example 2
[0040] As attached Figure 2As shown, the utility model also realizes an identifiable electronic module cover, the electronic module cover comprising:
[0041] The cover body 1 is made of a conductive material, and the conductive material is preferably a metal material with corrosion resistance and oxidation resistance;
[0042] SIM function chip unit 2, the identity information and placement location information of the electronic module corresponding thereto are pre-stored in the SIM function chip unit 2, the SIM function chip unit 2 has an SPI data interface for communication connection with the master control Internet of Things unit, the master control Internet of Things unit includes a master control Internet of Things chip and peripheral circuits, and the master control Internet of Things chip is an EC618 chip for Cat.1bis;
[0043] A radio frequency antenna unit 3, wherein the radio frequency antenna unit 3 is connected to a radio frequency transceiver interface of the master control Internet of Things unit;
[0044] Energy storage unit 4, the energy storage unit 4 is a lithium battery, the energy storage unit is electrically connected to the SIM function chip unit 2 and the radio frequency antenna unit; wherein,
[0045] The SIM function chip unit 2 is packaged on the inner surface of the cover body, and the radio frequency antenna unit is packaged on the outer surface of the cover body.
[0046] The electronic module cover body with identity identification of the present application pre-stores the identity information and placement location information of the electronic module cover body in the SIM functional chip unit. When the electronic module with the identity information needs to be called, the master control Internet of Things unit can collect the identity information of the electronic modules pre-stored in the functional chip units in all the electronic module covers, and perform screening and identification to find the electronic module corresponding to the target identity information and its placement location, which is convenient and quick.
[0047] Based on this application, it should be understood by those skilled in the art that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.
[0048] It should be noted that the above embodiments can be freely combined as needed. The above is only a preferred implementation of the utility model. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the utility model, and these improvements and modifications should also be regarded as the protection scope of the utility model.
[0049] All documents mentioned in this utility model are cited as references in this application, just as each document is cited as reference separately. In addition, it should be understood that after reading the above content of this utility model, those skilled in the art can make various changes or modifications to this utility model, and these equivalent forms also fall within the scope defined by the claims attached to this application.
Claims
1. An identity-recognizable electronic module cover, characterized in that: The electronic module cover comprises: A cover body, wherein the cover body is made of a conductive material; A function chip unit, in which the identity information and placement location information of the electronic module corresponding to the function chip unit are pre-stored, and the function chip unit has a data interface for communication connection with the master control Internet of Things unit; A radio frequency antenna unit, wherein the radio frequency antenna unit is connected to the radio frequency transceiver interface of the master control Internet of Things unit; wherein, The functional chip unit is packaged on the inner surface of the cover body, and the radio frequency antenna unit is packaged on the outer surface of the cover body.
2. The identifiable electronic module cover according to claim 1, characterized in that: The functional chip unit is a SIM chip.
3. The identifiable electronic module cover according to claim 2, characterized in that: The master control Internet of Things unit includes a master control Internet of Things chip and peripheral circuits.
4. The identifiable electronic module cover according to claim 3, characterized in that: The master control Internet of Things chip is a CPU chip of MSP430G2001.
5. The identifiable electronic module cover according to claim 4, characterized in that: The master control IoT chip is an EC618 chip for Cat.1bis.
6. The identifiable electronic module cover according to claim 5, characterized in that: The data interface of the functional chip unit is an SPI interface.