Integrated circuit sealed housing
By designing the integrated circuit sealed shell, using the connecting base and the protection plate to protect the gold finger of the integrated circuit, the problem of insufficient protection of the gold finger in the prior art is solved, and the stability and safety of the integrated circuit are improved.
Patent Information
- Application Number
- CN202421451432.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-24
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-06-24
AI Technical Summary
During the packaging process, the existing integrated circuit package shell does not protect the gold fingers on the side of the integrated circuit body, which can easily lead to damage to the integrated circuit.
An integrated circuit sealed housing is designed, and the gold fingers are protected by setting a connection base on the upper end of the pin to connect with the gold fingers on the side of the integrated circuit body, and using a protective pressure plate at the bottom of the sealing pressure plate to complete the protection of the gold fingers.
It effectively protects the gold fingers of the integrated circuit, reduces the damage to the gold fingers, and ensures the stability and safety of the integrated circuit.
Smart Images

Figure CN222705501U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuit packaging shells, in particular to an integrated circuit sealing shell. Background Art
[0002] With the development of integrated circuit technology, integrated circuits have been more and more widely used in the field of electronic science and technology. Since integrated circuits are key components of electronic devices, they need to be protected after being installed on the circuit board of the electronic device. At present, people use integrated circuit packaging brackets to package integrated circuits. The specific method is to fix the integrated circuit on a substrate used to carry the integrated circuit, and then use connecting wires to connect the connection points of the integrated circuit to the pins. The external device is connected to the integrated circuit through the pins, and then the integrated circuit and part of the pins are packaged together with a plastic shell to protect the integrated circuit.
[0003] In the related art, reference may be made to the Chinese patent with the announcement number CN219017630U, which specifically discloses an integrated circuit packaging shell. When the integrated circuit packaging shell is used, it is packaged by adopting a sliding engagement method. When packaging, the integrated circuit is slid into the side plate, and then the bottom plate and the side plate are pushed into the shell, so that the fixing rod is locked by the locking component in the bottom plate, and the packaging of the integrated circuit is completed, which reduces the packaging procedure, reduces the dependence on the packaging machine, reduces the packaging cost, and increases the practical performance.
[0004] There are some shortcomings in the use of the above-mentioned integrated circuit packaging shell: although the shell and the bottom plate can be installed by sliding plug-in, the positioning of the integrated circuit body is insufficient, too much emphasis is placed on the sealing during packaging, and the protection of the gold fingers on the sides of the integrated circuit body is ignored, which can easily cause damage to the integrated circuit body. Therefore, an integrated circuit sealed shell is now needed. Utility Model Content
[0005] The utility model aims to provide a sealed housing for an integrated circuit, which can connect a connection seat at the upper end of a pin with a gold finger at the side of an integrated circuit body, and protect the gold finger through a protective pressure plate at the bottom of a sealing pressure plate, so as to solve the technical problems mentioned in the background technology.
[0006] To achieve the above object, the utility model provides the following technical solutions: an integrated circuit sealed housing, comprising a protective housing, an air change box is embedded in the bottom of the protective housing, and two sets of protective frames are symmetrically installed on the inner wall of the protective housing;
[0007] The front and rear side surfaces of the protective shell are equidistantly provided with a plurality of sealed card slots, each of which has a group of pins embedded therein, and each of which has a group of connecting seats installed on the top of the pins, and each group of connecting seats extends into the protective shell and is inserted into the surface of the protective frame;
[0008] An integrated circuit body is mounted inside the protective shell, and gold fingers are arranged on both sides of the integrated circuit body, and the gold fingers are correspondingly inserted into the inside of each group of connection sockets;
[0009] A sealing pressure plate is clamped and installed on the top of the protective shell, and a plurality of groups of protection pressure plates are arranged at the bottom of the sealing pressure plate. The protection pressure plates are movably pressed against the surface of the gold finger.
[0010] Preferably, a bottom groove is provided at the bottom of the protective shell, an air exchange rack is fitted inside the bottom groove, the air exchange box is installed through the center of the air exchange rack, and two groups of limit grooves are symmetrically provided on the front and rear ends of the upper end of the protective shell.
[0011] Preferably, two groups of placement racks are symmetrically mounted on the inner wall of the protective shell, a group of baffles are respectively mounted on the four inflection points of the inner wall of the protective shell, and the left and right ends of the integrated circuit body are placed inside the corresponding side placement racks.
[0012] Preferably, a plurality of docking grooves are provided on the upper surface of the protection frame corresponding to the positions of the respective groups of sealing slots, and a plurality of through holes are provided on both sides of the protection shell corresponding to the positions of the respective groups of docking grooves.
[0013] Preferably, two groups of clamping plates are symmetrically installed on the front and rear sides of the sealing pressure plate, and the sealing pressure plate is fitted against the surface of the baffle plate and movably clamped into the interior of the protective shell.
[0014] Preferably, the clamping plate is inserted into the limiting groove, and the sealing pressure plate is provided with threaded holes corresponding to the positions of each group of baffles, connecting bolts are installed in the threads inside the threaded holes, and the ends of the threaded holes are bolted into the inside of the baffles.
[0015] Preferably, two groups of positioning plates are symmetrically installed on the lower surface of the sealing pressure plate, and several groups of positioning pressure blocks are equidistantly installed on the bottom of each group of positioning plates. Several groups of elastic push rods are equidistantly installed on the outer sides of the positioning plates on each side of the lower surface of the sealing pressure plate, and each group of protective pressure plates is correspondingly installed at the bottom of each group of elastic push rods.
[0016] Compared with the prior art, the beneficial effects of the utility model are:
[0017] The temperature inside the protective shell is exchanged by the air exchange frame installed at the bottom of the protective shell and the air exchange box in the middle of the air exchange frame, thereby ensuring the high efficiency of the integrated circuit body inside the protective shell during use. At the same time, the docking groove opened on the upper surface of the protective frame limits the connection seat, and the connection seat is used to complete the limit protection of each group of gold fingers. After the sealing pressure plate is installed, the elastic push rod and the protection pressure plate are pressed down to contact the gold fingers, further improving the limit of the gold fingers to ensure the stability of the use of the gold fingers. At the same time, after the sealing pressure plate is installed, the positioning pressure block can press the integrated circuit body, making the use of the gold fingers more stable and reducing the damage of the gold fingers. When the integrated circuit is sealed and protected, the stability of the integrated circuit and the safety of the use of the gold fingers can be better guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a schematic diagram of the structure of the utility model;
[0019] Figure 2 This is a schematic diagram of the disassembly of the sealing pressure plate installation structure of the utility model;
[0020] Figure 3 This is a schematic diagram of the disassembly of the installation structure of the integrated circuit body of the utility model;
[0021] Figure 4 This is a schematic diagram of the split pin installation structure of the utility model;
[0022] Figure 5 This is a schematic diagram of the installation structure of the air change box of the utility model;
[0023] Figure 6 This is a schematic diagram of the bottom structure of the sealing pressure plate of the utility model.
[0024] In the figure: 1. Protective shell; 2. Bottom slot; 3. Air exchange rack; 4. Air exchange box; 5. Placement rack; 6. Baffle; 7. Protective rack; 8. Docking slot; 9. Perforation; 10. Sealing card slot; 11. Pin; 12. Connecting seat; 13. Limiting slot; 14. Integrated circuit body; 15. Gold finger; 16. Sealing pressure plate; 17. Card plate; 18. Threaded hole; 19. Positioning plate; 20. Positioning block; 21. Elastic push rod; 22. Protective pressure plate; 23. Connecting bolt. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0026] The utility model provides: an integrated circuit sealed housing, such as Figure 1-Figure 6 As shown, it includes a protective shell 1, an air change box 4 is embedded and installed at the bottom of the protective shell 1, and two groups of protective frames 7 are symmetrically installed on the front and rear inner walls of the protective shell 1; a number of groups of sealing slots 10 are equidistantly provided on the front and rear side surfaces of the protective shell 1, a group of pins 11 are embedded and installed inside each group of sealing slots 10, a group of connecting seats 12 are installed on the top of each group of pins 11, and each group of connecting seats 12 extends into the protective shell 1 and is snapped into the surface of the protective frame 7; an integrated circuit body 14 is snap-fitted and installed inside the protective shell 1, and gold fingers 15 are arranged on both sides of the integrated circuit body 14, and the gold fingers 15 are correspondingly snapped into the inside of each group of connecting seats 12; a sealing pressure plate 16 is snap-fitted and installed on the top of the protective shell 1, and a number of protection pressure plates 22 are arranged at the bottom of the sealing pressure plate 16, and the protection pressure plates 22 are movably pressed against the surface of the gold fingers 15.
[0027] Preferably, a bottom groove 2 is opened at the bottom of the protective shell 1, and an air exchange rack 3 is installed in the inside of the bottom groove 2. An air exchange box 4 is installed through the center of the air exchange rack 3. Two groups of limiting grooves 13 are opened symmetrically on the front and rear of the upper end face of the protective shell 1. The bottom groove 2 opened at the bottom of the protective shell 1 limits the air exchange rack 3, so that the air exchange box 4 installed in the middle of the air exchange rack 3 can smoothly exchange the internal temperature of the protective shell 1, thereby ensuring the high efficiency of the use of the integrated circuit body 14.
[0028] Furthermore, two groups of placement racks 5 are symmetrically installed on the inner wall of the protective shell 1, and a group of baffles 6 are respectively installed at the four inflection points of the inner wall of the protective shell 1. The left and right ends of the integrated circuit body 14 are placed inside the corresponding side placement racks 5. The placement racks 5 installed on both sides of the inner wall of the protective shell 1 limit the integrated circuit body 14, so that the gold fingers 15 installed at both ends of the integrated circuit body 14 can contact the connecting seat 12 on the upper part of the protective frame 7, thereby completing the limiting of the integrated circuit body 14 and protecting the gold fingers 15 at the same time.
[0029] Furthermore, a plurality of docking grooves 8 are provided on the upper surface of the protection frame 7 corresponding to the positions of each group of sealing grooves 10, and a plurality of through holes 9 are provided on both sides of the protection shell 1 corresponding to the positions of each group of docking grooves 8. The sealing grooves 10 provided on the outer side of the protection shell 1 and the through holes 9 provided through the protection shell 1 enable the pins 11 and the connection socket 12 to be used stably, so that the connection socket 12 can extend into the interior of the protection shell 1 and be connected with the docking grooves 8. By limiting the gold finger 15 by the connection socket 12, the pin 11 can be stably connected to the outside, thereby completing the use of the integrated circuit body 14.
[0030] It is worth mentioning that two groups of card plates 17 are symmetrically installed on the front and rear sides of the sealing pressure plate 16. The sealing pressure plate 16 is fitted against the surface of the baffle plate 6 and movably inserted into the protective shell 1. The card plate 17 is inserted into the limiting groove 13. The sealing pressure plate 16 is provided with threaded holes 18 corresponding to the positions of each group of baffle plates 6. The threaded holes 18 are threadedly installed with connecting bolts 23, and the ends of the threaded holes 18 are bolted into the baffle plate 6. The sealing pressure plate 16 is placed against the baffle plate 6 and is connected to the protective shell 1 through the limiting groove 13, thereby better ensuring the protection of the integrated circuit body 14.
[0031] In addition, two groups of positioning plates 19 are symmetrically installed on the lower surface of the sealing pressure plate 16, and several groups of positioning blocks 20 are equidistantly installed at the bottom of each group of positioning plates 19. Several groups of elastic push rods 21 are equidistantly installed on the lower surface of the sealing pressure plate 16 outside the positioning plates 19 on each side, and each group of protective pressure plates 22 is correspondingly installed at the bottom of each group of elastic push rods 21. The positioning plate 19 installed at the bottom of the sealing pressure plate 16 limits the positioning blocks 20. By fixing the position of the sealing pressure plate 16, the positioning blocks 20 can stably press down the integrated circuit body 14, so that the position of the integrated circuit body 14 in the protective shell 1 is more stable, and the position of the fitting placement frame 5 is more secure. The elastic push rod 21 has a certain elasticity, which can make the protective pressure plate 22 press down the gold finger 15 to fix the gold finger 15 at the position of the connecting seat 12, thereby improving the protection of the gold finger 15.
[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A sealed housing for an integrated circuit, characterized in that: It comprises a protective shell (1), a wind box (4) is embedded in the bottom of the protective shell (1), and two sets of protective frames (7) are symmetrically installed on the inner wall of the protective shell (1); The front and rear side surfaces of the protective shell (1) are equidistantly provided with a plurality of sealing slots (10), each of which is embedded with a group of pins (11), and each of which is mounted at the top of a group of connecting seats (12), and each group of connecting seats (12) extends into the protective shell (1) and is inserted into the surface of the protective frame (7); An integrated circuit body (14) is mounted inside the protective shell (1), and gold fingers (15) are arranged on both sides of the integrated circuit body (14), and the gold fingers (15) are correspondingly inserted into the inside of each group of connection sockets (12); A sealing pressure plate (16) is clamped and installed at the top of the protective shell (1), and a plurality of groups of protection pressure plates (22) are arranged at the bottom of the sealing pressure plate (16). The protection pressure plates (22) are movably pressed against the surface of the gold finger (15).
2. The integrated circuit sealed package according to claim 1, characterized in that: The bottom of the protective shell (1) is provided with a bottom groove (2), an air exchange frame (3) is fitted inside the bottom groove (2), the air exchange box (4) is installed through the center of the air exchange frame (3), and two groups of limit grooves (13) are symmetrically provided on the front and rear ends of the upper end of the protective shell (1).
3. The integrated circuit sealed package according to claim 2, characterized in that: Two groups of placement racks (5) are symmetrically mounted on the inner wall of the protective shell (1), a group of baffles (6) are respectively mounted at four inflection points of the inner wall of the protective shell (1), and the left and right ends of the integrated circuit body (14) are placed inside the corresponding side placement racks (5).
4. The integrated circuit sealed package according to claim 3, characterized in that: The upper surface of the protection frame (7) is provided with a plurality of docking grooves (8) corresponding to the positions of the respective groups of sealing slots (10), and the two sides of the protection shell (1) are provided with a plurality of through holes (9) corresponding to the positions of the respective groups of docking grooves (8).
5. The integrated circuit sealed package according to claim 4, characterized in that: Two groups of clamping plates (17) are symmetrically mounted on the front and rear sides of the sealing pressure plate (16), and the sealing pressure plate (16) is fitted on the surface of the baffle plate (6) and movably clamped into the interior of the protective housing (1).
6. The integrated circuit sealed package according to claim 5, characterized in that: The clamping plate (17) is inserted into the limiting groove (13); the sealing pressure plate (16) is provided with threaded holes (18) corresponding to the positions of each group of baffles (6); the threaded holes (18) are internally threaded with connecting bolts (23), and the ends of the threaded holes (18) are bolted into the inside of the baffles (6).
7. The integrated circuit sealed package according to claim 6, characterized in that: Two groups of positioning plates (19) are symmetrically installed on the lower surface of the sealing pressure plate (16), and a plurality of groups of positioning pressure blocks (20) are equidistantly installed at the bottom of each group of positioning plates (19). A plurality of groups of elastic push rods (21) are equidistantly installed on the lower surface of the sealing pressure plate (16) outside the positioning plates (19) on each side, and each group of protection pressure plates (22) is correspondingly installed at the bottom of each group of elastic push rods (21).
Citation Information
Patent Citations
Integrated circuit packaging shell
CN219017630U