Optocoupler packaging structure

Abstract

The utility model discloses an optocoupler packaging structure, which relates to the technical field of photoelectric application and comprises an optocoupler body, two groups of mutually symmetrical pins are arranged on two sides of the optocoupler body, welding parts are arranged at extending ends of the pins, plugs are arranged at the bottom ends of the welding parts, and the pins are connected with the optocoupler body. A plurality of grooves are formed in the bottom end of the welding part and located on one side of the plug, an anti-skid mechanism is arranged on the top surface of the welding part, a first heat dissipation mechanism is arranged on the top surface of the optocoupler body, and second heat dissipation mechanisms are arranged on the two sides of the optocoupler body. The optical coupler body is used for containing more welding flux, so that the welding strength of the pins and the welding flux is enhanced, the welding stability is improved, the first heat dissipation mechanism and the second heat dissipation mechanism can conduct heat dissipation on the optical coupler body, and the overload problem caused by too high temperature in the using process is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of photoelectric application, in particular to an optical coupling packaging structure. Background Art

[0002] Optocoupler is also called photoelectric isolator or optocoupler, or optocoupler for short. It is a device that uses light as a medium to transmit electrical signals. It usually includes a light-emitting end and a receiving end packaged in the same tube shell. When an electrical signal is added to the input end, the infrared emitting chip emits light, and the output photosensitive chip generates a photocurrent after receiving the light, which flows out from the output end, thereby realizing the conversion of electricity, light and electricity. Optocouplers are widely used in digital circuits because of their small size, long life, no contact, strong anti-interference ability, high insulation strength between output and input, and unidirectional signal transmission.

[0003] Currently, the bottom surface of the optocoupler pin is designed to be a smooth full plane, and the pin contact area is small, which easily causes the optocoupler pin to detach from the solder, affecting product performance and increasing the cost of use.

[0004] Based on this, an optical coupler packaging structure is now provided to eliminate the drawbacks of the existing devices. Utility Model Content

[0005] The utility model aims to provide an optocoupler packaging structure to solve the problem that the existing pin contact area is small, the optocoupler pin is easily separated from the solder, the product performance is affected, and the use cost is high.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] An optocoupler packaging structure comprises an optocoupler body, two groups of mutually symmetrical pins are arranged on both sides of the optocoupler body, a welding portion is arranged at the extending end of the pin, a plug is arranged at the bottom end of the welding portion, a plurality of grooves are arranged at the bottom end of the welding portion located on one side of the plug, an anti-slip mechanism is arranged on the top surface of the welding portion, a first heat dissipation mechanism is arranged on the top surface of the optocoupler body, and second heat dissipation mechanisms are arranged on both sides of the optocoupler body.

[0008] On the basis of the above technical solutions, the present invention also provides the following optional technical solutions:

[0009] In an optional solution: the anti-slip mechanism includes anti-slip grooves, and the anti-slip grooves are evenly distributed on the top surface of the welding part.

[0010] In an optional solution: notches are provided on both sides of the pin.

[0011] In an optional solution: the first heat dissipation mechanism includes a ceramic heat sink, and the ceramic heat sink is fixedly connected to the top of the optocoupler body.

[0012] In an optional solution: the second heat dissipation mechanism includes heat dissipation windows, and the heat dissipation windows are symmetrically arranged on both sides of the optocoupler body.

[0013] In an optional solution: a dust cover is provided on the outer side of the heat dissipation window, and the outer end of the dust cover is fixedly connected to the side wall of the optical coupler body through a plurality of connecting rods.

[0014] In an optional solution: a gap is left between the dust cover and the heat dissipation window.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0016] The utility model is provided with a welding part at the extension end of the pin, a plug is provided at the bottom end of the welding part, a plurality of grooves are provided at the bottom end of the welding part on one side of the plug, an anti-slip mechanism is provided on the top surface of the welding part, a first heat dissipation mechanism is provided on the top surface of the optocoupler body, and second heat dissipation mechanisms are provided on both sides of the optocoupler body. When the plug is inserted into the circuit board, the grooves can increase the bonding area between the welding part and the solder, and are used to accommodate more solder, so as to strengthen the welding strength between the pin and the solder and improve the stability of the welding. The first heat dissipation mechanism and the second heat dissipation mechanism can dissipate the heat of the optocoupler body to prevent overload problems caused by excessively high temperature during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of the utility model from the first perspective.

[0018] Figure 2 This is a schematic diagram of the overall structure of the utility model from a second viewing angle.

[0019] Figure 3 This is a schematic diagram of the overall structure of the utility model from a third viewing angle.

[0020] Figure 4 It is a schematic diagram of the heat dissipation window structure of the utility model.

[0021] Notes on the figure numbers: 1. Optocoupler body; 2. Ceramic heat sink; 3. Pin; 4. Notch; 5. Welding part; 6. Anti-slip pattern; 7. Groove; 8. Plug; 9. Heat dissipation window; 10. Dust cover; 11. Connecting rod. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0023] Example 1

[0024] In one embodiment, Figure 1-Figure 4As shown, an optocoupler packaging structure includes an optocoupler body 1, two groups of mutually symmetrical pins 3 are arranged on both sides of the optocoupler body 1, a welding portion 5 is arranged at the extended end of the pin 3, a plug 8 is arranged at the bottom end of the welding portion 5, a plurality of grooves 7 are arranged at the bottom end of the welding portion 5 located on one side of the plug 8, an anti-slip mechanism is arranged on the top surface of the welding portion 5, a first heat dissipation mechanism is arranged on the top surface of the optocoupler body 1, and second heat dissipation mechanisms are arranged on both sides of the optocoupler body 1, the grooves 7 can increase the bonding area between the welding portion 5 and the solder, and improve the stability of welding, and the first heat dissipation mechanism and the second heat dissipation mechanism can dissipate heat for the optocoupler body.

[0025] In one embodiment, Figure 1 As shown, the anti-skid mechanism includes anti-skid patterns 6, which are evenly distributed on the top surface of the welding part 5. The anti-skid patterns 6 have an anti-skid effect to prevent the surface of the welding part 5 from being too smooth during welding, which is not conducive to positioning and affects the welding efficiency.

[0026] In one embodiment, Figure 1 As shown, notches 4 are provided on both sides of the pin 3, which can reduce material usage and reduce costs.

[0027] In one embodiment, Figure 1 As shown, the first heat dissipation mechanism includes a ceramic heat sink 2, which is located at the top of the optocoupler body 1 and fixedly connected. The ceramic heat sink 2 can quickly dissipate heat to prevent overload problems caused by excessive temperature during use.

[0028] In one embodiment, Figure 3 and Figure 4 As shown, the second heat dissipation mechanism includes heat dissipation windows 9, which are symmetrically arranged on both sides of the optocoupler body 1, and the heat dissipation windows 9 have a heat dissipation function.

[0029] Example 2

[0030] In one embodiment, Figure 1 and Figure 3 As shown, a dust cover 10 is arranged outside the heat dissipation window 9, and the outer end of the dust cover 10 is fixedly connected to the side wall of the optocoupler body 1 through a plurality of connecting rods. The dust cover 10 can prevent dust from entering the interior of the optocoupler body 1 through the heat dissipation window 9.

[0031] In one embodiment, Figure 3 As shown, there is a gap between the dust cover 10 and the heat dissipation window 9, so that the dust protection of the dust cover 10 is not affected during the heat dissipation process.

[0032] Working principle: The above embodiment discloses an optocoupler packaging structure. When the LED emits light and the light shines on the photoelectric sensor, the photoelectric sensor starts to flow current. In this system, the input light is proportional to the current at the output end. When the LED is powered, the LED emits light, and the light falls on the base of the phototransistor. After the light falls on the base of the phototransistor, it will be activated and can control the output circuit connected to the transistor. During installation, the plug 8 at the bottom of the welding part 5 on the pin 3 is inserted into the circuit board. The welding part 5 is soldered to the circuit board through solder. The groove 7 at the bottom of the welding part 5 can increase the bonding area between the welding part 5 and the solder, which is used to accommodate more solder to strengthen the welding strength between the pin 3 and the solder, improve the stability of welding, and accelerate heat dissipation through the first heat dissipation mechanism and the second heat dissipation mechanism to prevent overload problems caused by excessive temperature during use.

[0033] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. An optocoupler packaging structure, comprising an optocoupler body (1), wherein two groups of mutually symmetrical pins (3) are arranged on both sides of the optocoupler body (1), characterized in that: The extending end of the pin (3) is provided with a welding portion (5), the bottom end of the welding portion (5) is provided with a plug (8), the bottom end of the welding portion (5) is provided with a plurality of grooves (7) on one side of the plug (8), the top surface of the welding portion (5) is provided with an anti-slip mechanism, the top surface of the optical coupler body (1) is provided with a first heat dissipation mechanism, and the two sides of the optical coupler body (1) are provided with second heat dissipation mechanisms.

2. The optical coupler packaging structure according to claim 1, characterized in that: The anti-slip mechanism comprises anti-slip patterns (6), and the anti-slip patterns (6) are evenly distributed on the top surface of the welding portion (5).

3. The optical coupler packaging structure according to claim 1, characterized in that: Notches (4) are provided on both sides of the pin (3).

4. The optical coupler packaging structure according to claim 1, characterized in that: The first heat dissipation mechanism comprises a ceramic heat sink (2), and the ceramic heat sink (2) is located at the top of the optical coupler body (1) and is fixedly connected.

5. The optical coupler packaging structure according to claim 1, characterized in that: The second heat dissipation mechanism comprises heat dissipation windows (9), and the heat dissipation windows (9) are symmetrically arranged on both sides of the optical coupler body (1).

6. The optical coupler packaging structure according to claim 5, characterized in that: A dust cover (10) is arranged outside the heat dissipation window (9), and the outer end of the dust cover (10) is fixedly connected to the side wall of the optical coupler body (1) via a plurality of connecting rods.

7. The optical coupler packaging structure according to claim 6, characterized in that: A gap is left between the dust cover (10) and the heat dissipation window (9).

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