Package structure

Abstract

The utility model relates to a packaging structure. The packaging structure includes: a substrate, the substrate includes a functional area and a peripheral area distributed around the periphery of the functional area; a functional chip mounted above the functional area of ​​the substrate; a first electrical connection structure, located above the peripheral area of ​​the substrate, the first electrical connection structure includes a first dielectric layer and a plurality of first conductive connection posts located in the first dielectric layer, the first conductive connection posts are electrically connected to the substrate, the first dielectric layer has a groove on the surface facing the substrate, and the groove is located between adjacent first conductive connection posts. The utility model reduces the problem of plastic encapsulation mold flow back packaging, improves the plastic encapsulation quality of the functional chip, and increases the manufacturing yield of the packaging structure.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to a packaging structure. Background Art

[0002] In a double-sided system-in-Package (SiP) structure or a 3D stacked packaging structure, an electrical connection structure with an E-Bar (Embedded bar) is used to connect different substrates (such as a main substrate and a sub-substrate), and the E-Bar is used as an input / output (I / O) pin. As the double-sided system-in-Package structure or the 3D stacked packaging structure becomes more and more complex, its integration becomes higher and higher, and the number of input / output pins also increases synchronously, which means that the electrical connection structure not only needs to be set at multiple sides of the substrate, but also multiple electrical connection structures are distributed around the periphery of the functional chip and the functional device. During the plastic encapsulation process, since the input / output pins are densely distributed on the periphery of the functional chip and the functional device, the flow rate of the plastic encapsulation mold flow on the cutting path is relatively fast. The densely distributed input / output pins will block the plastic encapsulation mold flow, which will easily cause a back-packing phenomenon, resulting in poor filling of the plastic encapsulation mold flow in the middle area, the appearance of air holes and other problems, thereby causing poor plastic encapsulation of the functional chip and the functional device, reducing the performance of the packaging structure and affecting the yield of the packaging structure.

[0003] Therefore, how to reduce the problem of plastic mold flow back during the plastic packaging process, improve the quality of plastic packaging, and thus increase the manufacturing yield of the packaging structure is a technical problem that needs to be solved urgently. Summary of the invention

[0004] The utility model provides a packaging structure, which is used for reducing the problem of plastic molding mold flow back-wrapping during the plastic molding process, improving the plastic molding quality, and thus increasing the manufacturing yield of the semiconductor structure.

[0005] According to some embodiments, the utility model provides a packaging structure, including:

[0006] A substrate, the substrate comprising a functional area and a peripheral area distributed around the periphery of the functional area;

[0007] A functional chip is mounted on the functional area of ​​the substrate;

[0008] The first electrical connection structure is located on the peripheral area of ​​the substrate, the first electrical connection structure includes a first dielectric layer and a plurality of first conductive connection posts located in the first dielectric layer, the first conductive connection posts are electrically connected to the substrate, and the first dielectric layer has a concave surface facing the substrate.

[0009] A groove is formed between adjacent first conductive connecting pillars.

[0010] In some embodiments, it also includes:

[0011] First solder balls are located on the peripheral area of ​​the substrate, one end of each of the first solder balls is electrically connected to the first conductive connection column, and the other end of each of the first solder balls is electrically connected to the substrate;

[0012] A plastic encapsulation layer is at least located on the substrate, and the plastic encapsulation layer encapsulates the functional chip, and the plastic encapsulation layer fills the groove and the gap between the first dielectric layer and the substrate.

[0013] In some embodiments, the first electrical connection structure is located above the substrate along a first direction;

[0014] There are a plurality of grooves, the plurality of grooves are arranged along a second direction, and any one of the grooves is located between two adjacent first conductive connection pillars, and the second direction intersects the first direction.

[0015] In some embodiments, a depth of the groove is less than a height of the first electrical connection structure.

[0016] In some embodiments, the first dielectric layer includes a body layer, a first cover layer located on a side of the body layer facing the substrate, and a second cover layer located on a side of the body layer facing away from the substrate;

[0017] The groove penetrates the first covering layer and extends into the body layer.

[0018] In some embodiments, the depth of the groove is 1 / 5 to 2 / 3 of the height of the first electrical connection structure.

[0019] In some embodiments, the molding layer includes molding compound particles, and the width of the groove is greater than or equal to twice the diameter of the molding compound particles.

[0020] In some embodiments, the first electrical connection structure is located above the substrate along a first direction, and two first electrical connection structures are located on the peripheral region at opposite sides of the functional region along a third direction, and the third direction intersects with the first direction.

[0021] In some embodiments, for two first electrical connection structures located at opposite sides of the functional area along the third direction, the groove in one of the first electrical connection structures is aligned with the groove in the other of the first electrical connection structures along the third direction.

[0022] In some embodiments, a plurality of the first electrical connection structures are disposed above the peripheral region of the substrate, and the plurality of the first electrical connection structures are distributed around the periphery of the functional region.

[0023] In some embodiments, it also includes:

[0024] A second electrical connection structure is located above the peripheral area of ​​the substrate and on one side or two opposite sides of the functional area along the second direction, the second electrical connection structure includes a second dielectric layer, a plurality of second conductive connection pillars located in the second dielectric layer, and second solder balls located at ends of the second conductive connection pillars, one end of the second solder ball is electrically connected to the second conductive connection pillar, and the other end is electrically connected to the substrate, the surface of the second dielectric layer located between adjacent second solder balls is flat, and the second direction intersects both the first direction and the third direction.

[0025] The packaging structure provided by the utility model is provided with a first electrical connection structure above the peripheral area of ​​the substrate, wherein the first electrical connection structure includes a first dielectric layer and a plurality of first conductive connection posts located in the first dielectric layer, and the first dielectric layer has a groove on the surface facing the substrate, and the groove is located between adjacent first conductive connection posts, so that during the plastic encapsulation process, the plastic encapsulation mold flow can flow along the groove to the functional area, reducing the plastic encapsulation mold flow backpacking problem, thereby improving the plastic encapsulation quality of the functional chip in the functional area, and also reducing the risk of cold soldering between the first electrical connection structure and the substrate, thereby improving the manufacturing yield of the packaging structure. At the same time, since the plastic encapsulation mold flow flows along the groove to the functional area, the plastic encapsulation layer formed by the plastic encapsulation mold flow can also be filled in the groove, thereby enhancing the bonding strength between the first electrical connection structure and the substrate, which helps to further improve the overall structural stability of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Attached Figure 1 It is a top view schematic diagram of a packaging structure in a specific implementation mode of the utility model;

[0027] Attached Figure 2 It is a top view schematic diagram of another packaging structure in a specific implementation manner of the utility model;

[0028] Attached Figure 3 It is a cross-sectional schematic diagram of a packaging structure in a specific implementation mode of the utility model;

[0029] Attached Figure 4 It is a cross-sectional schematic diagram of another packaging structure in a specific implementation manner of the utility model;

[0030] Attached Figure 5It is a cross-sectional schematic diagram of a first electrical connection structure in a specific implementation mode of the utility model;

[0031] Attached Figure 6 It is a cross-sectional schematic diagram of another first electrical connection structure in a specific implementation manner of the utility model. DETAILED DESCRIPTION

[0032] The specific implementation of the packaging structure provided by the utility model is described in detail below with reference to the accompanying drawings.

[0033] This specific implementation provides a packaging structure, Figure 1 is a top view schematic diagram of a packaging structure in a specific implementation mode of the utility model, Figure 3 is a schematic cross-sectional view of a packaging structure in a specific implementation mode of the utility model, Figure 5 Schematic diagram of a cross-section of a first electrical connection structure in a specific embodiment of the utility model. Figure 1 , Figure 3 and Figure 5 As shown, the packaging structure includes:

[0034] A substrate 10, wherein the substrate 10 includes a functional area and a peripheral area distributed around the periphery of the functional area;

[0035] A functional chip 13 is mounted on the functional area of ​​the substrate 10;

[0036] The first electrical connection structure 11 is located on the peripheral area of ​​the substrate 10. The first electrical connection structure 11 includes a first dielectric layer 111 and a plurality of first conductive connection pillars 112 located in the first dielectric layer 111. The first conductive connection pillars 112 are electrically connected to the substrate 10. The first dielectric layer 111 has a groove 113 on the surface facing the substrate 10, and the groove 113 is located between adjacent first conductive connection pillars 112.

[0037] Specifically, if Figure 1 , Figure 3 and Figure 5As shown, the substrate 10 includes a top surface and a bottom surface that are relatively distributed along the first direction D1, and the functional chip 13 and the first electrical connection structure 11 are both located on the top surface of the substrate 10. In one example, the substrate 10 includes a plurality of repeating structural units arranged in an array along the second direction D2 and the third direction D3, and each of the repeating structural units includes the functional area and the peripheral area distributed around the periphery of the functional area. For example, the functional area is located in the middle of the repeating structural unit, and the peripheral area is located at the edge of the repeating structural unit. In one example, a plurality of the functional chips 13 and at least one functional device 14 are mounted on the functional area. The first electrical connection structure 11 is located on the peripheral area of ​​the substrate 10, and the first conductive connection column 112 is electrically connected to the substrate 10 as an input / output pin, and is used to lead out the signal in the substrate 10 or transmit the control signal to the substrate 10. The first dielectric layer 111 includes a top surface and a bottom surface that are relatively distributed along the first direction D1, and the bottom surface of the first dielectric layer 111 faces the substrate 10. The groove 113 extends from the bottom surface of the first dielectric layer 111 along the first direction D1 toward the inside of the first dielectric layer 111. The groove 113 is located between adjacent first conductive connecting pillars 112, thereby avoiding affecting the electrical connection performance between the first conductive connecting pillars 112 and the substrate 10. Figure 1 In the top view shown, the groove 113 is not visible. In order to clearly show the relative position relationship between the groove 113 and the first conductive connection column 112, Figure 1 The position of the groove 113 is shown in FIG.

[0038] In this specific embodiment, the groove 113 is provided on the side of the first dielectric layer 111 in the first electrical connection structure 11 facing the substrate 10, so that during the plastic encapsulation process, the plastic encapsulation mold flow can flow from the peripheral area to the functional area along the groove 113, thereby reducing the blocking effect of the first electrical connection structure 11 on the plastic encapsulation mold flow, optimizing the flow of the plastic encapsulation mold flow, reducing the plastic encapsulation mold flow backpacking problem, avoiding the problems of poor plastic encapsulation or bubbles in the functional area, thereby improving the plastic encapsulation quality of the functional chip in the functional area, reducing the risk of cold solder joints between the first electrical connection structure and the substrate, and improving the manufacturing yield of the packaging structure. At the same time, since the plastic encapsulation mold flow flows along the groove 113 to the functional area, the plastic encapsulation layer formed by the plastic encapsulation mold flow can also be filled in the groove 113, thereby enhancing the bonding strength between the first electrical connection structure 11 and the substrate 10, which helps to further improve the overall structural stability of the packaging structure.

[0039] In some embodiments, the packaging structure further includes:

[0040] First solder balls 30 are located on the peripheral area of ​​the substrate 10 , and one end of each of the first solder balls 30 is electrically connected to the first conductive connection pillar 112 , and the other end is electrically connected to the substrate 10 ;

[0041] The plastic encapsulation layer 35 is at least located on the substrate 10 . The plastic encapsulation layer 35 encapsulates the functional chip 13 , and the plastic encapsulation layer 35 fills the groove 113 and the gap between the first dielectric layer 111 and the substrate 10 .

[0042] Specifically, if Figure 3 and Figure 5 As shown, a plurality of first solder balls 30 are located on the bottom surface of the first dielectric layer 111, and one end of each first solder ball 30 is welded to the first conductive connection column 112 corresponding thereto, and the other end is welded to the substrate 10. The first solder ball 30 protrudes from the first dielectric layer 111 along the first direction D1, so that there is a gap between the bottom surface of the first dielectric layer 111 and the top surface of the substrate 10, so that the plastic molding flow flows to the functional area during the plastic molding process. The plastic molding flow flows from the peripheral area to the functional area along the gap between the first dielectric layer 111 and the substrate 10 and the groove 113, forming the plastic molding layer 35 that at least plastic molds the functional chip 13 and fills the groove 113 and the gap between the first dielectric layer 111 and the substrate 10. The provision of the groove 113 balances the stress of the first electrical connection structure 11, thereby ensuring the welding yield between the first solder ball 30 and the substrate 10 and reducing the risk of cold solder joints.

[0043] Attached Figure 4 is a cross-sectional schematic diagram of another packaging structure in a specific implementation mode of the utility model, Figure 6 is a cross-sectional schematic diagram of another first electrical connection structure in a specific embodiment of the utility model. Figure 4 and Figure 6 As shown, the first electrical connection structure 11 is located above the substrate 10 along the first direction D1;

[0044] There are multiple grooves 113 , and the multiple grooves 113 are arranged along the second direction D2 . Any of the grooves 113 is located between two adjacent first conductive connection pillars 112 . The second direction D2 intersects the first direction D1 .

[0045] For example, if Figure 1 , Figure 4 and Figure 6As shown, the first electrical connection structure 11 extends along the second direction D2, and the first electrical connection structure 11 has a plurality of the first conductive connection pillars 112 arranged at intervals along the second direction D2 and a plurality of the grooves 113 arranged at intervals along the second direction D2, and the grooves 113 and the first conductive connection pillars 112 are arranged alternately along the second direction D2. By providing a plurality of the grooves 113 in the first electrical connection structure 11, it is not only possible to further reduce the blocking effect of the first electrical connection structure 11 on the plastic encapsulation mold flow, thereby further optimizing the plastic encapsulation mold flow, but also to help improve the uniformity of the distribution of the plastic encapsulation mold flow in the functional area, so as to further improve the quality of plastic encapsulation. The plurality mentioned in this specific embodiment refers to more than two.

[0046] In some embodiments, the depth of the groove 113 is smaller than the height of the first conductive connection pillar 112 .

[0047] For example, the depth of the groove 113 along the first direction D1 is smaller than the height of the first electrical connection structure 11 along the first direction D1, thereby optimizing the plastic encapsulation mold flow while ensuring the stability of the first electrical connection structure 11.

[0048] In some embodiments, the first dielectric layer 111 includes a body layer 32, a first cover layer 31 located on a side of the body layer 32 facing the substrate 10, and a second cover layer 33 located on a side of the body layer 32 facing away from the substrate 10;

[0049] The groove 113 penetrates the first cover layer 31 and extends into the body layer 32 .

[0050] For example, if Figure 3-Figure 6 As shown, the first dielectric layer 111 includes the first covering layer 31, the main body layer 32 and the second covering layer 33 stacked in sequence along the first direction D1, wherein the materials of the first covering layer 31, the main body layer 32 and the second covering layer 33 are all insulating materials. The first conductive connection column 112 includes a top and a bottom that are relatively distributed along the first direction D1, and the bottom of the first conductive connection column 112 is electrically connected to the first solder ball 30. The second covering layer 33 has an opening 34 that exposes the top of the first conductive connection column 112, which is used to electrically connect the first conductive connection column 112 with other conductive elements. The groove 113 penetrates the first covering layer 31 along the first direction D1 and extends into the main body layer 32, and the groove 113 does not penetrate the main body layer 32 along the first direction D1, thereby avoiding affecting the stability of the first electrical connection structure 11.

[0051] In some embodiments, the depth of the groove 113 is 1 / 5 to 2 / 3 of the height of the first electrical connection structure 11. The height of the first electrical connection structure 11 may be the total thickness of the first dielectric layer 111 along the first direction D1. In one example, the depth of the groove 113 along the first direction D1 is 1 / 5 to 2 / 3 of the total thickness of the first dielectric layer 111 along the first direction D1 (i.e., the sum of the thicknesses of the first covering layer 31, the main layer 32, and the second covering layer 33 along the first direction D1), thereby further optimizing the plastic encapsulation mold flow and avoiding affecting the stability of the first electrical connection structure 11.

[0052] In order to further facilitate the smooth flow of the molding mold flow in the groove 113, in some embodiments, the molding layer 35 includes molding compound particles, and the width of the groove 113 is greater than or equal to twice the diameter of the molding compound particles.

[0053] In some embodiments, Figure 1 As shown, the first electrical connection structure 11 is located above the substrate 10 along a first direction D1, and two first electrical connection structures 11 are located on the peripheral areas at opposite sides of the functional area along a third direction D3, and the third direction D3 intersects with the first direction D1.

[0054] In some embodiments, for two first electrical connection structures 11 located on opposite sides of the functional area along the third direction D3, the groove 113 in one of the first electrical connection structures 11 is aligned with the groove 113 in the other first electrical connection structure 11 along the third direction D3.

[0055] In some embodiments, the packaging structure further includes:

[0056] The second electrical connection structure 12 is located above the peripheral area of ​​the substrate 10 and on one side or two opposite sides of the functional area along the second direction D2. The second electrical connection structure includes a second dielectric layer 121, a plurality of second conductive connection pillars 122 located in the second dielectric layer 121, and second solder balls located at ends of the second conductive connection pillars 122. One end of the second solder ball is electrically connected to the second conductive connection pillar 122, and the other end is electrically connected to the substrate 10. The surface of the second dielectric layer 121 located between adjacent second solder balls is flat, and the second direction D2 intersects with both the first direction D1 and the third direction.

[0057] For example, two of the first electrical connection structures 11 are distributed on opposite sides of the functional area along the third direction D3, and two of the second electrical connection structures 12 are distributed on opposite sides of the functional area along the second direction D2. The plastic mold flow flows from the peripheral area to the functional area along the third direction D3, and by aligning the grooves 113 in the two first electrical connection structures 11 distributed on opposite sides of the functional area along the third direction D3, the flow of the plastic mold flow along the third direction D3 can be smoother. No grooves are provided in the second dielectric layer 121 of the second electrical connection structure 12 to facilitate the flow of the plastic mold flow, so as to simplify the manufacturing process of the packaging structure, and help to arrange the second conductive connection pillars 122 more densely in the second electrical connection structure 12, thereby helping to further improve the integration of the packaging structure.

[0058] Attached Figure 2 Schematic diagram of another packaging structure in a specific embodiment of the utility model. Figure 2 In the top view shown, the groove 113 is not visible. In order to clearly show the relative position relationship between the groove 113 and the first conductive connection column 112, Figure 2 The position of the groove 113 is shown in FIG. In some other embodiments, a plurality of the first electrical connection structures 11 are provided above the peripheral area of ​​the substrate 10 , and the plurality of the first electrical connection structures 11 are distributed around the periphery of the functional area.

[0059] For example, if Figure 2 As shown, the four first electrical connection structures 11 are distributed around the functional area, so that the four first electrical connection structures 11 are distributed together around the periphery of the functional area, which can not only further optimize the molding mold flow, but also help to further eliminate bubbles in the molding process, thereby further improving the molding quality.

[0060] The packaging structure provided in this specific embodiment is provided with a first electrical connection structure above the peripheral area of ​​the substrate, wherein the first electrical connection structure includes a first dielectric layer and a plurality of first conductive connection pillars located in the first dielectric layer, and the first dielectric layer has a groove on the surface facing the substrate, and the groove is located between adjacent first conductive connection pillars, so that during the plastic encapsulation process, the plastic encapsulation mold flow can flow along the groove to the functional area, reducing the plastic encapsulation mold flow backpacking problem, thereby improving the plastic encapsulation quality of the functional chip in the functional area, reducing the risk of cold solder joints between the first electrical connection structure and the substrate, and improving the manufacturing yield of the packaging structure. At the same time, since the plastic encapsulation mold flow flows along the groove to the functional area, the plastic encapsulation layer formed by the plastic encapsulation mold flow can also be filled in the groove, thereby enhancing the bonding strength between the first electrical connection structure and the substrate, which helps to further improve the overall structural stability of the packaging structure.

[0061] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A packaging structure, characterized in that: include: A substrate, the substrate comprising a functional area and a peripheral area distributed around the periphery of the functional area; A functional chip is mounted on the functional area of ​​the substrate; A first electrical connection structure is located on the peripheral area of ​​the substrate, the first electrical connection structure includes a first dielectric layer and a plurality of first conductive connection pillars located in the first dielectric layer, the first conductive connection pillars are electrically connected to the substrate, and the first dielectric layer has a groove on the surface facing the substrate, and the groove is located between adjacent first conductive connection pillars.

2. The packaging structure according to claim 1, characterized in that: Also includes: First solder balls are located on the peripheral area of ​​the substrate, one end of each of the first solder balls is electrically connected to the first conductive connection column, and the other end of each of the first solder balls is electrically connected to the substrate; A plastic encapsulation layer is at least located on the substrate, and the plastic encapsulation layer encapsulates the functional chip, and the plastic encapsulation layer fills the groove and the gap between the first dielectric layer and the substrate.

3. The packaging structure according to claim 2, characterized in that: The first electrical connection structure is located above the substrate along a first direction; There are a plurality of grooves, the plurality of grooves are arranged along a second direction, and any one of the grooves is located between two adjacent first conductive connection pillars, and the second direction intersects the first direction.

4. The packaging structure according to claim 1, characterized in that: The depth of the groove is smaller than the height of the first electrical connection structure.

5. The packaging structure according to claim 1, characterized in that: The first dielectric layer includes a body layer, a first covering layer located on a side of the body layer facing the substrate, and a second covering layer located on a side of the body layer facing away from the substrate; The groove penetrates the first covering layer and extends into the body layer.

6. The packaging structure according to claim 1, characterized in that: The depth of the groove is 1 / 5 to 2 / 3 of the height of the first electrical connection structure.

7. The packaging structure according to claim 2, characterized in that: The molding layer includes molding compound particles, and the width of the groove is greater than or equal to twice the diameter of the molding compound particles.

8. The packaging structure according to claim 1, characterized in that: The first electrical connection structure is located above the substrate along a first direction, and two first electrical connection structures are located on the peripheral area at opposite sides of the functional area along a third direction, and the third direction intersects with the first direction.

9. The packaging structure according to claim 8, characterized in that: For the two first electrical connection structures located at opposite sides of the functional area along the third direction, the groove in one of the first electrical connection structures is aligned with the groove in the other of the first electrical connection structures along the third direction.

10. The packaging structure according to claim 1, characterized in that: A plurality of first electrical connection structures are disposed above the peripheral region of the substrate, and the plurality of first electrical connection structures are distributed around the periphery of the functional region.

11. The packaging structure according to claim 8, characterized in that: Also includes: A second electrical connection structure is located above the peripheral area of ​​the substrate and on one side or two opposite sides of the functional area along the second direction, the second electrical connection structure includes a second dielectric layer, a plurality of second conductive connection pillars located in the second dielectric layer, and second solder balls located at ends of the second conductive connection pillars, one end of the second solder ball is electrically connected to the second conductive connection pillar, and the other end is electrically connected to the substrate, the surface of the second dielectric layer located between adjacent second solder balls is flat, and the second direction intersects both the first direction and the third direction.

Images