Accurate Schottky diode packaging structure

Abstract

The utility model discloses a precise packaging structure of a Schottky diode, which comprises a packaging base, a packaging block, a Schottky chip, a first pin and a second pin, the packaging block is arranged above the packaging base, the Schottky chip is arranged in the packaging block, the first pin is arranged above the Schottky chip and extends to the outer side of the packaging block, and the second pin is arranged above the Schottky chip and extends to the outer side of the packaging block. The second pin is arranged below the Schottky chip and extends to the outer side of the packaging block, and the packaging base is provided with a first positioning pin upwards penetrating through the first pin and a second positioning pin upwards penetrating through the second pin. According to the precise packaging structure of the Schottky diode, the first pin and the second pin are positioned by using the first positioning pin and the second positioning pin on the packaging base, the position precision is high, the structural stability and the product percent of pass are improved, the structure is simple, and the cost is low.

Description

Technical Field

[0001] The utility model relates to the technical field of Schottky diode packaging, in particular to a Schottky diode precision packaging structure. Background Art

[0002] During the production process, Schottky diodes need to be packaged for protection. Depending on the packaging form, Schottky diodes are divided into leaded packaging and surface mount packaging.

[0003] The utility model with application number 202220648239.X discloses a shock-resistant Schottky diode, in which a Schottky chip is arranged in an insulating plastic package, and a first conductive plate and a second conductive plate are connected to the upper and lower ends of the Schottky chip respectively. The Schottky diode is protected by the insulating plastic package to ensure the structural stability of the first conductive plate and the second conductive plate. However, the structure is very complex and costly, and also affects the product qualification rate, and needs to be improved. Utility Model Content

[0004] The utility model aims to provide a Schottky diode precision packaging structure, improve the packaging accuracy and stability, and reduce costs.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A Schottky diode precision packaging structure comprises: a packaging base, a packaging block, a Schottky chip, a first pin and a second pin, wherein the packaging block is arranged above the packaging base, the Schottky chip is arranged in the packaging block, the first pin is arranged above the Schottky chip and extends to the outside of the packaging block, the second pin is arranged below the Schottky chip and extends to the outside of the packaging block, and a first positioning pin that penetrates the first pin upwards and a second positioning pin that penetrates the second pin upwards are arranged on the packaging base.

[0007] The first pin and the second pin extend to the same side or two opposite sides outside the packaging block.

[0008] Wherein, a first conductive adhesive in contact with the first pin is disposed on the top surface of the Schottky chip, and a second conductive adhesive in contact with the second pin is disposed on the bottom surface of the Schottky chip.

[0009] The first pin is provided with a first positioning hole corresponding to the first positioning pin, and the second pin is provided with a second positioning hole corresponding to the second positioning pin.

[0010] The first positioning pin is provided with a first limiting ring located below the first pin, and the second positioning pin is provided with a second limiting ring located below the second pin.

[0011] Wherein, the packaging base adopts an insulating plastic base.

[0012] Wherein, positioning holes are arranged at intervals at the bottom of the packaging base.

[0013] The beneficial effects of the utility model are as follows: a Schottky diode precision packaging structure, a specially designed packaging base, and a first positioning pin and a second positioning pin on the packaging base are used to position the first pin and the second pin, and the positioning is precise, which improves the stability of the Schottky chip, the first pin and the second pin during injection molding of the packaging block, has low production difficulty, is conducive to improving the product qualification rate, and has a simple structure and low production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the utility model. DETAILED DESCRIPTION

[0015] Combine the following Figure 1 The technical solution of the utility model is further illustrated by specific embodiments.

[0016] like Figure 1 The Schottky diode precision packaging structure shown includes: a packaging base 9, a packaging block 2, a Schottky chip 8, a first pin 3 and a second pin 10. The packaging base 9 adopts an insulating plastic base. The packaging base 9 is first injection molded, and then the packaging base 9 is placed in the mold of the packaging block 2 to perform injection molding of the packaging block 2. In this embodiment, the packaging block 2 is arranged above the packaging base 9, and positioning holes 11 are arranged at intervals at the bottom of the packaging base 9. The positioning holes 11 cooperate with the positioning pins in the injection mold of the packaging block 2 to position the packaging base 9.

[0017] The Schottky chip 8 is set in the packaging block 2, and the first pin 3 is set above the Schottky chip 8 and extends to the outside of the packaging block 2. In this embodiment, the top surface of the Schottky chip 8 is provided with a first conductive glue 1 in contact with the first pin 3, so as to fix and electrically connect the first pin 3 on the top surface of the Schottky chip 8.

[0018] The second pin 10 is arranged below the Schottky chip 8 and extends to the outside of the packaging block 2. In this embodiment, a second conductive glue 7 in contact with the second pin 10 is arranged on the bottom surface of the Schottky chip 8 to fix and electrically connect the second pin 10 on the bottom surface of the Schottky chip 8.

[0019] The first pin 3 and the second pin 10 can extend to the same side or opposite sides of the outside of the packaging block 2. In the present embodiment, the first pin 3 and the second pin 10 extend to opposite sides of the outside of the packaging block 2, which is beneficial to increase the distance between the first pin 3 and the second pin 10 and facilitate the subsequent welding and fixation on the circuit board.

[0020] A first positioning pin 4 that passes upward through the first pin 3 and a second positioning pin 12 that passes upward through the second pin 10 are provided on the packaging base 9. In the present embodiment, a first positioning hole 5 corresponding to the first positioning pin 4 is provided on the first pin 3, and a second positioning hole 14 corresponding to the second positioning pin 12 is provided on the second pin 10, thereby realizing lateral positioning of the first pin 3 and the second pin 10 in the packaging block 2 and improving positioning accuracy.

[0021] like Figure 1 As shown, in this embodiment, the first positioning pin 4 is provided with a first limiting ring 6 located below the first pin 3, and the second positioning pin 12 is provided with a second limiting ring 13 located below the second pin 10. The first limiting ring 6 and the second limiting ring 13 are used to perform longitudinal positioning of the first pin 3 and the second pin 10 in the packaging block 2, thereby further improving the packaging accuracy and reducing the deformation and misalignment problems of the first pin 3 and the second pin 10 during the packaging process.

[0022] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.

Claims

1. A Schottky diode precision packaging structure, characterized in that: include: A packaging base, a packaging block, a Schottky chip, a first pin and a second pin, wherein the packaging block is arranged above the packaging base, the Schottky chip is arranged in the packaging block, the first pin is arranged above the Schottky chip and extends to the outside of the packaging block, the second pin is arranged below the Schottky chip and extends to the outside of the packaging block, and the packaging base is provided with a first positioning pin that passes through the first pin upwards and a second positioning pin that passes through the second pin upwards.

2. The Schottky diode precision packaging structure according to claim 1, characterized in that: The first pin and the second pin extend to the same side or two opposite sides outside the packaging block.

3. The Schottky diode precision packaging structure according to claim 1, characterized in that: The top surface of the Schottky chip is provided with a first conductive adhesive in contact with the first pin, and the bottom surface of the Schottky chip is provided with a second conductive adhesive in contact with the second pin.

4. The Schottky diode precision packaging structure according to claim 1, characterized in that: The first pin is provided with a first positioning hole corresponding to the first positioning pin, and the second pin is provided with a second positioning hole corresponding to the second positioning pin.

5. The Schottky diode precision packaging structure according to claim 1, characterized in that: The first positioning pin is provided with a first limiting ring located below the first pin, and the second positioning pin is provided with a second limiting ring located below the second pin.

6. The Schottky diode precision packaging structure according to claim 1, characterized in that: The packaging base is an insulating plastic base.

7. The Schottky diode precision packaging structure according to claim 1, characterized in that: Positioning holes are arranged at intervals on the bottom of the packaging base.

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