A mobile phone integrated circuit board that is convenient for cleaning debris
By designing a structure including an outer frame, a collection frame and a mobile phone integrated circuit board body, the problem of difficult debris being cleaned during the repair of mobile phone integrated circuit board is solved, and the rapid collection and cleaning of debris is achieved, and the maintenance stability and efficiency are improved.
Patent Information
- Application Number
- CN202421511871.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-06-28
AI Technical Summary
During maintenance of existing mobile phone integrated circuit boards, it is difficult to clean up solder and other debris, resulting in abnormal noise during later use, affecting use.
A structure including an outer frame, a collection frame and a mobile phone integrated circuit board body is designed. There is a boss in the middle of the outer frame for installing the integrated circuit board body. The collection frame has a rectangular groove and a collection groove. The fast removal and reset of the collection frame is achieved through the clamping structure, which facilitates the collection and cleaning of debris.
It realizes rapid collection and cleaning of debris, improves the stability and efficiency of the maintenance process, and avoids abnormal noise problems caused by debris falling.
Smart Images
Figure CN222706527U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of mobile phone integrated circuit boards, in particular to a mobile phone integrated circuit board which is convenient for cleaning debris. Background Art
[0002] Mobile phones are indispensable items in users' daily lives. The mobile phone motherboard of a mobile phone is the mobile phone integrated circuit board, which is equipped with a CPU, graphics card, SIM card holder, circuit system, etc. One mobile phone corresponds to one mobile phone integrated circuit board. With the improvement of people's living standards and work needs, the use of mobile phones is becoming more and more frequent, and the consumption of mobile phone integrated circuit boards is increasing, which needs to be replaced and repaired.
[0003] When a general mobile phone integrated circuit board is being maintained, the solder and other debris that is cleaned can easily fall into the phone's interior and are difficult to clean. During subsequent use, the phone can make unusual noises, affecting its usability. Summary of the invention
[0004] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by this patent application is how to provide a mobile phone integrated circuit board that can collect and quickly remove debris and has high stability and is convenient for cleaning debris.
[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:
[0006] A mobile phone integrated circuit board that is convenient for cleaning debris, comprising an outer frame, a collection frame and a mobile phone integrated circuit board body;
[0007] The middle part of the outer frame protrudes upward to form a boss for mounting the mobile phone integrated circuit board body, the height of the boss is lower than the height of the outer frame, a rectangular groove is formed between the boss and the outer frame, the collection frame is arranged in a rectangular shape and slides in the rectangular groove, the collection frame has an upper opening to obtain the collection groove, and a snap-on structure is arranged on both sides of the collection frame and the outer frame.
[0008] In this way, the outer frame is fixed in the body, and the mobile phone integrated circuit board body is fixed on the boss of the outer frame. When debris is generated during the maintenance process, the debris is swept into the collection groove of the collection frame by a brush, and then the connection between the collection frame and the outer frame is released by the snap-fit structure, the collection frame is taken out, and after the debris in the collection frame is dumped, the collection frame is reset to the rectangular groove, and the collection frame is stably connected to the outer frame by the snap-fit structure.
[0009] The clamping structure comprises a clamping hook fixedly mounted on the outside of the collecting frame, a clamping ridge is protruded from the inner side of the lower end of the clamping hook, and a ridge that can be clamped with the clamping ridge is protruded from the outer side of the outer frame.
[0010] Wherein, the lower end of the hook is bent and extended outwards.
[0011] The inner side of the collecting frame has a lower height than the outer side, and the inner side of the collecting frame has a lower height than the integrated circuit board body.
[0012] Wherein, the inner upper end of the collecting frame is an inclined surface inclined outward and downward.
[0013] Wherein, a support tube is fixed at the lower end of the boss, and a clearance hole is provided through the boss and the body of the integrated circuit board facing the tube hole of the support tube.
[0014] In summary, the mobile phone integrated circuit board that is convenient for cleaning debris has the advantages of being able to collect debris, quickly taking it out, and having high stability. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 The utility model is a schematic structural diagram of a mobile phone integrated circuit board that is convenient for cleaning debris.
[0016] Figure 2 for Figure 1 Another schematic diagram.
[0017] Figure 3 for Figure 2 Enlarged schematic diagram at point A in the middle.
[0018] Figure 4 for Figure 1 Exploded diagram of . DETAILED DESCRIPTION
[0019] The present invention is further described in detail below in conjunction with the accompanying drawings. In the description of the present invention, it should be understood that the directions or positional relationships indicated by directional words such as "upper, lower" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.
[0020] like Figure 1-4 As shown, a mobile phone integrated circuit board that is convenient for cleaning debris includes an outer frame 1, a collection frame 2 and a mobile phone integrated circuit board body;
[0021] The middle part of the outer frame protrudes upward to form a boss 4 for mounting the mobile phone integrated circuit board body. The height of the boss is lower than the height of the outer frame. A rectangular groove 5 is formed between the boss and the outer frame. The collecting frame is arranged in a rectangular shape and slides in the rectangular groove. The collecting frame has an upper opening to obtain a collecting groove 6. A snap-fit structure 7 is provided on both sides of the collecting frame and the outer frame.
[0022] In this way, the outer frame is fixed in the body, and the mobile phone integrated circuit board body is fixed on the boss of the outer frame. When debris is generated during the maintenance process, the debris is swept into the collection groove of the collection frame by a brush, and then the connection between the collection frame and the outer frame is released by the snap-fit structure, the collection frame is taken out, and after the debris in the collection frame is dumped, the collection frame is reset to the rectangular groove, and the collection frame is stably connected to the outer frame by the snap-fit structure.
[0023] During implementation, the clamping structure includes a clamping hook 8 fixedly mounted on the outside of the collection frame, a clamping ridge 9 is protruding from the inner side of the lower end of the clamping hook, and a convex ridge 10 is protruding from the outer side of the outer frame and can be clamped with the clamping ridge. Quick connection and disassembly are achieved through the clamping of the clamping ridge and the convex ridge.
[0024] During implementation, the lower end of the hook is bent and extended outwards, so as to facilitate the hook to bend outwards and disassemble the rectangular frame.
[0025] During implementation, the inner side of the collection frame is lower than the outer side, and the inner side of the collection frame is lower than the height of the integrated circuit board body of the mobile phone, so that the debris on the integrated circuit board body of the mobile phone can be cleaned into the collection tank.
[0026] During implementation, the inner upper end of the collecting frame is an inclined surface 11 which is tilted outward and downward, so as to facilitate the debris to enter the collecting tank.
[0027] During implementation, a support tube 12 is fixed to the lower end of the boss, and a clearance hole 13 is provided through the boss and the body of the integrated circuit board facing the tube hole of the support tube. The connection between the body of the mobile phone integrated circuit board, the outer frame and the body is completed by passing the clearance hole and the support tube through the screw and connecting with the body.
[0028] Finally, it should be noted that those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include these modifications and variations.
Claims
1. A mobile phone integrated circuit board that is convenient for cleaning debris, characterized in that: Including outer frame, collection frame and mobile phone integrated circuit board body; The middle part of the outer frame protrudes upward to form a boss for mounting the mobile phone integrated circuit board body, the height of the boss is lower than the height of the outer frame, a rectangular groove is formed between the boss and the outer frame, the collection frame is arranged in a rectangular shape and slides in the rectangular groove, the collection frame has an upper opening to obtain the collection groove, and a snap-on structure is arranged on both sides of the collection frame and the outer frame.
2. A mobile phone integrated circuit board that is convenient for cleaning debris according to claim 1, characterized in that: The clamping structure comprises a clamping hook fixedly mounted on the outside of the collecting frame, a clamping ridge is protruding from the inner side of the lower end of the clamping hook, and a convex ridge capable of clamping with the clamping ridge is protruding from the outer side of the outer frame.
3. A mobile phone integrated circuit board that is convenient for cleaning debris according to claim 2, characterized in that: The lower end of the hook is bent and extended outwards.
4. A mobile phone integrated circuit board that is convenient for cleaning debris according to claim 1, characterized in that: The inner side of the collecting frame has a lower height than the outer side, and the inner side of the collecting frame has a lower height than the integrated circuit board body.
5. A mobile phone integrated circuit board that is convenient for cleaning debris according to claim 1, characterized in that: The inner upper end of the collecting frame is an inclined surface inclined outward and downward.
6. A mobile phone integrated circuit board that is convenient for cleaning debris according to claim 1, characterized in that: A support cylinder is fixed at the lower end of the boss, and a clearance hole is provided through the boss and the body of the integrated circuit board facing the cylinder hole of the support cylinder.