Speaker modules and electronic equipment

Abstract

The present application provides a speaker module and an electronic device, which relates to the field of electronic devices and is used to solve the problem of large thickness of electronic devices. Among them, the speaker module includes a mounting shell and a core. The mounting shell includes a shell structure and an extension structure connected to each other, and the shell structure forms a receiving cavity with an opening. The core includes a first part and a second part, the second part is located in the receiving cavity, and the first part extends out of the opening of the receiving cavity. The first part is connected to the second part and forms a step surface, and the step surface is sealed with the shell structure. The cavity enclosed by the second part and the shell structure serves as the back cavity of the core. The extension structure extends outward, and the extension structure is located on the side of the step surface close to the back cavity. The present application can reduce the distance between the first part and the screen assembly, thereby reducing the thickness of the electronic device, which is conducive to realizing the lightness and thinness of the electronic device.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of electronic devices, and in particular to a speaker module and an electronic device. Background Art

[0002] With the rapid development of science and technology, the development of electronic devices (mobile phones, tablets, computers, etc.) is also becoming more and more rapid. In electronic devices, in order to enable the electronic devices to have audio playback functions, speaker modules are provided. However, the existing speaker modules need to be fixed to other structures of the electronic devices, and in order to ensure the sound effect of the speaker modules, the size of the front cavity channel of the speaker modules needs to be ensured, which will increase the thickness of the electronic devices, which is not conducive to achieving the thinness of the electronic devices. Utility Model Content

[0003] The embodiments of the present application provide a speaker module and an electronic device, which are used to solve the problem of large thickness of the electronic device.

[0004] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0005] In a first aspect, a speaker module is provided. The speaker module includes a mounting shell and a core. The mounting shell includes a shell structure and an extension structure connected to each other, and the shell structure forms a receiving cavity with an opening. The core includes a first part and a second part, the second part is located in the receiving cavity, and the first part extends out of the opening of the receiving cavity. The first part is connected to the second part and forms a step surface, and the step surface is sealed to the shell structure. The cavity enclosed by the second part and the shell structure serves as a rear cavity of the core. The extension structure extends outward, and the extension structure is located on the side of the step surface close to the rear cavity.

[0006] The speaker module is fixedly connected to the support part through an extension structure, and the extension structure is located on the side of the step surface close to the rear cavity, which can shorten the distance between the first part and the screen assembly, thereby reducing the thickness of the electronic device and facilitating the thinness of the electronic device.

[0007] In a possible implementation of the first aspect, the housing structure includes a first mounting portion and a second mounting portion. The first mounting portion includes a mounting plate and a first side wall connected to an edge of the mounting plate. The mounting plate is arranged at an angle to the first side wall, the mounting plate is provided with an opening, and the first side wall is sealed and connected to the second mounting portion. The second portion, the mounting plate, the first side wall and the second mounting portion together form a rear cavity. The first side wall is sealed and connected to the second mounting portion to ensure the sealing between the first mounting portion and the second mounting portion.

[0008] In a possible implementation manner of the first aspect, the extension structure is connected to the first mounting portion to connect the extension structure to the shell structure, thereby achieving installation and fixation of the extension structure.

[0009] In a possible implementation manner of the first aspect, the extension structure is connected to the second mounting portion to connect the extension structure to the shell structure, thereby achieving installation and fixation of the extension structure.

[0010] In a possible implementation of the first aspect, the extension structure includes a first extension portion and a second extension portion that are sealed and connected, the first extension portion is sealed and connected to the first side wall, and the second extension portion is sealed and connected to the second mounting portion. By providing a sealed connection between the first extension portion and the second extension portion, the sealing area can be increased and the sealing performance of the mounting housing can be improved.

[0011] In a possible implementation of the first aspect, the first extension portion and the first mounting portion are integrally formed, and the first extension portion, the first side wall and the mounting plate are formed through a one-time process, thereby reducing the assembly steps between the first extension portion and the first side wall, reducing the assembly error between the first extension portion and the first side wall, and improving the sealing between the first extension portion and the first side wall.

[0012] In a possible implementation of the first aspect, the second extension portion and the second mounting portion are integrally formed, and the second extension portion and the second mounting portion are formed through a one-time process, thereby reducing the assembly steps between the second extension portion and the second mounting portion, reducing the assembly error between the second extension portion and the second mounting portion, improving the sealing between the second extension portion and the second mounting portion, and improving production efficiency.

[0013] In a possible implementation of the first aspect, the first side wall includes a side plate and a connecting plate, the side plate is connected to an edge of the mounting plate, the side plate and the mounting plate are arranged at an angle, and the side plate is connected to the extension structure; the connecting plate is connected to an end of the side plate away from the mounting plate, the connecting plate and the side plate are arranged at an angle, and the connecting plate is sealed and connected to the second mounting portion. The contact area between the first side wall and the second mounting portion is increased by providing the connecting plate, thereby improving the sealing and connection strength between the first side wall and the second mounting portion.

[0014] In a possible implementation of the first aspect, the second mounting portion includes a substrate and a second side wall connected to each other, the second side wall is connected to an edge of the substrate, the second side wall and the substrate are arranged at an angle, and the second side wall is sealed to the connecting plate, so as to increase the rear cavity and improve the sound effect.

[0015] In a possible implementation of the first aspect, the substrate includes a connected plate body and an air leaking member, the air leaking member is provided with an air leaking hole extending therethrough, the air leaking hole is connected to the rear cavity, and the air leaking hole is used to connect the rear cavity and the outside of the mounting shell to ensure air pressure balance between the rear cavity and the outside of the mounting shell.

[0016] In a second aspect, an electronic device is also provided, the electronic device comprising a screen assembly, a back cover, a middle frame, and a speaker module as described above, wherein the middle frame is located between the screen assembly and the back cover. The middle frame comprises a frame and a support portion connected to each other, the screen assembly, the back cover and the frame form a receiving cavity, and the speaker module is received in the receiving cavity. The support portion is fixedly connected to the extension structure. The end face of the support portion close to the screen assembly is the first end face, and the end face of the first part close to the screen assembly is the second end face. The spacing distance between the first end face and the screen assembly is greater than or equal to the spacing distance between the second end face and the screen assembly.

[0017] Since the electronic device provided in the present application includes a speaker module of any technical solution of the first aspect above, the two can solve the same technical problem and achieve the same effect.

[0018] In a possible implementation of the second aspect, the electronic device further includes a sealing structure, which is sealed and connected between the extension structure and the support portion. The front cavity channel is isolated from other structures of the electronic device by providing the sealing structure, so that the airflow in the front cavity channel can only be discharged through the sound outlet gap, so as to improve the sound output effect of the speaker module.

[0019] In a possible implementation of the second aspect, the sealing structure includes a compressible layer and an adhesive layer connected to each other, the compressible layer is sealingly connected to the extension structure; the adhesive layer is located between the compressible layer and the support portion, and a side of the adhesive layer away from the compressible layer is adhered to the support portion. The compressible layer is sealingly connected to the extension structure, and the sealing between the extension structure and the support portion is maintained by keeping the compressible layer in a compressed state.

[0020] In a possible implementation of the second aspect, the electronic device further comprises an abutment structure located in the accommodating cavity, the abutment structure abutting against a side of the extension structure away from the compressible layer. The abutment structure is provided to apply pressure close to the compressible layer to the extension structure, so that the compressible layer is in a compressed state, so as to maintain the sealing between the extension structure and the support portion.

[0021] In a possible implementation of the second aspect, the electronic device also includes a mainboard, and the mainboard serves as an abutment structure. The mainboard of the electronic device is rationally utilized, and the mainboard is abutted against a side of the extended structure away from the compressible layer. Compared with a specially set abutment structure, the number of internal structures of the electronic device is reduced, which can reduce costs and reduce the weight of the electronic device.

[0022] In a possible implementation of the second aspect, the electronic device further includes a mainboard bracket, and the mainboard bracket serves as an abutment structure. The mainboard bracket may be a structure for fixing the mainboard, and the mainboard bracket of the electronic device is reasonably utilized, and the mainboard bracket is abutted against a side of the extension structure away from the compressible layer. Compared with a special abutment structure, the number of internal structures of the electronic device is reduced, which can reduce costs and reduce the weight of the electronic device.

[0023] In a possible implementation of the second aspect, the electronic device further includes a buffer, the buffer is located between the extension structure and the abutment structure, and the buffer is connected to the extension structure and the abutment structure respectively. The buffer can play a role of buffering and protection, and by providing the buffer, the abutment structure is prevented from directly contacting the extension structure to generate a large force to deform the extension structure, thereby extending the service life of the extension structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0025] Figure 2 An exploded schematic diagram of an electronic device provided in an embodiment of the present application;

[0026] Figure 3 A cross-sectional schematic diagram of an electronic device;

[0027] Figure 4 for Figure 3 A magnified schematic diagram of the middle A area;

[0028] Figure 5 A cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application;

[0029] Figure 6 A cross-sectional schematic diagram of another electronic device provided in an embodiment of the present application;

[0030] Figure 7 A cross-sectional schematic diagram of a speaker module provided in an embodiment of the present application;

[0031] Figure 8 for Figure 7 A magnified schematic diagram of the middle B area;

[0032] Fig. 9 A schematic structural diagram of a first mounting portion in a speaker module provided in an embodiment of the present application;

[0033] Fig.10 A schematic diagram of the structure of a second mounting portion in a speaker module provided in an embodiment of the present application;

[0034] Fig.11A schematic diagram of the structure of an installation housing in a speaker module provided in an embodiment of the present application;

[0035] Fig.12 A schematic diagram of the structure of an installation housing in another speaker module provided in an embodiment of the present application;

[0036] Fig.13 A schematic diagram of the structure of an installation housing in another speaker module provided in an embodiment of the present application;

[0037] Fig.14 A cross-sectional schematic diagram of another speaker module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0038] In the embodiments of the present application, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features.

[0039] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0040] An embodiment of the present application provides an electronic device having a speaker module. Exemplarily, the electronic device may be a portable electronic device or other types of electronic devices. For example, the electronic device may be a mobile phone, a tablet computer, a laptop computer, a personal digital assistant (PDA), a smart watch, a monitor, a camera, a personal computer, a notebook computer, a wearable device, etc. For the convenience of explanation, the following examples are all taken as an example of the electronic device being a mobile phone.

[0041] See also Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. As can be seen from the above, in this embodiment, the electronic device 100 is a mobile phone, and the electronic device 100 can be an approximately rectangular plate-shaped structure.

[0042] For the convenience of the following description, an XYZ coordinate system is established, and the width direction of the electronic device 100 is defined as the X-axis direction, the length direction of the electronic device 100 is defined as the Y-axis direction, and the thickness direction of the electronic device 100 is defined as the Z-axis direction. It can be understood that Figure 1 Only some components of the electronic device 100 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not subject to the present invention. Figure 1 restrictions.

[0043] See also Figure 2 , Figure 2 An exploded schematic diagram of an electronic device provided in an embodiment of the present application. The electronic device 100 may include a screen assembly 10, a back cover 20, a middle frame 30, a speaker module 40, and a camera module 50. The screen assembly 10 can be used to display images, videos, etc. The screen assembly 10 may include a light-transmitting cover plate 11 and a display screen 12. The light-transmitting cover plate 11 and the display screen 12 are stacked. The light-transmitting cover plate 11 is mainly used to protect and dustproof the display screen 12. The material of the light-transmitting cover plate 11 includes but is not limited to glass. The display screen 12 may be a flexible display screen or a rigid display screen.

[0044] The back cover 20 may be used to protect the internal electronic components of the electronic device 100 . The back cover 20 may be located on a side of the display screen 12 away from the light-transmitting cover plate 11 .

[0045] The middle frame 30 may include a frame 31 and a support portion 32 connected to each other. Figure 2 (not shown), the frame 31 may be located between the back cover 20 and the light-transmitting cover plate 11, and the frame 31 may be fixedly connected to the back cover 20. Exemplarily, the frame 31 may be fixedly connected to the back cover 20 by adhesive. The light-transmitting cover plate 11 may be fixed to the frame 31 by adhesive.

[0046] Exemplarily, the middle frame 30 may further include a middle plate 34. The middle plate 34 is fixed to the inner surface of the frame 31. Exemplarily, the middle plate 34 and the frame 31 may be made of metal materials, and the middle plate 34 may be fixed to the frame 31 by welding. The middle plate 34 may also be an integrally formed structure with the frame 31. The middle plate 34 serves as the structural "skeleton" of the electronic device 100.

[0047] The camera module 50 can be used to take photos / videos, and the camera module 50 can be fixedly connected to the middle plate 34 by means of threaded connection, clamping, welding, etc.

[0048] The screen assembly 10, the back cover 20 and the frame 31 form a receiving cavity 21 ( Figure 2The speaker module 40 may be accommodated in the accommodating cavity 21. The speaker module 40 may be located at an end close to the camera module 50 (i.e., the upper speaker of the electronic device 100), or at an end away from the camera module 50 (i.e., the lower speaker of the electronic device 100). For the convenience of description, the following description is based on the example that the speaker module 40 is located at an end close to the camera module 50.

[0049] See also Figure 3 , Figure 3 Schematic diagram of a cross section of an electronic device. The speaker module in some embodiments includes a fixed shell 60 and a core 42, and the fixed shell 60 is formed with a fixed cavity 61 having an opening. The core 42 is a device that converts an electrical signal into an acoustic signal, and the core 42 includes a first part 421 and a second part 422 connected to each other, the second part 422 is located in the fixed cavity 61, and the first part 421 extends out of the opening of the fixed cavity 61. Exemplarily, the first part 421 may include a dustproof net, and the second part 422 may include structures such as a diaphragm, a voice coil, and a dome.

[0050] The first part 421 and the second part 422 are connected to form a step surface 423, and the step surface 423 is sealed and connected to the fixed housing 60. Exemplarily, the step surface 423 includes a first connection surface 4231 and a second connection surface 4232, the first connection surface 4231 is a portion of the surface of the second part 422 on the side close to the screen assembly 10 that is not connected to the first part 421, the first connection surface 4231 extends along the plane where the X-axis and the Y-axis are located, and the second connection surface 4232 extends along the Z-axis direction.

[0051] Please refer to Figure 4 , Figure 4 for Figure 3 The height of the gap between the first connection surface 4231 and the fixed housing 60 along the Z-axis direction is H1, H1 = 0.02 mm. Exemplarily, the gap between the first connection surface 4231 and the fixed housing 60 can be filled with a sealant to achieve a sealed connection between the first connection surface 4231 and the fixed housing 60.

[0052] The thickness of the fixed housing 60 along the Z-axis direction is H2, where H2=0.2 mm.

[0053] The electronic device further comprises a sealing structure 70, such as Figure 3As shown, the position of the sealing structure 70 in the speaker module is on the side of the first connection surface 4231 of the core 42 close to the screen assembly 10. Exemplarily, the middle frame 30 may also include a fixing portion 33, and the fixing portion 33 is sealed and connected to the end of the fixed shell 60 close to the screen assembly 10 through the sealing structure 70. The thickness of the sealing structure 70 along the Z-axis direction is H3, H3 = 0.18mm. The thickness of the fixing portion 33 along the Z-axis direction is H4, H4 = 0.45mm.

[0054] The first part 421, the middle frame 30, and the screen assembly 10 together form a front cavity channel 424. A sound outlet gap 80 is formed between the screen assembly 10 and the frame 31, and the sound outlet gap 80 is connected to the front cavity channel 424. The core 42 includes a diaphragm (not shown), the diaphragm vibrates, and resonates with the air in the front cavity channel 424 to form sound waves (i.e., sound), and the sound waves can be transmitted outward through the sound outlet gap 80 so that the user can hear the audio.

[0055] In order to ensure smooth airflow in the front cavity channel 424, a minimum value needs to be set for the height of the front cavity channel 424 along the Z axis. Assume that the minimum height of the front cavity channel 424 along the Z axis is H5, H5 = 0.8 mm.

[0056] like Figure 3 and Figure 4 As shown, the thickness of the first portion 421 along the Z-axis direction is H6, 0.4mm≤H6≤0.65mm, and illustratively, H6 can be 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm or 0.65mm. And H1+H2+H3+H4=0.85mm, that is, H6 10 Therefore, the minimum height of the front cavity channel 424 along the Z-axis direction is the distance between the end surface M2 of the fixing portion 33 and the screen assembly 10, that is, H 10 =H5.

[0057] In the existing electronic device, the distance from the first connection surface 4231 to the screen assembly 10 is H7, H7 = H1 + H2 + H3 + H4 + H5 = 1.65 mm. This makes the thickness of the electronic device 100 along the Z axis direction relatively large, which is not conducive to achieving the thinness of the electronic device 100.

[0058] See also Figure 5 , Figure 5 ​A cross-sectional schematic diagram of an electronic device provided in an embodiment of the present application. In order to solve the problem that the thickness of the above-mentioned electronic device along the Z-axis direction is large, an embodiment of the present application provides a speaker module 40. The speaker module 40 includes a mounting shell 41 and a core 42. The mounting shell 41 includes a shell structure 43 and an extension structure 44 connected to the shell structure 43, and the shell structure 43 is formed with a receiving cavity 4316 having an opening 4315.

[0059] The second portion 422 of the inner core 42 is located in the accommodating cavity 4316 , and the first portion 421 of the inner core 42 extends out of the opening 4315 of the accommodating cavity 4316 .

[0060] The first portion 421 is connected to the second portion 422 to form a step surface 423 . Exemplarily, a dimension of the first portion 421 along the X-axis direction is smaller than a dimension of the second portion 422 along the X-axis direction to form the step surface 423 .

[0061] The step surface 423 is sealed and connected to the shell structure 43. For example, the first connection surface 4231 of the step surface 423 and the shell structure 43 can be filled with sealant to achieve a sealed connection. Alternatively, the first connection surface 4231 and the shell structure 43, as well as the second connection surface 4232 and the shell structure 43 are filled with sealant to further ensure the sealed connection between the core 42 and the shell structure 43. The cavity enclosed by the second part 422 and the shell structure 43 serves as the rear cavity 425 of the core 42. It can be understood that the rear cavity 425 is the space in the accommodating cavity 4316 except the second part 422.

[0062] The extension structure 44 extends outward. Exemplarily, the extension structure 44 may extend along the plane where the X-axis and the Y-axis are located, that is, the angle between the extension direction of the extension structure 44 and the thickness direction of the shell structure 43 is 90°. In other embodiments, the extension direction of the extension structure 44 may be set at other angles with the thickness direction of the shell structure 43, for example, the angle between the extension direction of the extension structure 44 and the thickness direction of the shell structure 43 may be 10°, 20°, 30°, 40°, 45°, 50°, 60°, 70° or 80°.

[0063] The extension structure 44 is located on the side of the step surface 423 close to the rear cavity 425, that is, the extension structure 44 is located on the side of the step surface 423 away from the front cavity channel 424. The extension structure 44 is fixedly connected to the support portion 32 of the middle frame 30 so that the mounting shell 41 can be fixed on the support portion 32. By setting the extension structure 44 to be fixedly connected to the support portion 32, compared with the end surface of the shell structure 43 close to the screen assembly 10 being directly fixedly connected to the support portion 32, the distance between the first part 421 and the screen assembly 10 can be shortened.

[0064] The end surface of the support portion 32 close to the screen assembly 10 is the first end surface 321, and the end surface of the first portion 421 close to the screen assembly 10 is the second end surface 4211. The spacing distance between the first end surface 321 and the screen assembly 10 is H 11 The distance between the second end surface 4211 and the screen assembly 10 is H 12 , H 11 ≥H 12 That is, the second end surface 4211 is closer to the screen assembly 10 than the first end surface 321, or the spacing distance between the second end surface 4211 and the screen assembly 10 is equal to the spacing distance between the first end surface 321 and the screen assembly 10, and the minimum height H5 of the front cavity channel 424 along the Z-axis direction is the distance H between the second end surface 4211 and the screen assembly 10. 12 , H5=H 12 .

[0065] For example, in the embodiment of the present application, the distance from the first connection surface 4231 to the screen assembly 10 is H8, H8 = H6 + H5, 1.2 mm ≤ H8 ≤ 1.45 mm. In the existing electronic device, H7 = 1.65 mm. In other words, the thickness of the electronic device 100 along the Z axis in the embodiment of the present application can be reduced by H0, H0 = H7-H8, 0.2 mm ≤ H0 ≤ 0.45 mm, which is conducive to achieving the lightness and thinness of the electronic device 100.

[0066] The speaker module 40 in the embodiment of the present application is fixedly connected to the support portion 32 via an extension structure 44, and the extension structure 44 is located on the side of the step surface 423 close to the rear cavity 425, which can reduce the distance between the first part 421 and the screen assembly 10, thereby reducing the thickness of the electronic device 100 along the Z-axis direction, which is conducive to achieving the lightweight and thinness of the electronic device 100.

[0067] In some embodiments, see Figure 5 The electronic device further includes a sealing structure 70, which is sealed and connected between the extension structure 44 and the support portion 32. The sealing structure 70 is provided to isolate the front cavity channel 424 from other structures of the electronic device 100, so that the airflow in the front cavity channel 424 can only be discharged through the sound outlet gap 80, so as to improve the sound output effect of the speaker module 40.

[0068] In other embodiments, see Figure 6 , Figure 6 A cross-sectional schematic diagram of another electronic device provided in an embodiment of the present application. A sound outlet channel 311 is provided on the frame 31, and part of the airflow in the front cavity channel 424 can be discharged through the sound outlet gap 80 for earpiece playback; the other part can be discharged through the sound outlet channel 311 for speaker playback to meet different user usage scenarios.

[0069] In some embodiments, see Figure 6 The sealing structure 70 includes a compressible layer and an adhesive layer connected to each other, the adhesive layer is located between the compressible layer and the support portion 32, and the adhesive layer is adhered to the support portion 32 on a side away from the compressible layer, so that the sealing structure 70 can be fixedly connected to the support portion 32. The compressible layer is sealed and connected to the extension structure 44, and the sealing between the extension structure 44 and the support portion 32 is maintained by keeping the compressible layer in a compressed state.

[0070] In some embodiments, the sealing structure 70 can be a foam double-sided adhesive. The foam double-sided adhesive refers to a double-sided adhesive formed by coating adhesive on both sides of a foam cotton substrate and then covering one side with release paper or release film. The foam cotton substrate in the foam double-sided adhesive can be compressed and is a compressible layer. Adhesive is coated on both sides of the foam cotton substrate, and one side of the foam double-sided adhesive is covered with release paper or release film. The release paper or release film mainly serves to isolate sticky objects and facilitate the installation of the foam double-sided adhesive. The foam double-sided adhesive has the characteristics of good sealing, strong adhesion, good retention, good waterproof performance, and strong temperature resistance. In addition, both sides of the foam double-sided adhesive can be pasted, which can not only realize the fixed connection between the sealing structure 70 and the support portion 32, but also realize the fixed connection between the sealing structure 70 and the extension structure 44.

[0071] In some other embodiments, the sealing structure 70 may be formed by applying glue on both sides of a compressible material, and the compressible material forms a compressible layer. The compressible material may be foam, sponge, polymer foam material or other compressible material.

[0072] In some embodiments, see Figure 6 The electronic device 100 further includes an abutting structure 90, which is located in the accommodating cavity 21. The abutting structure 90 abuts against a side of the extension structure 44 away from the compressible layer, and the abutting structure 90 applies pressure close to the compressible layer to the extension structure 44, so that the compressible layer is in a compressed state, so as to maintain the sealing between the extension structure 44 and the support portion 32.

[0073] In some embodiments, the electronic device 100 further includes a mainboard, and the mainboard serves as the abutment structure 90. In this embodiment, the mainboard of the electronic device 100 is reasonably utilized, and the mainboard is abutted against the side of the extension structure 44 away from the compressible layer. Compared with the special arrangement of the abutment structure 90, the number of internal structures of the electronic device 100 is reduced, and the cost and weight of the electronic device 100 can be reduced.

[0074] In some embodiments, the electronic device 100 further includes a mainboard bracket, which serves as an abutment structure 90. The mainboard bracket may be a structure for fixing the mainboard, and the mainboard bracket of the electronic device 100 is reasonably utilized, and the mainboard bracket abuts against the side of the extension structure 44 away from the compressible layer. Compared with the special arrangement of the abutment structure 90, the number of internal structures of the electronic device 100 is reduced, which can reduce costs and reduce the weight of the electronic device 100.

[0075] In some embodiments, see Figure 6 The electronic device 100 further includes a buffer 91, which is connected between the extension structure 44 and the abutment structure 90. The buffer 91 can play a role of buffering and protection. By providing the buffer 91, the abutment structure 90 is prevented from directly contacting the extension structure 44 to generate a large force to deform the extension structure 44, thereby extending the service life of the extension structure 44.

[0076] Exemplarily, the buffer member 91 may be a foam double-sided adhesive tape, in which the foam base material may be compressed and rebound to provide buffering.

[0077] In some embodiments, see Figure 7 , Figure 7 A cross-sectional schematic diagram of a speaker module provided in an embodiment of the present application. The housing structure 43 includes a first mounting portion 431 and a second mounting portion 432. The first mounting portion 431 includes a mounting plate 4311 and a first side wall 4312 connected to the edge of the mounting plate 4311, and the mounting plate 4311 is arranged at an angle to the first side wall 4312. The mounting plate 4311 extends along the X-axis direction, and the mounting plate 4311 can be a plate-like structure that is approximately rectangular, and the first side wall 4312 is connected to the edge of the mounting plate 4311.

[0078] Exemplarily, the angle between the first side wall 4312 and the mounting plate 4311 may be 90°, that is, the first side wall 4312 and the mounting plate 4311 are perpendicular to each other. In other embodiments, the angle between the first side wall 4312 and the mounting plate 4311 may also be 10°, 20°, 30°, 40°, 45°, 50°, 60°, 70° or 80°, and the embodiment of the present application does not limit the angle between the first side wall 4312 and the mounting plate 4311.

[0079] The mounting plate 4311 defines an opening 4315 , and the opening 4315 matches the shape of the first portion 421 , so that the first portion 421 can extend out of the opening 4315 .

[0080] The first side wall 4312 is sealed and connected to the second mounting portion 432 to ensure the sealing between the first mounting portion 431 and the second mounting portion 432. The second portion 422, the mounting plate 4311, the first side wall 4312 and the second mounting portion 432 together form a rear cavity 425. Exemplarily, the mounting plate 4311, the first side wall 4312 and the second mounting portion 432 together form a receiving cavity 4316. After the second portion 422 is placed in the receiving cavity 4316, the second portion 422 and the cavity wall of the receiving cavity 4316 together form a rear cavity 425.

[0081] In some embodiments, the extension structure 44 is connected to the first mounting portion 431 to achieve the connection between the extension structure 44 and the housing structure 43, and to achieve the installation and fixation of the extension structure 44. Exemplarily, the extension structure 44 can be connected to the first side wall 4312, and the extension structure 44 can be arranged around the outer surface of the first side wall 4312, or the extension structure 44 can include at least two extension pieces (not shown), and the at least two extension pieces are spaced apart and distributed on the outer surface of the first side wall 4312.

[0082] In some embodiments, the extension structure 44 may be connected to the second mounting portion 432 to achieve connection between the extension structure 44 and the shell structure 43 , thereby achieving installation and fixation of the extension structure 44 .

[0083] In some embodiments, see Figure 7 The extension structure 44 includes a first extension portion 441 and a second extension portion 442 , and both the first extension portion 441 and the second extension portion 442 extend along the plane where the X-axis and the Y-axis are located.

[0084] Please refer to Figure 8 , Figure 8 for Figure 7 An enlarged schematic diagram of the middle B area. The first extension 441 is sealedly connected to the outer surface of the first side wall 4312 to ensure the sealing between the first extension 441 and the first side wall 4312, thereby improving the sealing of the installation shell. The second extension 442 is sealedly connected to the outer surface of the second mounting portion 432 to ensure the sealing between the second extension 442 and the second mounting portion 432, thereby improving the sealing of the installation shell. The first extension 441 and the second extension 442 are sealedly connected. Exemplarily, a sealant can be filled between the first extension 441 and the second extension 442 to keep the first extension 441 and the second extension 442 sealed, and a sealant can be filled between the first side wall 4312 and the second mounting portion 432 to keep the first side wall 4312 and the second mounting portion 432 sealed. That is, by setting the first extension 441 and the second extension 442 to be sealed, the connection area of ​​the sealant can be increased, and the sealing of the installation shell 41 can be improved.

[0085] In some embodiments, please refer to Fig. 9 In Figures (a) and (b), the first extension 441 and the first mounting portion 431 are integrally formed, that is, the first extension 441, the first side wall 4312 and the mounting plate 4311 are formed through a one-time process, which reduces the assembly steps between the first extension 441 and the first side wall 4312, reduces the assembly error between the first extension 441 and the first side wall 4312, and improves the sealing between the first extension 441 and the first side wall 4312. At the same time, the assembly steps between the first side wall 4312 and the mounting plate 4311 are also reduced, the assembly error between the first side wall 4312 and the mounting plate 4311 is reduced, the sealing between the first side wall 4312 and the mounting plate 4311 is improved, and the production efficiency is improved. Exemplarily, the first extension 441 and the first mounting portion 431 can be integrally formed and manufactured by injection molding, die casting, computer numerical control precision machining (computer numerical control, CNC) or other processes.

[0086] In other embodiments, the first extending portion 441 and the first mounting portion 431 may be manufactured separately, and then the first extending portion 441 and the first mounting portion 431 are assembled, and sealant is filled at the connection between the first extending portion 441 and the first mounting portion 431 to ensure a sealed connection between the first extending portion 441 and the first mounting portion 431.

[0087] Please refer to Fig.10 In Figure (a) and Figure (b), Fig.10 A schematic diagram of the structure of a second mounting portion in a speaker module provided in an embodiment of the present application. In some embodiments, the second extension portion 442 is integrally formed with the second mounting portion 432, that is, the second extension portion 442 and the second mounting portion 432 are formed through a one-time process, which reduces the assembly steps between the second extension portion 442 and the second mounting portion 432, reduces the assembly error between the second extension portion 442 and the second mounting portion 432, improves the sealing between the second extension portion 442 and the second mounting portion 432, and improves production efficiency.

[0088] In other embodiments, the second extension portion 442 and the second mounting portion 432 can also be manufactured separately, and then the second extension portion 442 and the second mounting portion 432 are assembled, and sealant is filled at the connection between the second extension portion 442 and the second mounting portion 432 to make the second extension portion 442 and the second mounting portion 432 sealed and connected.

[0089] In some embodiments, see Fig.11 In Figure (a) and Figure (b), Fig.11A schematic diagram of the structure of an installation shell in a speaker module provided in an embodiment of the present application. The first side wall 4312 includes a side panel 4313 and a connecting plate 4314, and the side panel 4313 is connected to the edge of the mounting plate 4311, and the side panel 4313 and the mounting plate 4311 are arranged at an angle. Exemplarily, the angle between the side panel 4313 and the mounting plate 4311 is 90°, that is, the side panel 4313 extends along the Z-axis direction. In other embodiments, the angle between the side panel 4313 and the mounting plate 4311 can also be other angles, and the embodiment of the present application does not limit the angle between the side panel 4313 and the mounting plate 4311.

[0090] The side plate 4313 is connected to the extension structure 44 to achieve the connection between the extension structure 44 and the shell structure 43 .

[0091] The connecting plate 4314 is connected to one end of the side plate 4313 away from the mounting plate 4311, and the connecting plate 4314 and the side plate 4313 are arranged at an angle. Exemplarily, the angle between the connecting plate 4314 and the side plate 4313 is 90°, that is, the connecting plate 4314 extends along the plane where the X-axis and the Y-axis are located, and the extending directions of the connecting plate 4314 and the mounting plate 4311 are consistent. The connecting plate 4314, the side plate 4313 and the mounting plate 4311 form a stable structure, thereby improving the structural stability of the shell structure 43. In other embodiments, the angle between the connecting plate 4314 and the side plate 4313 may also be other angles, and the embodiment of the present application does not limit the angle between the connecting plate 4314 and the side plate 4313.

[0092] The connecting plate 4314 is sealed and connected to the second mounting portion 432. For example, the connecting plate 4314 and the second mounting portion 432 can be sealed and connected by filling a sealant at the connection between the connecting plate 4314 and the second mounting portion 432. The contact area between the first side wall 4312 and the second mounting portion 432 is increased by providing the connecting plate 4314, so as to increase the connection area between the sealant and the first side wall 4312, and increase the connection area between the sealant and the second mounting portion 432, thereby improving the sealing and connection strength between the first side wall 4312 and the second mounting portion 432.

[0093] like Fig.11 As shown in Figures (a) and (b), the second mounting portion 432 can be a plate-like structure that is approximately rectangular, and the connecting plate 4314 can be a plate-like structure that is approximately rectangular and has a through hole in the middle. Fig.11 In Figure (a), the connecting plate 4314 extends in a direction away from the accommodating cavity 4316, that is, the connecting plate 4314 extends outward. Fig.11In FIG. 4B , the connecting plate 4314 extends in a direction close to the accommodating cavity 4316 , that is, the connecting plate 4314 extends inward. It should be noted that the through hole in the connecting plate 4314 needs to be larger than the maximum size of the core along the X-axis direction so that the core can pass through the through hole smoothly.

[0094] In some embodiments, see Fig.12 In Figure (a) and Figure (b), Fig.12 A schematic diagram of the structure of another installation shell in a speaker module provided in an embodiment of the present application. The second installation portion 432 may include a substrate 4321 and a second side wall 4322 connected to each other, the substrate 4321 extending along the X-axis direction, and the substrate 4321 may be a plate-like structure that is approximately rectangular. The second side wall 4322 is connected to the edge of the substrate 4321, and the second side wall 4322 is arranged at an angle to the substrate 4321. Exemplarily, the angle between the second side wall 4322 and the substrate 4321 may be 90°, that is, the second side wall 4322 extends along the Z-axis direction.

[0095] The second side wall 4322 is sealed and connected to the connecting plate 4314. For example, the second side wall 4322 can be sealed and connected to the connecting plate 4314 by filling a sealant at the connection between the second side wall 4322 and the connecting plate 4314. Compared with the second mounting portion 432 being a plate-shaped structure, the second mounting portion 432 includes a substrate 4321 and a second side wall 4322 connected to each other, which can increase the rear cavity and improve the sound output effect.

[0096] In some embodiments, the speaker module further includes a reinforcing glue 45, one end of which is sealed and connected to the second side wall 4322, and the other end of which is sealed and connected to the connecting plate 4314. The reinforcing glue 45 is provided to improve the connection sealing between the second side wall 4322 and the connecting plate 4314, strengthen the connection strength between the second side wall 4322 and the connecting plate 4314, and improve the structural stability of the mounting housing 41. Exemplarily, the reinforcing glue 45 and the sealing glue can be the same glue.

[0097] like Fig.12As shown in FIG. (a), the connecting plate 4314 extends outward, and the second side wall 4322 is sealed and connected to one end of the connecting plate 4314 away from the accommodating cavity 4316. The distance between the bottom end of the second side wall 4322 and the extension structure 44 is smaller than the distance between the bottom end of the connecting plate 4314 and the extension structure 44. The reinforcing glue 45 is located on the side of the connecting plate 4314 away from the substrate 4321, and the reinforcing glue 45 is located at the corner surrounded by the second side wall 4322 and the connecting plate 4314, increasing the connection area between the reinforcing glue 45 and the second side wall 4322, and increasing the connection area between the reinforcing glue 45 and the connecting plate 4314, thereby improving the sealing between the second side wall 4322 and the connecting plate 4314, and strengthening the connection strength between the second side wall 4322 and the connecting plate 4314.

[0098] like Fig.12 As shown in FIG. (b), the connecting plate 4314 extends inwardly, and the second side wall 4322 is sealed and connected to one end of the connecting plate 4314 near the accommodating cavity 4316. The reinforcing glue 45 is located on one side of the connecting plate 4314 near the base plate 4321, and the reinforcing glue 45 is located at the corner formed by the second side wall 4322 and the connecting plate 4314, so as to increase the connection area between the reinforcing glue 45 and the second side wall 4322, and increase the connection area between the reinforcing glue 45 and the connecting plate 4314, thereby improving the sealing between the second side wall 4322 and the connecting plate 4314, and strengthening the connection strength between the second side wall 4322 and the connecting plate 4314.

[0099] In some embodiments, see Fig.13 In Figure (a) and Figure (b), Fig.13 A schematic diagram of the structure of another installation shell in a speaker module provided in an embodiment of the present application. The second side wall 4322 may include a panel 4323 and a fixing plate 4324, the panel 4323 is connected to the edge of the substrate 4321, and the panel 4323 and the substrate 4321 are arranged at an angle. Exemplarily, the angle between the panel 4323 and the substrate 4321 is 90°, that is, the panel 4323 extends along the Z-axis direction. In other embodiments, the angle between the side panel 4313 and the mounting plate 4311 may also be other angles, and the embodiment of the present application does not limit the angle between the side panel 4313 and the mounting plate 4311.

[0100] The fixing plate 4324 is connected to one end of the enclosure 4323 away from the base plate 4321, and the fixing plate 4324 is arranged at an angle with the enclosure 4323. Exemplarily, the angle between the fixing plate 4324 and the enclosure 4323 is 90°, the fixing plate 4324 extends along the plane where the X-axis and the Y-axis are located, and the extension direction of the fixing plate 4324 is consistent with that of the connecting plate 4314. The fixing plate 4324 is sealed and connected to the connecting plate 4314. By providing the fixing plate 4324, the contact area between the second side wall 4322 and the connecting plate 4314 is increased, so that the connection between the second side wall 4322 and the connecting plate 4314 is more stable and reliable, thereby improving the structural stability of the mounting housing 41.

[0101] The fixing plate 4324 can extend outward or inward. Fig.13 As shown in FIG. (a), the fixing plate 4324 extends outward. Fig.13 As shown in Figure (b), the fixing plate 4324 extends inwardly.

[0102] In some embodiments, see Fig.14 , Fig.14 A cross-sectional schematic diagram of another speaker module provided in an embodiment of the present application. The substrate 4321 includes a plate body 4325 and an air leaking member 4326 connected to each other. The air leaking member 4326 is provided with a penetrating air leaking hole (not shown), which penetrates along the Z-axis direction and is connected to the rear cavity 425. The air leaking hole is used to connect the rear cavity 425 and the outside of the mounting shell 41 to ensure the air pressure balance between the rear cavity 425 and the outside of the mounting shell 41. Exemplarily, the air leaking member 4326 can be a damping cloth.

[0103] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0104] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A speaker module, characterized in that: The speaker module includes an installation shell and an inner core, the installation shell includes a connected shell structure and an extension structure, the shell structure forms a accommodating cavity with an opening; the inner core includes a first part and a second part, the second part is located in the accommodating cavity, the first part extends out of the opening of the accommodating cavity, the first part is connected to the second part and forms a step surface, and the step surface is sealed with the shell structure; the cavity enclosed by the second part and the shell structure serves as the back cavity of the inner core; the extension structure extends outward, and the extension structure is located on the side of the step surface close to the back cavity.

2. The speaker module according to claim 1, characterized in that: The shell structure includes a first mounting part and a second mounting part, the first mounting part includes a mounting plate and a first side wall connected to the edge of the mounting plate, the mounting plate and the first side wall are arranged at an angle, the mounting plate is provided with the opening, and the first side wall is sealed and connected to the second mounting part; the second part, the mounting plate, the first side wall and the second mounting part together enclose the rear cavity.

3. The speaker module according to claim 2, characterized in that: The extension structure is connected to the first mounting portion, or the extension structure is connected to the second mounting portion.

4. The speaker module according to claim 2, characterized in that: The extension structure includes a first extending portion and a second extending portion which are sealed and connected, wherein the first extending portion is sealed and connected to the first side wall, and the second extending portion is sealed and connected to the second mounting portion.

5. The speaker module according to claim 4, characterized in that: The first extension portion is integrally formed with the first mounting portion; and / or, The second extending portion and the second mounting portion are integrally formed.

6. The speaker module according to claim 2, characterized in that: The first side wall includes a side panel and a connecting plate, wherein the side panel is connected to the edge of the mounting plate and is arranged at an angle with the mounting plate, and the side panel is connected to the extension structure; the connecting plate is connected to an end of the side panel away from the mounting plate, and is arranged at an angle with the side panel, and the connecting plate is sealed and connected to the second mounting portion.

7. The speaker module according to claim 6, characterized in that: The second mounting portion includes a base plate and a second side wall connected to each other, the second side wall is connected to an edge of the base plate, the second side wall and the base plate are arranged at an angle, and the second side wall is sealed and connected to the connecting plate.

8. The speaker module according to claim 7, characterized in that: The base plate comprises a plate body and an air leaking member connected to each other. The air leaking member is provided with an air leaking hole which is in communication with the rear cavity.

9. An electronic device, characterized in that: The electronic device comprises a screen assembly, a back cover, a middle frame, and the speaker module according to any one of claims 1 to 8, wherein the middle frame is located between the screen assembly and the back cover, the middle frame comprises a border and a supporting portion connected to each other, the screen assembly, the back cover and the border form a receiving cavity, and the speaker module is received in the receiving cavity; the supporting portion is fixedly connected to the extension structure; the end face of the supporting portion close to the screen assembly is a first end face, and the end face of the first part close to the screen assembly is a second end face; wherein the spacing distance between the first end face and the screen assembly is greater than or equal to the spacing distance between the second end face and the screen assembly.

10. The electronic device according to claim 9, characterized in that: The electronic device further comprises a sealing structure, wherein the sealing structure is sealingly connected between the extending structure and the supporting portion.

11. The electronic device according to claim 10, characterized in that: The sealing structure comprises a compressible layer and an adhesive layer connected to each other, wherein the compressible layer is sealingly connected to the extension structure; the adhesive layer is located between the compressible layer and the support portion, and a side of the adhesive layer away from the compressible layer is adhered to the support portion.

12. The electronic device according to claim 11, characterized in that: The electronic device further comprises an abutting structure located in the accommodating cavity, wherein the abutting structure abuts against a side of the extending structure away from the compressible layer.

13. The electronic device according to claim 12, characterized in that: The electronic device further comprises a mainboard, and the mainboard serves as the abutment structure; and / or, The electronic device further comprises a mainboard bracket, and the mainboard bracket serves as the abutting structure.

14. The electronic device according to claim 12 or 13, characterized in that: The electronic device further includes a buffer component, which is located between the extending structure and the abutting structure, and is connected to the extending structure and the abutting structure respectively.

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