The invention discloses a multi-module impedance compound sound insulation plate and a manufacturing method thereof. The method adopts a principle based on a
Helmholtz resonator, and is characterized in that a shell is a panels made a rigid sound insulation material, and edges at one side are rolled to form a groove; the inner side of a damp sound insulation plate module groove is provided with a
bilayer plate sound insulation structural plate or a
bilayer plate sound insulation module protective layer, a sound sucking material, a protective fabric and a perforating plate. The manufacturing method comprises the following steps: according to different requirements of the sound insulation volume, respectively calculating a damp sound insulation plate module, a
bilayer sound insulation structural module and a perforating plate resonant sound sucking structural module; adjusting the thickness and the density of each material in each layer structure; adjusting the dimension of each acoustic structure, thus ensuring that each layer structure of the product conforms to the
quality standard of design requirements. The invention improves the environment adaptability of the sound insulation plate, can effectively ensure the service life in the moist environment, can improve the sound insulation volume to at least 10-15dB compared with like products, and simultaneously can carry out intensified design aiming at different
noise frequency band through adjusting each material and acoustic structures, thus improving the
noise decreasing effect.