A heat dissipation structure for a large-function infrared transmitter

Abstract

The utility model discloses a heat dissipation structure of a large-function infrared transmitter. The utility model relates to the technical field of heat dissipation structures. A device body is provided on the inner wall of the device body with an infrared transmitter body. A first heat dissipation copper sheet is installed near the upper side of the inner wall of the infrared transmitter body. A heat conductive sheet is installed at the center of the upper end of the first heat dissipation copper sheet. A second heat dissipation copper sheet is installed at the upper end of the heat conductive sheet. The utility model has the advantages of: enabling the heat dissipation mechanism to provide faster and more effective heat dissipation capability when the infrared transmitter body is running, so that the infrared transmitter body will not overheat during operation, causing damage to internal components, and enabling the heat dissipation mechanism to be separated from the infrared transmitter body, so that it is more convenient to repair the infrared transmitter body and the heat dissipation mechanism, thereby improving the functionality of the heat dissipation mechanism.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation structures, in particular to a heat dissipation structure of a large-function infrared transmitter. Background Art

[0002] An infrared radio wave transmitter is a device used for short-distance wireless communication. It transmits data by emitting infrared radio waves. Its product structure mainly includes a power module, a transmitting module, a control module and a receiving module. A large-function infrared transmitter is one of them. When a large-function infrared transmitter is running, it will generate heat and is generally equipped with a heat dissipation structure.

[0003] In the current existing technology, for example, patent number CN217010845U discloses a heat dissipation mechanism for a technical indicator detection device of a medium wave transmitter. Because the machine is always in working state and the ventilation effect is relatively poor, the heat dissipation of the electronic components inside is not good, resulting in damage or other adverse problems. According to the existing technical problems, we have designed a new technical solution. Utility Model Content

[0004] The utility model aims to provide a heat dissipation structure of a large-function infrared transmitter.

[0005] In order to solve the problems raised in the above-mentioned background technology, the utility model provides the following technical solutions: a heat dissipation structure of a large-function infrared transmitter, including a device body, an inner wall of the device body is provided with an infrared transmitter body, a first heat dissipation copper plate is installed near the upper side of the inner wall of the infrared transmitter body, a heat conductive plate is installed at the center of the upper end of the first heat dissipation copper plate, a second heat dissipation copper plate is installed at the upper end of the heat conductive plate, a circulation pipe is installed at the upper end of the second heat dissipation copper plate, a circulation pump is provided at the center of the upper end of the second heat dissipation copper plate, a slide plate is installed on the side wall of the second heat dissipation copper plate, and an L plate is installed near the right side of the slide plate.

[0006] Preferably, a water tank is fixedly connected to the upper end of the slide plate near the lower right corner, and a blocking cap is movably connected to the center position of the upper end of the water tank.

[0007] Preferably, a slot is provided at a position near the middle of the upper end of the L-plate, and a heat dissipation fan is fixedly connected inside the slot, and the number of the heat dissipation fans is two.

[0008] Preferably, the four corners of the lower end of the device body are fixedly connected with supporting legs, and the center position of the left side wall of the fixing frame is provided with a sliding groove.

[0009] Preferably, a fixing frame is provided at positions near both sides of the back side of the device body, a connecting block is provided on the inner wall of the fixing frame, and a plug plate is provided through the left side wall of the connecting block.

[0010] Preferably, a sliding groove is provided at the position where the connecting block contacts the plug plate, and the plug plate is slidably connected to the sliding groove.

[0011] Preferably, a bolt is provided through the center position of the right side wall of the plug plate, and the bolt passes through the device body, wherein the bolt is threadedly connected to the plug plate.

[0012] Compared with existing products, this patent has the following beneficial effects

[0013] When the infrared transmitter body is started, the circulation pump will be started synchronously, so that the circulation pump can circulate the water inside the water tank in the circulation pipe through the cooperation of the water tank and the circulation pipe. At the same time, the components inside the infrared transmitter body will emit heat, and then the heat will be conducted to the first heat sink copper sheet, and then the heat will be concentrated in the second heat sink copper sheet through the cooperation of the heat conductive sheet. At this time, the water inside the circulation pipe will take away the heat inside the second heat sink copper sheet when circulating, so that the second heat sink copper sheet can continue to dissipate heat, and through the cooperation of the heat dissipation fan, the cooling of the second heat sink copper sheet and the circulation pipe is accelerated, thereby improving the heat dissipation efficiency. Then, the water inside the water tank can be replaced through the plugging cap, so that the heat dissipation mechanism can provide faster and better heat dissipation capacity when the infrared transmitter body is running, so that the infrared transmitter body will not overheat when running, causing damage to internal components;

[0014] The heat dissipation mechanism is separated from the device body, so as to facilitate the replacement or maintenance of the components of the infrared transmitter body and the heat dissipation mechanism. After the maintenance is completed, the slide plate is pushed back again, and then the plug plate is inserted back, and finally the bolts are tightened. The function of separating the heat dissipation mechanism from the infrared transmitter body makes it more convenient to repair the infrared transmitter body and the heat dissipation mechanism, thereby improving the functionality of the heat dissipation mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure in the embodiment of the utility model;

[0016] Figure 2 It is a top view of an embodiment of the utility model;

[0017] Figure 3 This is a schematic diagram of the connection structure of the first heat dissipation copper sheet and the heat conducting sheet in the embodiment of the utility model;

[0018] Figure 4 It is a cross-sectional view of the device body in the embodiment of the utility model.

[0019] In the figure: 1. Device body; 2. Legs; 3. Infrared transmitter body; 4. First heat sink; 5. Heat conducting plate; 6. Second heat sink; 7. Water tank; 8. Circulation pipe; 9. Circulation pump; 10. L-plate; 11. Cooling fan; 12. Blockage; 13. Fixing bracket; 14. Slide plate; 15. Connecting block; 16. Insert plate; 17. Bolts. DETAILED DESCRIPTION

[0020] The specific implementation methods of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these implementation methods is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each implementation method of the present invention described below can be combined with each other as long as they do not conflict with each other. Example 1

[0021] See also Figure 1-4 The utility model provides a technical solution: a heat dissipation structure of a large-function infrared transmitter, including a device body 1, an infrared transmitter body 3 is arranged on the inner wall of the device body 1, a first heat dissipation copper sheet 4 is installed near the upper side of the inner wall of the infrared transmitter body 3, a heat conductive sheet 5 is installed at the center of the upper end of the first heat dissipation copper sheet 4, a second heat dissipation copper sheet 6 is installed at the upper end of the heat conductive sheet 5, a circulation pipe 8 is installed at the upper end of the second heat dissipation copper sheet 6, a circulation pump 9 is arranged at the center of the upper end of the second heat dissipation copper sheet 6, a slide plate 14 is installed on the side wall of the second heat dissipation copper sheet 6, and an L plate 10 is installed near the right side of the slide plate 14.

[0022] The upper end of the slide plate 14 is fixedly connected to the water tank 7 near the lower right corner, and the center position of the upper end of the water tank 7 is movably connected to the blocking cap 12.

[0023] A slot is formed near the middle of the upper end of the L-plate 10 , and a heat dissipation fan 11 is fixedly connected inside the slot, and the number of the heat dissipation fans 11 is two.

[0024] During use, when the infrared transmitter body 3 is started, the circulation pump 9 will be started synchronously, so that the circulation pump 9 pumps the water inside the water tank 7 into the circulation pipe 8, so that the water inside the water tank 7 circulates in the circulation pipe 8, and at the same time, the components inside the infrared transmitter body 3 will emit heat, and then the heat will be conducted to the first heat dissipation copper sheet 4, and then through the action of the heat conductive sheet 5, the heat will be concentrated in the second heat dissipation copper sheet 6, at this time, the water inside the circulation pipe 8 will take away the heat inside the second heat dissipation copper sheet 6 when circulating, so that the second heat dissipation copper sheet 6 can continue to dissipate heat, at this time, the heat dissipation fan 11 will dissipate heat for the second heat dissipation copper sheet 6 and the circulation pipe 8, so that the cooling of the second heat dissipation copper sheet 6 and the circulation pipe 8 is accelerated, and the heat dissipation efficiency is improved, and then the water inside the water tank 7 can be replaced through the plugging cap 12, so that the heat dissipation mechanism can provide faster and better heat dissipation capacity when the infrared transmitter body 3 is running, so that the infrared transmitter body 3 will not overheat during operation, causing damage to internal components. Example 2

[0025] See also Figure 1-4 The utility model provides a technical solution: a large-function infrared transmitter heat dissipation structure, a fixing frame 13 is arranged near both sides of the back of the device body 1, a connecting block 15 is arranged on the inner wall of the fixing frame 13, and a plug board 16 is arranged through the left wall of the connecting block 15.

[0026] A sliding groove is provided at the position where the connecting block 15 contacts the plugging plate 16, and the plugging plate 16 is slidably connected to the sliding groove.

[0027] A bolt 17 is provided through the center of the right side wall of the inserting plate 16 , and the bolt 17 passes through the device body 1 , wherein the bolt 17 is threadedly connected to the inserting plate 16 .

[0028] Specifically, when the infrared transmitter body 3 and the heat dissipation mechanism need to be repaired, the bolt 17 is loosened to cancel the fixing of the bolt 17 on the plug plate 16, and then the plug plate 16 is pulled to slide in the bolt 17 and the slide groove inside the connecting block 15, and then the connecting block 15 is pulled to make the slide plate 14 slide in the groove inside the device body 1, so as to separate the heat dissipation mechanism from the device body 1, thereby facilitating the replacement or repair of the infrared transmitter body 3 and the components of the heat dissipation mechanism. After the repair is completed, the slide plate 14 is pushed back again, and then the plug plate 16 is inserted back, and finally the bolt 17 is tightened, so that the heat dissipation mechanism can be separated from the infrared transmitter body 3, which makes it more convenient to repair the infrared transmitter body 3 and the heat dissipation mechanism, thereby improving the functionality of the heat dissipation mechanism.

[0029] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations of these embodiments are made without departing from the principles and spirit of the present invention, and still fall within the scope of protection of the present invention.

Claims

1. A heat dissipation structure of a large-function infrared transmitter, comprising a device body (1), characterized in that: An infrared transmitter body (3) is arranged on the inner wall of the device body (1); a first heat dissipation copper sheet (4) is installed near the upper side of the inner wall of the infrared transmitter body (3); a heat conducting sheet (5) is installed at the center of the upper end of the first heat dissipation copper sheet (4); a second heat dissipation copper sheet (6) is installed at the upper end of the heat conducting sheet (5); a circulation pipe (8) is installed at the upper end of the second heat dissipation copper sheet (6); a circulation pump (9) is arranged at the center of the upper end of the second heat dissipation copper sheet (6); a slide plate (14) is installed on the side wall of the second heat dissipation copper sheet (6); and an L plate (10) is installed near the right side of the slide plate (14).

2. The heat dissipation structure of a high-function infrared transmitter according to claim 1, characterized in that: A water tank (7) is fixedly connected to the upper end of the slide plate (14) near the lower right corner, and a blocking cap (12) is movably connected to the center of the upper end of the water tank (7).

3. The heat dissipation structure of a high-function infrared transmitter according to claim 1, characterized in that: The upper end of the L-plate (10) is provided with a slot near the middle, and a heat dissipation fan (11) is fixedly connected inside the slot, and the number of the heat dissipation fans (11) is two.

4. The heat dissipation structure of a high-function infrared transmitter according to claim 1, characterized in that: The four corners of the lower end of the device body (1) are fixedly connected to supporting legs (2), and a sliding groove is provided at the center position of the left side wall of the fixing frame (13).

5. The heat dissipation structure of a high-function infrared transmitter according to claim 1, characterized in that: A fixing frame (13) is provided at positions close to both sides of the back of the device body (1), a connecting block (15) is provided on the inner wall of the fixing frame (13), and a plug plate (16) is provided through the left side wall of the connecting block (15).

6. The heat dissipation structure of a high-function infrared transmitter according to claim 5, characterized in that: A sliding groove is provided at the position where the connecting block (15) contacts the plug plate (16), and the plug plate (16) is slidably connected to the sliding groove.

7. The heat dissipation structure of a high-function infrared transmitter according to claim 6, characterized in that: A bolt (17) is provided through the center of the right side wall of the insert plate (16), and the bolt (17) passes through the device body (1), wherein the bolt (17) is threadedly connected to the insert plate (16).

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