Circuit board drying equipment

Abstract

The present application relates to the technical field of circuit board manufacturing, and more specifically, to a circuit board drying device. In the circuit board drying device provided in the embodiment of the present application, when the circuit board needs to be dried, the circuit board is first placed on the roller conveyor belt of the inclined plate of the humanoid support, and then the roller conveyor belt is started and the circuit board can be moved toward the inside of the drying bin. When the circuit board enters the inside of the drying bin, the drying fan will blow air to dry the circuit board. Since the circuit board is placed obliquely on the roller conveyor belt of the inclined plate, under the action of the wind force of the drying fan, the etching liquid remaining on the surface of the circuit board will flow obliquely into the water storage tank, so that the drying fan can easily dry the circuit board thoroughly. With the above-mentioned structural design, it can take less time to dry the circuit board, thereby greatly improving the drying efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board manufacturing, and more specifically, to a circuit board drying device. Background Art

[0002] With the rapid development of electronic products, the manufacturing market competition pressure of printed circuit boards, which are the basis of electronic components, is increasing, and the quality standards of printed circuit boards are becoming more and more stringent. As important production links of printed circuit boards, the horizontal production lines of development, etching, film stripping and drying need to be disassembled for maintenance due to the need for equipment maintenance and product quality considerations.

[0003] In the related art, printed circuit boards involve many wet manufacturing processes, such as circuit etching and surface roughening, etc. After these processes, the printed circuit boards need to be dried so that subsequent welding operations can be carried out smoothly.

[0004] However, in the actual production process, since a large amount of etching liquid adheres to the surface of the conductive layer, it takes a long time to dry the etching liquid, thereby greatly reducing the drying efficiency. Utility Model Content

[0005] In view of this, an embodiment of the present application provides a circuit board drying device to solve the technical problem in the related art that the drying device is difficult to completely remove the etching liquid on the surface of the circuit board.

[0006] In order to achieve the above objectives, the present application provides the following technical solutions:

[0007] A circuit board drying device, comprising:

[0008] frame;

[0009] A drying bin, the drying bin is arranged on the frame, the drying bin has a material inlet and a material outlet, a driving motor is arranged at the top of the drying bin, the driving motor is vertically arranged on the top surface of the drying bin, and a drying fan connected to the driving motor is arranged on the inner top surface of the drying bin;

[0010] A transport channel, the transport channel is horizontally arranged on the frame, and the transport channel passes through the drying bin through the inlet and the outlet;

[0011] A herringbone bracket, the herringbone bracket comprising two inclined plates, the two inclined plates being arranged on the upper surface of the transport channel, each inclined plate being provided with a roller conveyor belt, the two roller conveyor belts being located directly below the drying fan, and the roller conveyor belts being used to transport circuit boards;

[0012] A baffle is vertically arranged on the upper surface of the transport channel, the baffle is located beside the inclined plate, and a water storage tank is formed between the baffle and the inclined plate.

[0013] In some possible implementations, the length of the herringbone support is equal to the length of the transport channel.

[0014] In some possible implementations, a plurality of the driving motors are disposed on the top upper surface of the drying bin, the driving motors extend along the length direction of the drying bin, and each of the driving motors is connected to the drying fan.

[0015] In some possible implementations, the connection line between the plurality of driving motors and the drying fan coincides with the center line of the drying chamber in the width direction.

[0016] In some possible implementations, the connection line between the plurality of driving motors and the drying fan coincides with the center line of the herringbone bracket.

[0017] In some possible implementations, a water collecting box is further provided on the bottom surface of the transport channel, and the water collecting box is connected to the water storage tank.

[0018] The circuit board drying device provided in the embodiment of the present application has at least the following beneficial effects:

[0019] In the circuit board drying equipment provided in the embodiment of the present application, when the circuit board needs to be dried, the circuit board is first placed on the roller conveyor belt of the inclined plate of the humanoid support, and then the roller conveyor belt is started and the circuit board can be moved toward the inside of the drying chamber. When the circuit board enters the inside of the drying chamber, the drying fan will blow air to dry the circuit board. Since the circuit board is placed obliquely on the roller conveyor belt of the inclined plate, under the action of the wind force of the drying fan, the etching liquid remaining on the surface of the circuit board will flow obliquely into the water storage tank, thereby, the drying fan can easily dry the circuit board thoroughly. With the above-mentioned structural design, it can take less time to dry the circuit board, thereby greatly improving the drying efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A schematic diagram of the structure of a circuit board drying device provided in an embodiment of the present application;

[0022] Figure 2 A side view of a circuit board drying device provided in an embodiment of the present application;

[0023] Figure 3 A side sectional view of a circuit board drying device provided in an embodiment of the present application.

[0024] In the figure:

[0025] 100, frame; 200, drying bin; 210, material inlet; 220, material outlet; 300, driving motor; 400, drying fan; 500, herringbone bracket; 510, inclined plate; 520, roller conveyor belt; 600, baffle; 700, water storage tank; 800, water collection box; 900, transportation channel. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] like Figure 1-Figure 3 As shown, the circuit board drying equipment provided in the embodiment of the present application includes a frame 100, a drying chamber 200, a transport channel 900, a herringbone bracket 500 and a baffle 600, wherein the frame 100 is a supporting structure of the drying equipment, and in the present embodiment, the frame 100 is a floor-standing frame. The drying chamber 200 is arranged on the frame 100, and the drying chamber 200 is a structure with a chamber inside, and the drying chamber 200 has an inlet 210 and an outlet 220. In actual use, the circuit board can enter the drying chamber 200 from the inlet 210, and realize the drying process in the drying chamber 200, and finally leave the drying chamber 200 through the outlet 220.

[0028] A driving motor 300 is fixedly installed on the upper surface of the top plate of the drying bin 200. The driving motor 300 is vertically arranged on the upper surface of the top plate of the drying bin 200. The driving shaft of the driving motor 300 passes through the top plate of the drying bin 200 and extends into the drying bin 200. The driving shaft of the driving motor 300 is located at the end of the drying bin 200 and is fixedly connected to a drying fan 400. Therefore, the driving motor 300 can drive the drying fan 400 to rotate, thereby achieving drying of the circuit boards in the drying bin 200.

[0029] Preferably, a plurality of drive motors 300 are disposed on the upper surface of the top plate of the drying chamber 200, and the plurality of drive motors 300 are arranged equidistantly along the length direction of the drying chamber 200. In some embodiments, the center line of the plurality of drive motors 300 coincides with the center line of the width direction of the drying chamber 200. Each drive motor 300 is correspondingly connected to a drying fan 400, so that the drying chamber 200 can have a stronger drying treatment effect.

[0030] The transport channel 900 is horizontally arranged on the frame 100. The transport channel 900 enters the drying chamber 200 from the feed inlet 210 and passes through the interior of the drying chamber 200 and extends toward the feed inlet 210. The herringbone bracket 500 is arranged on the upper surface of the transport channel 900. Figure 2 As shown, the herringbone support 500 includes two inclined plates 510, each of which is provided with a roller conveyor belt 520, and the roller conveyor belt 520 is used to transport the circuit board. Preferably, the length of the roller conveyor belt 520 is adapted to the length of the transport channel 900.

[0031] In this embodiment, the baffle 600 is a structure vertically arranged on the upper surface of the transport channel 900, the baffle 600 is located beside the inclined plate 510, and a water storage tank 700 is formed between the baffle 600 and the inclined plate 510. When the circuit board is placed obliquely on the roller conveyor belt 520, the etching liquid remaining on the surface of the circuit board will flow obliquely into the water storage tank 700.

[0032] In the circuit board drying device provided in the embodiment of the present application, when the circuit board needs to be dried, the circuit board is first placed on the roller conveyor belt 520 of the inclined plate 510 of the humanoid support, and then the roller conveyor belt 520 is started and the circuit board can be moved toward the inside of the drying chamber 200. After the circuit board enters the inside of the drying chamber 200, the drying fan 400 blows air to dry the circuit board. Since the circuit board is placed obliquely on the roller conveyor belt 520 of the inclined plate 510, under the action of the wind force of the drying fan 400, the etching liquid remaining on the surface of the circuit board will flow obliquely into the water storage tank 700, thereby, the drying fan 400 can easily dry the circuit board thoroughly. With the above-mentioned structural design, it takes less time to dry the circuit board, thereby greatly improving the drying efficiency.

[0033] In some embodiments, a water collecting box 800 is further provided on the bottom surface of the transport channel 900, and the water collecting box 800 is connected to the water storage tank 700. In this way, the remaining etching liquid can be recycled and processed again through the water collecting box 800, thereby improving the utilization rate of resources.

[0034] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0035] It should be noted that the phrases "one embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include certain features, structures or characteristics, but not every embodiment may include the certain features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing certain features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments, whether explicitly or not explicitly described.

[0036] In general, terms should be understood, at least in part, by the context in which they are used. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, depending, at least in part, on the context. Similarly, terms such as "a," "an," or "the" may also be understood to convey singular usage or to convey plural usage, depending, at least in part, on the context.

[0037] It should be easily understood that “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above” or “over,” but also may include the meaning of “above” or “over something” with no intervening features or layers therebetween (i.e., directly on something).

[0038] In addition, spatially relative terms, such as "below," "below," "beneath," "above," "above," etc., may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0039] The term "substrate" as used herein refers to the material on which subsequent material layers are added. The substrate itself may be patterned. The material added on top of the substrate may be patterned, or may remain unpatterned. In addition, the substrate may include a wide range of materials, such as silicon, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate may be made of a non-conductive material (e.g., glass, plastic, or sapphire wafer, etc.).

[0040] The term "layer" used in the text may refer to a material portion including an area with a certain thickness. A layer may extend over the entire underlying structure or overlying structure, or may have a range smaller than the range of the underlying or overlying structure. In addition, a layer may be an area of ​​a homogeneous or inhomogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, a layer may be located between the top surface and the bottom surface of the continuous structure or between any paired lateral planes at the top surface and the bottom surface. A layer may extend laterally, vertically and / or along a tapered surface. A substrate may be a layer, may include one or more layers therein, and / or may have one or more layers located thereon, above it and / or below it. A layer may include multiple layers. For example, an interconnect layer may include one or more conductors and a contact layer (forming contacts, interconnects and / or vias therein) and one or more dielectric layers.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board drying device, characterized in that: include: Rack(100); A drying bin (200), the drying bin (200) being arranged on the frame (100), the drying bin (200) having an inlet (210) and an outlet (220), a driving motor (300) being arranged at the top of the drying bin (200), the driving motor (300) being arranged vertically on the top surface of the top of the drying bin (200), and a drying fan (400) connected to the driving motor (300) being arranged on the inner top surface of the drying bin (200); a transport channel (900), wherein the transport channel (900) is horizontally arranged on the frame (100), and the transport channel (900) passes through the drying bin (200) through the material inlet (210) and the material outlet (220); A herringbone bracket (500), the herringbone bracket (500) comprising two inclined plates (510), the two inclined plates (510) being arranged on the upper surface of the transport channel (900), each of the inclined plates (510) being provided with a roller conveyor belt (520), the two roller conveyor belts (520) being located directly below the drying fan (400), and the roller conveyor belts (520) being used for transporting circuit boards; A baffle (600) is vertically arranged on the upper surface of the transport channel (900), the baffle (600) is located beside the inclined plate (510), and a water storage tank (700) is formed between the baffle (600) and the inclined plate (510).

2. The circuit board drying equipment according to claim 1, characterized in that: The length of the herringbone support (500) is equal to the length of the transport channel (900).

3. The circuit board drying equipment according to claim 1, characterized in that: A plurality of the driving motors (300) are arranged on the top upper surface of the drying bin (200), the driving motors (300) extend along the length direction of the drying bin (200), and each of the driving motors (300) is connected to the drying fan (400).

4. The circuit board drying equipment according to claim 3, characterized in that: The connection line between the plurality of driving motors (300) and the drying fan (400) coincides with the center line of the drying chamber (200) in the width direction.

5. The circuit board drying equipment according to claim 4, characterized in that: The connection line between the plurality of driving motors (300) and the drying fan (400) coincides with the center line of the herringbone bracket (500).

6. The circuit board drying equipment according to claim 1, characterized in that: A water collecting box (800) is also provided on the bottom surface of the transport channel (900), and the water collecting box (800) is connected to the water storage tank (700).

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