Double-layer micro-channel miniature cooling device

Abstract

The utility model belongs to the technical field of heat dissipation and cooling of three-dimensional integrated circuits and high-power semiconductors, and relates to a double-layer micro-channel miniature cooling device. Comprising a top plate (1), a jet flow hole plate (2), a bubble forming cavity (3), a spiral blade type cooling target plate (4), a heat exchange cavity (5) and an outflow hole (6). The utility model provides a novel structure, which combines the advantages of the rib columns and the micropores, improves the heat transfer coefficient and the critical heat flux density, and strengthens the heat transfer. After a cooling medium jet flow enters the bubble forming cavity (3), due to the fact that the rib columns and the bubble forming holes (3) are distributed on the cooling medium jet flow, the nucleation point density is improved, a cooling working medium can conduct primary heat exchange, a large number of bubbles are generated to take away heat, and the working efficiency of the cooling working medium is improved; after a cooling working medium enters the heat exchange cavity (5), advanced heat exchange can be carried out, and spiral blades of the spiral blade type cooling target plate (4) can generate turbulent flow, so that the purpose of enhancing heat dissipation is achieved, and the cooling working medium is fully used.

Description

Technical Field

[0001] The utility model belongs to the technical field of three-dimensional integrated circuit and high-power semiconductor heat dissipation and cooling, and relates to a double-layer micro-channel micro-cooling device. Background Art

[0002] In recent years, with the continuous development of human technology, chip technology, microelectronics technology and other technologies have developed rapidly, the integration level of electronic circuits has been continuously improved, and the capacity of electronic components has been continuously expanded. The resulting high heat generation of electronic components has become a major hidden danger affecting normal operation. For electronic equipment, increased temperature means reduced reliability. When the temperature of electronic equipment reaches 70-80°C, its reliability decreases by 5% for every 10°C increase in temperature. On this basis, in view of the excessively high local temperature and uneven distribution of microelectronic components, as well as the rise and development of microscale devices and their cooling devices, higher demands have been put forward for enhanced heat transfer technology in small spaces. At the same time, the existing direction of enhanced heat exchange is mainly to improve the cooling effect of microchannel liquid by changing the shape and internal roughness of the microchannel. However, double-layer or even multi-layer cooling structures are relatively rare.

[0003] In view of this situation, microchannel cooling technology has been widely used. At present, microchannel cooling mostly uses ribs, which has the advantage of increasing the critical heat flux density, but cannot increase the heat transfer coefficient. At the same time, because of the alternating hot and cold bubbles, it will cause uneven fluid in each area of ​​the microchannel, no gas-liquid separation inside, and poor heat exchange performance. Utility Model Content

[0004] The purpose of the utility model is to improve the cooling efficiency and strengthen the heat exchange through a new structure, while achieving gas-liquid separation at the same time. To achieve this purpose, the scheme of the utility model is as follows:

[0005] A double-layer microchannel cooling device comprises a top plate (1), a jet hole plate (2), a bubble forming cavity (3), a spiral blade type cooling target plate (4), a heat exchange cavity (5), and an outflow hole (6). The utility model is a one-inlet and two-outlet device.

[0006] Furthermore, the top plate (1) has a water inlet hole, and the cooling medium flows in through the water inlet hole.

[0007] Furthermore, the jet holes in the jet hole plate (2) are arranged in a 5×2 uniform array, with a lateral and longitudinal distance of 19 d. The jet hole plate (2) is 119 d long, 62 d wide and 5 d thick.

[0008] Furthermore, the centers of the two arc-shaped ribs in the bubble forming chamber (3) are coaxial with the jet holes of the jet hole plate (2); the bubble forming chamber (3) comprises a jet hole (31), a shield-shaped rib (32), a bubble forming hole (33), a diamond-shaped rib (34), and an arc-shaped rib (35), a total of five working units; the jet hole (31) of the bubble forming chamber (3) is coaxial with the spiral blade type cooling target plate (4); and the outflow hole (6) is located on both sides of the heat exchange chamber (5).

[0009] Furthermore, the bubble forming chamber (3) comprises a jet hole (31), a shield-shaped rib column (32), a bubble forming hole (33), a diamond-shaped rib column (34), and an arc-shaped rib column (35), a total of five working units.

[0010] Furthermore, the jet holes (31) are arranged in a uniform array of 5×2 in the bubble forming chamber (3).

[0011] Furthermore, a diamond rib (34), a bubble forming hole (33), an arc rib (35), and a shield rib (32) form a working group. The diamond rib (34) is distributed around the bubble forming hole (33) and the arc rib (35) in a 5×2 uniform array; the arc rib (35) is distributed between the bubble forming hole (33) and the shield rib (32); the shield rib (32) is distributed between the arc rib (35), close to the edge of the bubble forming cavity (3) and between the four jet holes (31).

[0012] Furthermore, the diameters of the jet hole (31) and the bubble forming hole (33) are 5d and 4d respectively; the depth of the bubble forming hole (33) is 1.5d, the height of the arc rib column (35) is 3d; the height of the diamond rib column (34) is 5d and the side length is 4d; the height of the shield rib column (32) is 5d.

[0013] Furthermore, the cooling medium flows through the bubble forming chamber (3) to perform preliminary heat exchange; the diamond ribs (34), the arc ribs (35) and the shield ribs (32) can enhance heat exchange, increase the critical heat flux density, and make the heat exchange more sufficient; the bubble forming holes (33) increase the nucleation point density and the heat transfer coefficient, so that the bubbles are formed and separated.

[0014] Furthermore, the jet hole (31) in the bubble forming chamber (3) and the spiral blade type cooling target plate (4) in the heat exchange chamber (5) are cocentric.

[0015] Furthermore, the spiral blade-shaped cooling target plates (4) in the heat exchange cavity (5) are arranged in a 6×3 uniform array.

[0016] Furthermore, three layers of ribs are distributed on the spiral blade type cooling target plate (4), the first layer is composed of 12 quadrilateral ribs, the second layer is composed of 12 wider quadrilateral ribs, and the third layer is composed of 12 spiral blade ribs and 12 rhombus ribs.

[0017] Furthermore, the spiral blade type cooling target plate (4) has a diameter of 18d and a rib column height of 2d.

[0018] Furthermore, there are three outflow holes (6) on each side of the heat exchange cavity (5); the outflow holes (6) have a diameter of 2d and are spaced 19d apart.

[0019] Furthermore, the cooling medium flows in from the circular water inlet of the top plate (1), passes through the jet hole plate (2) to slow down the flow rate of the medium, flows into the bubble forming chamber (3) from the jet hole, and impacts the center of the arc-shaped rib column. The medium disperses and impacts the circular rib column (35), the shield-shaped rib column (32) and the diamond-shaped rib column (34), so that the medium is dispersed more evenly. Preliminary heat dissipation is performed, and then the medium flows through the bubble forming hole (33), enters the heat exchange chamber (5) from the jet hole (31), and performs advanced heat exchange with the spiral blade type cooling target plate (4), and finally flows out from the outflow holes (6) on both sides.

[0020] The advantages of the utility model are:

[0021] The double-layer design allows the cooling medium to undergo two heat exchanges; initial heat exchange is performed in the bubble forming chamber (3), the temperature of the cooling medium rises, and the temperature change in the heat exchange chamber (5) is smaller than that in the bubble forming chamber (3), so bubbles are not easily generated; and after the advanced heat exchange, the overall heat exchange is more sufficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Appearance of a double-layer microchannel micro cooling device

[0023] Figure 2 A double-layer microchannel micro-cooling device jet orifice structure diagram

[0024] Figure 3 A three-dimensional schematic diagram of the bubble formation chamber of a double-layer microchannel micro-cooling device

[0025] Figure 4 Three views of the bubble formation cavity of a double-layer microchannel micro-cooling device

[0026] Figure 5 A three-dimensional schematic diagram of a heat exchange cavity of a double-layer microchannel micro-cooling device

[0027] Figure 6 Three views of a heat exchange cavity of a double-layer microchannel micro cooling device

[0028] Figure 7A double-layer microchannel micro-cooling device with spiral blades for cooling the target plate structure DETAILED DESCRIPTION

[0029] The utility model is a one-in-two-out device, a double-layer microchannel cooling device, comprising a top plate 1, a jet orifice plate 2, a bubble forming cavity 3, a spiral blade type cooling target plate 4, a heat exchange cavity 5, and an outflow hole 6; the cooling medium flows in from the circular water inlet of the top plate 1, slows down the flow rate of the medium through the jet orifice plate 2, flows into the bubble forming cavity 3 from the jet hole, the medium impacts the center of the arc rib column, and the medium scatters and impacts the circular rib column 35 and the shield rib column 3) and the diamond rib column 34, so that the medium is dispersed more evenly. Preliminary heat dissipation is performed, and then the medium flows through the bubble forming hole 33, enters the heat exchange cavity 5 from the jet hole 31 and performs advanced heat exchange with the spiral blade type cooling target plate 4, and finally flows out from the outflow holes 6 on both sides.

[0030] The lower part of the top plate 1 is welded to the upper part of the jet orifice plate 2, and the lower part of the bubble forming chamber 3 is welded to the upper part of the heat exchange chamber 5. The above structural materials are all made of oxygen-free copper, and the connection method is completed by vacuum welding.

[0031] refer to Figure 2 The jet orifice plate 2 is made of oxygen-free copper, and the jet holes on it are formed by micro-milling and polished. The jet orifice plate 2 is 119d long, 62d wide, and 5d thick. The jet holes are arranged in a 4×2 uniform array, and the distance between them in the horizontal and vertical directions is 19d. The cooling medium enters the bubble forming chamber 3 from the jet holes.

[0032] refer to Figure 4 The existence of the bubble forming holes 33 in the bubble forming cavity 3 significantly improves the nucleation point density and the heat transfer coefficient, and after the initial heat exchange, the overall heat exchange time is longer and the heat exchange is more sufficient. The diamond ribs are arranged in a uniform array of 2×5 on the bubble forming cavity 3, with a height of 5d and a side length of 4d. The shield ribs 32 are 5d high and arranged in a uniform array of 6×3.

[0033] refer to Figure 5 The heat exchange cavity 5 is made of oxygen-free copper smelting method, and its main function is heat exchange; the arc structure design of the spiral blade cooling target plate 4 increases the disturbance of the cooling medium, so that the cooling medium flowing out of the bubble forming cavity 3 can fully play its role; the spiral blade cooling target plate 4 is distributed in 6×3, and the rib column is glued to the base. There are six outflow holes 6 on the heat exchange cavity 5, which are arranged on both sides to facilitate the outflow of the cooling medium.

[0034] refer to Figure 6 The base of the spiral blade cooling target plate 4 is cut from oxygen-free copper, and the upper ribs are made of silicon cutting. The ribs are glued to the base for easy replacement. The ribs are more dispersed, which increases the contact area with the cooling medium and improves the heat dissipation efficiency of the medium.

[0035] refer to Figure 7 There are three layers of ribs distributed on the spiral blade cooling target plate 4. The first layer consists of 12 quadrilateral ribs, the second layer consists of 12 wider quadrilateral ribs, and the third layer consists of 12 spiral blade ribs and 12 rhombus ribs. The arc angle of the spiral blade rib is formed by the tangent of the circle with a radius of 6.3d and a radius of 11.5d, and the whole is a spiral structure; the rhombus rib has a side length of 4d and an angle of 57°, and is evenly distributed in an array.

[0036] Matters not covered in this utility model are known technologies.

[0037] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A double-layer micro-channel micro-cooling device, comprising a top plate (1), a jet orifice plate (2), a bubble forming cavity (3), a spiral blade type cooling target plate (4), a heat exchange cavity (5), and an outflow hole (6), characterized in that: The centers of the two arc-shaped rib columns in the bubble forming chamber (3) are coaxial with the jet hole of the jet hole plate (2); the bubble forming chamber (3) comprises a jet hole (31), a shield-shaped rib column (32), a bubble forming hole (33), a diamond-shaped rib column (34), and an arc-shaped rib column (35), a total of five working units; the jet hole (31) of the bubble forming chamber (3) is coaxial with the spiral blade type cooling target plate (4); and the outflow hole (6) is located on both sides of the heat exchange chamber (5).

2. A double-layer micro-channel micro-cooling device according to claim 1, characterized in that: The jet holes (31) are arranged in a 5×2 uniform array in the bubble forming cavity (3); the diamond ribs (34) are distributed around the bubble forming cavity (33) and the arcuate ribs (35) in a 5×2 uniform array; the arcuate ribs (35) are distributed between the bubble forming cavity (33) and the shield ribs (32); the shield ribs (32) are distributed between the arcuate ribs (35), close to the edge of the bubble forming cavity (3) and between the four jet holes (31).

3. A double-layer micro-channel micro-cooling device according to claim 1, characterized in that: A rhombus rib column (34), a bubble forming hole (33), an arcuate rib column (35), and a shield rib column (32) form a working group.

4. A double-layer micro-channel micro-cooling device according to claim 1, characterized in that: The jet hole (31) in the bubble forming cavity (3) and the spiral blade type cooling target plate (4) in the heat exchange cavity (5) are cocentric.

5. The double-layer micro-channel micro-cooling device according to claim 1, characterized in that: The spiral blade type cooling target plate (4) is provided with three layers of ribs, the first layer is composed of 12 quadrilateral ribs, the second layer is composed of 12 wider quadrilateral ribs, and the third layer is composed of 12 spiral blade ribs and 12 rhombus ribs.

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