Photovoltaic protection power device module with bayonet anti-failure structure

Abstract

The utility model discloses a photovoltaic protection power device module with a bayonet anti-failure structure, including a conductive copper sheet 1, a conductive copper sheet 2, a jumper and an epoxy plastic encapsulation body, wherein one end of the conductive copper sheet 1 is provided with a copper sheet 1 encapsulation area, and one end of the conductive copper sheet 2 is provided with a copper sheet 2 encapsulation area, and a heat dissipation gap is provided between the copper sheet 2 encapsulation area and the copper sheet 1 encapsulation area, one end of the jumper is conductively welded to the copper sheet 1 encapsulation area, and the other end is conductively welded to a chip, and the chip is arranged on the copper sheet 2 encapsulation area, and the epoxy plastic encapsulation body internally encapsulates and fixes the copper sheet 1 encapsulation area, the copper sheet 2 encapsulation area and the jumper, wherein the epoxy plastic encapsulation body is rectangular, and arc corners are respectively provided at the corner positions thereof. By adopting the technical scheme, the arc corners can reduce the corner pores and colloid loss during the production process of the epoxy plastic encapsulation body, thereby ensuring the molding quality of the epoxy plastic encapsulation body, so that the molding quality of the power diode module product is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of diode module structures, in particular to a photovoltaic protection power device module with a bayonet anti-failure structure. Background Art

[0002] Solar photovoltaic modules are devices that convert solar energy into electrical energy. In photovoltaic power generation systems, junction boxes play an important role. They are mainly used to output the current generated by each photovoltaic module and converge it to the system control box. In addition, the junction box also protects the solar photovoltaic modules. The junction box is generally equipped with a power diode module, which is connected to the battery string in the photovoltaic module. When there is a cell damage in the battery string or a hot spot effect caused by light blocking, the faulty battery string can be separated from the photovoltaic system to avoid its adverse effect on the entire photovoltaic system.

[0003] In the power diode module, a gap is maintained between two copper sheets, and the two copper sheets are conductively welded through a jumper. Finally, the jumper and the welding ends of the two copper sheets are fixed by epoxy packaging, thereby forming a modular structure of the power diode. In the prior art, the molding quality of the regular rectangular epoxy plastic package is poor, resulting in poor installation and heat dissipation effects of the power diode module product; in addition, when the two ends of the copper sheet are subjected to external pressure, it is easy to cause damage to the body, resulting in product failure and other problems. Utility Model Content

[0004] The utility model aims to provide a photovoltaic protection power device module with a bayonet anti-failure structure, which is used to solve the problems in the prior art that the rectangular epoxy plastic package causes poor molding effect of the power diode module product and the body is easily damaged.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] A photovoltaic protection power device module with a bayonet anti-failure structure, comprising:

[0007] A conductive copper sheet 1, one end of which is provided with a copper sheet 1 packaging area;

[0008] A second conductive copper sheet, one end of which is provided with a second copper sheet packaging area, and a heat dissipation gap is provided between the second copper sheet packaging area and the first copper sheet packaging area;

[0009] A jumper wire, one end of which is conductively welded to the copper sheet first packaging area, and the other end of which is conductively welded to a chip, wherein the chip is arranged on the copper sheet second packaging area;

[0010] An epoxy plastic encapsulation body, which internally encapsulates and fixes the copper sheet first encapsulation area, the copper sheet second encapsulation area and the jumper;

[0011] The epoxy plastic encapsulation body is rectangular in shape, and arc corners are arranged at the corners of the body.

[0012] As a further solution of the utility model: serrated strips are respectively arranged on the two side surfaces of the packaging area of ​​the copper sheet 1, and serrated edges 1 are respectively arranged on the two side outer edges; serrated U-shaped strips are respectively arranged on the two side surfaces of the packaging area of ​​the copper sheet 2, and serrated edges 2 are respectively arranged on the two side outer edges.

[0013] As a further solution of the utility model: the jumper is a U-shaped conductive sheet, a bent ear end on one side of the U-shaped conductive sheet is welded to the sawtooth strip on one side surface, and a bent ear end on the other side is welded to the chip.

[0014] As a further solution of the utility model: at least two copper sheet one through holes are arranged between the two side surfaces of the copper sheet one packaging area; at least three copper sheet two through holes are arranged between the two side surfaces of the copper sheet two packaging area.

[0015] As a further solution of the utility model: an end face folding groove is arranged on the edge of the copper sheet one packaging area facing the copper sheet two packaging area, and an end face protrusion matching the end face folding groove is arranged on the edge of the copper sheet two packaging area, and a heat dissipation gap is provided between the end face protrusion and the end face folding groove.

[0016] As a further solution of the utility model: the conductive copper sheet 1 and the conductive copper sheet 2 are respectively provided with assembly holes, and the side ends of the epoxy plastic sealing body are penetrated and arranged in the assembly holes.

[0017] As a further solution of the utility model: the conductive copper sheet 1 and the conductive copper sheet 2 are respectively provided with tin block welding areas.

[0018] As a further solution of the utility model: the side ends of the conductive copper sheet 1 and the conductive copper sheet 2 are symmetrically provided with bayonet grooves.

[0019] As a further solution of the utility model: the conductive copper sheet 1 and the conductive copper sheet 2 are respectively provided with positioning holes; the conductive copper sheet 1 or the conductive copper sheet 2 is provided with an anti-reverse positioning opening.

[0020] The beneficial effects of the utility model are as follows: the conductive copper sheet one and the conductive copper sheet two are encapsulated and fixed by the epoxy plastic sealing body, the shape structure of the epoxy plastic sealing body is improved, and arc corners are respectively arranged at the corner positions. The arc corners can reduce the corner pores and colloid loss during the production process of the epoxy plastic sealing body, thereby ensuring the molding quality of the epoxy plastic sealing body, thereby ensuring the molding quality of the power diode module product of the present application, and the well-molded epoxy plastic sealing body can enhance the heat dissipation effect, improve the junction temperature capacity and the thermal escape capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The utility model is further described below in conjunction with the accompanying drawings.

[0022] Figure 1 It is a side structural schematic diagram of the utility model;

[0023] Figure 2 It is another lateral structural schematic diagram of the utility model;

[0024] Figure 3 The utility model is a schematic diagram of a structure in which a first conductive copper sheet and a second conductive copper sheet are connected via a jumper wire.

[0025] In the figure: 1. Conductive copper sheet 1; 10. Copper sheet 1 packaging area; 100. Sawtooth strip; 101. Sawtooth edge 1; 102. Copper sheet 1 through hole; 103. End face folding groove; 2. Conductive copper sheet 2; 20. Copper sheet 2 packaging area; 200. Sawtooth U-shaped strip; 201. Sawtooth edge 2; 202. Copper sheet 2 through hole; 203. End face protrusion; 3. Epoxy plastic package; 30. Arc corner; 4. Jumper; 5. Chip; 6. Assembly hole; 7. Tin block welding area; 8. Bayonet slot; 9. Positioning hole; 90. Anti-reverse positioning port. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] In the description of the present invention, it should be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention; in the description of the present invention, "multiple" and "several" mean at least two, for example two, three, etc., unless otherwise clearly and specifically defined.

[0028] See also Figures 1 to 3As shown, the utility model is a photovoltaic protection power device module with a bayonet anti-failure structure, comprising a conductive copper sheet 1, a conductive copper sheet 2, a jumper 4 and an epoxy plastic package body 3, wherein a copper sheet 1 packaging area 10 is arranged at one end of the conductive copper sheet 1, a copper sheet 2 packaging area 20 is arranged at one end of the conductive copper sheet 2, a heat dissipation gap is provided between the copper sheet 2 packaging area 20 and the copper sheet 1 packaging area 10, one end of the jumper 4 is conductively welded to the copper sheet 1 packaging area 10, and the other end is conductively welded to a chip 5, the chip 5 is arranged on the copper sheet 2 packaging area 20, and the epoxy plastic package body 3 internally encapsulates and fixes the copper sheet 1 packaging area 10, the copper sheet 2 packaging area 20 and the jumper 4, wherein the epoxy plastic package body 3 is rectangular, and arc corners 30 are respectively arranged at the corner positions thereof.

[0029] In the power diode module structure containing a bayonet conductive structure of the present application, the conductive copper sheet 1 and the conductive copper sheet 2 are encapsulated and fixed by the epoxy plastic encapsulation body 3, so that the copper sheet 1 encapsulation area 10, the copper sheet 2 encapsulation area 20 and the jumper 4 are encapsulated and fixed inside the epoxy plastic encapsulation body 3. The shape and structure of the epoxy plastic encapsulation body 3 are improved, and arc corners 30 are respectively provided at the corner positions. The arc corners 30 can reduce the corner pores and colloid missing during the production process of the epoxy plastic encapsulation body 3, thereby ensuring the molding quality of the epoxy plastic encapsulation body 3, thereby ensuring the molding quality of the power diode module product of the present application. The well-molded epoxy plastic encapsulation body 3 can enhance the heat dissipation effect and improve the junction temperature capacity and thermal escape capacity.

[0030] In this specific embodiment, serrated strips 100 are respectively provided on the two side surfaces of the copper sheet one packaging area 10, and serrated edges 101 are respectively provided on the two side outer edges; serrated U-shaped strips 200 are respectively provided on the two side surfaces of the copper sheet two packaging area 20, and serrated edges 201 are respectively provided on the two side outer edges; the jumper 4 is a U-shaped conductive sheet, and the bent ear end on one side of the U-shaped conductive sheet is welded and connected to the serrated strip 100 on one side surface, and the bent ear end on the other side is welded and connected to the chip 5; the welding contact area of ​​the jumper 4 can be increased, and the serrated strip 100, serrated edge 101, serrated U-shaped strip 200 and serrated edge 201 can increase the contact area with the epoxy plastic package 3, so that the molding of the epoxy plastic package 3 is stable and the molding quality of the power diode module is ensured.

[0031] In this specific embodiment, at least two copper sheet through holes 102 are arranged between the two side surfaces of the copper sheet packaging area 10; at least three copper sheet through holes 202 are arranged between the two side surfaces of the copper sheet packaging area 20; so that the epoxy plastic sealing body 3 arranged on the two side surfaces of the copper sheet packaging area 10 and the copper sheet packaging area 20 can be penetrated and fixed; the through holes strengthen the bonding strength between the epoxy plastic sealing body 3 and the copper guide sheet by locking glue, thereby enhancing the bonding stability, thereby offsetting the pressure of the copper sheets on both sides and better protecting the main body; at the same time, it can increase the penetration ability of the curing glue during the molding of the epoxy plastic sealing body 3, and improve the appearance of the plastic sealing body such as bubbles, missing corners, and incomplete filling.

[0032] In this specific embodiment, an end face folding groove 103 is provided on the edge of the copper sheet one packaging area 10 facing the copper sheet two packaging area 20, and an end face protrusion 203 matching the end face folding groove 103 is provided on the edge of the copper sheet two packaging area 20, and a heat dissipation gap is provided between the end face protrusion 203 and the end face folding groove 103; when the conductive copper sheet one 1 and the conductive copper sheet two 2 are packaged by the epoxy plastic packaging body 3, the facing end faces are designed from traditional flat ends to bent ends, which can increase the heat dissipation area of ​​the heating ends of the conductive copper sheet one 1 and the conductive copper sheet two 2, facilitate rapid heat dissipation, and during the molding process of the epoxy plastic packaging body 3, the heat stress resistance of the epoxy plastic packaging body 3 can be enhanced.

[0033] In this specific embodiment, assembly holes 6 are respectively opened on the conductive copper sheet 1 and the conductive copper sheet 2, and the side ends of the epoxy plastic sealing body 3 are set through the assembly holes 6; the set assembly holes 6 can make the epoxy plastic sealing body 3 as a whole encapsulated and fixed, thereby improving the molding quality of the epoxy plastic sealing body 3.

[0034] In this specific implementation manner, a tin block welding area 7 is respectively provided on the conductive copper sheet 1 and the conductive copper sheet 2 2 .

[0035] In this specific embodiment, the side ends of the conductive copper sheet 1 and the conductive copper sheet 2 are symmetrically provided with bayonet slots 8; the bayonet slots 8 are provided to facilitate the positioning and installation of the diode module product, so as to facilitate the installation.

[0036] In this specific embodiment, a positioning hole 9 is provided on each of the conductive copper sheet 1 and the conductive copper sheet 2; an anti-reverse positioning port 90 is provided on the conductive copper sheet 1 or the conductive copper sheet 2, to facilitate the operation and installation of the diode module product.

[0037] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A photovoltaic protection power device module with a bayonet anti-failure structure, characterized in that: include: A conductive copper sheet (1), one end of which is provided with a copper sheet packaging area (10); A second conductive copper sheet (2), one end of which is provided with a second copper sheet packaging area (20), and a heat dissipation gap is provided between the second copper sheet packaging area (20) and the first copper sheet packaging area (10); A jumper wire (4), one end of which is conductively welded to the copper sheet first packaging area (10), and the other end of which is conductively welded to a chip (5), wherein the chip (5) is arranged on the copper sheet second packaging area (20); An epoxy plastic encapsulation body (3), the copper sheet first encapsulation area (10), the copper sheet second encapsulation area (20) and the jumper wire (4) being encapsulated and fixed therein; The epoxy plastic encapsulation body (3) is rectangular in shape, and arc corners (30) are respectively arranged at the corners.

2. A photovoltaic protection power device module with a bayonet anti-failure structure according to claim 1, characterized in that: The copper sheet one packaging area (10) is provided with sawtooth strips (100) on both side surfaces, and the outer edges on both sides are provided with sawtooth edges (101); the copper sheet two packaging area (20) is provided with sawtooth U-shaped strips (200) on both side surfaces, and the outer edges on both sides are provided with sawtooth edges (201).

3. A photovoltaic protection power device module with a bayonet anti-failure structure according to claim 2, characterized in that: The jumper (4) is a U-shaped conductive sheet, one side of the U-shaped conductive sheet is bent and connected to the sawtooth strip (100) on one side surface by welding, and the other side of the U-shaped conductive sheet is bent and connected to the chip (5) by welding.

4. A photovoltaic protection power device module with a bayonet anti-failure structure according to claim 2, characterized in that: At least two copper sheet one through holes (102) are arranged between the two side surfaces of the copper sheet one packaging area (10); and at least three copper sheet two through holes (202) are arranged between the two side surfaces of the copper sheet two packaging area (20).

5. A photovoltaic protection power device module with a bayonet anti-failure structure according to claim 1, characterized in that: An end face folding groove (103) is arranged on the edge of the copper sheet first packaging area (10) facing the copper sheet second packaging area (20), and an end face protrusion (203) matching the end face folding groove (103) is arranged on the edge of the copper sheet second packaging area (20), and a heat dissipation gap is provided between the end face protrusion (203) and the end face folding groove (103).

6. A photovoltaic protection power device module with a bayonet anti-failure structure according to claim 1, characterized in that: The conductive copper sheet 1 (1) and the conductive copper sheet 2 (2) are each provided with an assembly hole (6), and the side end of the epoxy plastic sealing body (3) is arranged through the assembly hole (6).

7. A photovoltaic protection power device module with a bayonet anti-failure structure according to claim 1, characterized in that: The conductive copper sheet one (1) and the conductive copper sheet two (2) are each provided with a tin block welding area (7).

8. A photovoltaic protection power device module with a bayonet anti-failure structure according to claim 1, characterized in that: The side ends of the conductive copper sheet 1 (1) and the conductive copper sheet 2 (2) are symmetrically provided with bayonet slots (8).

9. A photovoltaic protection power device module with a bayonet anti-failure structure according to claim 1, characterized in that: The conductive copper sheet one (1) and the conductive copper sheet two (2) are each provided with a positioning hole (9); the conductive copper sheet one (1) or the conductive copper sheet two (2) is provided with an anti-reverse positioning opening (90).

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