Packaging structure
By using the design of adapter plate assembly in the chip package structure, the risk of conductive column height limitation and offset is solved, achieving higher density conductive column layout and lower manufacturing costs.
Patent Information
- Application Number
- CN202420559431.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-21
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2034-03-21
AI Technical Summary
In the prior art, when making conductive columns, the height is limited by the electroplating process, which is difficult to process, and the column planting method has the risk of shifting or inclination, so the density of the conductive column cannot be increased.
An adapter plate assembly is adopted, wherein the side walls of the conductive post include a first side wall and a second side wall, the second side wall is exposed from the side of the plate member, and the side walls of the chip and the adapter plate assembly are covered by a mold seal layer to increase the density of the conductive post.
It achieves simple structure and convenient processing, reduces manufacturing costs, is not restricted by the height of the electroplating process, avoids the risk of shifting and inclination of the conductive columns, and sets more and more dense conductive columns in the package stacking structure.
Smart Images
Figure CN222720430U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip manufacturing, and in particular, to a packaging structure. Background Art
[0002] The package on package (POP) structure includes multiple layers of packages, and the upper and lower layers of packages are generally connected by conductive pillars. There are three methods for making conductive pillars in the prior art: the first method uses electroplating to form conductive pillars; Figure 1 A schematic side view of a packaging structure in the prior art is shown. Figure 2 FIG. 2 shows a side view schematic diagram of a second prior art packaging structure. Figure 1-2 As shown, a chip 901 is arranged above the first redistribution layer 902, and the chip 901 is encapsulated in a molding layer 904. An electronic component 905 is arranged above the molding layer 904 and is electrically connected to the first redistribution layer 902 through a conductive column 903. A solder ball 906 is also arranged below the first redistribution layer 902. The first redistribution layer 902 and the conductive column 903 are connected by an electrical connector 907, which may be a wire or a solder ball. Figure 3 A side view schematically shows a third packaging structure of the prior art. Figure 4 FIG. 4 shows a side view schematic diagram of a fourth prior art packaging structure. Figure 3-4 As shown, the second redistribution layer 909 can also be arranged above the mold encapsulation layer 904 and electrically connected to the first redistribution layer 902 through the conductive pillar 903. The first redistribution layer 902 and the conductive pillar 903 are connected through an electrical connector 907. The electrical connector 907 can be a wire or a solder ball. The height of the conductive pillars made using this method will be limited by the electroplating process, and the processing difficulty is high, which is not conducive to improving the yield rate.
[0003] The second method uses a column planting method to set the conductive column. The advantage of using this method is that the height of the conductive column is not limited by the electroplating height, but its disadvantage is that the production capacity of the conductive column that can be used for the packaging structure is limited and there is a risk of the conductive column being offset or tilted when planting.
[0004] The third prior art for making conductive posts uses an adapter plate assembly. Figure 5 A schematic side view of another prior art packaging structure is shown; Figure 6 It shows that Figure 5 The schematic top view of the adapter board assembly of the packaging structure of the prior art is shown. Figure 5-6As shown, the adapter plate assembly 907 is a prefabricated assembly, which is made by drilling holes on a plate 907a and setting conductive pillars 907b in the holes; when in use, the adapter plate assembly 907 is set around the chip 901, at a position between the first redistribution layer 902 and the electronic component 905, and the first redistribution layer 902 and the electronic component 905 are electrically connected through the conductive pillars 907b; Figure 2 As shown in the portion marked as A, because the conductive pillars 907b are disposed in the drilled holes of the plate 907a, the spacing between the conductive pillars 907b is limited by the plate 907a, and the density of the conductive pillars 907b cannot be further increased.
[0005] In summary, the art needs to provide a packaging structure that can overcome the defects of the prior art. Utility Model Content
[0006] The present application provides a packaging structure, which can solve the problems of the prior art. The purpose of the present application is achieved through the following technical solutions.
[0007] One embodiment of the present application provides a packaging structure, which includes: a chip; an adapter plate assembly, the adapter plate assembly includes a plate and a conductive column, the side wall of the conductive column includes a first side wall and a second side wall, the adapter plate assembly is arranged on the side of the chip, the conductive column is arranged on one side of the plate, the first side wall is in contact with the plate, and the second side wall is exposed from the side of the plate; a molding layer, the molding layer covers the side walls of the chip and the adapter plate assembly.
[0008] In some optional embodiments, according to the packaging structure provided by one of the embodiments of the present application, the area of the second side wall accounts for a proportion of greater than or equal to 30% of the overall area of the side wall of the conductive pillar.
[0009] In some optional embodiments, according to the packaging structure provided by one of the embodiments of the present application, the distance between the second side wall and the chip is smaller than the distance between the first side wall and the chip.
[0010] In some optional embodiments, according to the packaging structure provided by one of the embodiments of the present application, the distance between the first side wall and the chip is smaller than the distance between the second side wall and the chip.
[0011] In some optional embodiments, a packaging structure is provided according to one of the above embodiments of the present application, wherein the board includes a main board and a plurality of protrusions, the protrusions include a first side surface and a second side surface arranged opposite to each other, the protrusions are arranged on one side of the main board and the protrusions protrude toward the outside of the main board, the protrusions and the main board form a groove, the conductive column is arranged in the groove, and the first side surface of the protrusions contacts the first side wall of the conductive column.
[0012] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the second side surface is a curved surface.
[0013] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the board and the molding layer are made of the same material.
[0014] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the top of the conductive column is protruding or recessed relative to the upper surface of the board.
[0015] In some optional embodiments, according to the packaging structure provided by one of the embodiments of the present application, the bottom of the conductive column is protruding or recessed relative to the lower surface of the board.
[0016] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the top of the conductive column is flush with the upper surface of the board.
[0017] In some optional implementations, according to the packaging structure provided by one of the above implementations of the present application, the bottom of the conductive column is flush with the lower surface of the board.
[0018] In some optional embodiments, a packaging structure is provided according to one of the above embodiments of the present application, wherein the packaging structure also includes a first redistribution layer, the first redistribution layer is arranged under the chip and electrically connected to the chip, the bottom end of the conductive column is electrically connected to the first redistribution layer, and the first redistribution layer is electrically connected to the electronic components or the second redistribution layer arranged above the packaging structure through the conductive column.
[0019] The advantages of the packaging structure according to the implementation mode of the present application are: simple structure, easy processing, and reduced manufacturing cost; it is not subject to the height limitation of the electroplating process and there is no risk of conductive column displacement or tilt; the volume of the adapter board assembly is reduced, and more and denser conductive columns can be arranged between the upper and lower layers of the packaging stacking structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Other features, objectives and advantages of the present application will become more apparent through the detailed description of non-limiting embodiments of the present application with reference to the following drawings.
[0021] Other features, objectives and advantages of the present application will become more apparent through the detailed description of non-limiting embodiments of the present application with reference to the following drawings.
[0022] Figure 1 A schematic side view of a packaging structure of the prior art is shown;
[0023] Figure 2A schematic side view of a second prior art packaging structure is shown;
[0024] Figure 3 A schematic side view of a packaging structure of a third prior art is shown;
[0025] Figure 4 A schematic side view of a fourth prior art packaging structure is shown;
[0026] Figure 5 A side view schematic diagram of a fifth prior art packaging structure is shown;
[0027] Figure 6 It shows that Figure 5 A schematic top view of an adapter board assembly of a fifth prior art packaging structure is shown;
[0028] Figure 7 A schematic side view of a packaging structure according to an embodiment of the present application is shown;
[0029] Figure 8 It shows that Figure 7 A top cross-sectional schematic diagram of the packaging structure shown;
[0030] Fig. 9 It shows that Figure 7 A schematic top view of an adapter board assembly of the packaging structure shown;
[0031] Fig.10 It shows that Figure 7 A schematic side view of an adapter plate assembly of the packaging structure shown;
[0032] Fig.11 A schematic side view of a packaging structure according to another embodiment of the present application is shown;
[0033] Fig.12 A schematic side view of an adapter plate assembly of a second embodiment is shown;
[0034] Fig.13 A schematic side view of an adapter plate assembly of a third embodiment is shown;
[0035] Fig.14 Shows the use of Fig.13 A schematic side view of the packaging structure of the adapter board assembly of the third embodiment is shown;
[0036] Fig.15 A schematic side view of an adapter plate assembly according to a fourth embodiment is shown;
[0037] Fig.16 Shows the use of Fig.15 A schematic side view of the packaging structure of the adapter plate assembly of the fourth embodiment is shown;
[0038] Fig.17 A schematic side view of an adapter plate assembly according to a fifth embodiment is shown;
[0039] Fig.18 A schematic side view of a packaging structure according to another embodiment of the present application is shown;
[0040] Fig.19 A schematic side view of a packaging structure according to another embodiment of the present application is shown;
[0041] Fig. 20 It shows that Figure 8 A schematic top view of the transfer board assembly of the packaging structure shown before and after the mold sealing layer is provided;
[0042] Fig.21 It shows that Fig. 20 The schematic side view of the transfer board assembly of the packaging structure shown is after the molding layer is provided.
[0043] Numbers and component names: 1-chip, 2-adapter board assembly, 3-molding layer, 4-first redistribution layer, 5-electronic component, 6-first solder ball, 7-second solder ball, 8-first electrical connector, 9-second electrical connector, 10-second redistribution layer, 11-bump, 21-board, 22-conductive column, 211-main board, 212-raised portion, 212a-first side, 212b-second side, 221-first side wall, 222-second side wall, 901-chip, 902-first redistribution layer, 903-conductive column, 904-molding layer, 905-electronic component, 906-solder ball, 907-adapter board assembly, 907a-board, 907b-conductive column, 908-electrical connector, 909-second redistribution layer. DETAILED DESCRIPTION
[0044] The specific implementation methods of the present application are described below in conjunction with the accompanying drawings and examples. Through the contents recorded in this specification, those skilled in the art can clearly and completely understand the technical solutions, technical problems solved, and technical effects produced by the present application. It is understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. In addition, for ease of description, only the parts related to the present application are shown in the accompanying drawings.
[0045] It should be readily understood that the meanings of “on,” “over,” and “over…” in this application should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also means “on something” including the presence of intermediate components or layers therebetween.
[0046] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or component to another element or component illustrated in the drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
[0047] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present application, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed in the present application. At the same time, the terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of narration, and are not used to limit the scope of the implementation of the present application. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present application without substantially changing the technical content.
[0048] The term "layer" as used herein refers to a material portion including an area with a certain thickness. The layer can extend over the entire lower or upper structure, or can have a degree less than the range of the lower or upper structure. In addition, the layer can be a region of a homogeneous or inhomogeneous continuous structure, and its thickness is less than the thickness of the continuous structure. For example, the layer can be located between the top surface and the bottom surface of the continuous structure or between any pair of horizontal planes therebetween. The layer can extend horizontally, vertically and / or along a tapered surface. A substrate can be a layer, one or more layers can be included therein, and / or one or more layers can be present thereon, above and / or below. A layer can include multiple layers. For example, a semiconductor layer can include one or more doped or undoped semiconductor layers, and can have the same or different materials.
[0049] The term "rewiring layer" used in this article may refer to a rewiring layer composed of a conductive material and a dielectric material (Dielectric). It should be noted that the process can adopt the currently known or future developed rewiring layer formation technology, which is not specifically limited in this disclosure. For example, the rewiring layer can be formed by including but not limited to photolithography, electroplating (plating), chemical plating (Electroless plating), etc. Here, the dielectric material may include organic and / or inorganic substances, wherein the organic substance may be, for example: polyamide fiber (Polyamide, PA), polyimide (Polyimide, PI), epoxy resin (Epoxy), poly-p-phenylene benzobisoxazole (Poly-p-phenylene benzobisoxazole, PBO) fiber, FR-4 epoxy glass cloth laminate, PP (PrePreg, prepreg material or semi-cured resin, semi-cured sheet), ABF (AjinomotoBuild-up Film), etc., and the inorganic substance may be, for example, silicon (Si), glass (glass), ceramic (ceramic), silicon oxide, silicon nitride, tantalum oxide, etc. The conductive material may include a seed layer and a metal layer. Here, the seed layer may be, for example, titanium (Ti), tungsten (W), nickel (Ni), etc., and the metal layer may be, for example, gold (Au), silver (Ag), aluminum (Al), nickel (Ni), palladium (Pd), copper (Cu) or an alloy thereof. It should also be noted that the longitudinal cross section corresponding to the embodiment of the present application may be a cross section corresponding to the front view direction, the transverse cross section may be a cross section corresponding to the right view direction, and the horizontal cross section may be a cross section corresponding to the top view direction.
[0050] The term "electrical connector" used in this article may be a pad or a bump. The bump may be, for example, a gold bump (usually rectangular, gold), a solder bump (usually round, copper plus tin), or a pillar bump (usually columnar octagonal or polygonal, copper plus tin or lead plus tin).
[0051] In addition, the embodiments and features in the embodiments of the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.
[0052] Figure 7 A schematic side view of a packaging structure according to an embodiment of the present application is shown. Figure 8 It shows that Figure 7 A top cross-sectional schematic diagram of the packaging structure shown. Fig. 9 It shows that Figure 7 A schematic top view of the adapter board assembly of the packaging structure shown. Fig.10It shows that Figure 7 A schematic side view of the transfer board assembly of the packaging structure shown in FIG. Figures 7 to 10 As shown, the packaging structure includes: a chip 1; an adapter board assembly 2, the adapter board assembly 2 includes a board 21 and a conductive column 22, the side wall of the conductive column 22 includes a first side wall 221 and a second side wall 222, the adapter board assembly 2 is arranged on the side of the chip 1, the conductive column 22 is arranged on one side of the board 21, the first side wall 221 is in contact with the board 21, and the second side wall 222 is exposed from the side of the board 21; a molding layer 3, the molding layer 3 covers the side walls of the chip 1 and the adapter board assembly 2.
[0053] In some optional embodiments, according to the packaging structure provided by one of the embodiments of the present application, the area of the second side wall 222 accounts for a proportion of greater than or equal to 30% of the overall area of the side wall of the conductive pillar 22 .
[0054] In some optional embodiments, according to the packaging structure provided by one of the embodiments of the present application, the distance between the second side wall 222 and the chip 1 is smaller than the distance between the first side wall 221 and the chip 1 .
[0055] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the plate 21 includes a main board 211 and a plurality of raised portions 212, the raised portion includes a first side surface 212a and a second side surface 212b arranged opposite to each other, the first side surface 212a and the second side surface 212b are both arc surfaces, and in some embodiments, the curvature of the first side surface 212a in the side view direction is less than the curvature of the second side surface 212b. The raised portion 212 is arranged on one side of the main board 211 and the raised portion 212 is raised toward the outside of the main board 211, the raised portion 212 and the main board 211 form a groove, the conductive column 22 is arranged in the groove, and the first side surface 212a of the raised portion 212 is in contact with the first side wall 221 of the conductive column 22.
[0056] In some optional implementations, according to the packaging structure provided by one of the above implementations of the present application, the second side surface 212b is a curved surface.
[0057] In some optional embodiments, according to the packaging structure provided by one embodiment of the present application, the plate 21 and the encapsulation layer 3 are made of the same material. The materials used for the plate 21 and the encapsulation layer 3 may include but are not limited to: epoxy resin, filler, catalyst, pigment, release agent, flame retardant, coupling agent, hardener, low stress absorber, adhesion promoter, ion trapping agent, etc.
[0058] In some optional embodiments, a packaging structure is provided according to one of the above embodiments of the present application, wherein the packaging structure also includes a first redistribution layer 4, the first redistribution layer 4 is arranged under the chip 1 and is electrically connected to the chip 1 through the bump 11 under the chip 1, the bottom end of the conductive column 22 is electrically connected to the first redistribution layer 4, and the first redistribution layer 4 is electrically connected to the electronic component 5 arranged above the packaging structure through the conductive column 22.
[0059] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the packaging structure also includes a first electrical connector 8, and the first redistribution layer 4 is electrically connected to the bump 11 and the conductive column 22 of the chip 1 respectively through the first electrical connector 8.
[0060] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the packaging structure also includes a first redistribution layer 4 and a first solder ball 6, the first solder ball 6 is arranged at the bottom of the first redistribution layer 4, and the first redistribution layer 4 is electrically connected to an external device through the first solder ball 6.
[0061] In some optional implementations, according to the packaging structure provided by one of the above implementations of the present application, Figure 7 As shown, the top of the conductive pillar 22 is flush with the upper surface of the plate 21 and the bottom of the conductive pillar 22 is flush with the lower surface of the plate 21 .
[0062] Fig.11 FIG. 2 shows a schematic side view of a packaging structure according to another embodiment of the present application. Fig.11 As shown, the first redistribution layer 4 can also be electrically connected to the second redistribution layer 10 disposed above the packaging structure through the conductive pillars 22 .
[0063] Fig.12 FIG. 2 shows a schematic side view of an adapter plate assembly of a second embodiment. Fig.12 As shown, the top of the conductive pillar 22 protrudes relative to the upper surface of the plate 21 and the bottom of the conductive pillar 22 protrudes relative to the lower surface of the plate 21 .
[0064] Fig.13 A schematic side view of an adapter plate assembly according to a third embodiment is shown. Fig.14 Shows the use of Fig.13 The schematic side view of the packaging structure of the adapter board assembly of the third embodiment is shown in FIG. Figure 13 to Figure 14 As shown, the top of the conductive column 22 is flush with the upper surface of the board 21 and the bottom of the conductive column 22 protrudes relative to the lower surface of the board 21, the top of the conductive column 22 is electrically connected to the electronic component 5 through the second solder ball 7, and the bottom of the conductive column 22 is electrically connected to the first redistribution layer 4.
[0065] Fig.15 A schematic side view of an adapter plate assembly according to a fourth embodiment is shown. Fig.16 Shows the use of Fig.15 FIG. 2 is a side view schematic diagram of the packaging structure of the adapter board assembly 2 of the fourth embodiment. Figure 15 to Figure 16 As shown, the top of the conductive column 22 is recessed relative to the upper surface of the board 21 and the bottom of the conductive column 22 is protruding relative to the lower surface of the board 21. The top of the conductive column 22 is electrically connected to the electronic component 5 through the second solder ball 7 and the second electrical connector 9, and the bottom of the conductive column 22 is electrically connected to the first redistribution layer 4 in a plant manner.
[0066] Fig.17 FIG. 4 is a side view schematic diagram of an adapter plate assembly of a fifth embodiment. Fig.17 As shown, the top of the conductive pillar 22 is recessed relative to the upper surface of the plate 21 and the bottom of the conductive pillar 22 is recessed relative to the lower surface of the plate 21 .
[0067] Fig.18 FIG. 2 shows a schematic side view of a packaging structure according to another embodiment of the present application. Fig.18 As shown, two groups of adapter board assemblies 2 are respectively arranged on the side of each side of the chip 1, and one side of the adapter board assembly 2 on which the conductive column 22 is arranged faces the adjacent adapter board assembly 2, and the first redistribution layer 4 is electrically connected to the electronic component 5 arranged above the packaging structure through the conductive column 22. At this time, because there is no plate 21 between the conductive columns 22 of the two adjacent groups of adapter board assemblies 2, the distance between the conductive columns 22 can be minimized to the greatest extent, thereby increasing the density of the conductive columns 22.
[0068] Fig.19 FIG. 2 shows a side view of a packaging structure according to another embodiment of the present application. Fig.19As shown, the first redistribution layer 4 can also be electrically connected to the second redistribution layer 10 disposed above the packaging structure through the conductive pillars 22 .
[0069] Fig. 20 It shows that Figure 8 The schematic top view of the adapter board assembly of the packaging structure shown is before and after the molding layer is provided. Fig.21 It shows that Fig. 20 The schematic side view of the transfer board assembly of the package structure shown in FIG. Fig. 20 As shown, the packaging structure before setting the mold sealing layer is as follows Fig. 20 As shown in the package structure numbered 1001 on the left, a transfer board assembly 2 is arranged around the chip 1, and the side of the transfer board assembly 2 with the conductive column 22 faces the chip 1, and a fillable space is formed between the chip 1 and the transfer board assembly 2; the package structure after the mold sealing layer is arranged is as shown in FIG. Fig. 20 The package structure numbered 1002 on the right and Fig.21 As shown, the space between the chip 1 and the adapter board assembly 2 is filled to form a mold sealing layer 3, wherein the adapter board assembly 2 can limit the range of the mold sealing layer 3, and the filling method of the mold sealing layer includes but is not limited to dispensing.
[0070] The advantages of the packaging structure according to the implementation mode of the present application are: simple structure, easy processing, and reduced manufacturing cost; it is not subject to the height limitation of the electroplating process and there is no risk of conductive column displacement or tilt; the volume of the adapter board assembly is reduced, and more and denser conductive columns can be arranged between the upper and lower layers of the packaging stacking structure.
[0071] Although the present application has been described and illustrated with reference to the specific embodiments of the present application, these descriptions and illustrations are not intended to limit the present application. It will be clearly understood by those skilled in the art that various changes may be made, and equivalent elements may be substituted within the embodiments without departing from the scope of protection of the present application as defined by the claims. Due to variables in the manufacturing process, etc., there may be differences between the technical reproduction in the present application and the actual device. There may be other embodiments of the present application that are not specifically described. The description and illustrations should be regarded as illustrative, not restrictive, and modifications may be made according to the purpose and spirit of the present application, all of which are within the scope of protection of the claims. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations may be recombined, subdivided or arranged to form equivalent methods without departing from the teachings of the present application. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit the present application.
Claims
1. A packaging structure, characterized in that: include: chip; An adapter plate assembly, the adapter plate assembly includes a plate and a conductive column, the side wall of the conductive column includes a first side wall and a second side wall, the adapter plate assembly is arranged on the side of the chip, the conductive column is arranged on one side of the plate, the first side wall is in contact with the plate, and the second side wall is exposed from the side of the plate; A molding layer covers the chip and the side walls of the adapter board assembly.
2. The packaging structure according to claim 1, characterized in that: The area of the second side wall accounts for a proportion of greater than or equal to 30% of the overall area of the side wall of the conductive pillar.
3. The packaging structure according to claim 1, characterized in that: A distance between the second sidewall and the chip is smaller than a distance between the first sidewall and the chip.
4. The packaging structure according to claim 1, characterized in that: A distance between the first side wall and the chip is smaller than a distance between the second side wall and the chip.
5. The packaging structure according to claim 1, characterized in that: The plate component includes a main board and a plurality of raised portions, wherein the raised portion includes a first side surface and a second side surface that are arranged opposite to each other, the raised portion is arranged on one side of the main board and the raised portion protrudes toward the outside of the main board, the raised portion and the main board form a groove, the conductive column is arranged in the groove, and the first side surface of the raised portion contacts the first side wall of the conductive column.
6. The packaging structure according to claim 5, characterized in that: The second side surface is a curved surface.
7. The packaging structure according to claim 1, characterized in that: The plate and the mold sealing layer are made of the same material.
8. The packaging structure according to claim 1, characterized in that: The top of the conductive column is protruding or recessed relative to the upper surface of the plate.
9. The packaging structure according to claim 1, characterized in that: The top of the conductive column is flush with the upper surface of the plate.
10. The packaging structure according to claim 1, characterized in that: The packaging structure also includes a first redistribution layer, which is arranged below the chip and electrically connected to the chip, the bottom end of the conductive column is electrically connected to the first redistribution layer, and the first redistribution layer is electrically connected to the electronic component or the second redistribution layer arranged above the packaging structure through the conductive column.