A multi-layer flexible circuit board
By setting up a protective mechanism on the flexible circuit board substrate, including external and internal protective layers and metal wires, the problem of lack of protection during the bending process of multi-layer flexible circuit boards is solved, and the stability of bending and installation convenience are improved.
Patent Information
- Application Number
- CN202421398368.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-19
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2034-06-19
AI Technical Summary
The existing multi-layer flexible circuit board lacks effective protection during bending, which can easily lead to damage to the conductive parts and cannot maintain their state after bending, which increases the connection complexity.
A protective mechanism is provided on the flexible circuit board substrate, including an external protective layer and an internal protective layer. The external protective layer is made of polyester material, and the internal protective layer is made of polyimide material, and is connected by a metal wire, which has bending properties to maintain a bending state.
The bending radius of the copper foil is increased through the protective mechanism, reducing the risk of damage, and maintaining a bent state, which facilitates installation and connection, and improves installation convenience and stability.
Smart Images

Figure CN222721680U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of flexible circuit boards, and in particular relates to a multi-layer flexible circuit board. Background Art
[0002] Flexible circuit boards, also known as soft boards, are printed circuits made of flexible insulating substrates. Flexible circuits provide excellent electrical properties, can meet the design needs of smaller and higher density installations, and also help reduce assembly processes and enhance reliability. Flexible circuit boards are the only solution to meet the miniaturization and mobility requirements of electronic products. They can be bent, wound, and folded freely, and can withstand millions of dynamic bends without damaging the wires. They can be arranged arbitrarily according to spatial layout requirements, and can be moved and stretched arbitrarily in three-dimensional space, thereby achieving the integration of component assembly and wire connection. Flexible circuit boards can greatly reduce the size and weight of electronic products, and are suitable for the trend of electronic products towards high density and small size. In order to meet the needs of the development in the direction of high reliability, flexible circuit boards are divided into single-sided, double-sided and multi-layer boards. The base material used is mainly polyimide copper clad laminate, which has high heat resistance and good dimensional stability. It is pressed with a covering film that has both mechanical protection and good electrical insulation properties to form the final product. The surface and inner conductors of the double-sided and multi-layer printed circuit boards are metallized to achieve electrical connection between the inner and outer circuits. The functions of flexible circuit boards can be divided into four types, namely lead lines, printed circuits, connectors and multi-functional integrated systems. Their uses cover computers, computer peripheral auxiliary systems, consumer appliances and automobiles. Flexible circuit boards are needed in flexible sensors.
[0003] A multilayer flexible circuit board with a patent announcement number of CN212542743U in the prior art includes a flexible substrate, one end of the flexible substrate is fixedly connected to an end piece, and the other end is fixedly connected to a mounting piece, a wiring hole is symmetrically arranged on the side of one end of the mounting piece, a gold finger is arranged on the side of the mounting piece, a second bolt is symmetrically arranged on the side of the mounting piece, and a second nut is threadedly connected on the second bolt, and slots are symmetrically arranged on the upper and lower sides of the flexible substrate, and the upper and lower adjacent flexible substrates are connected by a first bolt, and notches are symmetrically arranged on both sides of the slot. This multilayer flexible circuit board connects the upper and lower circuit boards by bolts, so that the upper and lower circuit boards can be used according to the use It needs to be freely spliced, and a cavity is formed between the upper and lower circuit boards, which is beneficial to the heat dissipation of the circuit board. Multiple notches are symmetrically arranged on both sides of the bolt connection, so that the flexibility of the flexible circuit board connection is not affected. However, there are still the following deficiencies in actual use: From a practical point of view, during the flexible bending process of the circuit board, due to the lack of effective protection of the bending part of the circuit board body, when it is bent excessively, it is easy to cause damage to its internal conductive part, which in turn affects the use of the circuit board, and after the bending occurs, it cannot be maintained in the bent state. During the connection process, due to its own flexibility, the circuit board is easy to recover, thereby increasing the operational complexity of the connection process and making it inconvenient to carry out the connection work.
[0004] Therefore, a multi-layer flexible circuit board is needed to solve the problems in the prior art that the bending part of the circuit board body lacks effective protection and is prone to bending damage and cannot maintain the bent state during the connection process, making it inconvenient to connect. Utility Model Content
[0005] The purpose of the utility model is to provide a multi-layer flexible circuit board to solve the problems raised in the above background technology.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a multi-layer flexible circuit board, comprising a flexible circuit board substrate, an end piece, an insert and a copper foil, wherein the end piece is arranged on the left side of the flexible circuit board substrate, the insert is arranged on the right side of the flexible circuit board substrate, a protective mechanism is arranged on the flexible circuit board substrate, a gasket is arranged on the end piece, a positioning hole is opened on the end piece, a mounting hole is opened on the insert, and a pin connected to the copper foil is arranged on the upper part of the insert.
[0007] The protective mechanism includes an external protective layer, which is sleeved on the outside of the flexible circuit board substrate, a second sealing sheet is fixedly connected to the left side of the external protective layer, a first sealing sheet is fixedly connected to the right side of the external protective layer, a metal wire is fixedly connected inside the external protective layer, and an internal protective layer is fixedly connected to the inner surface of the external protective layer.
[0008] It should be noted in the solution that the copper foil is welded in the flexible circuit board substrate and is connected to the gasket and the pins respectively.
[0009] It is further worth mentioning that the external protective layer is in the form of a box body penetrating on both sides and matches the flexible circuit board substrate. The external protective layer is made of polyester material, which is convenient for all-round protection of the flexible circuit board substrate and improves the protectiveness of the flexible circuit board substrate.
[0010] It should be further explained that the metal wire is made of a metal material with bending properties, so that the protective mechanism remains stable after bending, thereby maintaining stability for the flexible circuit board substrate and improving the convenience of the flexible circuit board substrate during the connection process.
[0011] As a preferred embodiment, a plurality of the metal wires are provided, and the plurality of the metal wires are evenly arranged around the outer protective layer and arranged inside the outer protective layer wall, so as to further improve the stability of the flexible circuit board substrate after bending, so as to facilitate connection work.
[0012] As a preferred implementation, the inner protective layer is made of polyimide material.
[0013] Compared with the prior art, the multilayer flexible circuit board provided by the utility model has at least the following beneficial effects:
[0014] By providing a protective mechanism on the flexible circuit board substrate, the flexible circuit board substrate can provide bending protection for the copper foil during the bending process, thereby increasing the bending radius of the copper foil during the bending process, thereby reducing the possibility of bending damage. Furthermore, by using the metal wire inside the protective mechanism, the flexible circuit board substrate can be kept in a bent state during the bending process, thereby improving its bending stability, so that the end piece and the plug piece can be installed and connected respectively, thereby improving the convenience of installation. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0016] Figure 2 This is a schematic diagram of the split structure of the utility model;
[0017] Figure 3 This is a schematic diagram of the protection mechanism structure of the utility model;
[0018] Figure 4 It is a schematic diagram of the cutaway structure of the protection mechanism of the utility model.
[0019] In the figure: 1, flexible circuit board substrate; 2, end piece; 201, gasket; 202, positioning hole; 3, insert; 301, pin; 302, mounting hole; 4, copper foil; 5, protection mechanism; 501, external protection layer; 502, first sealing sheet; 503, second sealing sheet; 504, metal wire; 505, internal protection layer. DETAILED DESCRIPTION
[0020] The present invention will be further described below in conjunction with the embodiments.
[0021] See also Figure 1-4 The utility model provides a multi-layer flexible circuit board, including a flexible circuit board substrate 1, an end piece 2, an inserting piece 3 and a copper foil 4, the end piece 2 is arranged on the left side of the flexible circuit board substrate 1, the inserting piece 3 is arranged on the right side of the flexible circuit board substrate 1, a protective mechanism 5 is arranged on the flexible circuit board substrate 1, a gasket 201 is arranged on the end piece 2, a positioning hole 202 is opened on the end piece 2, a mounting hole 302 is opened on the inserting piece 3, and a pin 301 connected to the copper foil 4 is arranged on the upper part of the inserting piece 3.
[0022] The protective mechanism 5 includes an external protective layer 501, which is sleeved on the outside of the flexible circuit board substrate 1. The second sealing piece 503 is fixedly connected to the left side of the external protective layer 501, and the first sealing piece 502 is fixedly connected to the right side of the external protective layer 501. A metal wire 504 is fixedly connected inside the external protective layer 501, and an internal protective layer 505 is fixedly connected to the inner surface of the external protective layer 501.
[0023] When the flexible circuit board substrate 1 is bent, the metal wire 504 is bent by bending through the external protective layer 501. Due to the setting of the external protective layer 501, the bending radius of the flexible circuit board substrate 1 is increased during the bending process, thereby protecting the copper foil 4 and preventing the copper foil 4 from being damaged due to the small bending radius. At the same time, the bending performance of the metal wire 504 allows the internal protective layer 505 to maintain a bent state, thereby maintaining the bent state of the flexible circuit board substrate 1, thereby facilitating the installation and connection of the end piece 2 or the plug-in piece 3.
[0024] Further Figure 1 and Figure 2 As shown, it is worth explaining in detail that the copper foil 4 is welded in the flexible circuit board substrate 1 and is respectively connected to the gasket 201 and the pin 301. The protective mechanism 5 is used to improve the protectiveness of the copper foil 4 so that the flexible circuit board substrate 1 can be transported stably after installation to improve the working efficiency of the flexible circuit board substrate 1.
[0025] Further Figure 3 and Figure 4As shown, it is worth specifically explaining that the external protective layer 501 is set in a box body that penetrates on both sides and matches the setting of the flexible circuit board substrate 1. The external protective layer 501 is made of polyester material, which is convenient for all-round protection of the flexible circuit board substrate 1, improves the protectiveness of the flexible circuit board substrate 1, and the external protective layer 501 can increase the bending radius of the flexible circuit board substrate 1 when bending, thereby improving the bending stability of the flexible circuit board substrate 1 and ensuring the normal operation of the flexible circuit board substrate 1.
[0026] Further Figure 3 and Figure 4 As shown, it is worth explaining in detail that the metal wire 504 is made of a metal material with bending performance, so that the protection mechanism 5 can remain stable after bending, thereby maintaining the stability of the flexible circuit board substrate 1 and improving the convenience of the flexible circuit board substrate 1 during the connection process.
[0027] Further Figure 3 and Figure 4 As shown, it is worth explaining in detail that a plurality of metal wires 504 are provided, and the plurality of metal wires 504 are evenly arranged around the outer protective layer 501 and arranged inside the wall of the outer protective layer 501, so as to further improve the stability of the flexible circuit board substrate 1 after bending, so as to facilitate the connection work.
[0028] Further Figure 3 and Figure 4 As shown, it is worth specifically explaining that the internal protective layer 505 is made of polyimide material. The internal protective layer 505 is arranged between the external protective layer 501 and the flexible circuit board substrate 1 to further improve the protection of the flexible circuit board substrate 1 during the bending process, so as to improve the normal operation of the flexible circuit board substrate 1.
[0029] This solution has the following working process: when this device is used, the flexible circuit board substrate 1 is installed and connected through the end piece 2 and the plug-in piece 3. When the flexible circuit board substrate 1 is bent, it is bent through the external protective layer 501, so that the metal wire 504 is bent. Due to the setting of the external protective layer 501, the bending radius of the flexible circuit board substrate 1 is increased during the bending process, thereby protecting the copper foil 4 to prevent the copper foil 4 from being damaged due to the small bending radius. At the same time, through the bending performance of the metal wire 504, the internal protective layer 505 can maintain a bent state, thereby maintaining the bending state of the flexible circuit board substrate 1, thereby facilitating the installation and connection of the end piece 2 or the plug-in piece 3. At the same time, the internal protective layer 505 is arranged between the external protective layer 501 and the flexible circuit board substrate 1, so as to further improve the protection of the flexible circuit board substrate 1 during the bending process, so as to improve the normal operation of the flexible circuit board substrate 1.
[0030] In summary: by providing the protective mechanism 5 on the flexible circuit board substrate 1, the flexible circuit board substrate 1 can provide bending protection for the copper foil 4 during the bending process, increase the bending radius of the copper foil 4 during the bending process, thereby reducing the possibility of bending damage, and through the metal wire 504 in the protective mechanism 5, the flexible circuit board substrate 1 can be kept in a bent state during the bending process of the flexible circuit board substrate 1, thereby improving its bending stability, so that the end piece 2 and the plug-in piece 3 can be installed and connected respectively, thereby improving the convenience of installation.
Claims
1. A multilayer flexible circuit board, comprising a flexible circuit board substrate (1), an end sheet (2), an insert sheet (3) and a copper foil (4), characterized in that: The end piece (2) is arranged on the left side of the flexible circuit board substrate (1), the plug piece (3) is arranged on the right side of the flexible circuit board substrate (1), a protective mechanism (5) is arranged on the flexible circuit board substrate (1), a gasket (201) is arranged on the end piece (2), a positioning hole (202) is provided on the end piece (2), a mounting hole (302) is provided on the plug piece (3), and a pin (301) connected to the copper foil (4) is arranged on the upper part of the plug piece (3); The protective mechanism (5) comprises an external protective layer (501), the external protective layer (501) is sleeved on the outside of the flexible circuit board substrate (1), the left side of the external protective layer (501) is fixedly connected to a second sealing sheet (503), the right side of the external protective layer (501) is fixedly connected to a first sealing sheet (502), the inside of the external protective layer (501) is fixedly connected to a metal wire (504), and the inner surface of the external protective layer (501) is fixedly connected to an internal protective layer (505).
2. A multilayer flexible circuit board according to claim 1, characterized in that: The copper foil (4) is welded inside the flexible circuit board substrate (1) and is respectively connected to the gasket (201) and the pin (301).
3. A multilayer flexible circuit board according to claim 1, characterized in that: The external protective layer (501) is in the form of a box body with two sides penetrating therethrough and is matched with the flexible circuit board substrate (1). The external protective layer (501) is made of polyester material.
4. The multilayer flexible circuit board according to claim 1, characterized in that: The metal wire (504) is made of a metal material with bendability.
5. The multilayer flexible circuit board according to claim 1, characterized in that: A plurality of the metal wires (504) are provided, and the plurality of the metal wires (504) are evenly arranged around the outer protective layer (501) and are arranged inside the wall of the outer protective layer (501).
6. The multilayer flexible circuit board according to claim 1, characterized in that: The inner protective layer (505) is made of polyimide material.
Citation Information
Patent Citations
Multilayer flexible circuit board
CN212542743U