A communication module and terminal packaged in LGA

Abstract

The utility model discloses a communication module and terminal of LGA package, which are applied to the field of communication technology. The pad is a circular pad, and the pad forms a pad array on the surface of one side of the communication module body; the pad array includes a pad unit distributed periodically, and the pad unit includes four pads distributed in an isosceles right triangle, and the two right-angled sides of the pad unit are respectively parallel to the corresponding side in the communication module body; three pads in the pad unit are located at the three vertices of the isosceles right triangle, and one pad is located at the midpoint of the hypotenuse of the isosceles right triangle. By setting the pad unit of this structure, the two adjacent pads along the midline of the triangle will be the closest pads. When the distance between the nearest adjacent pads is constant, the distance between the pads parallel to the side direction of the communication module body can be significantly increased, which is convenient for the discharge of gas when the SMT passes through the furnace, reduces the risk of welding short circuit or cold welding, and improves the welding quality.

Description

Technical Field

[0001] The utility model relates to the technical field of communication, in particular to an LGA packaged communication module and a terminal. Background Art

[0002] Communication modules are widely used in IOT (Internet of Things) industries such as POS (point of sale), power grid, and Internet of Vehicles. As the link in the Internet of Things industry, communication modules provide support for the interconnection of all things. With the popularization of 5G large-bandwidth and high-speed modules, customers' products are being used more and more widely. And with the application of 5G large-bandwidth and high-speed modules in the MBB (Mobile Broad Band) market, they usually have the function of AP (Access Point).

[0003] With the increasing number of 5G applications at this stage, 5G communication modules require a large number of GND (ground) pins for heat dissipation as power consumption increases. Therefore, the number of pins required for 5G communication modules is usually more than 400 pins.

[0004] However, the traditional LGA (land grid array) pin definition greatly limits the increase in the number of pins, and blindly increasing the number of pins will reduce the pin spacing, thereby causing the risk of welding short circuits or cold welding, affecting the welding quality. Therefore, how to provide an LGA packaged communication module with higher welding quality is an urgent problem that technicians in this field need to solve. Utility Model Content

[0005] An object of the present invention is to provide a communication module of an LGA package, which can have higher welding quality; another object of the present invention is to provide a terminal, in which the communication module can have higher welding quality.

[0006] In order to solve the above technical problems, the utility model provides a communication module of LGA package, comprising a communication module body and a solder pad located on a surface of one side of the communication module body;

[0007] The solder pad is a circular solder pad, and the solder pad forms a solder pad array on the surface of one side of the communication module body; the solder pad array includes periodically distributed solder pad units, and the solder pad unit includes four solder pads distributed in an isosceles right triangle, and the two right-angled sides of the solder pad unit are respectively parallel to the corresponding side sides in the communication module body; three of the solder pads in the solder pad unit are located at the three vertices of the isosceles right triangle, and one of the solder pads is located at the midpoint of the hypotenuse of the isosceles right triangle.

[0008] Optionally, the surface of the communication module body is divided into at least three pad setting areas, and the pad unit is set in any of the pad setting areas; the pad setting areas are ring-shaped, and multiple pad setting areas are nested in sequence along a direction from the edge of the communication module body to the center; and blank areas for accommodating surface routing are set between adjacent pad setting areas.

[0009] Optionally, the pads are evenly distributed in any pad setting area.

[0010] Optionally, the pads include heat dissipation pads, and the heat dissipation pads are evenly distributed in at least one of the pad setting areas.

[0011] Optionally, each pad setting area is provided with a plurality of the heat dissipation pads, and the heat dissipation pads are evenly distributed in each pad setting area.

[0012] Optionally, any of the pad setting areas is provided with at most four rows or four columns of the pads along the vertical direction of the edge of the adjacent communication module body.

[0013] Optionally, the distances between adjacent pads in the pad setting area are equal.

[0014] Optionally, the outline of the pad setting area is the same as the outline of the communication module body.

[0015] Optionally, the pads have the same size.

[0016] The utility model also provides a terminal, comprising the LGA packaged communication module as described in any of the above items.

[0017] The utility model provides an LGA packaged communication module, comprising a communication module body and a solder pad located on one side surface of the communication module body; the solder pad is a circular solder pad, and the solder pad forms a solder pad array on one side surface of the communication module body; the solder pad array comprises a solder pad unit distributed periodically, the solder pad unit comprises four solder pads distributed in an isosceles right triangle, and two right-angled sides of the solder pad unit are respectively parallel to corresponding side sides in the communication module body; three solder pads in the solder pad unit are located at three vertices of the isosceles right triangle, and one solder pad is located at the midpoint of the hypotenuse of the isosceles right triangle.

[0018] By setting the pad unit of this structure, the two adjacent pads along the midline of the triangle will be the closest pads. When the distance between the closest adjacent pads is constant, the distance between the pads parallel to the side of the communication module body can be significantly increased, which is convenient for the gas discharge during the SMT (Surface Mounted Technology) furnace, reduces the risk of welding short circuit or cold welding, and improves the welding quality.

[0019] The present invention also provides a terminal, which also has the above-mentioned beneficial effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a schematic diagram of the front structure of an LGA packaging module in the prior art;

[0022] Figure 2 for Figure 1 Schematic diagram of the back structure;

[0023] Figure 3 A schematic diagram of the front structure of an LGA-packaged communication module provided by an embodiment of the utility model;

[0024] Figure 4 for Figure 3 Schematic diagram of the back structure;

[0025] Figure 5 for Figure 4 Surface routing diagram in .

[0026] In the figure: 1. Communication module body, 2. Solder pad, 3. Solder pad setting area, 4. Surface routing, 5. Solder pad unit. DETAILED DESCRIPTION

[0027] The core of this utility model is to provide a communication module with LGA package. Figure 1 as well as Figure 2 , Figure 1 It is a schematic diagram of the front structure of an LGA packaging module in the prior art; Figure 2 for Figure 1 See the back structure diagram of Figure 1 as well as Figure 2In the prior art, the size of the traditional LGA module is 41mm±0.15mm×44mm±0.15mm, the bottom of the module uses a 1.0mm×0.7mm pad, the pad spacing is 0.7mm, the center spacing of the two rows of pads along the long side is 1.7mm, and the center spacing of the two rows of pads along the short side is 1.4mm. The package has a total of 336 pins on the periphery, plus 4 external pins and 90 internal GND pins with a diameter of 1.2mm for heat dissipation, totaling 430 pins. With the increasing number of 5G applications at this stage, 5G communication modules require a large number of GND pins for heat dissipation as power consumption increases. Therefore, the number of pins required for 5G communication modules is usually above 400 pins. Therefore, the conventional LGA modules in the prior art usually have the following problems: Defect 1: The pin spacing is small, only 0.7mm, which is not conducive to the exhaust of gas during SMT (Surface Mounted Technology) furnace, and it is easy to produce cold solder joints and short circuit risks during module patching; Defect 2: The pad is rectangular, and its size is usually 1.0mm×0.7mm, which is different from the circular shape of solder paste after melting, and the welding yield is poor; Defect 3: The number of pins is small, which is not convenient for interface expansion. Defect 4: The pins are arranged irregularly, and it is difficult to find the pins.

[0028] The utility model provides an LGA-packaged communication module, comprising a communication module body and a solder pad located on one side surface of the communication module body; the solder pad is a circular solder pad, and the solder pad forms a solder pad array on one side surface of the communication module body; the solder pad array comprises periodically distributed solder pad units, and the solder pad unit comprises four solder pads distributed in an isosceles right triangle, and two right-angled sides of the solder pad unit are respectively parallel to corresponding sides in the communication module body; three solder pads in the solder pad unit are located at three vertices of the isosceles right triangle, and one solder pad is located at the midpoint of the hypotenuse of the isosceles right triangle.

[0029] By setting the pad unit of this structure, the two adjacent pads along the midline of the triangle will be the closest pads. When the distance between the closest adjacent pads is constant, the distance between the pads parallel to the side of the communication module body can be significantly increased, which is convenient for the gas discharge during SMT furnace, reduces the risk of welding short circuit or cold welding, and improves the welding quality.

[0030] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0031] Embodiment 1

[0032] Please refer to Figures 3 to 5 , Figure 3 A schematic diagram of the front structure of an LGA-packaged communication module provided by an embodiment of the utility model; Figure 4 for Figure 3 Schematic diagram of the back structure; Figure 5 for Figure 4 Surface routing diagram in .

[0033] See also Figure 3 as well as Figure 4 In an embodiment of the utility model, the LGA packaged communication module includes a communication module body 1 and a pad 2 located on one side surface of the communication module body 1; the pad 2 is a circular pad 2, and the pad 2 forms a pad array on one side surface of the communication module body 1; the pad array includes periodically distributed pad units 5, and the pad unit 5 includes four pads 2 distributed in an isosceles right triangle, and the two right-angled sides of the pad unit 5 are respectively parallel to the corresponding side edges in the communication module body 1; three of the pads 2 in the pad unit 5 are located at the three vertices of the isosceles right triangle, and one of the pads 2 is located at the midpoint of the hypotenuse of the isosceles right triangle.

[0034] The above-mentioned communication module body 1 is a module body mainly used to realize various communication functions. The electronic circuit for realizing the communication function of this application is specifically arranged in the communication module. The specific structure of the communication module can be set according to the actual situation, and is not specifically limited here. Normally, the communication module body 1 will be generally rectangular or rectangular with missing corners, and it has two pairs of parallel sides. In this embodiment, the above-mentioned pad 2 is the pin corresponding to the communication module body 1, and the pad 2 is specifically arranged on the surface of one side of the communication module body 1, and it is usually arranged on the back of the communication module body 1.

[0035] In this embodiment, the pad 2 is a circular pad 2, and the circular pad 2 is a BGA (Ball GridAray) package definition. This application applies the BGA package definition to the LGA package module, so that the morphology of the pad 2 is consistent with the circular shape after the solder paste is melted, thereby effectively improving the welding yield.

[0036] The pad units 5 are periodically distributed on the surface of the communication module body 1. Specifically, two types of pad units 5 are arranged on the surface of the entire communication module body 1. Figure 3The isosceles triangle structure framed in the middle, and the other is a pad unit 5 formed by flipping 180° along the hypotenuse, and the right-angled sides of the two pad units 5 are parallel to. In this embodiment, the pad units 5 of the above two morphologies are usually arranged alternately to form a pad array with a periodic distribution. At this time, for a certain pad 2, its nearest adjacent pad 2 is the pad 2 adjacent in the 45° direction. At this time, for a certain pad 2, it will be opposite to the gap between the two pads 2 along the direction parallel to the side of the communication module body 1.

[0037] The surface of the communication module body 1 is divided into at least three pad setting areas 3, and the pad unit 5 is set in any of the pad setting areas 3; the pad setting area 3 is ring-shaped, and multiple pad setting areas 3 are nested in sequence along the direction from the edge of the communication module body 1 to the center; a blank area for accommodating surface routing 4 is set between adjacent pad setting areas 3.

[0038] In this embodiment, the surface of the communication module body 1 is divided into at least three pad setting areas 3, and the above-mentioned pad unit 5 is arranged in each pad setting area 3, so that the distribution of the pads 2 will be specifically distributed along the pad setting area 3. In this embodiment, the pad setting area 3 is annular, and the pad setting area 3 is nested in sequence along the direction from the edge of the communication module body 1 to the center. In this embodiment, the pads 2 distributed in the same pad setting area 3 can be called a group of pads 2, and the distribution of a group of pads 2 is generally annular, and the distribution of pads 2 of different groups is arranged in a circular nested manner. Obviously, the area of ​​the pad setting area 3 located on the outside is usually larger, and more pads 2 are distributed. On the contrary, the area of ​​the pad setting area 3 located on the inside is usually smaller, and the number of pads 2 arranged therein will also be reduced.

[0039] In this embodiment, a blank area for accommodating surface routing 4 is provided between adjacent pad setting areas 3. The gap between adjacent pad setting areas 3 allows surface routing 4 to be provided on the surface of the communication module body 1, thereby reducing the complexity of routing inside the communication module body 1 and reducing the design difficulty of the communication module.

[0040] Specifically, in this embodiment, the pads 2 are evenly distributed in any pad setting area 3. That is, the pads 2 are evenly distributed in the pad setting area 3, so that the pads 2 are relatively evenly arranged on the surface of the communication module body 1.

[0041] In this embodiment, the pads 2 include heat dissipation pads, that is, the pads 2 are a general term for various pads 2. In this embodiment, the signal pads for transmitting data and the heat dissipation pads for grounding and heat dissipation are arranged in the same structure. In this embodiment, the heat dissipation pads are evenly distributed in at least one of the pad arrangement areas 3.

[0042] That is, the above-mentioned heat dissipation pads are distributed in at least one pad setting area 3, and the heat dissipation pads are evenly distributed in the corresponding pad setting area 3 to ensure that the position of the heat dissipation of the communication module is more uniform and the heat dissipation efficiency is higher. Specifically, in this embodiment, each pad setting area 3 is usually provided with a plurality of heat dissipation pads, and the heat dissipation pads are evenly distributed in each pad setting area 3 to further improve the uniformity of heat dissipation and the heat dissipation efficiency.

[0043] When the heat dissipation pad is set only in one pad setting area 3, the heat dissipation pad can also be set in the pad setting area 3 located in the center, and the heat dissipation pads can be concentratedly set in the central area of ​​the communication module body 1 to simulate the setting distribution of the heat dissipation pads in the current LGA package.

[0044] In this embodiment, when the above-mentioned pad units 5 are evenly arranged in the pad arrangement area 3, for a pad 2, the pad 2 closest to it is the pad 2 arranged in the diagonal 45° direction, and the spacing between pads 2 adjacent in the horizontal or vertical direction is greater than the spacing between pads 2 arranged in the diagonal focus direction. In this embodiment, the spacing between two adjacent pads 2 in the 45° angle direction is substantially the same as the spacing in the vertical or horizontal direction in the prior art, and at this time, the spacing between two pads 2 in the vertical or horizontal direction in this embodiment is significantly greater than the spacing between two pads 2 in the same direction in the prior art.

[0045] See also Figure 5 On this basis, any of the pad setting areas 3 in this embodiment is provided with at most four rows or columns of the pads 2 along the vertical direction of the edge of the adjacent communication module body 1. Since the pads 2 in this embodiment are arranged in a long grid-like interval, when no more than four rows or columns of pads 2 are provided along the vertical direction of the edge of the adjacent communication module body 1, the pads 2 in the middle can directly lead the wiring to the blank area or the edge of the communication module body 1 through the above-mentioned gap, so as to facilitate the wiring to lead out the signals of each pad 2 from the surface of the communication module body 1 where the pads 2 are provided.

[0046] In this embodiment, the distances between the adjacent pads 2 in the pad setting area 3 are all equal. That is, in the same pad setting area 3, the spacing between the pads 2 is usually equal to meet the uniform distribution condition. And in each pad setting area 3, the spacing between the adjacent pads 2 along the same direction is also equal. That is, no matter which pad setting area 3, the spacing between the adjacent pads 2 along the same direction is the same constant value, which makes the pads 2 in this embodiment distributed in all pad setting areas 3 with the same structure.

[0047] In this embodiment, the outline of the above-mentioned pad setting area 3 is generally the same as the outline of the communication module body 1, and the above-mentioned outline includes the outer outline and the inner outline of the pad setting area 3. Setting the outline of the pad setting area 3 to be the same as the outline of the communication module body 1 can make the communication module body 1 fill the entire surface of the communication module body 1 as much as possible without leaving dead corners, thereby setting as many pads 2 as possible on the surface of the communication module body 1.

[0048] In this embodiment, the sizes of the pads 2 are generally the same.

[0049] The communication module of an LGA package provided in this embodiment, by setting the pad unit 5 of this structure, two adjacent pads 2 along the midline of the triangle are the closest pads 2. When the distance between the closest adjacent pads 2 is constant, the distance between the pads 2 parallel to the side direction of the communication module body 1 can be significantly increased, which is convenient for the discharge of gas during SMT furnace, reduces the risk of welding short circuit or cold welding, and improves the welding quality. By distributing the pads 2 in the pad setting area 3, and the pad setting area 3 is nested in a ring shape on the surface of the communication module body 1, the number of pads 2 in the communication module can be greatly increased, so that it has more pins.

[0050] Embodiment 2

[0051] The present application will provide a specific structure of a communication module with LGA package. In this embodiment, the diameter of the pad 2 is 0.95mm, and the distance between the two closest pads 2 is 0.8mm, that is, the distance between the two adjacent pads 2 along the 45° direction is 0.8mm, and the center distance between the two adjacent pads 2 along the 45° direction is 1.75mm. Taking the 45mm±0.15mm×48mm±0.15mm size module as an example, a 507-pin package can be implemented.

[0052] At this time, in this embodiment, the package area is 2160mm, and the area of ​​the single core pad 2 is 0.71mm 2 , the pad 2 spacing along the oblique 45° direction, that is, the pin spacing is 0.8mm, the pad 2 spacing along the vertical or horizontal direction, that is, the pin spacing is 1.525mm, and the pad 2 center spacing along the vertical or horizontal direction is 2.475mm. At this time, the parameters of the new LGA package communication module provided by this application and the traditional LGA package communication module in the prior art are compared as shown in Table 1 below:

[0053] Table 1

[0054] Package Type Package size Package area Number of pins Pad area Pin spacing Traditional LGA package communication module 41mm×44mm <![CDATA[1804mm 2 ]]> 430 <![CDATA[0.7mm 2 (1.0mm×0.7mm)]]> 0.7mm New LGA package communication module 45mm×48mm <![CDATA[2160mm 2 ]]> 507 <![CDATA[0.71mm 2 (0.95mm diameter pad)]]> 0.8mm (45° oblique direction) 1.525mm (vertical / horizontal direction)

[0055] From the above comparison, it can be seen that the number of pins of the new LGA package communication module defined in this embodiment is significantly increased compared with the traditional LGA module, and at the same time, the area of ​​a single pad 2 is increased, the pin spacing is increased, and the welding quality is significantly improved. In addition, the pin distribution of the pad 2 of the new LGA communication module can be arranged in the manner of A1~A37, AR1~AR37, so that the pin position can be directly found by the Pin No.

[0056] In addition, since the pin spacing of the LGA package module provided by this application in the vertical and horizontal directions is as high as 1.525mm (pad center distance 2.475mm), which is more than twice the 0.7mm pin spacing of the original traditional LGA package, it is convenient to directly lead out from the surface during client line design, thereby reducing the client line level and reducing client design costs.

[0057] Embodiment 3

[0058] This embodiment also provides a terminal, which includes a communication module in an LGA package as provided in any of the above utility model embodiments, that is, the communication module used in this embodiment, which can specifically adopt the communication module structure provided in the above embodiments. Other structures in the terminal can refer to the prior art and will not be described here.

[0059] Since the terminal of this embodiment uses the LGA-packaged communication module provided by the above-mentioned utility model embodiment, the communication module in the terminal can have higher performance and just the right heat dissipation, thereby having higher product quality.

[0060] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0061] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0062] The above is a detailed introduction to a communication module and terminal in an LGA package provided by the utility model. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiment is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A communication module in LGA package, characterized in that: It includes a communication module body and a welding pad located on a surface of one side of the communication module body; The solder pad is a circular solder pad, and the solder pad forms a solder pad array on the surface of one side of the communication module body; the solder pad array includes periodically distributed solder pad units, and the solder pad unit includes four solder pads distributed in an isosceles right triangle, and the two right-angled sides of the solder pad unit are respectively parallel to the corresponding side sides in the communication module body; three of the solder pads in the solder pad unit are located at the three vertices of the isosceles right triangle, and one of the solder pads is located at the midpoint of the hypotenuse of the isosceles right triangle.

2. The LGA packaged communication module according to claim 1, characterized in that: The surface of the communication module body is divided into at least three pad setting areas, and the pad unit is arranged in any of the pad setting areas; the pad setting areas are ring-shaped, and multiple pad setting areas are nested in sequence along the direction from the edge of the communication module body to the center; blank areas for accommodating surface routing are arranged between adjacent pad setting areas.

3. The LGA packaged communication module according to claim 2, characterized in that: The pads are evenly distributed in any pad setting area.

4. The LGA packaged communication module according to claim 3, characterized in that: The pads include heat dissipation pads, and the heat dissipation pads are evenly distributed in at least one of the pad setting areas.

5. The LGA packaged communication module according to claim 4, characterized in that: Each pad setting area is provided with a plurality of heat dissipation pads, and the heat dissipation pads are evenly distributed in each pad setting area.

6. The LGA packaged communication module according to claim 1, characterized in that: Any of the pad arrangement regions may be provided with at most four rows or four columns of the pads along the vertical direction of the edges of the adjacent communication module bodies.

7. The LGA packaged communication module according to claim 6, characterized in that: The distances between adjacent pads in the pad setting area are all equal.

8. The LGA packaged communication module according to claim 1, characterized in that: The outline of the pad setting area is the same as the outline of the communication module body.

9. The LGA packaged communication module according to claim 1, characterized in that: The pads have the same size.

10. A terminal, characterized in that: A communication module comprising the LGA package as claimed in any one of claims 1 to 9.

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