High reliability diode devices

Abstract

The utility model discloses a high-reliability diode device, comprising: a vertically arranged chip, a positive electrode pin, a negative electrode pin and a plastic package body coated on the outside of the chip, wherein the positive electrode pin and the negative electrode pin are respectively located on the outside of the plastic package body at one end opposite to the chip, the positive electrode surface of the chip is electrically connected to the positive electrode connection part of a positive terminal, the negative electrode surface of the chip is electrically connected to the negative electrode connection part of a negative terminal, the other end of the positive electrode lead part of the positive terminal connected to the positive electrode connection part is overlapped with one end of the positive electrode pin located in the plastic package body, and the other end of the negative electrode lead part of the negative terminal connected to the negative electrode connection part is overlapped with one end of the negative electrode pin located in the plastic package body. The utility model can effectively avoid the situation that the stress generated when the pin is bent during use is transmitted to the inside of the plastic package body to affect the chip performance, thereby improving the stability of the device performance and the reliability during long-term use.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor power devices, in particular to a high-reliability diode device. Background Art

[0002] Axial diode devices are the most basic semiconductor devices. Their main function is to convert alternating current into direct current and they are widely used in various electronic circuits. When installing existing axial diode devices, the pins generally need to be bent before being installed on the PCB, which can easily cause the leads to break or loosen, and even affect the grains on the inner wall. Utility Model Content

[0003] The utility model aims to provide a high-reliability diode device, which can effectively avoid the situation where the stress generated when the pins are bent during use is transmitted to the inside of the plastic package and affects the chip performance, thereby improving the stability of the device performance and the reliability during long-term use.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a high-reliability diode device, comprising: a vertically arranged chip, a positive electrode pin, a negative electrode pin and a plastic package body coated on the outside of the chip, wherein the positive electrode pin and the negative electrode pin are each located on the outside of the plastic package body at one end opposite to the chip, the positive electrode surface of the chip is electrically connected to the positive electrode connection part of a positive terminal, the negative electrode surface of the chip is electrically connected to the negative electrode connection part of a negative terminal, the other end of the positive lead part of the positive terminal connected to the positive electrode connection part is overlapped with one end of the positive electrode pin located in the plastic package body, and the other end of the negative electrode lead part of the negative terminal connected to the negative electrode connection part is overlapped with one end of the negative electrode pin located in the plastic package body.

[0005] The further improved scheme in the above technical scheme is as follows:

[0006] 1. In the above solution, the positive electrode connection portion of the positive terminal and the negative electrode connection portion of the negative terminal are both sheet-shaped portions arranged parallel to the chip and are respectively located on both sides of the chip.

[0007] 2. In the above solution, the positive lead portion of the positive terminal and the negative lead portion of the negative terminal are both strip-shaped portions extending in the horizontal direction.

[0008] 3. In the above scheme, at least one through hole is provided on the positive lead portion and the positive pin of the positive terminal, and on the negative lead portion and the negative pin of the negative terminal and at their respective overlapping areas.

[0009] 4. In the above solution, the positive lead portion of the positive terminal and the positive pin, and the negative lead portion of the negative terminal and the negative pin are connected by soldering.

[0010] 5. In the above solution, the positive electrode surface of the chip and the positive electrode connection part of the positive electrode terminal, and the negative electrode surface of the chip and the negative electrode connection part of the negative electrode terminal are both connected by welding through a solder sheet.

[0011] Due to the application of the above technical solution, the utility model has the following advantages and effects compared with the prior art:

[0012] The utility model discloses a high-reliability diode device, wherein the positive electrode surface of the chip is electrically connected to the positive electrode connection part of a positive electrode terminal, the negative electrode surface of the chip is electrically connected to the negative electrode connection part of a negative electrode terminal, the other end of the positive electrode lead part of the positive electrode terminal connected to the positive electrode connection part is overlapped with one end of the positive electrode pin located in the plastic package, and the other end of the negative electrode lead part of the negative electrode terminal connected to the negative electrode connection part is overlapped with one end of the negative electrode pin located in the plastic package, which can effectively avoid the situation that the stress generated when the pin is bent during use is transmitted to the inside of the plastic package to affect the chip performance, thereby improving the stability of the device performance and the reliability during long-term use; further, at least one through hole is opened on the positive electrode lead part of the positive terminal, the positive electrode pin, the negative electrode lead part of the negative terminal and the negative electrode pin and located at the respective overlap areas, which can reduce the structural stress at the welding point and improve the structural stability at the welding point, thereby further improving the reliability and stability of the device as a whole. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Attached Figure 1 This is a schematic diagram of the structure of the high reliability diode device of the utility model;

[0014] Attached Figure 2 This is a schematic diagram of the structure of Example 2 of the utility model.

[0015] In the above figures: 1. chip; 2. positive electrode pin; 3. negative electrode pin; 4. plastic package; 5. positive electrode terminal; 51. positive electrode connection part; 52. positive electrode lead part; 6. negative electrode terminal; 61. negative electrode connection part; 62. negative electrode lead part; 7. through hole; 8. solder sheet. DETAILED DESCRIPTION

[0016] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0017] Embodiment 1: A high-reliability diode device comprises: a vertically arranged chip 1, a positive electrode pin 2, a negative electrode pin 3 and a plastic package 4 wrapped around the outside of the chip 1, wherein the positive electrode pin 2 and the negative electrode pin 3 are each located on the outside of the plastic package 4 at one end opposite to the chip 1, the positive electrode surface of the chip 1 is electrically connected to the positive electrode connection portion 51 of a positive terminal 5, the negative electrode surface of the chip 1 is electrically connected to the negative electrode connection portion 61 of a negative terminal 6, the positive lead portion 52 of the positive terminal 5 connected to the positive electrode connection portion 51 at one end is overlapped with one end of the positive pin 2 located in the plastic package 4, and the negative lead portion 62 of the negative terminal 6 connected to the negative electrode connection portion 61 at one end is overlapped with one end of the negative pin 3 located in the plastic package 4.

[0018] The positive electrode connection portion 51 of the positive electrode terminal 5 and the negative electrode connection portion 61 of the negative electrode terminal 6 are both sheet-shaped portions arranged parallel to the chip 1 and are located on both sides of the chip 1 respectively;

[0019] The positive lead portion 52 of the positive terminal 5 and the positive pin 2, and the negative lead portion 62 of the negative terminal 6 and the negative pin 3 are both connected by soldering;

[0020] The positive electrode surface of the chip 1 and the positive electrode connection portion 51 of the positive electrode terminal 5 , and the negative electrode surface of the chip 1 and the negative electrode connection portion 61 of the negative electrode terminal 6 are both connected by welding through a solder sheet 8 .

[0021] Embodiment 2: A high-reliability diode device comprises: a vertically arranged chip 1, a positive electrode pin 2, a negative electrode pin 3 and a plastic package 4 wrapped around the outside of the chip 1, wherein the positive electrode pin 2 and the negative electrode pin 3 are each located on the outside of the plastic package 4 at one end opposite to the chip 1, the positive electrode surface of the chip 1 is electrically connected to the positive electrode connection portion 51 of a positive terminal 5, the negative electrode surface of the chip 1 is electrically connected to the negative electrode connection portion 61 of a negative terminal 6, the positive lead portion 52 of the positive terminal 5 connected to the positive electrode connection portion 51 at one end is overlapped with one end of the positive pin 2 located in the plastic package 4, and the negative lead portion 62 of the negative terminal 6 connected to the negative electrode connection portion 61 at one end is overlapped with one end of the negative pin 3 located in the plastic package 4.

[0022] The positive electrode connection portion 51 of the positive electrode terminal 5 and the negative electrode connection portion 61 of the negative electrode terminal 6 are both sheet-shaped portions arranged parallel to the chip 1 and are located on both sides of the chip 1 respectively;

[0023] like Figure 2 As shown, at least one through hole 7 is provided on the positive lead portion 52 of the positive terminal 5, the positive pin 2, the negative lead portion 62 of the negative terminal 6 and the negative pin 3 and located at their respective overlapping areas;

[0024] The positive electrode lead portion 52 of the positive electrode terminal 5 and the positive electrode pin 2 , and the negative electrode lead portion 62 of the negative electrode terminal 6 and the negative electrode pin 3 are connected by soldering.

[0025] When the high-reliability diode device is used, it can effectively prevent the stress generated when the pin is bent during use from being transmitted to the inside of the plastic package and affecting the chip performance, thereby improving the stability of the device performance and the reliability during long-term use;

[0026] Furthermore, the structural stress at the welding point can be reduced, and the structural stability at the welding point can be improved, thereby further improving the overall reliability and stability of the device.

[0027] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A high reliability diode device, comprising: A chip (1), a positive electrode pin (2), a negative electrode pin (3) and a plastic package (4) wrapped around the outside of the chip (1) are arranged vertically, wherein the positive electrode pin (2) and the negative electrode pin (3) are each located on the outside of the plastic package (4) at one end opposite to the chip (1), and are characterized in that: the positive electrode surface of the chip (1) is electrically connected to the positive electrode connection portion (51) of a positive electrode terminal (5), the negative electrode surface of the chip (1) is electrically connected to the negative electrode connection portion (61) of a negative electrode terminal (6), the positive electrode lead portion (52) of the positive electrode terminal (5) having one end connected to the positive electrode connection portion (51) is overlapped with one end of the positive electrode pin (2) located inside the plastic package (4), and the negative electrode lead portion (62) of the negative electrode terminal (6) having one end connected to the negative electrode connection portion (61) is overlapped with one end of the negative electrode pin (3) located inside the plastic package (4).

2. The high reliability diode device according to claim 1, characterized in that: The positive electrode connection portion (51) of the positive electrode terminal (5) and the negative electrode connection portion (61) of the negative electrode terminal (6) are both sheet-shaped portions arranged parallel to the chip (1) and are respectively located on both sides of the chip (1).

3. The high reliability diode device according to claim 1, characterized in that: The positive electrode lead portion (52) of the positive electrode terminal (5) and the negative electrode lead portion (62) of the negative electrode terminal (6) are both strip-shaped portions extending in the horizontal direction.

4. The high reliability diode device according to any one of claims 1 to 3, characterized in that: At least one through hole (7) is provided on the positive lead portion (52) of the positive terminal (5), the positive pin (2), the negative lead portion (62) of the negative terminal (6), and the negative pin (3) and is located at each overlapping region.

5. The high reliability diode device according to claim 4, characterized in that: The positive lead portion (52) of the positive terminal (5) and the positive pin (2), and the negative lead portion (62) of the negative terminal (6) and the negative pin (3) are both connected by soldering.

6. The high reliability diode device according to claim 1, characterized in that: The positive electrode surface of the chip (1) and the positive electrode connection portion (51) of the positive electrode terminal (5), and the negative electrode surface of the chip (1) and the negative electrode connection portion (61) of the negative electrode terminal (6) are both connected by welding via a solder sheet (8).

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