A shunt resistance temperature acquisition module

Abstract

The utility model proposes a shunt resistor temperature acquisition module, wherein a steam conduction zone is formed between a heat conduction channel portion and one end of the shunt, the steam conduction zone is used to conduct the steam generated by the heat of the shunt to the heat conduction hole of the circuit board for temperature monitoring, the steam conduction zone conducts the heat generated by the shunt into the temperature monitoring portion through the steam conduction zone, the heat conduction hole or directly through the circuit board heat conduction, and through heat conduction and steam conduction, temperature acquisition is doubly guaranteed, greatly improving the acquisition accuracy; a dual NTC resistor redundant design is set to ensure one supply and one backup, and at the same time, the dual NTC resistor data are compared in real time. When the difference is large, the acquisition fails, further improving the temperature acquisition accuracy; a square single-point soldering pad is set for welding, the heat dissipation is slow, the welding temperature is low, and reflow soldering can be used instead of the existing gas phase soldering, which greatly reduces the welding cost, and the high welding quality ensures that the steam enters the steam conduction zone.

Description

Technical Field

[0001] The utility model relates to the technical field of shunts, and more specifically, to a shunt resistance temperature acquisition module. Background Art

[0002] Shunts are commonly used DC current measurement devices in new energy electric vehicles and energy storage industries. In the application of shunts, a large current will be loaded on the resistor of the shunt (i.e., the current detection resistor). Since the resistor will heat up due to continuous loading, the temperature change will affect the resistance value of the shunt.

[0003] The closest to the prior art is publication number: CN107677883A, a current sensor accuracy correction device and method. The utility model provides a current sensor accuracy correction device and method, the compensation device includes a shunt, a PCB acquisition board, a voltage detection device and a temperature sensor; the PCB acquisition board and the shunt are welded into one; the temperature sensor is arranged on the PCB acquisition board and is tightly attached to the shunt; the PCB acquisition board is also provided with a shunt acquisition point and an external wiring harness; the voltage detection device is respectively connected to the voltage of the temperature sensor and the current sensor; the shunt acquisition points are respectively arranged at both ends of the PCB acquisition board, respectively connected to the shunt and the PCB acquisition board, and used to collect the voltage at both ends of the shunt.

[0004] The existing shunt is tightly attached to the PCB acquisition board. When the temperature coefficient is large, it is more susceptible to temperature changes, resulting in temperature acquisition errors, which leads to inaccurate temperature compensation during current measurement, reducing the current value measurement accuracy of the shunt.

[0005] In view of this, the utility model proposes a shunt resistance temperature acquisition module with high acquisition accuracy and simple structure. Utility Model Content

[0006] The utility model aims to provide a shunt resistance temperature acquisition module with high acquisition accuracy and simple structure.

[0007] A shunt resistor temperature acquisition module comprises a circuit board 1 and a shunt 2. One side of the circuit board 1 is provided with a welding portion for welding, and the other side of the circuit board 1 is provided with a temperature monitoring portion 3 for temperature acquisition and monitoring. One end of the shunt 2 is connected to the circuit board 1 through the welding portion, and is characterized in that: the welding portion comprises a split pad portion 4 and a heat conduction channel portion 5, the left and right sides of the middle of the circuit board 1 are provided with a split pad portion 4, a heat conduction channel portion 5 is provided between adjacent split pad portions 4, and two groups of heat conduction holes 6 are provided on the heat conduction channel portion 5. The heat conduction holes 6 are used to receive heat output by the shunt 2 through heat conduction. One end of the shunt 2 is connected to the circuit board 1 through the split pad portion 4, and a steam conduction area 7 is formed between the heat conduction channel portion 5 and one end of the shunt 2. The steam conduction area 7 is used to conduct the steam generated by the heat of the shunt 2 to the heat conduction hole 6 of the circuit board for temperature monitoring. The steam conduction area 7 conducts the heat generated by the shunt 2 into the temperature monitoring portion 3 through the steam conduction area 7, the heat conduction hole 6 or directly through the circuit board 1.

[0008] Furthermore, the temperature monitoring unit 3 includes a monitoring resistor 8 and a control module 9. A guide plate 10 is provided on the other side of the circuit board 1 near a group of heat conduction holes 6. A monitoring resistor 8 is provided on the inner side of each guide plate 10. A control module 9 is provided above the monitoring resistor 8. Each monitoring resistor 8 is electrically connected to the control module 9. The control module 9 is used to receive the output data of the monitoring resistor 8.

[0009] Furthermore, the monitoring resistor 8 is an NTC resistor.

[0010] Furthermore, the interval between adjacent NTC resistors is 5 mm.

[0011] Furthermore, the guide plate 10 is a copper plate to facilitate heat transfer.

[0012] In some embodiments, the split pad portion 4 includes a plurality of groups of pads 41 , which are arranged in parallel and spaced apart, and a transverse flow channel 11 is formed between adjacent groups of pads 41 to facilitate gas dissipation during welding.

[0013] Furthermore, the pad 41 includes a plurality of single-point pads 42 , which are arranged in parallel and spaced apart, and a vertical flow channel 12 is formed between adjacent single-point pads 42 to facilitate the dissipation of bubbles generated during horizontal welding and prevent tin overflow.

[0014] Furthermore, the transverse flow channel 11 and the vertical flow channel 12 form a cross flow channel 13, which facilitates the dissipation of bubbles generated during vertical welding and prevents tin overflow.

[0015] Furthermore, the single-point pad 42 is in a shape of a square, a rectangle, or a circle, and is preferably in a square shape for ease of processing.

[0016] In some embodiments, the split pad portion 4 and the heat conduction channel portion 5 have the same width.

[0017] Beneficial effects of the utility model: The utility model proposes a shunt resistor temperature acquisition module, the welding part includes a split pad part 4 and a heat conduction channel part 5, the split pad part 4 is provided on the left and right sides of the middle of the circuit board 1, and a heat conduction channel part 5 is provided between adjacent split pad parts 4. Two groups of heat conduction holes 6 are provided on the heat conduction channel part 5, and the heat conduction holes 6 are used to receive the heat output by the shunt 2 through heat conduction. One end of the shunt 2 is connected to the circuit board 1 through the split pad part 4, and a steam conduction area 7 is formed between the heat conduction channel part 5 and one end of the shunt 2. The steam conduction area 7 is used to conduct the steam generated by the heat of the shunt 2 to the heat conduction holes 6 of the circuit board for temperature measurement. Monitoring, the steam conduction zone 7 transfers the heat generated by the diverter 2 into the temperature monitoring part 3 through the steam conduction zone 7, the heat conduction hole 6 or directly through the circuit board 1. Through heat conduction and steam conduction, the temperature collection is doubly guaranteed, which greatly improves the collection accuracy; a dual NTC resistor redundant design is set to ensure one supply and one backup, and at the same time, the dual NTC resistor data are compared in real time. When the difference is large, the collection fails, which further improves the temperature collection accuracy; a square single-point pad is set for welding, which has slow heat dissipation and low welding temperature. Reflow soldering can be used instead of existing gas phase soldering, which greatly reduces the welding cost, and the high welding quality ensures that the steam enters the steam conduction zone 7. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a structural schematic diagram of a shunt resistor temperature acquisition module of the present application.

[0019] Figure 2 This is a schematic diagram of the connection between the circuit board welding part and the shunt of a shunt resistance temperature acquisition module of the present application.

[0020] Figure 3 This is a schematic diagram of the connection between a circuit board temperature monitoring part and a shunt of a shunt resistor temperature acquisition module of the present application.

[0021] Figure 4 This is a schematic diagram of the connection side between a circuit board and a shunt of a shunt resistance temperature acquisition module of the present application.

[0022] Main component symbols

[0023] Circuit board 1, diverter 2, temperature monitoring part 3, split pad part 4, pad 41, single point pad 42, heat conduction channel part 5, heat conduction hole 6, steam conduction area 7, monitoring resistor 8, control module 9, guide plate 10, horizontal flow channel 11, vertical flow channel 12, cross flow channel 13.

[0024] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0025] The following examples are described to assist the understanding of the present application, and the examples are not and should not be interpreted in any way as limiting the scope of protection of the present application.

[0026] In the following description, those skilled in the art will recognize that throughout this discussion, components may be described as separate functional units (which may include sub-units), but those skilled in the art will recognize that various components or portions thereof may be divided into separate components or may be integrated together (including within a single system or component).

[0027] At the same time, the connections between components or systems are not intended to be limited to direct connections, rather, the data between these components may be modified, reformatted, or otherwise changed by intermediate components. In addition, additional or fewer connections may be used. It should also be noted that the terms "coupled," "connected," or "input" should be understood to include direct connections, indirect connections through one or more intermediate devices, and wireless connections. Embodiment 1:

[0028] like Figure 1 As shown, it is a structural schematic diagram of a shunt resistor temperature acquisition module of the present application; Figure 2 As shown, it is a schematic diagram of the connection between the circuit board welding part and the shunt of a shunt resistance temperature acquisition module of the present application; Figure 3 As shown in FIG. 1 , it is a schematic diagram of the connection between the circuit board temperature monitoring part and the shunt of a shunt resistor temperature acquisition module of the present application; Figure 4 The figure shows a schematic diagram of the connection side between a circuit board and a shunt of a shunt resistor temperature acquisition module of the present application.

[0029] A shunt resistor temperature acquisition module comprises a circuit board 1 and a shunt 2. One side of the circuit board 1 is provided with a welding portion for welding, and the other side of the circuit board 1 is provided with a temperature monitoring portion 3 for temperature acquisition and monitoring. One end of the shunt 2 is connected to the circuit board 1 through the welding portion, and is characterized in that: the welding portion comprises a split pad portion 4 and a heat conduction channel portion 5, the left and right sides of the middle of the circuit board 1 are provided with a split pad portion 4, a heat conduction channel portion 5 is provided between adjacent split pad portions 4, and two groups of heat conduction holes 6 are provided on the heat conduction channel portion 5. The heat conduction holes 6 are used to receive heat output by the shunt 2 through heat conduction. One end of the shunt 2 is connected to the circuit board 1 through the split pad portion 4, and a steam conduction area 7 is formed between the heat conduction channel portion 5 and one end of the shunt 2. The steam conduction area 7 is used to conduct the steam generated by the heat of the shunt 2 to the heat conduction hole 6 of the circuit board for temperature monitoring. The steam conduction area 7 conducts the heat generated by the shunt 2 into the temperature monitoring portion 3 through the steam conduction area 7, the heat conduction hole 6 or directly through the circuit board 1.

[0030] The temperature monitoring unit 3 includes a monitoring resistor 8 and a control module 9. A guide plate 10 is provided on the other side of the circuit board 1 near a group of heat conduction holes 6. A monitoring resistor 8 is provided on the inner side of each guide plate 10. A control module 9 is provided above the monitoring resistor 8. Each monitoring resistor 8 is electrically connected to the control module 9. The control module 9 is used to receive the output data of the monitoring resistor 8.

[0031] The monitoring resistor 8 is an NTC resistor.

[0032] The adjacent NTC resistors are spaced 5 mm apart.

[0033] The guide plate 10 is a copper plate to facilitate heat transfer.

[0034] The split pad portion 4 includes a plurality of groups of pads 41 , which are arranged in parallel and spaced apart. A transverse flow channel 11 is formed between adjacent groups of pads 41 to facilitate gas dissipation during welding.

[0035] The pad 41 includes a plurality of single-point pads 42 , which are arranged in parallel and spaced apart, and a vertical flow channel 12 is formed between adjacent single-point pads 42 to facilitate the dissipation of bubbles generated during horizontal welding and prevent tin overflow.

[0036] The transverse flow channel 11 and the vertical flow channel 12 form a cross flow channel 13, which is convenient for dispersing bubbles generated during vertical welding and preventing tin overflow.

[0037] The single-point pad 42 is in a square, rectangular, or circular shape, and is preferably in a square shape for ease of processing.

[0038] In some embodiments, the split pad portion 4 and the heat conduction channel portion 5 have the same width.

[0039] Beneficial effects of the utility model: The utility model proposes a shunt resistor temperature acquisition module, the welding part includes a split pad part 4 and a heat conduction channel part 5, the split pad part 4 is provided on the left and right sides of the middle of the circuit board 1, and a heat conduction channel part 5 is provided between adjacent split pad parts 4. Two groups of heat conduction holes 6 are provided on the heat conduction channel part 5, and the heat conduction holes 6 are used to receive the heat output by the shunt 2 through heat conduction. One end of the shunt 2 is connected to the circuit board 1 through the split pad part 4, and a steam conduction area 7 is formed between the heat conduction channel part 5 and one end of the shunt 2. The steam conduction area 7 is used to conduct the steam generated by the heat of the shunt 2 to the heat conduction holes 6 of the circuit board for temperature measurement. Monitoring, the steam conduction zone 7 transfers the heat generated by the diverter 2 into the temperature monitoring part 3 through the steam conduction zone 7, the heat conduction hole 6 or directly through the circuit board 1. Through heat conduction and steam conduction, the temperature collection is doubly guaranteed, which greatly improves the collection accuracy; a dual NTC resistor redundant design is set to ensure one supply and one backup, and at the same time, the dual NTC resistor data are compared in real time. When the difference is large, the collection fails, which further improves the temperature collection accuracy; a square single-point pad is set for welding, which has slow heat dissipation and low welding temperature. Reflow soldering can be used instead of existing gas phase soldering, which greatly reduces the welding cost, and the high welding quality ensures that the steam enters the steam conduction zone 7.

[0040] Although the present application has disclosed multiple aspects and embodiments, other aspects and embodiments will be obvious to those skilled in the art, and several modifications and improvements may be made without departing from the concept of the present application, all of which belong to the protection scope of the present application. The multiple aspects and embodiments disclosed in the present application are only for illustration and are not intended to limit the present application. The actual protection scope of the present application shall be subject to the claims.

Claims

1. A shunt resistor temperature acquisition module, comprising a circuit board (1) and a shunt (2), wherein one side of the circuit board (1) is provided with a welding portion for welding, and the other side of the circuit board (1) is provided with a temperature monitoring portion (3) for temperature acquisition and monitoring, and one end of the shunt (2) is connected to the circuit board (1) via the welding portion, characterized in that: The welding part comprises a split pad part (4) and a heat conduction channel part (5). The split pad part (4) is provided on the left and right sides of the middle part of the circuit board (1). The heat conduction channel part (5) is provided between adjacent split pad parts (4). The heat conduction channel part (5) is provided with two groups of heat conduction holes (6). The heat conduction holes (6) are used to receive heat output by the diverter (2) through heat conduction. One end of the diverter (2) is connected to the circuit board (1) through the split pad part (4). A steam conduction area (7) is formed between the heat conduction channel part (5) and one end of the diverter (2). The steam conduction area (7) is used to conduct steam generated by the heat of the diverter (2) to the heat conduction holes (6) of the circuit board for temperature monitoring. The steam conduction area (7) conducts the heat generated by the diverter (2) into the temperature monitoring part (3) through the steam conduction area (7), the heat conduction holes (6) or directly through the circuit board (1).

2. The shunt resistor temperature acquisition module according to claim 1, characterized in that: The temperature monitoring unit (3) comprises a monitoring resistor (8) and a control module (9). A guide plate (10) is provided on the other side of the circuit board (1) near a group of heat conduction holes (6). A monitoring resistor (8) is provided on the inner side of each guide plate (10). A control module (9) is provided above the monitoring resistor (8). Each monitoring resistor (8) is electrically connected to the control module (9). The control module (9) is used to receive output data of the monitoring resistor (8).

3. The shunt resistor temperature acquisition module according to claim 2, characterized in that: The monitoring resistor (8) is an NTC resistor.

4. The shunt resistor temperature acquisition module according to claim 3, characterized in that: The adjacent NTC resistors are spaced 5 mm apart.

5. The shunt resistor temperature acquisition module according to claim 2, characterized in that: The guide plate (10) is a copper plate, which facilitates heat transfer.

6. The shunt resistor temperature acquisition module according to claim 1, characterized in that: The split pad portion (4) comprises a plurality of groups of pads (41), the plurality of groups of pads (41) being arranged in parallel and spaced apart, and a transverse flow channel (11) being formed between adjacent groups of pads (41) to facilitate gas dissipation during welding.

7. The shunt resistor temperature acquisition module according to claim 6, characterized in that: The soldering pad (41) comprises a plurality of single-point soldering pads (42), the plurality of single-point soldering pads (42) being arranged in parallel and spaced apart, and a vertical flow channel (12) being formed between adjacent single-point soldering pads (42) to facilitate the dissipation of bubbles generated during horizontal soldering and to prevent tin overflow.

8. The shunt resistor temperature acquisition module according to claim 7, characterized in that: The horizontal flow channel (11) and the vertical flow channel (12) form a cross flow channel (13), which facilitates the dissipation of bubbles generated during vertical welding and prevents tin overflow.

9. The shunt resistor temperature acquisition module according to claim 7, characterized in that: The single-point welding pad (42) is in one of the following shapes: square, rectangular, or circular.

10. The shunt resistor temperature acquisition module according to claim 1, characterized in that: The split pad portion (4) and the heat conduction channel portion (5) have the same width.

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