Optical module

Abstract

The optical module provided by the utility model comprises a circuit board, a first signal processing chip, a first lens assembly, a TIA and a third heat dissipation piece. The first signal processing chip is electrically connected with the first light emitting chip. An open cavity is formed between the first lens assembly and the surface of the circuit board. The open cavity is provided with an opening facing the first signal processing chip. The first light emitting chip and the first light receiving chip are located in the open cavity. The TIA is arranged in the open cavity, the TIA is located on the side, away from the first signal processing chip, of the first light receiving chip, and the TIA is electrically connected with the first light receiving chip. And a third heat dissipation piece is arranged above the first signal processing chip in a covering manner. The third heat dissipation piece comprises a third blocking face. And the third blocking surface faces the opening, the third blocking surface forms a partition between the opening and the first signal processing chip, and the heat-conducting medium is limited on the third heat dissipation piece, so that the heat-conducting medium on the surface of the first signal processing chip is prevented from entering the open cavity through the opening.

Description

Technical Field

[0001] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules, as one of the key components in optical communication equipment, can realize the conversion of optical and electrical signals. In the development of optical communication technology, the data transmission rate of optical modules is required to be continuously improved. Utility Model Content

[0003] The embodiment of the present disclosure provides an optical module to adapt to a signal processing chip and improve high-frequency signal transmission performance.

[0004] The optical module provided in the embodiment of the present disclosure includes:

[0005] A circuit board, a surface of which is provided with a first light receiving chip and a first light emitting chip;

[0006] A first signal processing chip is disposed on the surface of the circuit board, and is located on the same surface of the circuit board as the first light emitting chip and the first light receiving chip, and the first signal processing chip is electrically connected to the first light emitting chip; the surface of the first signal processing chip is cooled by a heat conducting medium;

[0007] A first lens assembly is located on the same surface of a circuit board as the first signal processing chip, an open cavity is formed between the first lens assembly and the surface of the circuit board, the open cavity has an opening open toward the first signal processing chip, the first light emitting chip and the first light receiving chip are located in the open cavity, and the first lens assembly is covered on the first light receiving chip and the surface of the first light emitting chip to change the transmission direction of the optical signal to be transmitted to the first light receiving chip and change the transmission direction of the optical emission signal generated by the first light emitting chip;

[0008] A TIA is disposed in the open cavity, the TIA is located on a side of the first light receiving chip away from the first signal processing chip, and the TIA is electrically connected to the first light receiving chip;

[0009] A third heat sink is covered above the first signal processing chip, and includes a third bearing surface, a third blocking surface, and a third supporting portion. The surface of the third bearing surface is provided with a heat-conducting medium to dissipate heat from the first signal processing chip. The third blocking surface faces the opening, and the third blocking surface forms a partition between the opening and the first signal processing chip. The third supporting portion is used to prop up the third bearing surface to above the first signal processing chip.

[0010] The optical module provided by the present disclosure includes a circuit board, a first signal processing chip, a first lens assembly, a TIA and a third heat sink. The first signal processing chip is electrically connected to the circuit board and is located on the same surface of the circuit board as the first light emitting chip and the first light receiving chip. The first signal processing chip is electrically connected to the first light emitting chip. The surface of the first signal processing chip dissipates heat through a heat conducting medium. The first lens assembly is located on the same surface of the circuit board as the first signal processing chip. The first lens assembly covers the surfaces of the first light emitting chip and the first light receiving chip to change the transmission direction of the optical signal to be transmitted to the first light receiving chip and change the transmission direction of the optical emission signal generated by the first light emitting chip. Since the first signal processing chip is electrically connected to the first light emitting chip, the first lens assembly covers the surfaces of the first light emitting chip and the first light receiving chip, so the first signal processing chip and the first lens assembly should be set close to each other to ensure signal transmission performance. An open cavity opened toward the first signal processing chip is formed between the first lens assembly and the surface of the circuit board. The open cavity has an opening toward the first signal processing chip. The first light emitting chip and the first light receiving chip are located in the open cavity. The TIA is arranged in an open cavity, and the TIA is located on a side of the first light receiving chip away from the first signal processing chip, and the TIA is electrically connected to the first light receiving chip. The existence of the open cavity causes the bottom of the first lens assembly to be open to the first signal processing chip, and for this reason, a third heat sink is provided above the first signal processing chip. The third heat sink includes a third blocking surface. The third blocking surface faces the opening, and the third blocking surface forms a barrier between the opening and the first signal processing chip, restricting the heat conducting medium to the third heat sink, so as to prevent the heat conducting medium on the surface of the first signal processing chip from entering the open cavity through the opening, thereby preventing the optical chip in the open cavity from being contaminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0012] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0013] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0014] Figure 3A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0015] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0016] Figure 5 A schematic diagram of a layout structure inside an optical module provided in some embodiments of the present disclosure;

[0017] Figure 6 A layout cross-sectional structure inside an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0018] Figure 7 A local cross-sectional structure inside an optical module provided according to some embodiments of the present disclosure Figure 2 ;

[0019] Figure 8 A schematic diagram of a light path corresponding to a layout inside an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0020] Fig. 9 A schematic diagram of a light path corresponding to a layout inside an optical module provided according to some embodiments of the present disclosure Figure 2 ;

[0021] Fig.10 An assembly diagram of a first lens assembly and a first signal processing chip provided according to some embodiments of the present disclosure;

[0022] Fig.11 A structural diagram of an end surface of a first lens assembly facing a first signal processing chip provided according to some embodiments of the present disclosure;

[0023] Fig.12 A diagram of an optical module layout structure provided according to some embodiments of the present disclosure;

[0024] Fig.13 A layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0025] Fig.14 A layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 2 ;

[0026] Fig.15 A schematic side view of an optical module layout provided according to some embodiments of the present disclosure;

[0027] Fig.16 It is another layout structure diagram of an optical module provided according to some embodiments of the present disclosure;

[0028] Fig.17 Another layout decomposition structure of an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0029] Fig.18 Another layout decomposition structure of an optical module provided according to some embodiments of the present disclosure Figure 2 ;

[0030] Fig.19 It is another layout structure diagram of an optical module provided according to some embodiments of the present disclosure;

[0031] Fig. 20 Another layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0032] Fig.21 Another layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 2 ;

[0033] Fig. 22 Another layout structure diagram of an optical module provided according to some embodiments of the present disclosure;

[0034] Fig.23 A surface structure diagram of another layout circuit board of an optical module provided according to some embodiments of the present disclosure;

[0035] Fig.24 A structural diagram of a first signal processing chip and a second signal processing chip disposed on a surface of a circuit board according to some embodiments of the present disclosure;

[0036] Fig.25 A structural diagram of a first lens assembly and a second lens assembly provided on a circuit board surface according to some embodiments of the present disclosure;

[0037] Fig.26 A schematic diagram of an optical module optical path according to some embodiments of the present disclosure Figure 1 ;

[0038] Fig. 27 A schematic diagram of an optical module optical path according to some embodiments of the present disclosure Figure 2 ;

[0039] Fig.28 A circuit board surface structure provided according to some embodiments of the present disclosure Figure 1 ;

[0040] Fig.29 A circuit board surface structure provided according to some embodiments of the present disclosure Figure 2 ;

[0041] Fig.30 A circuit board surface structure provided according to some embodiments of the present disclosure Figure 3 ;

[0042] Fig.31 A schematic diagram of a circuit board surface layout provided according to some embodiments of the present disclosure Figure 1 ;

[0043] Fig.32 A schematic diagram of a circuit board surface layout provided according to some embodiments of the present disclosure Figure 2 ;

[0044] Fig.33 A side view structural diagram of a first lens assembly provided according to some embodiments of the present disclosure;

[0045] Fig.34 A structural diagram of a first heat dissipation element provided according to some embodiments of the present disclosure;

[0046] Fig.35 A schematic diagram of a circuit board surface layout provided in some embodiments of the present disclosure Figure 3 ;

[0047] Fig.36 A schematic diagram of a circuit board surface layout provided according to some embodiments of the present disclosure Figure 4 ;

[0048] Fig.37 A structural diagram of a third heat dissipation element provided according to some embodiments of the present disclosure;

[0049] Fig.38 A schematic diagram of a circuit board surface layout provided according to some embodiments of the present disclosure Figure 5 ;

[0050] Fig.39 A schematic diagram of a circuit board surface layout provided according to some embodiments of the present disclosure Figure 6 ;

[0051] Fig.40 A bottom structural diagram of a first lens assembly provided according to some embodiments of the present disclosure;

[0052] Fig.41 An exploded view of an assembly of a first lens assembly and a first optical fiber support provided according to some embodiments of the present disclosure;

[0053] Fig.42 A structural diagram of an end face of a first lens assembly facing an optical port provided according to some embodiments of the present disclosure;

[0054] Fig.43A cross-sectional structural diagram of an assembly of a first lens assembly and a first optical fiber support provided according to some embodiments of the present disclosure;

[0055] Fig.44 A cross-sectional structural diagram of a first lens assembly provided according to some embodiments of the present disclosure;

[0056] Fig.45 This is a bottom surface structural diagram of a first lens assembly provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0057] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0058] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" implies open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "same", "consistent", and "flush" are not limited to absolute mathematical theoretical relationships, but also include an acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0059] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0060] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0061] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0062] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0063] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0064] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0065] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal based on the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0066] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0067] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0068] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0069] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, and a lens assembly. In some embodiments, a first lens assembly 400 and a second lens assembly 500 are disposed on the surface of the circuit board 300. The shell includes an upper shell 201 and a lower shell 202, and the upper shell 201 covers the lower shell 202 to form the above shell with two openings 204 and 205; the outer contour of the shell generally presents a square body.

[0070] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0071] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0072] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the opening 204 and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access the external optical fiber 101, so that the optical fiber 101 connects the first lens assembly 400 and the second lens assembly 500 in the optical module 200.

[0073] The upper housing 201 and the lower housing 202 are combined to facilitate the installation of the circuit board 300 and the like into the housing, and the upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned components. In addition, when assembling the circuit board 300 and the like, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these components, which is conducive to automated production.

[0074] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0075] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0076] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0077] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), etc. The chips may include microcontroller units (Microcontroller Unit, MCU), laser driver chips, transimpedance amplifiers (Transimpedance Amplifier, TIA), limiting amplifiers (Limiting amplifier), clock and data recovery chips (Clock and Data Recovery, CDR), power management chips, digital signal processing (Digital Signal Processing, DSP) chips.

[0078] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0079] The circuit board 300 also includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide more pins, so as to adapt to occasions where the number of pins is large. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0080] In some embodiments, the lens assembly is connected to a fiber support. The fiber support allows the fiber array to pass through and fix the fiber array. Exemplarily, the first lens assembly 400 is connected to the first fiber support 700, and the second lens assembly 500 is connected to the second fiber support 800.

[0081] Figure 5 FIG. 1 is a schematic diagram of a layout structure inside an optical module provided in some embodiments of the present disclosure. Figure 5As shown, in some embodiments, the first lens assembly 400 and the second lens assembly 500 are arranged along the length direction of the circuit board 300. Exemplarily, the second lens assembly 500 is arranged between the first lens assembly 400 and the signal processing chip 302. Exemplarily, the signal processing chip 302 is a DSP chip.

[0082] In some embodiments, the second lens assembly 500 is farther from the optical port than the first lens assembly 400. The optical fiber array connected to the second optical fiber bracket 800 passes along the surface of the first lens assembly 400 until it is connected to the second lens assembly 500.

[0083] In some embodiments, a first optical fiber array 700 a is disposed between the first optical fiber bracket 700 and the optical fiber adapter 900 , and a second optical fiber array 800 a is disposed between the second optical fiber bracket 800 and the optical fiber adapter 900 .

[0084] The first optical fiber array 700 a and the second optical fiber array 800 a are arranged parallel to the surface of the circuit board 300 , so the transmission direction of the optical signal is parallel to the surface of the circuit board 300 .

[0085] In some embodiments, a light receiving chip 303 , a TIA 3031 , a light emitting chip 304 , and a laser driving chip 3041 are disposed on the surface of the circuit board 300 .

[0086] In some embodiments, the optical receiving chip 303 is disposed adjacent to the TIA 3031. The optical receiving chip 303 is used to convert the received optical signal into a photocurrent signal, and the TIA 3031 is used to convert the photocurrent signal into a voltage signal and amplify the voltage signal.

[0087] In some embodiments, the light emitting chip 304 is disposed adjacent to the laser driving chip 3041. The laser driving chip 3041 is used to generate a driving signal and send the driving signal to the light emitting chip 304. The light emitting chip 304 converts the received electrical signal into an optical signal under the action of the driving signal.

[0088] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are in a buckle-type configuration and can be buckled on the surface of the circuit board 300 .

[0089] In some embodiments, the first lens assembly 400 and the surface of the circuit board 300 form an open cavity 400 b. Exemplarily, the light receiving chip 303 , the TIA 3031 , the light emitting chip 304 , and the laser driving chip 3041 are located on the surface of the circuit board 300 and are covered by the first lens assembly 400 .

[0090] In some embodiments, the first lens assembly 400 is disposed on the surface of the light receiving chip 303, TIA3031, light emitting chip 304, and laser driver chip 3041. The second lens assembly 500 is also disposed on the surface of another group of light receiving chips 303, TIA3031, light emitting chip 304, and laser driver chip 3041.

[0091] In some embodiments, a cover tail cavity is formed at the end of the first lens assembly 400 and the end of the second lens assembly 500 to cover the TIA 3031 and the laser driving chip 3041 .

[0092] In some embodiments, the first lens assembly 400 and the second lens assembly 500 have a light path turning function, which can turn the transmission direction of the optical signal transmitted in the first optical fiber array 700a and the second optical fiber array 800a from parallel to the surface of the circuit board 300 to perpendicular to the circuit board 300, so as to be transmitted to the optical receiving chip 303.

[0093] In some embodiments, the first lens assembly 400 and the second lens assembly 500 have a light path turning function, which can turn the transmission direction of the optical signal emitted upward from the light emitting chip 304 along the surface of the circuit board 300 to be parallel to the surface of the circuit board 300, so as to output the optical signal emitted by the light emitting chip 304 along the first optical fiber array 700a and the second optical fiber array 800a to the outside of the optical module.

[0094] Figure 6 A layout cross-sectional structure inside an optical module provided according to some embodiments of the present disclosure Figure 1 , Figure 7 A local cross-sectional structure inside an optical module provided according to some embodiments of the present disclosure Figure 2 .like Figure 6 and Figure 7 As shown, in some embodiments, the second lens assembly 500 is disposed between the first lens assembly 400 and the DSP 302 .

[0095] In some embodiments, the first lens assembly 400 is disposed on a surface of a group of light receiving chips 303 and light emitting chips 304 .

[0096] In some embodiments, the second lens assembly 500 is disposed on the surface of another group of light receiving chips 303 and light emitting chips 304 .

[0097] In some embodiments, a TIA 3031 is disposed between the optical receiving chip 303 and the signal processing chip 302 , and a laser driving chip 3041 is disposed between the optical transmitting chip 304 and the signal processing chip 302 .

[0098] In some embodiments, the signal processing chip 302 is electrically connected to the gold finger 301 .

[0099] In some embodiments, the signal processing chip 302 can be flipped on the surface of the circuit board 300. For example, the solder bumps on the bottom surface of the signal processing chip 302 are connected downward to the surface of the circuit board 300. The solder bumps are routed along the surface of the circuit board 300 to be electrically connected to the gold fingers 301.

[0100] In some embodiments, after the solder bumps of the signal processing chip 302 are connected to the pads on the surface of the circuit board 300 by heating and pressurizing, the viscous filler is filled in both directions along the edge of the signal processing chip 302. The gap between the signal processing chip 302 and the circuit board 300 has a capillary siphon effect, and the filled viscous filler is sucked in and flows toward the center, thereby filling the gap between the signal processing chip 302 and the circuit board 300, thereby achieving stable fitting between the signal processing chip 302 and the circuit board 300.

[0101] In some embodiments, the signal processing chip 302 is electrically connected to the gold finger 301 through the traces on the surface of the circuit board 300 from the solder bump.

[0102] In some embodiments, the light receiving chip 303 and the light emitting chip 304 covered under the second lens assembly 500 are electrically connected to the signal processing chip 302 by wire bonding.

[0103] The light receiving chip 303 and the light emitting chip 304 covered under the first lens assembly 400 are electrically connected to the signal processing chip 302 in a through-hole manner.

[0104] In some embodiments, a first optical path turning surface 401 is formed on the surface of the first lens assembly 400, and a second optical path turning surface 501 is formed on the surface of the second lens assembly 500. The first optical path turning surface 401 and the second optical path turning surface 501 have the same structure and function, and the first optical path turning surface 401 is used as an example for exemplary description.

[0105] A light receiving chip 303 and a light emitting chip 304 are disposed below the first light path turning surface 401. The light receiving chip 303 and the light emitting chip 304 are arranged in an array along the width direction of the circuit board 300. The light receiving direction of the light receiving chip 303 is perpendicular to the surface of the circuit board 300, and the light emitting direction of the light emitting chip 304 is perpendicular to the surface of the circuit board 300.

[0106] In some embodiments, the optical path turning of the optical receiving chip 303 and the optical emitting chip 304 is realized by the first optical path turning surface 401. The first optical path turning surface 401 has a reflective effect, and the optical path of the optical signal transmitted to the inside of the optical module can be turned through reflection of the first optical path turning surface 401 so as to be received by the optical receiving chip 303, and the optical path of the optical signal emitted by the optical emitting chip 304 can also be turned so as to be output to the outside of the optical module along the optical fiber array.

[0107] Exemplarily, the optical signal transmitted to the interior of the optical module is reflected by the first optical path turning surface 401 to achieve optical path turning, turning the optical path from parallel to the surface of the circuit board 300 to perpendicular to the surface of the circuit board 300, so that the optical signal transmitted to the interior of the optical module can be received by the optical receiving chip 303.

[0108] Exemplarily, the optical signal generated by the optical emitting chip 304 is reflected by the first optical path turning surface 401 to achieve optical path turning, turning the optical path from perpendicular to the surface of the circuit board 300 to parallel to the surface of the circuit board 300, so that the optical signal generated by the optical emitting chip 304 can be transmitted along the optical fiber array to the outside of the optical module.

[0109] Figure 8 A schematic diagram of a light path corresponding to a layout inside an optical module provided according to some embodiments of the present disclosure Figure 1 , Fig. 9 A schematic diagram of a light path corresponding to a layout inside an optical module provided according to some embodiments of the present disclosure Figure 2 .like Figure 8 and Fig. 9 As shown, in some embodiments, the first lens assembly 400 has an optical path turning function.

[0110] In some embodiments, the optical path turning of the light receiving chip 303 and the light emitting chip 304 are both realized through the first optical path turning surface 401 .

[0111] In some embodiments, the optical signal transmitted along the optical fiber array to the inside of the optical module reaches the first optical path turning surface 401, and the optical path is turned by downward reflection of the first optical path turning surface 401, thereby turning the optical path to a direction perpendicular to the circuit board 300 so as to be received by the optical receiving chip 303.

[0112] In some embodiments, the optical signal generated by the optical emission chip 304 is transmitted upward along the surface of the circuit board 300 to the first optical path turning surface 401, and the optical path is turned by reflection from the first optical path turning surface 401. Exemplarily, the first optical path turning surface 401 reflects the optical signal output by the optical emission chip 304 toward the optical port, thereby turning the optical path transmission direction to be able to be transmitted along the optical fiber array, so as to transmit the optical signal generated by the optical emission chip 304 to the outside of the optical module.

[0113] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302, and the other end of the signal processing chip 302 is electrically connected to the laser driving chip 3041 and TIA3031 respectively, and then the laser driving chip 3041 is electrically connected to the light emitting chip 304, and TIA3031 is electrically connected to the light receiving chip 303.

[0114] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302 , and the other end of the signal processing chip 302 is directly electrically connected to the light emitting chip 304 and / or the light receiving chip 303 .

[0115] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302, and the other end of the signal processing chip 302 is directly electrically connected to the light emitting chip 304. For example, the laser driving chip 3041 can be integrated into the signal processing chip 302 to reduce power consumption.

[0116] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302, and the other end of the signal processing chip 302 is directly electrically connected to the optical receiving chip 303. For example, the TIA 3031 can be integrated into the signal processing chip 302 to reduce power consumption.

[0117] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302, and the other end of the signal processing chip 302 is electrically connected to the optical receiving chip 303 and the optical transmitting chip 304. Exemplarily, the laser driving chip 3041 and the TIA 3031 are respectively integrated into the signal processing chip 302, thereby reducing power consumption.

[0118] In some embodiments, the laser driving chip 3041 and / or the TIA 3031 are integrated in the signal processing chip 302 , and the signal processing chip 302 generates a large amount of heat and has a large heat dissipation requirement.

[0119] In some embodiments, the surface of the signal processing chip 302 is cooled by a heat-conducting medium. For example, the heat-conducting medium is a heat-conducting gel. The heat-conducting gel has a certain fluidity.

[0120] In some embodiments, a heat-conducting medium such as thermally conductive gel may be filled between the signal processing chip 302 and the upper shell 201 to conduct the heat generated by the signal processing chip 302 to the upper shell 201 through the thermally conductive gel, and then dissipate the heat to the outside through the upper shell 201, thereby dissipating the heat of the signal processing chip 302.

[0121] In some embodiments, the first lens assembly 400 covers the surface of the first light emitting chip 304 and the first light receiving chip 303. The first lens assembly 400 is used to change the transmission direction of the optical signal to be transmitted to the first light receiving chip 303 and to change the transmission direction of the optical emission signal generated by the first light emitting chip 304.

[0122] Since the signal processing chip 302 is electrically connected to the first light emitting chip 304 and / or the first light receiving chip 303, and the first lens assembly 400 is covered on the surface of the first light emitting chip 304 and the first light receiving chip 303, the signal processing chip 302 and the first lens assembly 400 should be arranged in close distance to ensure the electrical connection distance between the signal processing chip 302 and the first light emitting chip 304 and the first light receiving chip 303, respectively, so as to ensure the high-frequency signal transmission performance between the first signal processing chip 305 and the first light emitting chip 304 and the first light receiving chip 303, respectively.

[0123] Fig.10 This is an assembly diagram of a first lens assembly and a first signal processing chip provided according to some embodiments of the present disclosure. Fig.11 This is a structural diagram of the end surface of a first lens assembly facing the first signal processing chip according to some embodiments of the present disclosure. Fig.10 and Fig.11 As shown, in some embodiments, an open cavity 400b is formed between the first lens assembly 400 and the surface of the circuit board 300. The first light emitting chip 304 and the first light receiving chip 303 are located in the open cavity 400b. The open cavity 400b is open toward the signal processing chip.

[0124] In some embodiments, the open cavity 400b has an opening therein that is open toward the first signal processing chip 305. The configuration of the open cavity 400b enables the first lens assembly 400 to be miniaturized.

[0125] In some embodiments, the open cavity 400b is open toward the first signal processing chip 305, and the bottom of the first lens assembly 400 is open to the signal processing chip. The optical path of the first lens assembly 400 determines that the opening of the open cavity 400b has a certain height, so the opening space of the open cavity 400b is relatively large, and the thermal conductive gel on the surface of the signal processing chip can easily overflow into the open cavity 400b, causing contamination to the optical chip. The opening height of the open cavity 400b is sufficient to avoid the wiring on the surface of the circuit board 300, and is also sufficient to allow the thermal conductive gel to pass through.

[0126] In some embodiments, a side wall may be formed on the side of the first lens assembly 400 facing the signal processing chip to block the opening of the open cavity 400b. Based on the material and process of the first lens assembly 400, the thickness of the formed side wall is relatively large, which undoubtedly increases the distance between the first lens assembly 400 and the signal processing chip.

[0127] In some embodiments, in order to prevent the heat-conducting gel on the surface of the signal processing chip from overflowing into the open cavity 400b through the opening of the open cavity 400b, a heat sink is provided on the surface of the signal processing chip, and the surface of the heat sink can not only carry the heat-conducting medium, but also establish a barrier between the signal processing chip and the open cavity 400b. The barrier faces the opening of the open cavity 400b, and establishes a barrier between the opening and the signal processing chip, limiting the heat-conducting medium to the surface of the heat sink, thereby preventing the heat-conducting medium from overflowing into the open cavity 400b through the opening, thereby avoiding contamination of the optical chip.

[0128] In some embodiments, in order to prevent the heat-conducting gel on the surface of the signal processing chip from overflowing into the open cavity 400b through the opening of the open cavity 400b, a first cover is provided on the first lens assembly 400. The first cover includes a baffle. The baffle is arranged toward the opening. The baffle forms a barrier between the opening and the signal processing chip, and limits the heat-conducting medium to one side of the baffle, so as to prevent the heat-conducting medium on the surface of the signal processing chip from entering into the open cavity through the opening, thereby preventing the optical chip in the open cavity from being contaminated.

[0129] Fig.12 A diagram of an optical module layout structure provided according to some embodiments of the present disclosure is shown in FIG. Fig.13 A layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 1 , Fig.14 A layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 2 .like Figure 12 to Figure 14 As shown, in some embodiments, the first lens assembly 400 , the first signal processing chip 305 , the second lens assembly 500 , and the second signal processing chip 306 are disposed on the same surface of the circuit board 300 .

[0130] In some embodiments, the upper housing 201 of the optical module may form a heat dissipation duct with the cage 106 of the host computer 100 , so the upper housing 201 has a better heat dissipation effect than the lower housing 202 .

[0131] In some embodiments, the first lens assembly 400, the first signal processing chip 305, the second lens assembly 500, and the second signal processing chip 306 are disposed on the upper surface of the circuit board 300 to fully utilize the space between the circuit board 300 and the upper shell 201, and utilize the heat dissipation characteristics of the upper shell 201.

[0132] In some embodiments, the first lens assembly 400 is connected to a first optical fiber bracket 710 in which a first optical fiber array is fixed, and the second lens assembly 500 is connected to a second optical fiber bracket 720 in which a second optical fiber array is fixed.

[0133] In some embodiments, the first optical fiber bracket 710, the first lens assembly 400, and the first signal processing chip 305 cooperate with each other to realize the transmission and reception of four optical signals; the second optical fiber bracket 720, the second lens assembly 500, and the second signal processing chip 306 cooperate with each other to realize the transmission and reception of another four optical signals.

[0134] In some embodiments, compared to using one signal processing chip, using the first signal processing chip 305 and the second signal processing chip 306 respectively can simultaneously ensure that the first lens assembly 400 and the first signal processing chip 305 are set close to each other, and the second lens assembly 500 and the second signal processing chip 306 are set close to each other.

[0135] In some embodiments, the first signal processing chip 305 is located on the same surface of the circuit board 300 as the first light receiving chip 303 and the first light emitting chip 304 , and the first lens assembly 400 is located on the same surface of the circuit board 300 as the first signal processing chip 305 .

[0136] In some embodiments, the first signal processing chip 305 is electrically connected to the first light transmitting chip 304 and / or the first light receiving chip 303 .

[0137] In some embodiments, an open cavity 400b is formed between the first lens assembly 400 and the surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are located in the open cavity 400b. Exemplarily, the first light receiving chip 303 and the first light emitting chip 304 are disposed on the surface of the circuit board 300, and the first lens assembly 400 is covered on the top.

[0138] In some embodiments, an open cavity 400b is formed between the second lens assembly 500 and the surface of the circuit board 300. The second light receiving chip 303a and the second light emitting chip 304a are located in the open cavity. Exemplarily, the second light receiving chip 303a and the second light emitting chip 304a are arranged on the surface of the circuit board 300, and the upper part is covered by the second lens assembly 500.

[0139] In some embodiments, the provision of the open cavity 400 b enables the first lens assembly 400 to be miniaturized, which facilitates the first signal processing chip 305 to be close to the first lens assembly 400 .

[0140] In some embodiments, the open cavity 400 b has an opening that opens toward the first signal processing chip 305 .

[0141] The existence of the open cavity 400b causes the bottom of the first lens assembly 400 to be open to the first signal processing chip 305, and the thermal conductive gel on the surface of the first signal processing chip 305 may overflow into the open cavity 400b through the opening of the open cavity 400b, causing contamination to the first light emitting chip 304 and the first light receiving chip 303 in the open cavity 400b.

[0142] In some embodiments, a first heat sink 810 is provided on the surface of the first signal processing chip 305, and a second heat sink 820 is provided on the surface of the second signal processing chip 306. The first heat sink 810 and the second heat sink 820 have the same structure and function. The structure and function of the heat sink are described below by taking the first heat sink 810 as an example.

[0143] In some embodiments, the first heat sink 810 includes a first bearing surface 811, a first blocking surface 812, and a first supporting portion 813. The first bearing surface 811 is horizontally disposed relative to the surface of the circuit board 300, and the first blocking surface 812 is vertically disposed relative to the surface of the circuit board 300. The first blocking surface 812 is connected to the end of the first bearing surface 811, and the first supporting portion 813 is disposed at the bottom of the first bearing surface 811.

[0144] In some embodiments, the second heat sink 820 includes a second bearing surface 821, a second blocking surface 822, and a second supporting portion 823. Each surface has the same configuration and function as the first heat sink 810. The first heat sink 810 is taken as an example for illustration.

[0145] In some embodiments, the first bearing surface 811 is located above the first signal processing chip 305. A heat-conducting medium may be disposed on the surface of the first bearing surface 811 to dissipate heat for the first signal processing chip 305. Exemplarily, the heat-conducting medium is a heat-conducting gel, which is thermally connected to a heat-dissipating boss disposed on the bottom surface of the upper housing 201, thereby transferring the heat generated by the first signal processing chip 305 through the upper housing 201.

[0146] In some embodiments, the first blocking surface 812 faces the opening of the open cavity 400b. The first blocking surface 812 is located on one side of the first lens assembly 400. The first blocking surface 812 stands between the opening of the open cavity 400b and the first bearing surface 811, thereby forming a certain barrier between the first signal processing chip 305 and the first lens assembly 400, limiting the thermal conductive gel on the first bearing surface 811, thereby preventing the thermal conductive gel on the surface of the first bearing surface 811 from overflowing into the open cavity 400b through the opening of the open cavity 400b.

[0147] In some embodiments, the bottom end of the first support portion 813 is connected to the surface of the circuit board 300, and the first support portion 813 is used to prop up the first bearing surface 811 to a certain height, so as to prop up the first bearing surface 811 above the first signal processing chip 305. At the same time, the first support portion 813 can realize the connection between the first heat sink 810 and the circuit board 300.

[0148] In some embodiments, the first signal processing chip 305 is electrically connected to the first light receiving chip 303 and the first light emitting chip 304. For example, the first signal processing chip 305 integrates a laser driving chip and a TIA.

[0149] In some embodiments, the first signal processing chip 305 faces both the first light receiving chip 303 and the first light emitting chip 304 . The first light receiving chip 303 and the first light emitting chip 304 are located on the same side of the first signal processing chip 305 .

[0150] In some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are electrically connected to the gold fingers 301 , respectively.

[0151] In some embodiments, the first signal processing chip 305 is electrically connected to the circuit board 300 through the bottom surface. The bottom surface of the first signal processing chip 305 is formed with solder bumps, which are electrically connected to the surface traces of the circuit board 300 to achieve electrical connection between the first signal processing chip 305 and the circuit board 300.

[0152] In some embodiments, the wiring on the surface of the circuit board 300 passes from one side of the first blocking surface 812 through the other side of the first blocking surface 812 and extends into the open cavity 400 b , and a solder pad is formed at the end of the wiring.

[0153] The first light receiving chip 303 and the first light emitting chip 304 are electrically connected to the pads at the ends of the wiring respectively, so that the first signal processing chip 305 is electrically connected to the first light receiving chip 303 and the first light emitting chip 304 respectively.

[0154] In some embodiments, a gap is formed between the first blocking surface 812 and the surface of the circuit board 300 to avoid wiring on the surface of the circuit board 300 .

[0155] In some embodiments, two heat dissipation bosses are disposed on the bottom surface of the upper housing 201 , which are thermally connected to the first signal processing chip 305 and the second signal processing chip 306 respectively, so as to transfer the heat generated by the signal processing chips to the upper housing 201 via the heat dissipation bosses.

[0156] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are staggered on the same surface of the circuit board 300 so that the optical fiber arrays corresponding to the two lens assemblies are staggered, thereby preventing the optical fiber array connected to the second lens assembly 500 from passing through the surface of the first lens assembly 400 and the first signal processing chip 305, thereby preventing the optical fiber array connected to the second lens assembly 500 from being covered by the heat dissipation boss thermally connected to the first signal processing chip 305, thereby protecting the optical fiber array.

[0157] In some embodiments, a backlight detector 307 is disposed on the surface of the first lens assembly 400 . The backlight detector 307 is disposed on the surface of the circuit board 300 .

[0158] In some embodiments, the backlight detector 307 is located on a side of the first light emitting chip 304 facing the first optical fiber support 710 to monitor the light emission power of the first light emitting chip 304 .

[0159] In some embodiments, the first light emitting chip 304 is disposed between the backlight detector 307 and the first signal processing chip 305 .

[0160] In some embodiments, the optical surface of the first lens assembly 400 is fixed, and the relative position of the backlight detector 307 and the first light emitting chip 304 is fixed. Exemplarily, the backlight detector 307 is located on the side of the first light emitting chip 304 facing the first optical fiber bracket 710.

[0161] Fig.15 FIG. 1 is a schematic side view of an optical module layout provided according to some embodiments of the present disclosure. Fig.15 As shown, in some embodiments, a first heat sink 810 is disposed on the surface of the first signal processing chip 305. The first heat sink 810 includes a first bearing surface 811, a first blocking surface 812, and a first supporting portion 813.

[0162] The first blocking surface 812 forms a certain barrier between the first signal processing chip 305 and the first lens assembly 400 to prevent the thermal conductive gel on the surface of the first bearing surface 811 from overflowing into the open cavity 400b, thereby preventing the thermal conductive gel from contaminating the first light receiving chip 303 and the first light emitting chip 304 in the open cavity 400b.

[0163] In the above embodiment, the first heat sink 810 can carry the thermally conductive gel to dissipate the heat of the first signal processing chip 305, and at the same time, the thermally conductive gel can be limited on the first heat sink 810, thereby preventing the thermally conductive gel from overflowing through the opening to the open cavity 400b, thereby providing the necessary conditions for the first lens assembly 400 and the first signal processing chip 305 to be arranged in close proximity, thereby ensuring the signal transmission performance between the first light receiving chip covered under the first lens assembly 400 and the built-in TIA of the first signal processing chip 305; and at the same time, ensuring the signal transmission performance between the first light emitting chip covered under the first lens assembly 400 and the built-in laser driver chip of the first signal processing chip 305.

[0164] Fig.16 This is another layout structure diagram of an optical module provided according to some embodiments of the present disclosure. Fig.17 Another layout decomposition structure of an optical module provided according to some embodiments of the present disclosure Figure 1 , Fig.18 Another layout decomposition structure of an optical module provided according to some embodiments of the present disclosure Figure 2 .like Figure 16-Figure 18 As shown, in some embodiments, the first lens assembly 400 , the first signal processing chip 305 , the second lens assembly 500 , and the second signal processing chip 306 are located on the same surface of the circuit board 300 .

[0165] In some embodiments, the first lens assembly 400, the first signal processing chip 305, the second lens assembly 500, and the second signal processing chip 306 are disposed on the upper surface of the circuit board 300 to fully utilize the space between the circuit board 300 and the upper shell 201, and utilize the heat dissipation characteristics of the upper shell 201.

[0166] In some embodiments, the end surface of the first lens assembly 400 facing the first signal processing chip 305 is relatively flat, and the end surface of the second lens assembly 500 facing the second signal processing chip 306 is relatively flat.

[0167] In some embodiments, a first light receiving chip 303 and a first light emitting chip 304 are provided under the first lens assembly 400 to realize the reception and emission of optical signals. A second light receiving chip 303a and a second light emitting chip 304a are provided under the second lens assembly 500. The following embodiments take the first lens assembly 400, the first light receiving chip 303, and the first light emitting chip 304 as examples.

[0168] In some embodiments, the first signal processing chip 305 is located on the same surface of the circuit board 300 as the first light receiving chip 303 and the first light emitting chip 304 , and the first lens assembly 400 is located on the same surface of the circuit board 300 as the first signal processing chip 305 .

[0169] In some embodiments, the first signal processing chip 305 is electrically connected to the first light emitting chip 304. The first signal processing chip 305 has a built-in laser driving chip.

[0170] In some embodiments, an open cavity 400b is formed between the first lens assembly 400 and the surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are located in the open cavity 400b. Exemplarily, the first light receiving chip 303 and the first light emitting chip 304 are disposed on the surface of the circuit board 300, and the first lens assembly 400 is covered on the top.

[0171] As mentioned above, the existence of the open cavity 400b causes the bottom of the first lens assembly 400 to be open to the first signal processing chip 305, and the thermal conductive gel on the surface of the first signal processing chip 305 may overflow into the open cavity 400b through the opening of the open cavity 400b, causing contamination to the first light emitting chip 304 and the first light receiving chip 303 in the open cavity 400b.

[0172] In some embodiments, the TIA 3031 is disposed inside the first signal processing chip 305 , and the laser driving chip is disposed outside the first signal processing chip 305 .

[0173] In some embodiments, the laser driving chip is disposed inside the first signal processing chip 305 , and the TIA 3031 is disposed outside the first signal processing chip 305 .

[0174] In some embodiments, the laser driving chip is disposed inside the first signal processing chip 305 , and the TIA 3031 is disposed outside the first lens assembly 400 .

[0175] In some embodiments, the laser driving chip is disposed in the first signal processing chip 305, and the TIA 3031 is disposed in an open cavity 400b surrounded by the first lens assembly 400 and the surface of the circuit board 300. Exemplarily, the TIA 3031 is disposed on the surface of the circuit board 300 and is covered by the first lens assembly 400.

[0176] In some embodiments, the TIA is set in the open cavity 400b surrounded by the first lens assembly 400 and the surface of the circuit board 300, which is limited by the size of the open cavity 400b. Different types of TIA3031 have different sizes. In order to ensure that the structure and size of the first lens assembly 400 are fixed, the TIA is set in the open cavity 400b surrounded by the first lens assembly 400 and the surface of the circuit board 300, which is more suitable for TIAs with smaller sizes. Of course, the size of the first lens assembly 400 can also be adjusted to adapt to TIAs of different sizes.

[0177] In some embodiments, TIA3031 is disposed on the side of the first optical receiving chip 303 facing the first optical fiber bracket 710, that is, TIA3031 is located on the side of the first optical receiving chip 303 away from the first signal processing chip 305, thereby shortening the distance between the first lens assembly 400 and the first signal processing chip 305.

[0178] In some embodiments, the optical path of the first lens assembly 400 determines that the open cavity 400b has a certain height, so the open space of the open cavity 400b is relatively large, and the thermal conductive gel on the surface of the first signal processing chip 305 can easily overflow into the open cavity 400b, causing contamination to the optical chip.

[0179] In some embodiments, the surface of the first signal processing chip 305 can be covered with the first heat sink 810. The first blocking surface 812 in the first heat sink 810 forms a certain barrier between the first signal processing chip 305 and the opening of the open cavity 400b, restricting the thermal conductive gel on the first bearing surface 811, thereby preventing the thermal conductive gel from overflowing into the open cavity 400b, thereby preventing the thermal conductive gel from contaminating the first light receiving chip 303 and the first light emitting chip 304 in the open cavity 400b.

[0180] In some embodiments, a third heat sink 850 may be disposed on the surface of the first signal processing chip 305 , and a fourth heat sink 860 may be disposed on the surface of the second signal processing chip 306 .

[0181] In some embodiments, the structure of the third heat sink 850 is similar to that of the first heat sink 810 , so in different embodiments, these two heat sinks are in parallel, and either heat sink structure can be used.

[0182] In some embodiments, the third heat dissipation element 850 includes a third bearing surface 851 , a third blocking surface 852 , and a third supporting portion 853 .

[0183] In some embodiments, a heat-conducting medium, such as a heat-conducting gel, may be disposed on the surface of the third bearing surface 851 to transfer the heat generated by the first signal processing chip 305 to the upper housing 201 .

[0184] In some embodiments, the third blocking surface 852 stands on one end of the third bearing surface 851 close to the first lens assembly 400. The third blocking surface 852 faces the opening of the open cavity 400b, and limits the thermal conductive gel on the third bearing surface 851, thereby preventing the thermal conductive gel from overflowing into the open cavity 400b. The third blocking surface 852 establishes a barrier between the third bearing surface 851 and the open cavity 400b, and seals the open cavity 400b to a certain extent, thereby preventing the thermal conductive gel from overflowing into the open cavity 400b, thereby preventing the optical chip from being contaminated.

[0185] In some embodiments, the third support portion 853 is disposed at the bottom of the third bearing surface 851 to prop up the third bearing surface 851 above the first signal processing chip 305. Exemplarily, the length of the third support portion 853 is longer than the length of the first support portion 813. Exemplarily, there is a gap between the third bearing surface 851 and the first signal processing chip 305.

[0186] In some embodiments, the first signal processing chip 305 faces both the first light receiving chip 303 and the first light emitting chip 304 .

[0187] In some embodiments, the first optical receiving chip 303 is located between the TIA 3031 and the first signal processing chip 305. Exemplarily, the TIA 3031, the first optical receiving chip 303, and the first signal processing chip 305 are arranged in sequence.

[0188] In some embodiments, the surface pads of the TIA 3031 are connected to the surface pads of the first light receiving chip 303 by wire bonding, so as to realize electrical connection between the TIA 3031 and the first light receiving chip 303 .

[0189] In some embodiments, the surface pads of the TIA 3031 are connected to the surface of the circuit board 300 by wire bonding to achieve electrical connection between the TIA 3031 and the circuit board 300 .

[0190] In some embodiments, pads are formed around the surface of TIA3031 , wherein the pads on one side close to the first light receiving chip 303 are electrically connected to the pads on the surface of the first light receiving chip 303 , and the pads on the other three sides are electrically connected to the surface of the circuit board 300 .

[0191] In some embodiments, when TIA3031 is arranged on the side of the first optical receiving chip 303 facing the first optical fiber bracket 710, the pads on the surface of TIA3031 used for electrical connection with the first optical receiving chip 303 are arranged adjacent to the pads on the surface of the first optical receiving chip 303 to ensure that the wiring length between TIA3031 and the first optical receiving chip 303 is short.

[0192] In some embodiments, the position of the pads on the surface of the TIA3031 electrically connected to the first light receiving chip 303 is fixed, and the position of the pads on the surface of the first light receiving chip 3031 electrically connected to the TIA3031 is fixed. Figure 5 The relative position relationship between the first light receiving chip 303 and the TIA 3031 is achieved by rotating 180° toward the direction of the first optical fiber bracket 710 .

[0193] In some embodiments, the first light emitting chip 304 is located at one side of the first signal processing chip 305 , which can ensure high-frequency signal transmission performance between the first light emitting chip 304 and the first signal processing chip 305 .

[0194] In some embodiments, the first signal processing chip 305 is electrically connected to the circuit board 300 through the bottom surface. The bottom surface of the first signal processing chip 305 is formed with solder bumps, which are electrically connected to the surface traces of the circuit board 300 to achieve electrical connection between the first signal processing chip 305 and the circuit board 300.

[0195] In some embodiments, the wiring on the surface of the circuit board 300 passes through the other side of the third blocking surface 852 from one side of the third blocking surface 852 and extends into the open cavity 400 b , and a solder pad is formed at the end of the wiring.

[0196] The first light emitting chip 304 is electrically connected to the pad at the end of the trace, thereby achieving electrical connection between the first signal processing chip 305 and the first light emitting chip 304 .

[0197] In some embodiments, a backlight detector 307 is disposed on a side of the first light emitting chip 304 away from the first signal processing chip 305. The backlight detector 307 is located in the open cavity 400b.

[0198] In some embodiments, the backlight detector 307 is located on a side of the first light emitting chip 304 facing the first optical fiber support 710. The first lens assembly 400 splits light to the backlight detector 307 to monitor the light power emitted by the first light emitting chip 304.

[0199] In some embodiments, the first light emitting chip 304 is disposed between the backlight detector 307 and the first signal processing chip 305 .

[0200] In some embodiments, the optical surface of the first lens assembly 400 is fixed, and the relative position of the backlight detector 307 and the first light emitting chip 304 is fixed. Exemplarily, the backlight detector 307 is located on the side of the first light emitting chip 304 facing the first optical fiber bracket 710.

[0201] In some embodiments, the first signal processing chip 305 is electrically connected to the first light receiving chip 303. The first signal processing chip 305 is integrated with a TIA.

[0202] The laser driving chip is disposed on the side of the first light emitting chip 304 away from the first signal processing chip 305, and the first lens assembly 400 does not perform light splitting. That is, the side of the first light emitting chip 304 away from the first signal processing chip 305 is not provided with a backlight detector 307.

[0203] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are offset on the surface of the circuit board 300 so that the optical fiber arrays connected to the two lens assemblies are correspondingly offset on the surface of the circuit board 300, thereby preventing the optical fiber array connected to the second lens assembly 500 from passing through the surface of the first lens assembly 400 and the first signal processing chip 305, thereby preventing the optical fiber array connected to the second lens assembly 500 from being covered by the heat dissipation boss thermally connected to the first signal processing chip 305, thereby protecting the optical fiber array.

[0204] In the above embodiment, the TIA is arranged in the open cavity 400b surrounded by the first lens assembly 400 and the circuit board 300, and the TIA is located on one side of the first light receiving chip 303, so as to ensure the signal transmission performance between the TIA and the first light receiving chip 303. The laser driving chip is built into the first signal processing chip 305, and the first signal processing chip 305 is electrically connected to the first light emitting chip 304. A third heat sink 850 is provided above the first signal processing chip 305, and the third heat sink 850 can not only carry the thermal conductive gel to dissipate the heat of the first signal processing chip 305, but also prevent the thermal conductive gel on the surface from overflowing into the open cavity 400b, so as to ensure that the first lens assembly 400 and the first signal processing chip 305 are arranged in close proximity, thereby ensuring the high-frequency signal transmission performance between the first light emitting chip 304 covered below the first lens assembly 400 and the laser driving chip built into the first signal processing chip 305.

[0205] Fig.19 is another layout structure diagram of an optical module provided according to some embodiments of the present disclosure, Fig. 20 Another layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 1 , Fig.21 Another layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 2 .like Figure 19-21 As shown, in some embodiments, the first lens assembly 400 , the first signal processing chip 305 , the second lens assembly 500 , and the second signal processing chip 306 are disposed on the same surface of the circuit board 300 .

[0206] In some embodiments, the first lens assembly 400, the first signal processing chip 305, the second lens assembly 500, and the second signal processing chip 306 are disposed on the upper surface of the circuit board 300 to fully utilize the space between the circuit board 300 and the upper shell 201, and utilize the heat dissipation characteristics of the upper shell 201.

[0207] In some embodiments, the first signal processing chip 305 is located on the same surface of the circuit board 300 as the first light receiving chip 303 and the first light emitting chip 304 , and the first lens assembly 400 is located on the same surface of the circuit board 300 as the first signal processing chip 305 .

[0208] In some embodiments, the first signal processing chip 305 is electrically connected to the first light emitting chip 304 and / or the first light receiving chip 303 , respectively.

[0209] In some embodiments, an open cavity 400b is formed between the first lens assembly 400 and the surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are located in the open cavity 400b. Exemplarily, the first light receiving chip 303 and the first light emitting chip 304 are disposed on the surface of the circuit board 300, and the first lens assembly 400 is covered on the top.

[0210] As mentioned above, the existence of the open cavity 400b causes the bottom of the first lens assembly 400 to be open to the first signal processing chip 305, and the thermal conductive gel on the surface of the first signal processing chip 305 may overflow into the open cavity 400b through the opening of the open cavity 400b, causing contamination to the first light emitting chip 304 and the first light receiving chip 303 in the open cavity 400b.

[0211] In some embodiments, a first cover 910 is provided on the surface of the first lens assembly 400 .

[0212] In some embodiments, the first cover 910 includes a top plate 911 , a support plate 912 , and a baffle 913 .

[0213] The top plate 911 is overlapped on the first lens assembly 400. One end of the top plate 911 is disposed on the surface of the first lens assembly 400, and the other end is connected to the baffle 913.

[0214] The support plates 912 on both sides stand on the surface of the circuit board 300, and the bottom of the support plates 912 is arranged on the surface of the circuit board 300. The support plates 912 have a certain height, and can prop up the top plate 911 to a certain height, so that the top plate 911 can be placed on the surface of the first lens assembly 400. The support plates 912 on both sides can enclose and protect the TIA3031 from two sides.

[0215] One side of the baffle 913 faces the first signal processing chip 305, and the other side faces the opening of the open cavity 400b. The baffle 913 forms a barrier between the opening of the open cavity 400b and the first signal processing chip 305, restricting the heat-conducting medium to one side of the baffle 913, so as to prevent the heat-conducting medium on the surface of the first signal processing chip 305 from entering the open cavity 400b through the opening, thereby preventing the optical chip in the open cavity 400b from being contaminated.

[0216] In some embodiments, the first signal processing chip 305 is electrically connected to the first light emitting chip 304. The laser driving chip is built into the first signal processing chip 305.

[0217] In some embodiments, the material of the first cover 910 is different from that of the first lens assembly 400. Based on the material and process of the first cover 910, the first cover 910 forms a sidewall blocking opening relative to the first lens assembly 400 itself, and can have a smaller thickness, thereby shortening the distance between the first lens assembly 400 and the first signal processing chip 305.

[0218] In some embodiments, the TIA 3031 is disposed outside the first signal processing chip 305 and also outside the open cavity 400 b .

[0219] In some embodiments, the TIA 3031 is disposed between the first lens assembly 400 and the first signal processing chip 305 .

[0220] In some embodiments, the TIA 3031 is located below the first cover 910 . The first cover 910 is disposed on the surface of the TIA 3031 .

[0221] The top plate 911 can not only fix the first cover 910 on the surface of the first lens assembly 400 , but also cover and protect the TIA 3031 from above.

[0222] In some embodiments, the TIA 3031 is electrically connected to the first light receiving chip 303. The surface pads of the TIA 3031 are connected to the surface pads of the first light receiving chip 303 by wire bonding, so as to realize the electrical connection between the TIA 3031 and the first light receiving chip 303.

[0223] In some embodiments, the opening of the open cavity 400 b can avoid wire bonding between the TIA 3031 and the first light receiving chip 303 .

[0224] In some embodiments, the first signal processing chip 305 is electrically connected to the circuit board 300 through the bottom surface. The bottom surface of the first signal processing chip 305 is formed with solder bumps, which are electrically connected to the surface traces of the circuit board 300 to achieve electrical connection between the first signal processing chip 305 and the circuit board 300.

[0225] In some embodiments, the wiring on the surface of the circuit board 300 passes from one side of the baffle 913 through the other side of the baffle 913 and extends into the open cavity 400 b , and a solder pad is formed at the end of the wiring.

[0226] The first light emitting chip 304 is electrically connected to the pad at the end of the trace, thereby achieving electrical connection between the first signal processing chip 305 and the first light emitting chip 304 .

[0227] In some embodiments, there is a certain gap between the baffle 913 and the surface of the circuit board 300 to avoid the wiring on the surface of the circuit board 300.

[0228] In some embodiments, both sides of the top plate 911 are expanded outward and bent to form a bent portion 9111, and bosses 400a are formed on both side walls of the first lens assembly 400, respectively. The bent portions 9111 on both sides are respectively arranged on the bosses 400a on both sides, thereby fixing the first cover 910 on the side walls of the first lens assembly 400. It can be understood that the first cover 910 can also be fixed without forming the bosses 400a.

[0229] In some embodiments, a fifth heat sink 830 is disposed on the surface of the first signal processing chip 305 , and a sixth heat sink 840 is disposed on the surface of the second signal processing chip 306 .

[0230] In some embodiments, the fifth heat dissipation element 830 includes a bearing surface 831 and a supporting portion 832 located on the bottom surface of the bearing surface 931 .

[0231] The bearing surface 831 is provided on the surface of the first signal processing chip 305, and a heat-conducting medium, such as a heat-conducting gel, may be provided on the surface of the bearing surface 831. The heat-conducting gel is heat-conductingly connected to the heat dissipation boss on the upper housing 201, so that the heat generated by the first signal processing chip 305 is sequentially transferred to the upper housing 201 through the heat-conducting gel and the heat dissipation boss, and then the heat is transferred to the outside of the optical module through the upper housing 201.

[0232] The bottom end of the support portion 832 is connected to the circuit board 300 . The support portion 832 is used to prop up the carrying surface 831 to a certain height, so that the carrying surface 831 is covered above the first signal processing chip 305 .

[0233] In some embodiments, the bearing surface 831 is covered on the surface of the first signal processing chip 305, and the baffle 913 can form a barrier between the first lens assembly 400 and the first signal processing chip 305, thereby preventing the thermal conductive gel on the surface of the bearing surface 831 from overflowing into the open cavity 400b, thereby preventing the optical chip from being contaminated by the thermal conductive gel.

[0234] In some embodiments, the TIA 3031 is disposed outside the first lens assembly 400, and the TIA 3031 is shielded and protected by the first cover 910. This structure is not limited to the internal space of the first lens assembly 400, and is adapted to TIA 3031 of different sizes while keeping the structure of the first fixing assembly 400 fixed. For example, the size of the first cover 910 can be adjusted according to the size of the TIA.

[0235] In some embodiments, the TIA 3031 is disposed on a side of the first optical receiving chip 303 facing the first signal processing chip 305 , which can ensure that the TIA 3031 and the first optical receiving chip 303 are disposed in close proximity, thereby ensuring high-frequency signal transmission performance between the two.

[0236] In some embodiments, a backlight detector 307 is disposed on the surface of the first lens assembly 400 . The backlight detector 307 is disposed on the surface of the circuit board 300 .

[0237] In some embodiments, the backlight detector 307 is disposed on one side of the first light emitting chip 304 to monitor the light emitting power of the light emitting chip 304 .

[0238] In some embodiments, the first light emitting chip 304 is disposed between the backlight detector 307 and the first signal processing chip 305 .

[0239] It can be understood that the above embodiment takes the TIA as an example in which the TIA is external to the signal processing chip and the laser driving chip is built into the signal processing chip. Therefore, the technical solution disclosed in the above embodiment is also applicable to the embodiment in which the laser driving chip is external to the signal processing chip and the TIA is built into the signal processing chip.

[0240] In the above embodiment, TIA3031 is electrically connected to the first light receiving chip 303, and TIA3031 is arranged on one side of the first light receiving chip 303, which can ensure the high-frequency signal transmission performance between the two. The first signal processing chip 305 is electrically connected to the first light transmitting chip 304. The first lens assembly 400 is provided with a first cover 910, and the baffle of the first cover 910 stands between the first lens assembly 400 and the first signal processing chip 305, thereby preventing the thermal conductive gel from overflowing into the open cavity 400b, providing the necessary conditions for the first lens assembly 400, TIA, and the first signal processing chip 305 to be arranged in close proximity to each other, thereby ensuring that the first laser driving chip 304 covered under the first lens assembly 400 is arranged in close proximity to the laser driving chip built into the first signal processing chip 305, thereby ensuring the signal transmission performance between the two.

[0241] Fig. 22 Another layout structure diagram of an optical module provided according to some embodiments of the present disclosure is shown in FIG. Fig.23 FIG. 1 is a surface structure diagram of another layout circuit board of an optical module provided according to some embodiments of the present disclosure. Fig. 22 and Fig.23 As shown, in some embodiments, the signal processing chip and the lens assembly are respectively disposed on two surfaces of the circuit board 300 .

[0242] In some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are disposed on one surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are disposed on another surface of the circuit board 300, and the first lens assembly 400 covers the surfaces of the first light receiving chip 303 and the first light emitting chip 304. The second lens assembly 500 and the first lens assembly 400 are respectively disposed on another surface of the circuit board 300.

[0243] In some embodiments, the first signal processing chip 305 and the first lens assembly 400 are respectively located on different surfaces of the circuit board 300 , and the second signal processing chip 306 and the second lens assembly 500 are respectively located on different surfaces of the circuit board 300 .

[0244] In some embodiments, the circuit board 300 includes a first surface and a second surface. Exemplarily, the first signal processing chip 305 and the second signal processing chip 306 are disposed on the first surface of the circuit board 300, and the first lens assembly 400 and the second lens assembly 500 are disposed on the second surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are disposed on the second surface.

[0245] In some embodiments, the first surface of the circuit board 300 is the upper surface of the circuit board 300 , and the first signal processing chip 305 and the second signal processing chip 306 are disposed on the upper surface of the circuit board 300 to fully utilize the upper housing 201 to dissipate heat for the two signal processing chips.

[0246] In some embodiments, the second surface of the circuit board 300 is the lower surface of the circuit board 300 , and the first lens assembly 400 and the second lens assembly 500 are disposed on the lower surface of the circuit board 300 .

[0247] In some embodiments, the first signal processing chip 305 and the first lens assembly 400 are respectively arranged on different surfaces of the circuit board 300, and the second signal processing chip 306 and the second lens assembly 500 are respectively arranged on different surfaces of the circuit board 300, so that the first signal processing chip 305 and the first lens assembly are separated, and the second signal processing chip 306 and the second lens assembly 500 are separated, which effectively prevents the thermal conductive gel on the surface of the signal processing chip from overflowing to the corresponding lens assembly, thereby avoiding contamination of the photosensitive surfaces of the lens assembly, the light receiving chip and the light emitting chip.

[0248] In some embodiments, the first lens assembly 400 is disposed on the surface of the first light receiving chip 303 and the first light emitting chip 304 to change the transmission direction of the optical signal to be transmitted to the first light receiving chip 303 and to change the transmission direction of the optical emission signal generated by the first light emitting chip 304 to achieve optical signal reception and emission. The second lens assembly 500 adopts the same configuration.

[0249] The first lens assembly 400 covers the surfaces of the first light receiving chip 303 and the first light emitting chip 304 to change the transmission direction of the optical signal to be transmitted to the first light receiving chip 303 and the transmission direction of the optical emission signal generated by the first light emitting chip 304 .

[0250] In some embodiments, the first signal processing chip 305 integrates a TIA and a laser driver chip, and the second signal processing chip 306 integrates a TIA and a laser driver chip.

[0251] In some embodiments, since the first signal processing chip 305 is integrated with a TIA and a laser driver chip, the first lens assembly 400 and the first signal processing chip 305 are arranged in correspondence with each other in the thickness direction of the circuit board 300, so as to ensure that the optical receiving chip and the TIA integrated in the first signal processing chip 305 are arranged in close proximity up and down, and the first optical transmitting chip and the laser driver chip integrated in the first signal processing chip 305 are arranged in close proximity up and down, thereby ensuring signal integrity and improving high-frequency signal transmission performance. The same is true between the second signal processing chip 306 and the second lens assembly 500.

[0252] In some embodiments, the first signal processing chip 305 and the first lens assembly 400 are disposed opposite to each other vertically, so that the first light receiving chip and the first light emitting chip covered by the first lens assembly 400 are disposed close to the first signal processing chip 305 vertically.

[0253] In some embodiments, the second signal processing chip 306 and the second lens assembly 500 are disposed opposite to each other vertically, so that the first light receiving chip and the first light emitting chip covered by the second lens assembly 500 are disposed close to the second signal processing chip 306 vertically.

[0254] In some embodiments, a first heat dissipation boss 2012 and a second heat dissipation boss 2013 are formed on the bottom surface of the upper housing 201. The first heat dissipation boss 2012 is thermally connected to the first signal processing chip 305, and the heat generated by the first signal processing chip 305 is transferred to the upper housing 201 through the first heat dissipation boss 2012, and then the heat is transferred to the outside through the upper housing 201. The second heat dissipation boss 2013 is thermally connected to the second signal processing chip 306, and the heat generated by the second signal processing chip 306 is transferred to the outside through the second heat dissipation boss 2013.

[0255] In some embodiments, the first signal processing chip 305 is integrated with a TIA or a laser driver chip, and the second signal processing chip 306 is integrated with a TIA or a laser driver chip. In this case, the first signal processing chip 305 and the second signal processing chip 306 can also be arranged on the upper surface of the circuit board 300; the first lens assembly 400 and the second lens assembly 500 can also be arranged on the lower surface of the circuit board 300.

[0256] In some embodiments, the first signal processing chip integrates a laser driving chip and an external TIA.

[0257] In some embodiments, the TIA may be disposed outside the first lens assembly 400 as in the above embodiments, and the TIA and the first lens assembly 400 are disposed together on the lower surface of the circuit board 300 .

[0258] In some embodiments, the TIA may be disposed in an open cavity 400 b enclosed by the first lens assembly 400 and the circuit board 300 as in the above embodiment, and the TIA and the first lens assembly 400 are disposed together on the lower surface of the circuit board 300 .

[0259] Fig.24 The structure diagram of a circuit board surface provided with a first signal processing chip and a second signal processing chip according to some embodiments of the present disclosure is shown. Fig.24 As shown, in some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are disposed on the same surface of the circuit board 300 .

[0260] In some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are respectively disposed on the upper surface of the circuit board 300 to fully utilize the better heat dissipation of the upper housing 201 .

[0261] In some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are staggered on the upper surface of the circuit board 300 to disperse the heat generated by the two signal processing chips to different areas of the circuit board 300 .

[0262] Fig.25 The following is a structural diagram of a circuit board surface provided with a first lens assembly and a second lens assembly according to some embodiments of the present disclosure. Fig.25 As shown, in some embodiments, the first lens assembly 400 and the second lens assembly 500 are disposed on the same surface of the circuit board 300 .

[0263] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are disposed on the lower surface of the circuit board 300 .

[0264] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are staggered and disposed on the lower surface of the circuit board 300 .

[0265] In some embodiments, the space between the lower surface of the circuit board 300 and the lower shell 202 is smaller than the space between the upper surface of the circuit board 300 and the upper shell 201, and the first lens assembly 400 and the second lens assembly 500 are thinned to adapt to the space between the lower surface of the circuit board 300 and the lower shell 202.

[0266] In some embodiments, the end surface of the first lens assembly 400 is butted against the end surface of the first optical fiber bracket 710 to reduce the thickness of the first lens assembly 400 and fit into the space between the lower surface of the circuit board 300 and the lower housing 202 .

[0267] In some embodiments, the first light receiving chip 303 is disposed on the lower surface of the circuit board 300 and is covered by the first lens assembly 400 .

[0268] In some embodiments, the first light emitting chip 304 is disposed on the lower surface of the circuit board 300 and is covered by the first lens assembly 400 .

[0269] In some embodiments, the external optical signal is coupled to the optical surface of the first lens assembly 400 via the optical fiber array connected to the first optical fiber bracket 710 , and is coupled to the first optical receiving chip 303 via the first lens assembly 400 .

[0270] In some embodiments, the light emitting signal generated by the first light emitting chip 304 is coupled to the optical fiber array connected to the first optical fiber bracket 710 via the first lens assembly 400, so that the light emitting signal is output along the optical fiber array.

[0271] In some embodiments, a first optical path turning surface 401 is formed on the surface of the first lens assembly 400, and an optical path turning surface 501 is formed on the surface of the second lens assembly 500. The first optical path turning surface 401 and the optical path turning surface 501 have the same structure and function.

[0272] In some embodiments, the optical path turning of the first optical receiving chip 303 and the first optical emitting chip 304 is achieved through the first optical path turning surface 401 .

[0273] In some embodiments, the first light path turning surface 401 is an inclined surface and has a reflective effect.

[0274] In some embodiments, the external optical signal is coupled to the first optical path turning surface 401 of the first lens assembly 400 via the optical fiber array connected to the first optical fiber bracket 710, and the optical signal transmission direction is changed by reflection from the first optical path turning surface 401, and then coupled to the first optical receiving chip 303 to realize optical signal reception.

[0275] In some embodiments, the light emission signal generated by the first light emission chip 304 is reflected by the first lens assembly 400 through the first optical path turning surface 401, changing the transmission direction of the light emission signal, and then coupling the light emission signal to the optical fiber array connected to the first optical fiber bracket 710, and outputting the light emission signal to the outside of the optical module to achieve light signal emission.

[0276] Fig.26 A schematic diagram of an optical module optical path according to some embodiments of the present disclosure Figure 1 , Fig. 27 A schematic diagram of an optical module optical path according to some embodiments of the present disclosure Figure 2 .like Fig.26 and Fig. 27 As shown, in some embodiments, the first signal processing chip 305 and the first lens assembly 400 are respectively located on different surfaces of the circuit board 300 .

[0277] In some embodiments, the first optical fiber support 710 is docked with the first lens assembly 400 to thin the first lens assembly 400 .

[0278] In some embodiments, the first lens assembly 400 is disposed toward the lower surface of the circuit board 300 .

[0279] In some embodiments, the first lens assembly 400 and the lower surface of the circuit board 300 form an open cavity 400 b.

[0280] In certain embodiments, the first light receiving chip 303 is disposed on the lower surface of the circuit board 300 and is covered from below by the first lens assembly 400 .

[0281] In some embodiments, the first light emitting chip 304 is disposed on the lower surface of the circuit board 300 and is covered from below by the first lens assembly 400 .

[0282] In some embodiments, a first optical path turning surface 401 is formed on the surface of the first lens assembly 400. Exemplarily, the first optical path turning surface 401 is exposed to the outside.

[0283] In some embodiments, the first light path turning surface 401 is tilted relative to the surface of the circuit board 300 and has a reflective effect, thereby playing a role in light path turning.

[0284] In some embodiments, the first optical path turning surface 401 is located at the intersection of the optical path of the first optical fiber holder 710 and the optical path of the first optical receiving chip 303. This position is also the intersection of the optical path of the first optical fiber holder 710 and the optical path of the first optical emitting chip 304.

[0285] In some embodiments, the external optical signal reaches the first optical path turning surface 401 along the optical fiber array connected to the first optical fiber bracket 710, and is reflected by the first optical path turning surface 401 so that the external optical signal is coupled to the first optical receiving chip 303 to achieve optical signal reception.

[0286] In some embodiments, the optical emission signal generated by the first optical emission chip 304 reaches the first optical path turning surface 401, and is reflected by the first optical path turning surface 401 so that the optical emission signal is coupled to the optical fiber array connected to the first optical fiber bracket 710, and output to the outside of the optical module to realize optical signal emission.

[0287] In some embodiments, the first signal processing chip 305 is electrically connected to the first light receiving chip 303. The TIA is built in the first signal processing chip 305.

[0288] In some embodiments, the first signal processing chip 305 is disposed on the upper surface of the circuit board 300 by flip-chip bonding, and the first light receiving chip 303 is also disposed on the lower surface of the circuit board 300 by flip-chip bonding. The first signal processing chip 305 and the first light receiving chip 303 are electrically connected by drilling holes along the upper and lower surfaces of the circuit board 300.

[0289] Exemplarily, the solder bumps on the bottom surface of the first signal processing chip 305 are connected downward to the upper surface of the circuit board 300, and the solder bumps on the bottom surface of the first light receiving chip 303 are connected upward to the lower surface of the circuit board 300. The solder bumps of the first signal processing chip 305 for electrically connecting to the light receiving chip 303 and the solder bumps of the first light receiving chip 303 for electrically connecting to the first signal processing chip 305 are electrically connected by vias.

[0290] Exemplarily, the solder bumps of the first signal processing chip 305 electrically connected to the first optical receiving chip 303 are aligned vertically with the solder bumps of the first optical receiving chip 303 electrically connected to the first signal processing chip 305 to shorten the via height and improve high-frequency signal transmission performance.

[0291] In some embodiments, the first signal processing chip 305 is disposed on the upper surface of the circuit board 300 by flip-chip bonding, and a via is punched along the solder bump of the first signal processing chip 305 toward the lower surface of the circuit board 300 to achieve electrical connection between the first signal processing chip 305 and the lower surface of the circuit board 300. The first light receiving chip 303 is electrically connected to the lower surface of the circuit board 300 by wire bonding. Thus, the first signal processing chip 305 is electrically connected to the first light receiving chip 303.

[0292] In some embodiments, the first signal processing chip 305 can be sunk toward the lower surface of the circuit board 300, or the first light receiving chip 303 can be moved up toward the upper surface of the circuit board 300 to shorten the electrical connection distance between the first signal processing chip 305 and the first light receiving chip 303 and improve high-frequency signal transmission performance.

[0293] In some embodiments, the first light emitting chip 304 is electrically connected to the first signal processing chip 305. The laser driving chip is built into the first signal processing chip 305. The electrical connection method between the first light emitting chip 304 and the first signal processing chip 305 can refer to the electrical connection method between the first light receiving chip and the first signal processing chip 305 described above.

[0294] Fig.28 A circuit board surface structure provided according to some embodiments of the present disclosure Figure 1 .like Fig.28 As shown, in some embodiments, a first signal processing chip 305 and a second signal processing chip 306 are disposed on the surface of the circuit board 300 .

[0295] In some embodiments, the first signal processing chip 305 is electrically connected to the first light receiving chip 303 and the first light emitting chip 304 . The TIA and the laser driving chip are built in the first signal processing chip 305 .

[0296] In some embodiments, one side of the first signal processing chip 305 faces both the first light receiving chip 303 and the first light emitting chip 304. Exemplarily, the first light receiving chip 303 and the first light emitting chip 304 are disposed on the same side of the first signal processing chip 305.

[0297] In some embodiments, the first optical receiving chip 303 and the first signal processing chip 305 are arranged in close proximity, so that the first optical receiving chip 303 and the TIA in the first signal processing chip 305 are arranged in close proximity to ensure high-frequency signal transmission performance between the first optical receiving chip 303 and the first signal processing chip 305 .

[0298] In some embodiments, the first light emitting chip 304 and the first signal processing chip 305 are arranged in close proximity, so that the first light emitting chip 304 and the TIA in the first signal processing chip 305 are arranged in close proximity to ensure high-frequency signal transmission performance between the first light emitting chip 304 and the first signal processing chip 305 .

[0299] In some embodiments, the first light receiving chip 303 is electrically connected to the first signal processing chip 305. Exemplarily, the surface pads of the first light receiving chip 303 are wire-bonded to the surface pads of the circuit board 300, and the solder bumps on the bottom surface of the first signal processing chip 305 are electrically connected to the surface pads of the circuit board 300 through the surface traces of the circuit board 300, thereby realizing the electrical connection between the first light receiving chip 303 and the first signal processing chip 305.

[0300] In some embodiments, the first light emitting chip 304 is electrically connected to the first signal processing chip 305. Exemplarily, the surface pads of the first light emitting chip 304 are wire-bonded to the surface pads of the circuit board 300, and the solder bumps on the bottom surface of the first signal processing chip 305 are electrically connected to the surface pads of the circuit board 300 through the surface traces of the circuit board 300, thereby realizing the electrical connection between the first light emitting chip 304 and the first signal processing chip 305.

[0301] In some embodiments, a backlight detector 307 is disposed on one side of the first light emitting chip 304 to monitor the output optical power of the first light emitting chip 304. Exemplarily, the first light emitting chip 304 is disposed between the backlight detector 307 and the first signal processing chip 305.

[0302] In some embodiments, a heating element 308 is disposed on one side of the first light emitting chip 304 to enable the first light emitting chip 304 to operate within a certain range and to prevent high frequency performance of the first light emitting chip 304 from deteriorating when the first light emitting chip 304 is at a low temperature.

[0303] In some embodiments, the heating element 308 is directed toward both the first light emitting chip 304 and the backlight detector 307 .

[0304] In some embodiments, a local copper metallization process is performed below the first light emitting chip 304 and the heating element 308, so that the two are located on the same copper-plated area. The heat generated by the heating element 308 is transferred to the first light emitting chip 304 through the copper-plated area, thereby increasing the heat transfer efficiency between the heating element 308 and the first light emitting chip 304.

[0305] In some embodiments, the copper-plated area is limited to below the first light emitting chip 304 and the heating element 308 to prevent the heat generated by the heating element 308 from being transferred to other areas, thereby reducing power loss and increasing the temperature regulation efficiency of the first light emitting chip 304 .

[0306] In some embodiments, the surface of the first signal processing chip 305 may be covered with the first heat sink 810 mentioned in the above embodiment, and the first heat sink 810 includes a first blocking surface 812. The specific structure and function of the first heat sink 810 may refer to the above embodiment.

[0307] In some embodiments, the first light receiving chip 303 , the first light emitting chip 304 , the backlight detector 307 , and the heating element 308 are disposed on the surface of the circuit board 300 and are covered by the first lens assembly 400 .

[0308] In some embodiments, the first blocking surface 812 is located on one side of the first lens assembly 400. The first blocking surface 812 can form a certain barrier between the first signal processing chip 305 and the first lens assembly 400 to prevent the thermal conductive gel on the surface of the first bearing surface 811 from overflowing into the open cavity 400b, thereby preventing the optical chip from being contaminated by the thermal conductive gel.

[0309] Fig.29 A circuit board surface structure provided according to some embodiments of the present disclosure Figure 2 .like Fig.29 As shown, in some embodiments, a first signal processing chip 305 and a second signal processing chip 306 are disposed on the surface of the circuit board 300. The first signal processing chip 305 and the second signal processing chip 306 are configured in the same manner, and the first signal processing chip 305 is taken as an example for exemplary description.

[0310] In some embodiments, the first signal processing chip 305 has a built-in laser driving chip and an external TIA 3031 .

[0311] In some embodiments, the TIA 3031 is disposed on a side of the first light receiving chip 303 away from the first signal processing chip 305. Exemplarily, the first light receiving chip 303 is disposed between the TIA 3031 and the first signal processing chip 305.

[0312] In some embodiments, the first light emitting chip 304 and the first light receiving chip 303 are disposed on the same side of the first signal processing chip 305 .

[0313] In some embodiments, a backlight detector 307 is disposed on one side of the first light emitting chip 304, and a heating element 308 is disposed on one side of the first light emitting chip 304 and the backlight detector 307. The relative relationship between the first light emitting chip 304, the backlight detector 307, and the heating element 308 is as follows: Fig.28 As shown, no further details are given.

[0314] In some embodiments, the first light receiving chip 303 , the TIA 3031 , the first light emitting chip 304 , the backlight detector 307 , and the heating element 308 are disposed on the surface of the circuit board 300 and are covered by the first lens assembly 400 .

[0315] In some embodiments, according to the Fig.30 The relative position relationship between the surface pad of the first light receiving chip 303 and the surface pad of the TIA3031 is rotated 180° counterclockwise to obtain the attached Fig.29 The relative position relationship between the surface pads of the first light receiving chip 303 and the surface pads of the TIA3031.

[0316] In some embodiments, the surface of the first signal processing chip 305 may be covered with a first heat sink 810 to prevent the thermal conductive gel on the surface of the first heat sink 810 from overflowing into the open cavity 400 b and contaminating the optical chip.

[0317] In some embodiments, a third heat sink 850 may be disposed on the surface of the first signal processing chip 305 to prevent the thermal conductive gel on the surface of the third heat sink 850 from overflowing into the open cavity 400 b and contaminating the optical chip.

[0318] In some embodiments, the TIA is placed in the open cavity 400b formed by the first lens assembly 400 and the surface of the circuit board 300, which is limited by the size of the open cavity 400b. Different types of TIAs 3031 have different sizes. In order to ensure that the structure and size of the first lens assembly 400 are fixed, placing the TIA in the open cavity 400b formed by the first lens assembly 400 and the surface of the circuit board 300 is more suitable for TIAs with smaller sizes.

[0319] Fig.29 The structure shown is applicable to an embodiment in which a laser driver chip is built into a signal processing chip, and the TIA is built into an open cavity 400b surrounded by the first lens assembly 400 and the circuit board surface. In some embodiments, a solder pad 3033 is provided on the surface of the TIA3031 on one side adjacent to the first light receiving chip 303, and a solder pad 3032 is provided on the surface of the first light receiving chip 303 on one side adjacent to the TIA3031. The solder pad 3033 is arranged adjacent to the solder pad 3032 and is electrically connected to achieve electrical connection between the TIA3031 and the first light receiving chip 303.

[0320] Fig.30 A circuit board surface structure provided according to some embodiments of the present disclosure Figure 3 .like Fig.30 As shown, in some embodiments, a first signal processing chip 305 and a second signal processing chip 306 are disposed on the surface of the circuit board 300. The first signal processing chip 305 and the second signal processing chip 306 are configured in the same manner, and the first signal processing chip 305 is taken as an example for exemplary description.

[0321] In some embodiments, the first signal processing chip 305 is electrically connected to the first light emitting chip 304. The laser driving chip is disposed in the first signal processing chip 305.

[0322] In some embodiments, the TIA 3031 is disposed on a side of the first light receiving chip 303 facing the first signal processing chip 305. Exemplarily, the TIA 3031 is disposed between the first light receiving chip 303 and the first signal processing chip 305.

[0323] In some embodiments, the first light emitting chip 304 and the first light receiving chip 303 are disposed on the same side of the first signal processing chip 305 .

[0324] In some embodiments, the first light emitting chip 304 is electrically connected to the first signal processing chip 305. The first signal processing chip 305 is electrically connected to the surface traces of the circuit board 300 through the bottom surface. The surface traces of the circuit board 300 extend into the open cavity 400b and form pads at the ends. The surface pads of the first light emitting chip 304 are electrically connected to the pads at the ends of the traces, thereby realizing the electrical connection between the first light emitting chip 304 and the first signal processing chip 305.

[0325] In some embodiments, the first light receiving chip 303 is electrically connected to the TIA 3031. Exemplarily, the surface pads of the first light receiving chip 303 and the surface pads of the TIA 3031 are electrically connected by wire bonding.

[0326] In some embodiments, the pads on the surface of TIA3031 close to the first light receiving chip 303 are used for wire bonding connection with the first light receiving chip 303. The pads on the surface of the first light receiving chip 303 are set close to TIA3031 to shorten the wire bonding distance between the first light receiving chip 303 and TIA3031.

[0327] In some embodiments, a backlight detector 307 is disposed on one side of the first light emitting chip 304, and a heating element 308 is disposed on one side of the first light emitting chip 304 and the backlight detector 307. The relative relationship between the first light emitting chip 304, the backlight detector 307, and the heating element 308 is as follows: Fig.28 As shown, no further details are given.

[0328] In some embodiments, the surface of TIA3031 is covered with the first cover 910 mentioned in the above embodiments to protect TIA3031. The top surface of the first cover 910 is placed on the surface of the first lens assembly 400 to protect TIA3031 outside the first lens assembly 400.

[0329] In some embodiments, the first light receiving chip 303, the first light emitting chip 304, the backlight detector 307, and the heating element 308 are disposed on the surface of the circuit board 300 and are covered by the first lens assembly 400. The TIA 3031 is disposed outside the first lens assembly 400.

[0330] In some embodiments, the surface of the first signal processing chip 305 is covered with the fifth heat sink 830 mentioned in the above embodiment. The fifth heat sink 830 includes a bearing surface 831, and the specific structure of the fifth heat sink 830 is not repeated.

[0331] The bearing surface 831 is arranged on the surface of the first signal processing chip 305. The surface of the bearing surface 831 may be provided with a thermally conductive gel, which is thermally connected to the heat dissipation boss on the upper shell 201, so that the heat generated by the first signal processing chip 305 is transferred to the upper shell 201 via the thermally conductive gel and the heat dissipation boss in sequence, and the heat is conducted to the outside of the optical module via the upper shell 201.

[0332] In some embodiments, the TIA 3031 is disposed outside the first lens assembly 400, and the TIA 3031 is shielded and protected by the first cover 910. This structure is not limited to the internal space of the first lens assembly 400, and is adapted to TIA 3031 of different sizes while keeping the structure of the first fixing assembly 400 fixed. For example, the size of the first cover 910 can be adjusted according to the size of the TIA.

[0333] Fig.30 The structure shown is applicable to an embodiment in which a laser driving chip is built into a signal processing chip, the TIA is placed outside the first lens assembly 400, and the TIA is placed between the first lens assembly 400 and the first signal processing chip 305. In some embodiments, a pad 3033 is provided on the surface of the side of the TIA3031 adjacent to the first light receiving chip 303, and a pad 3032 is provided on the surface of the side of the first light receiving chip 303 adjacent to the TIA3031. The pad 3033 is arranged adjacent to the pad 3032 and is electrically connected to achieve electrical connection between the TIA3031 and the first light receiving chip 303.

[0334] Will Fig.30 The TIA3031 and the first light receiving chip 303 are rotated 180° counterclockwise to obtain Fig.29 The positional relationship between the TIA3031 and the first light receiving chip 303.

[0335] Fig.31 A schematic diagram of a circuit board surface layout provided according to some embodiments of the present disclosure Figure 1 , Fig.32 A schematic diagram of a circuit board surface layout provided according to some embodiments of the present disclosure Figure 2 .like Fig.31 and Fig.32 As shown, in some embodiments, the first lens assembly 400 and the first signal processing chip 305 are disposed close to each other on the same surface of the circuit board 300. Fig.31 And attached Fig.32The structure shown can be adapted to a solution in which the first signal processing chip 305 has a built-in TIA and a laser driving chip.

[0336] In some embodiments, an open cavity 400b is formed between the bottom of the first lens assembly 400 and the surface of the circuit board 300 to shorten the distance between the first lens assembly 400 and the first signal processing chip 305. The open cavity 400b is open toward the first signal processing chip 305. However, the existence of the open cavity 400b causes the bottom of the first lens assembly 400 to be open to the first signal processing chip 305, and the thermal conductive gel on the surface of the first signal processing chip 305 will overflow into the open cavity 400b, causing contamination to the first light emitting chip 304 and the first light receiving chip 303 in the open cavity 400b.

[0337] In some embodiments, a first heat sink 810 is disposed on the surface of the first signal processing chip 305 . A first bearing surface 811 of the first heat sink 810 carries a thermally conductive gel to conduct heat generated by the first signal processing chip 305 to the upper housing 201 .

[0338] In some embodiments, the first blocking surface 812 in the first heat sink 810 is located on one side of the first lens assembly 400. The first blocking surface 812 stands between the first lens assembly 400 and the first bearing surface 811, so as to form a certain barrier between the first signal processing chip 305 and the first lens assembly 400, so as to prevent the thermal conductive gel on the surface of the first bearing surface 811 from overflowing into the open cavity 400b, thereby preventing the thermal conductive gel from contaminating the first light receiving chip 303 and the first light emitting chip 304 in the open cavity 400b.

[0339] In some embodiments, one end of the first heat sink 810 away from the first lens assembly 400 extends beyond the end surface of the first signal processing chip 305, thereby providing sufficient space for the thermal conductive gel on the surface to prevent the thermal conductive gel from overflowing along the end surface of the first signal processing chip to the surface of the circuit board 300.

[0340] In some embodiments, the first bearing surface 811 includes an expansion portion 8111 and a contraction portion 8112. The expansion portion 8111 is disposed close to the first lens assembly 400, and the contraction portion 8112 is connected to the expansion portion 8111.

[0341] Since the width of the first lens assembly 400 is greater than the width of the first signal processing chip 305, the width of the expansion portion 8111 is greater than the width of the contraction portion 8112, so that the end face of the first lens assembly 400 can be enclosed in a larger range, thereby protecting the end face of the first lens assembly 400 in a larger range.

[0342] In some embodiments, the first lens assembly 400 is formed with a first refractive surface 410 from the side, and the first refractive surface 410 is located above the first light receiving chip 303.

[0343] In some embodiments, the first refractive surface 410 is inclined relative to the surface of the circuit board 300 .

[0344] In some embodiments, the first lens assembly 400 is connected to the first optical fiber holder 710 .

[0345] In some embodiments, the first light receiving chip 303 is disposed below the first refractive surface 410. The first refractive surface 410 faces downward toward the first light receiving chip 303.

[0346] In some embodiments, the incident light path of the first refractive surface 410 is toward the first optical fiber holder 710 , and the outgoing light path is toward the first light receiving chip 303 .

[0347] In some embodiments, the external light signal is transmitted along the first optical fiber bracket 710 to the first refractive surface 410, and the first refractive surface 410 reflects the external light signal toward the first light receiving chip 303, thereby turning the external light signal to the surface of the first light receiving chip 303. The first light receiving chip 303 converts the received light signal into an electrical signal to complete the reception of the light signal.

[0348] In some embodiments, the first lens assembly 400 is formed from the side with: a second refractive surface 420, a third refractive surface 430 bent and connected to the second refractive surface 420, and a fourth refractive surface 440 bent and connected to the third refractive surface 430. The second refractive surface 420 is located above the first light emitting chip 304, the third refractive surface 430 is located above the second refractive surface 420, and the fourth refractive surface 440 is located above the third refractive surface 430.

[0349] In some embodiments, the third refractive surface 430 connects one end of the second refractive surface 420 and one end of the fourth refractive surface 440 .

[0350] In some embodiments, the second refractive surface 420 , the third refractive surface 430 , and the fourth refractive surface 440 are respectively inclined relative to the surface of the circuit board 300 .

[0351] In some embodiments, the second refractive surface 420 and the third refractive surface 430 have different inclination directions, and the second refractive surface 420 and the third refractive surface 430 form a bending area shaped like a less-than sign.

[0352] In some embodiments, the third refractive surface 430 and the fourth refractive surface 440 have different inclination directions, the second refractive surface 420 and the fourth refractive surface 440 have the same inclination directions, and the third refractive surface 430 and the fourth refractive surface 440 form a bending area in the form of a greater than sign.

[0353] In some embodiments, the optical signal emitted by the first optical emission chip 304 is transmitted upward to the second refractive surface 420 in a direction perpendicular to the circuit board 300. A portion of the optical signal is reflected by the second refractive surface 420 to the backlight detector 307 to achieve light splitting, thereby monitoring the optical power emitted by the first optical emission chip 304; another portion of the optical signal is refracted upward from the surface of the second refractive surface 420 to the third refractive surface 430, and refracted upward from the third refractive surface 430 to the fourth refractive surface 440, and the fourth refractive surface 440 is oriented toward the first optical fiber bracket 710, so the optical signal reaching the fourth refractive surface 440 is reflected by the fourth refractive surface 440 into the first optical fiber bracket 710, so that the optical signal generated by the first optical emission chip 304 is transmitted to the outside of the optical module through the first optical fiber bracket 710, completing the emission of the optical signal.

[0354] In some embodiments, the first refractive surface 410, the second refractive surface 420, the third refractive surface 430, and the fourth refractive surface 440 are respectively located on the side of the first lens assembly 400. Exemplarily, these refractive surfaces are respectively formed by digging inward from the side of the first lens assembly 400. These refractive surfaces are all hidden in the first lens assembly 400, thereby preventing these refractive surfaces from being dirty.

[0355] In some embodiments, the top surface 450 of the first lens assembly 400 extends out to shield the first refractive surface 410 and the fourth refractive surface 440 from above to prevent these refractive surfaces from being dirty.

[0356] In some embodiments, the first blocking surface 812 stands on the side of the refractive surfaces of the first lens assembly 400, so as to prevent the thermal conductive gel from overflowing to the refractive surfaces, thereby ensuring the cleanliness of the refractive surfaces.

[0357] Fig.33 A lens assembly structure provided according to some embodiments of the present disclosure Figure 1 .like Fig.33 As shown, in some embodiments, a top surface 450 is formed above the first lens assembly 400 .

[0358] In some embodiments, the first lens assembly 400 is formed with a first refractive surface 410 above the first light receiving chip 303 to reflect the optical signal onto the first light receiving chip 303 .

[0359] In some embodiments, the first lens assembly 400 sequentially forms a second refractive surface 420, a third refractive surface 430, and a fourth refractive surface 440 above the first light emitting chip 304, so as to gradually transmit the optical signal generated by the first light emitting chip 304 to the fourth refractive surface 440, so as to transmit the optical signal to the first optical fiber bracket 710 through reflection by the fourth refractive surface 440, and then transmit it to the outside.

[0360] In some embodiments, the top surface 450 covers the first refractive surface 410 and the fourth refractive surface 440 from above to cover and shield the first refractive surface 410 and the fourth refractive surface 440 from above, respectively, to prevent other objects from touching the first refractive surface 410 and the fourth refractive surface 440, thereby preventing their surfaces from being contaminated and protecting the optical surface.

[0361] In some embodiments, a first groove 460 and a second groove 470 are respectively formed on two sides of the bottom surface of the first lens assembly 400. The first groove 460 and the second groove 470 are recessed upward.

[0362] In some embodiments, the bottom surface of the first lens assembly 400 is fixedly connected to the surface of the circuit board 300 , and the bottom surface of the first lens assembly 400 is covered with a first light emitting chip 304 , a first light receiving chip 303 , etc.

[0363] In some embodiments, a viscous medium is bidirectionally filled along the edges of both sides of the bottom surface of the first lens assembly 400 to fix the first lens assembly 400 to the surface of the circuit board 300. The gap between the first lens assembly 400 and the circuit board 300 has a capillary siphon effect, and the filled viscous medium is sucked in and flows toward the center. The first groove 460 and the second groove 470 are arranged to prevent the viscous filler from continuing to flow toward the center to the surfaces of the first light emitting chip 304, the first light receiving chip 303, etc., thereby causing certain pollution to the first light emitting chip 304, the first light receiving chip 303, etc., and affecting the pasting and fixing effect of the first lens assembly 400. Exemplarily, the viscous medium is glue.

[0364] In some embodiments, the edges of both sides of the bottom surface of the first lens assembly 400 are bidirectionally filled with viscous medium, and the viscous medium on both sides is sucked into the first groove 460 and the second groove 470 to avoid continuing to flow toward the center of the first lens assembly 400.

[0365] The arrangement of the first groove 460 and the second groove 470 can form a height difference between the bottom surfaces of the two side edges of the first lens assembly 400 and the surfaces of the first groove 460 and the second groove 470, respectively, to reduce the capillary siphon phenomenon of the viscous medium, so that the first groove 460 and the second groove 470 play a role of glue isolation.

[0366] Fig.34 FIG. 1 is a structural diagram of a first heat sink provided according to some embodiments of the present disclosure. Fig.34 As shown, in some embodiments, the first heat dissipation element 810 includes a first bearing surface 811 , a first blocking surface 812 located on one side of the first bearing surface 811 , and a first supporting portion 813 located below the first bearing surface 811 .

[0367] In some embodiments, the first supporting portions 813 are distributed on two sides below the first blocking surface 812 and on two sides below the first supporting surface 811 .

[0368] In some embodiments, there is an avoidance gap 814 between the first blocking surface 812 and the surface of the circuit board 300 to avoid the wiring between the first light receiving chip 303 and the first light transmitting chip 304 covered under the first lens assembly 400 and the first signal processing chip 305 .

[0369] Fig.35 A schematic diagram of a circuit board surface layout provided in some embodiments of the present disclosure Figure 3 , Fig.36 A schematic diagram of a circuit board surface layout provided according to some embodiments of the present disclosure Figure 4 .like Fig.35 and Fig.36 As shown, in some embodiments, the first lens assembly 400 and the first signal processing chip 305 are located on the same surface of the circuit board 300. Fig.35 and Fig.36 The provided structure is suitable for the first signal processing chip 305 to have a built-in laser driving chip and an external TIA. Alternatively, the first signal processing chip 305 to have a built-in TIA and an external laser driving chip.

[0370] In some embodiments, an open cavity 400 b is formed between the bottom of the first lens assembly 400 and the surface of the circuit board 300 .

[0371] In some embodiments, TIA3031 is disposed in an open cavity 400b surrounded by the first lens assembly 400 and the surface of the circuit board 300. The first light receiving chip 303 and TIA3031 are disposed in the open cavity 400b. The first light receiving chip 303 and TIA3031 are disposed on the surface of the circuit board 300 and are covered by the first lens assembly 400.

[0372] In some embodiments, a third heat sink 850 is disposed on the surface of the first signal processing chip 305. The third heat sink 850 can seal the open cavity 400b, thereby preventing the thermal conductive gel from overflowing into the open cavity 400b.

[0373] In some embodiments, the first light receiving chip 303 is located between the TIA 3031 and the first signal processing chip 305 .

[0374] In some embodiments, the TIA 3031 is disposed in an open cavity 400 b enclosed by the first lens assembly 400 and the surface of the circuit board 300 , so as to shorten the distance between the first lens assembly 400 and the first signal processing chip 305 and bring them closer together.

[0375] Fig.37 FIG. 1 is a structural diagram of a third heat sink provided according to some embodiments of the present disclosure. Fig.37 As shown, in some embodiments, the third heat dissipation element 850 includes a third bearing surface 851 , a second blocking surface 82 located above one side of the third bearing surface 851 , and a third supporting portion 835 located below the third bearing surface 851 .

[0376] In some embodiments, a thermally conductive gel may be disposed on the surface of the third carrying surface 851 to transfer the heat generated by the first signal processing chip 305 to the upper housing 201 .

[0377] In some embodiments, the third blocking surface 852 stands on one end of the third supporting surface 851 close to the first lens assembly 400, which can prevent the thermal conductive gel on the surface of the third supporting surface 851 from overflowing into the open cavity 400b, while avoiding the wiring between the first light emitting chip 304 and the first signal processing chip 305.

[0378] In some embodiments, the third support portion 853 is disposed at the bottom of the third supporting surface 851 to prop up the third supporting surface 851 above the first signal processing chip 305. The length of the third support portion 853 is longer than that of the first support portion 813.

[0379] Fig.38 A schematic diagram of a circuit board surface layout provided according to some embodiments of the present disclosure Figure 5 , Fig.39 A schematic diagram of a circuit board surface layout provided according to some embodiments of the present disclosure Figure 6 .like Fig.38 and Fig.39 As shown, in some embodiments, the first lens assembly 400 and the first signal processing chip 305 are located on the same surface of the circuit board 300. Fig.38 and Fig.39 The structure shown is suitable for the first signal processing chip 305 having a built-in laser driving chip and an external TIA 3031. Alternatively, the first signal processing chip 305 has a built-in TIA 3031 and an external laser driving chip.

[0380] In some embodiments, the TIA 3031 is disposed outside the first lens assembly 400 . The TIA 3031 is disposed between the first lens assembly 400 and the first signal processing chip 305 .

[0381] In some embodiments, the surface of TIA3031 is covered with a first cover 910 . The first cover 910 is placed on the top surface of the first lens assembly 400 to protect TIA3031 .

[0382] Fig.40 FIG. 1 is a bottom structure diagram of a first lens assembly provided according to some embodiments of the present disclosure. Fig.40 As shown, in some embodiments, the first lens assembly 400 is connected to the first optical fiber support 710 .

[0383] In some embodiments, the first optical fiber bracket 710 is contracted at one end toward the first lens assembly 400, and the contraction area does not completely enter the first lens assembly 400, so that a margin is left between the first optical fiber bracket 710 and the first lens assembly 400 to avoid mutual interference between the two due to processing errors, thereby ensuring that the two are tightly engaged with each other.

[0384] In some embodiments, one end of the first lens assembly 400 is covered with a first light receiving chip 303 , and the other end is covered with a first light emitting chip 304 , a backlight detector 307 and a heating element 308 .

[0385] Fig.41 The following is an exploded view of the assembly of a first lens assembly and a first optical fiber support according to some embodiments of the present disclosure. Fig.41 As shown, in some embodiments, the first lens assembly 400 is connected to the first optical fiber support 710 .

[0386] In some embodiments, a supporting surface 480 is formed at the rear of the first lens assembly 400 to support the first optical fiber bracket 710. Exemplarily, the first optical fiber bracket 710 is disposed on the surface of the supporting surface 480.

[0387] In some embodiments, a first assembly hole 711 and a second assembly hole 712 are respectively formed on both sides of the end surface where the first optical fiber bracket 710 is connected to the first lens assembly 400 to achieve assembly connection with the first lens assembly 400 .

[0388] In some embodiments, the first assembly hole 711 and the second assembly hole 712 are respectively formed with a first optical fiber array fixing hole 713 and a second optical fiber array fixing hole 714. The first optical fiber array fixing hole 713 is penetrated with a first optical fiber array, and the first optical fiber array is used to transmit an external optical signal to the surface of the first lens assembly 400. The second optical fiber array fixing hole 714 is penetrated with a second optical fiber array, and the second optical fiber array is used to transmit the optical signal generated by the first light emitting chip 304 to the outside of the optical module.

[0389] Fig.42 FIG. 1 is a side view of a first lens assembly provided according to some embodiments of the present disclosure. Fig.42 As shown, in some embodiments, a supporting surface 480 is formed at the rear portion of the first lens assembly 400 to support the first optical fiber bracket 710 .

[0390] In some embodiments, a first limiting column 491 and a second limiting column 492 are respectively formed on both sides of the mating surface of the first optical fiber bracket 710. The first assembly hole 711 is nested on the first limiting column 491, and the second assembly hole 712 is nested on the second limiting column 492, so that the first optical fiber bracket 710 is limited on the first lens assembly 400, and the first optical fiber bracket 710 is fixedly connected to the first lens assembly 400.

[0391] In some embodiments, a first lens array 493 and a second lens array 494 are respectively formed between the first limiting pillar 491 and the second limiting pillar 492 to improve light coupling efficiency.

[0392] In some embodiments, the first lens array 493 is coupled to the first optical fiber array, and the second lens array 494 is coupled to the second optical fiber array. In some embodiments, the first lens array 493 includes a plurality of collimating lenses, and the second lens array 494 includes a plurality of converging lenses.

[0393] In some embodiments, the first lens array 493 receives the optical signal from the first optical fiber array, and the collimating lens included in the first lens array 493 collimates the signal light to obtain parallel light, and the parallel light enters the first lens assembly 400 .

[0394] In some embodiments, the optical signal emitted by the first optical emitting chip 304 enters the second lens array 494 after the transmission direction is turned, and the signal light is converged by the converging lens included in the second lens array 494, and then converged to the optical fiber end face and enters the second optical fiber array.

[0395] In some embodiments, the first lens array 493 and the second lens array 494 are both optical surfaces and require precision machining. During precision machining, a height difference will be formed with the surroundings, so a step surface 495 is formed between the first lens array 493 and the second lens array 494.

[0396] Fig.43 The following is a cross-sectional structural diagram of a first lens assembly and a first optical fiber support assembly according to some embodiments of the present disclosure. Fig.43 As shown, in some embodiments, one end of the first optical fiber bracket 710 is embedded in the first lens assembly 400 , thereby achieving connection between the first optical fiber bracket 710 and the first lens assembly 400 .

[0397] In some embodiments, the end surface 715 of the first optical fiber holder 710 is connected to the first lens assembly 400 .

[0398] In some embodiments, the end face 715 is polished to form an inclined end face so that the light reflected from the optical fiber end face is guided to the optical fiber cladding, thereby preventing the light from being returned to the optical fiber core layer, thereby ensuring signal quality.

[0399] In some embodiments, the angle between the end surface 715 and the vertical plane is 9°-10°. Exemplarily, the angle is 8° to improve the return loss.

[0400] Fig.44 FIG. 1 is a cross-sectional structural diagram of a first lens assembly provided according to some embodiments of the present disclosure. Fig.44 As shown, in some embodiments, a first inclined boss 496 is formed on one side of the first limiting column 491 , and a second inclined boss 497 is formed on one side of the second limiting column 492 .

[0401] In some embodiments, the first inclined boss 496 and the second inclined boss 497 are respectively tightly fitted and connected to the end surface 715 to increase the physical contact between the first optical fiber bracket 710 and the first lens assembly 400 to be closer.

[0402] In some embodiments, two ends of the end surface 715 are tightly fitted with the first inclined boss 496 and the second inclined boss 497 respectively.

[0403] In some embodiments, the surface of the first inclined boss 496 is protruded relative to the root of the first limiting column 491 , and the surface of the second inclined boss 497 is protruded relative to the root of the second limiting column 492 .

[0404] In some embodiments, the first inclined boss 496 and the second inclined boss 497 can provide a better fitting surface for fixation with the end face 715 , and are also easier to process than making an inclined end face from the root of the first limiting column 491 and the second limiting column 492 .

[0405] Fig.45 FIG. 1 is a bottom surface structure diagram of a first lens assembly provided according to some embodiments of the present disclosure. Fig.45 As shown, in some embodiments, a first refractive surface 410 is formed on one side of the surface of the first lens assembly 400 , and a second refractive surface 420 , a third refractive surface 430 and a fourth refractive surface 440 are formed on the other side.

[0406] In some embodiments, a third lens array 498 is formed at the bottom end of the first lens assembly 400 corresponding to the first refractive surface 410 side, and a fourth lens array 499 is formed at the bottom end of the first lens assembly 400 corresponding to the second refractive surface 420 side.

[0407] In some embodiments, the first light receiving chip 303 is disposed below the third lens array 498. The third lens array 498 includes a plurality of converging lenses to converge the optical signal and couple it into the first light receiving chip 303 to increase the optical coupling efficiency.

[0408] In some embodiments, the first light emitting chip 304 is disposed below the fourth lens array 499. Exemplarily, the fourth lens array 499 includes a plurality of collimating lenses to collimate the divergent light emitted by the first light emitting chip 304 and couple it into the first lens assembly 400 to increase the light coupling efficiency.

[0409] In some embodiments, the surface where the third lens array 498 is located protrudes from the surface where the fourth lens array 499 is located, so that the focal length of the third lens array 498 falls on the first light receiving chip 303 and the focal length of the fourth lens array 499 falls on the first light emitting chip 304.

[0410] In some embodiments, the third lens array 498 and the fourth lens array 499 are optical surfaces that need to be precisely processed, and a height difference will be formed with the surroundings during precision processing.

[0411] In some embodiments, a first groove 460 and a second groove 470 are respectively formed at the bottom end of the first lens assembly 400 .

[0412] In some embodiments, the first groove 460 and the second groove 470 can form a height difference between the bottom surface of the edge of both sides of the first lens assembly 400 and the surface of the first groove 460 and the second groove 470, respectively, to reduce the capillary siphon phenomenon of the glue in the gap between the first lens assembly 400 and the surface of the circuit board 300. The first groove 460 and the second groove 470 can play a role in separating glue.

[0413] In some embodiments, if the gap between the surface of the third lens array 498 and the fourth lens array 499 and the circuit board 300 is large, the capillary siphon phenomenon of the gap on the glue is weak, and the first groove 460 and the second groove 470 may not be formed.

[0414] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. An optical module, characterized in that: include: A circuit board, with a first light receiving chip and a first light emitting chip disposed on the surface; A first signal processing chip is disposed on a surface of the circuit board, and is located on the same surface of the circuit board as the first light emitting chip and the first light receiving chip, and the first signal processing chip is electrically connected to the first light emitting chip; A first lens assembly is located on the same surface of a circuit board as the first signal processing chip, an open cavity is formed between the first lens assembly and the surface of the circuit board, the open cavity has an opening open toward the first signal processing chip, the first light emitting chip and the first light receiving chip are located in the open cavity, and the first lens assembly is covered on the first light receiving chip and the surface of the first light emitting chip to change the transmission direction of the optical signal to be transmitted to the first light receiving chip and change the transmission direction of the optical emission signal generated by the first light emitting chip; A TIA is disposed in the open cavity, and the TIA is located on a side of the first light receiving chip away from the first signal processing chip; A third heat sink is projected above the first signal processing chip, comprising a third bearing surface, a third blocking surface, and a third supporting portion, wherein a heat conducting medium is disposed on the surface of the third bearing surface to dissipate heat for the first signal processing chip; the third blocking surface faces the opening, and the third blocking surface forms a barrier between the opening and the first signal processing chip; The third supporting portion is used to prop up the third carrying surface to above the first signal processing chip.

2. The optical module according to claim 1, characterized in that: A backlight detector is provided on a side of the first light emitting chip away from the first signal processing chip.

3. The optical module according to claim 1, characterized in that: The first signal processing chip is electrically connected to the circuit board through the bottom surface; A wiring is formed on the surface of the circuit board. The wiring passes through the third blocking surface from one side and extends into the open cavity. A pad is formed at the end of the wiring. The first light emitting chip is connected to the pad by wire bonding.

4. The optical module according to claim 1, characterized in that: The first lens assembly is formed with a first refractive surface from the side, and the first refractive surface is arranged above the first light receiving chip to turn the transmission direction of the optical signal to be transmitted to the first light receiving chip; The first lens assembly is formed from the side with: a second refractive surface, a third refractive surface bent and connected to the second refractive surface, and a fourth refractive surface bent and connected to the third refractive surface, the second refractive surface is arranged above the first light emitting chip; the transmission direction of the optical signal generated by the first light emitting chip is turned sequentially through the second refractive surface, the third refractive surface, and the fourth refractive surface; The top surface of the first lens component extends out to shield the first refractive surface and the fourth refractive surface from above.

5. The optical module according to claim 1, characterized in that: A backlight detector is provided on a side of the first light emitting chip away from the first signal processing chip; The first light emitting chip is disposed between the backlight detector and the first signal processing chip.

6. The optical module according to claim 5, characterized in that: A heating element is provided on one side of the first light emitting chip and the backlight detector, and the first light emitting chip and the heating element are located on the same copper-clad area.

7. The optical module according to claim 1, characterized in that: The TIA is connected to the first light receiving chip by wire bonding.

8. An optical module, characterized in that: include: A circuit board, with a first light receiving chip and a first light emitting chip disposed on the surface; A first signal processing chip is disposed on a surface of the circuit board, and is located on the same surface of the circuit board as the first light emitting chip and the first light receiving chip, and the first signal processing chip is electrically connected to the first light emitting chip; A first lens assembly is located on the same surface of a circuit board as the first signal processing chip, an open cavity is formed between the first lens assembly and the surface of the circuit board, the open cavity has an opening open toward the first signal processing chip, the first light emitting chip and the first light receiving chip are located in the open cavity, and the first lens assembly is covered on the first light receiving chip and the surface of the first light emitting chip to change the transmission direction of the optical signal to be transmitted to the first light receiving chip and change the transmission direction of the optical emission signal generated by the first light emitting chip; A third heat sink is projected above the first signal processing chip, comprising a third bearing surface, a third blocking surface, and a third supporting portion, wherein a heat conducting medium is disposed on the surface of the third bearing surface to dissipate heat for the first signal processing chip; the third blocking surface faces the opening, and the third blocking surface forms a barrier between the opening and the first signal processing chip; The third supporting portion is used to prop up the third carrying surface to above the first signal processing chip.

9. The optical module according to claim 8, characterized in that: The TIA is disposed in the open cavity, and the TIA is located on a side of the first light receiving chip away from the first signal processing chip.

10. The optical module according to claim 8, characterized in that: A backlight detector is provided on a side of the first light emitting chip away from the first signal processing chip.

Images