A transparent glue detection system
By using the short-wave infrared image acquisition module and the short-wave infrared light source in the transparent glue detection system, the strong absorption of short-wave infrared light and the weak absorption characteristics of the background are solved, and efficient and accurate glue detection is achieved.
Patent Information
- Application Number
- CN202421028482.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-11
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2034-05-11
AI Technical Summary
The prior art is difficult to achieve clear imaging in transparent glue detection, mainly because transparent glue transmits the background color in conventional visible light imaging, resulting in poor detection effect.
The short-wave infrared image acquisition module and the short-wave infrared light source are used to tilt the light to the transparent glue through the short-wave infrared light source, and the image is captured by the short-wave infrared camera and lens. The strong absorption of the short-wave infrared light and the weak absorption characteristics of the background are used to improve the contrast of the glue profile.
It effectively improves the contour contrast of transparent glue, realizes accurate detection of transparent glue, and meets the efficient and reliable detection needs in the field of industrial automation.
Smart Images
Figure CN222748488U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of machine vision detection, in particular to a transparent glue detection system. Background Art
[0002] With the rapid development of automation technology, the market has increasingly stringent requirements for the precision of product processes, which requires the removal of adverse factors that affect product processes. In the application of transparent glue detection, we found that some glue detection projects did not plan to use machine vision detection technology in the initial evaluation stage, or when a new glue detection process was temporarily needed during the project progress, or when the manual line was converted to an automatic line, the addition of fluorescent agents was not considered. Therefore, although the addition of fluorescent agents can improve the effect of visual imaging detection, this measure will trigger large-scale adjustments to the existing project evaluation and additional cost expenditures. In actual applications, for transparent glue detection without fluorescent effect, conventional visible light imaging technology often cannot clearly image the glue. The main reason is that transparent glue appears transparent in conventional visible light tests, transmits background colors, and is almost inseparable from the background, resulting in the detection effect failing to meet the established requirements.
[0003] Therefore, it is necessary to improve the existing technology.
[0004] The above information is presented as background information only to assist with understanding the present disclosure and no determination or admission is made as to whether any of the above may be used as prior art with respect to the present disclosure. Utility Model Content
[0005] The utility model provides a transparent glue detection system to solve the problems existing in the prior art.
[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0007] A transparent glue detection system includes a short-wave infrared image acquisition module and a short-wave infrared light source; wherein:
[0008] The short-wave infrared image acquisition module is located above the workpiece to be detected;
[0009] The short-wave infrared light source is arranged obliquely toward the transparent glue of the workpiece to be detected.
[0010] Furthermore, in the transparent glue detection system, the short-wave infrared image acquisition module includes a short-wave infrared camera and a short-wave infrared lens.
[0011] Furthermore, in the transparent glue detection system, the wavelength range of the short-wave infrared camera and the short-wave infrared lens is 900-1700nm.
[0012] Furthermore, in the transparent glue detection system, the wavelength of the short-wave infrared light source is 1550 nm.
[0013] Furthermore, in the transparent glue detection system, the inclination angle θ of the short-wave infrared light source relative to the plane where the workpiece to be detected is located is 45°±5°.
[0014] Furthermore, in the transparent glue detection system, the distance between the short-wave infrared image acquisition module and the workpiece to be detected is 260±10 mm.
[0015] Furthermore, in the transparent glue detection system, the distance between the short-wave infrared light source and the workpiece to be detected is 140±5 mm.
[0016] Compared with the prior art, the utility model has the following beneficial effects:
[0017] The utility model provides a transparent glue detection system, which includes a short-wave infrared image acquisition module and a short-wave infrared light source. Since the transparent glue absorbs the short-wave infrared light strongly, while the background absorbs the short-wave infrared light less, the imaging grayscales of the transparent glue and the background are different, which improves the contour contrast of the transparent glue, thereby effectively realizing accurate detection of the transparent glue.
[0018] The present invention has other characteristics and advantages, which will be apparent from the accompanying drawings and subsequent specific embodiments incorporated herein, or will be described in detail in the accompanying drawings and subsequent specific embodiments incorporated herein, which together are used to explain the specific principles of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0020] Figure 1 It is a schematic diagram of the structure (side view) of a transparent glue detection system and a workpiece to be detected provided by an embodiment of the utility model;
[0021] Figure 2 It is a structural (stereoscopic) schematic diagram of a transparent glue detection system provided by an embodiment of the utility model;
[0022] Figure 3 It is a structural (side view) schematic diagram of a transparent glue detection system provided by an embodiment of the utility model.
[0023] Reference numerals:
[0024] Short-wave infrared image acquisition module 1, short-wave infrared light source 2, workpiece to be detected 3;
[0025] A short-wave infrared camera 11 and a short-wave infrared lens 12 . DETAILED DESCRIPTION
[0026] In order to explain in detail the possible application scenarios, technical principles, specific schemes that can be implemented, and the purposes and effects that can be achieved, the following is a detailed description of the specific embodiments listed in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.
[0027] Reference to "embodiment" herein means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The term "embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or association with other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, the various technical features mentioned in the embodiments can be combined in any way to form a corresponding implementable technical solution.
[0028] Unless otherwise defined, the technical terms used in this document have the same meanings as those generally understood by those skilled in the art to which this application belongs; the use of relevant terms in this document is only for describing specific embodiments and is not intended to limit this application.
[0029] In the description of this application, the term "and / or" is an expression used to describe the logical relationship between objects, indicating that three relationships may exist, for example, A and / or B, which means: A exists, B exists, and A and B exist at the same time. In addition, the character " / " in this article generally indicates that the objects before and after are in an "or" logical relationship.
[0030] In the present application, terms such as “first” and “second” are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship of quantity, priority or sequence between these entities or operations.
[0031] Without further limitations, in this application, the words "include", "comprises", "has" or other similar expressions used in the sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those limited elements, but also other elements not explicitly listed, or also include elements inherent to such process, method or product.
[0032] Similar to the understanding in the Examination Guidelines, in this application, expressions such as "greater than", "less than", "exceed" and the like are understood to exclude the number itself; expressions such as "above", "below", "within" and the like are understood to include the number itself. In addition, in the description of the embodiments of this application, "multiple" means more than two (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups", "multiple times", etc., unless otherwise clearly and specifically limited.
[0033] In the description of the embodiments of the present application, space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present application or facilitating the reader's understanding, and do not indicate or imply that the referred device or component must have a specific position, a specific orientation, or be constructed or operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.
[0034] Unless otherwise expressly specified or limited, in the description of the embodiments of the present application, the terms "install", "connect", "connect", "fix", "set", etc. used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For technicians in the technical field to which the present application belongs, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0035] Embodiment 1
[0036] In view of the above-mentioned defects in the prior art, the applicant, based on many years of rich practical experience and professional knowledge in design and manufacturing in this field, and in conjunction with the application of theory, actively conducts research and innovation in the hope of creating a technology that can solve the defects in the prior art. After continuous research and design, and after repeated trial production and improvement, the present utility model with real practical value was finally created.
[0037] Please refer to Figure 1-3 The embodiment of the utility model provides a transparent glue detection system, which is mainly composed of a short-wave infrared image acquisition module 1 and a short-wave infrared light source 2. The specific design is as follows:
[0038] The short-wave infrared image acquisition module 1 is located above the workpiece 3 to be inspected and is responsible for capturing image information. The short-wave infrared light source 2 is tilted toward the transparent glue of the workpiece 3 to be inspected to emit short-wave infrared light.
[0039] It is worth noting that this embodiment makes full use of the characteristics that the transparent glue strongly absorbs short-wave infrared light, while the background weakly absorbs short-wave infrared light, and constructs a machine vision detection system by combining the short-wave infrared image acquisition module 1 and the short-wave infrared light source 2. When the short-wave infrared light source 2 emits short-wave infrared light to the workpiece 3 to be detected, the short-wave infrared image acquisition module 1 can capture the significant difference in grayscale between the transparent glue and the background on the workpiece 3 to be detected. This design significantly improves the contrast of the transparent glue outline, so that the system can accurately and effectively detect the transparent glue.
[0040] In summary, the transparent glue detection system provided in this embodiment realizes accurate detection of transparent glue by utilizing the characteristics of short-wave infrared light and combining a specific system structure design, thereby providing an efficient and reliable solution for the field of industrial automation.
[0041] Please refer again Figure 1-3 In this embodiment, the transparent glue detection system is further optimized and upgraded. The structure of the short-wave infrared image acquisition module 1 is more sophisticated, and it mainly includes a short-wave infrared camera 11 and a short-wave infrared lens 12.
[0042] As a core component, the short-wave infrared camera 11 is responsible for capturing image information under the illumination of short-wave infrared light. It has the characteristics of high sensitivity and high resolution, and can clearly capture the details of the transparent glue on the workpiece 3 to be inspected, providing high-quality image data for subsequent analysis and processing.
[0043] The short-wave infrared lens 12 plays a role in focusing and adjusting the light path, ensuring that the short-wave infrared camera 11 can accurately capture the target image. By optimizing the lens design, the short-wave infrared lens 12 in this embodiment can effectively reduce the scattering and interference of light and improve the imaging quality.
[0044] In this embodiment, one of the key components of the transparent glue detection system, namely the short-wave infrared camera 11 and the short-wave infrared lens 12, has a wavelength range that is precisely set at 900-1700nm. The selection of this wavelength range is based on the strong absorption characteristics of transparent glue to short-wave infrared light, and the relatively weak absorption characteristics of background materials to light in this wavelength range. Through this setting, the system can effectively capture the significant difference between transparent glue and the background in the image, thereby improving the detection accuracy.
[0045] In addition, the wavelength of the short-wave infrared light source 2 is set to 1550nm, which is within the wavelength range of the short-wave infrared camera 11 and the short-wave infrared lens 12, ensuring that the light emitted by the light source can be effectively captured by the camera and the lens. At the same time, light with a wavelength of 1550nm has excellent performance in transparent glue detection, which can further improve the accuracy and reliability of detection.
[0046] Please refer again Figure 1 In this embodiment, for one of the key components of the transparent glue detection system, i.e., the short-wave infrared light source 2, a tilt angle θ relative to the plane where the workpiece 3 to be detected is located is specially set. After multiple experiments and optimizations, an optimal tilt angle range of 45°±5° is determined.
[0047] The setting of this tilt angle is intended to ensure that the light emitted by the short-wave infrared light source 2 can optimally illuminate the transparent glue area on the workpiece 3 to be inspected. When the tilt angle θ is 45°±5°, the light emitted by the light source can more evenly cover the surface of the transparent glue, thereby ensuring that the short-wave infrared camera 11 can capture a clear and complete image.
[0048] At the same time, this tilt angle also helps to reduce the scattering and reflection of light during the irradiation process, further improving the imaging quality. By precisely controlling the tilt angle of the short-wave infrared light source 2, we can achieve more accurate and reliable detection of transparent glue.
[0049] In summary, in this embodiment, the inclination angle θ of the short-wave infrared light source 2 is set to 45°±5° based on comprehensive considerations of system performance and detection accuracy, aiming to achieve the best detection effect.
[0050] Please refer again Figure 1 In this embodiment, the key parameters of the transparent glue detection system are set more carefully.
[0051] First, the distance between the short-wave infrared image acquisition module 1 and the workpiece to be inspected 3 is precisely controlled within the range of 260±10mm. This distance is set based on multiple experiments and debugging to ensure that the image acquisition module can capture clear and complete images while avoiding image blur or distortion caused by being too close or too far. By maintaining this stable distance, the system can more accurately capture the outline and details of the transparent glue, improving the accuracy and reliability of detection.
[0052] Secondly, the distance between the short-wave infrared light source 2 and the workpiece to be inspected 3 is also carefully set and controlled within the range of 140±5mm. This distance is set to ensure that the light emitted by the light source can fully illuminate the transparent glue area on the workpiece to be inspected, while avoiding the impact of too strong or too weak light on the imaging quality. By maintaining this appropriate distance, the light source can emit a uniform and stable light beam, providing high-quality image data for the image acquisition module.
[0053] Although the term short-wave infrared image acquisition module, short-wave infrared light source, workpiece to be detected, etc. is used more frequently in this application, the possibility of using other terms is not excluded. These terms are used only to more conveniently describe and explain the essence of the utility model; interpreting them as any additional restrictions is contrary to the spirit of the utility model.
[0054] The utility model provides a transparent glue detection system, which includes a short-wave infrared image acquisition module and a short-wave infrared light source. Since the transparent glue absorbs the short-wave infrared light strongly, while the background absorbs the short-wave infrared light less, the imaging grayscales of the transparent glue and the background are different, which improves the contour contrast of the transparent glue, thereby effectively realizing accurate detection of the transparent glue.
[0055] Finally, it should be noted that although the above embodiments have been described in the specification and drawings of this application, this does not limit the scope of patent protection of this application. All technical solutions generated by replacing or modifying equivalent structures or equivalent processes based on the essential concept of this application using the contents recorded in the specification and drawings of this application, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are included in the scope of patent protection of this application.
Claims
1. A transparent glue detection system, characterized in that: It comprises a short-wave infrared image acquisition module (1) and a short-wave infrared light source (2); wherein: The short-wave infrared image acquisition module (1) is located above the workpiece to be inspected; The short-wave infrared light source (2) is arranged obliquely toward the transparent glue of the workpiece to be inspected.
2. The transparent glue detection system according to claim 1, characterized in that: The short-wave infrared image acquisition module (1) comprises a short-wave infrared camera (11) and a short-wave infrared lens (12).
3. The transparent glue detection system according to claim 2, characterized in that: The wavelength range of the short-wave infrared camera (11) and the short-wave infrared lens (12) is 900-1700 nm.
4. The transparent glue detection system according to claim 1, characterized in that: The wavelength of the short-wave infrared light source (2) is 1550 nm.
5. The transparent glue detection system according to claim 1, characterized in that: The inclination angle θ of the short-wave infrared light source (2) relative to the plane where the workpiece to be detected is located is 45°±5°.
6. The transparent glue detection system according to claim 1, characterized in that: The distance between the short-wave infrared image acquisition module (1) and the workpiece to be detected is 260±10 mm.
7. The transparent glue detection system according to claim 1, characterized in that: The distance between the short-wave infrared light source (2) and the workpiece to be detected is 140±5 mm.