LED packaging structure, backlight module and display device

Abstract

The present application discloses an LED packaging structure, a backlight module and a display device. The LED packaging structure includes a substrate layer, a bracket, an LED chip, a first packaging adhesive layer and a second packaging adhesive layer; the substrate layer has a bearing surface; the bracket is at least partially located on the side where the bearing surface is located and connected to the substrate layer to form a receiving groove; the LED chip is electrically connected to the substrate layer; the first packaging adhesive layer is completely located in the receiving groove and covers the LED chip; the second packaging adhesive layer is arranged on the side of the first packaging adhesive layer away from the bearing surface and is partially located in the receiving groove, and the second packaging adhesive layer has an upper light emitting surface arranged away from the bearing surface and a peripheral light emitting surface arranged around the upper light emitting surface; the light projected by the LED chip passes through the first packaging adhesive layer and passes through the second packaging adhesive layer from the upper light emitting surface and the peripheral light emitting surface. This design can effectively increase the light emitting angle of the LED chip, and the LED packaging structure can be applied to the field of vehicle-mounted backlight, and it can be made into, but not limited to, a liquid crystal backlight module, a central control screen, etc.

Description

Technical Field

[0001] The present application relates to the technical field of LED chips, and in particular to an LED packaging structure, a backlight module and a display device. Background Art

[0002] LED (Light Emitting Diode) is a semiconductor device that uses the energy released when carriers recombine to generate light. LED has many advantages such as low power consumption, pure color, long life, small size, fast response time, energy saving and environmental protection. For example, LED can be used in but not limited to LCD screens, TVs or car backlights and automotive interior and exterior lighting.

[0003] In the related art, products with LEDs are generally designed to meet the requirement of backlight mixing distance and make the whole machine body thinner and lighter. A layer of opaque or nearly opaque shielding material (usually white or dark colloid) is set on the surface of the LED after molding, so that the upper surface of the LED does not emit light and only the surrounding side surface emits light. However, this structure in which the upper surface of the LED does not emit light will result in a smaller overall light output angle of the LED. Therefore, how to effectively increase the light output angle of the LED has become an urgent problem to be solved. Utility Model Content

[0004] The embodiments of the present application provide an LED packaging structure, a backlight module and a display device, which can solve the problem of small light emission angle of LED in the related art.

[0005] In the first aspect, an embodiment of the present application provides an LED packaging structure; the LED packaging structure includes a substrate layer, a bracket, an LED chip, a first packaging adhesive layer and a second packaging adhesive layer, the substrate layer has a bearing surface, the bracket is at least partially located on the side of the substrate layer where the bearing surface is located and is connected to the substrate layer to enclose a receiving groove, the LED chip is located in the receiving groove and is electrically connected to the substrate layer, the first packaging adhesive layer is completely located in the receiving groove and covers the LED chip, the second packaging adhesive layer is arranged on the side of the first packaging adhesive layer away from the bearing surface and is partially located in the receiving groove, the second packaging adhesive layer has an upper light emitting surface arranged away from the bearing surface, and a peripheral light emitting surface arranged around the upper light emitting surface, and the light projected by the LED chip passes through the first packaging adhesive layer and then passes through the second packaging adhesive layer from the upper light emitting surface and the peripheral light emitting surface.

[0006] Based on the LED packaging structure of the embodiment of the present application, after the light projected by the LED chip enters the first packaging layer from the air, the light is refracted or diffused in the first packaging layer, which can change the propagation path of the light. Then, after the light with the changed propagation path enters the second packaging layer from the first packaging layer, the light is refracted or diffused again in the second packaging layer, which can change the propagation path of the light again, and passes through the second packaging layer from the upper light emitting surface and the peripheral light emitting surface, thereby achieving the effect of further increasing the light emitting angle of the LED chip. After the light projected by the LED chip is refracted and scattered by the first packaging layer and the second packaging layer, it passes through the second packaging layer from the upper light emitting surface and the peripheral light emitting surface of the second packaging layer, so that the ratio of the peripheral light and the light directly above the LED chip is evenly distributed, so that the uniformity of the backlight mixing of the LED chip is better.

[0007] In a second aspect, an embodiment of the present application provides a backlight module; the backlight module includes a driving circuit and the above-mentioned LED packaging structure, and the driving end of the driving circuit is electrically connected to the LED packaging structure.

[0008] The backlight module based on the embodiment of the present application has the above-mentioned LED packaging structure, which can effectively increase the light output angle of the backlight module and improve the light output uniformity of the backlight module.

[0009] In a third aspect, an embodiment of the present application provides a display device; the display device includes a housing and the above-mentioned backlight module, the housing has a receiving cavity, and the backlight module is installed in the receiving cavity of the housing.

[0010] The display device according to the embodiment of the present application has the above-mentioned backlight module, which can effectively increase the light output angle of the display device and improve the light output uniformity of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0012] Figure 1 A schematic cross-sectional view of an LED packaging structure in an embodiment of the present application;

[0013] Figure 2 This is a schematic cross-sectional structure diagram of a bracket in one embodiment of the present application;

[0014] Figure 3 is a schematic cross-sectional structure diagram of a bracket in another embodiment of the present application;

[0015] Figure 4 It is a structural schematic diagram of an LED packaging structure in another embodiment of the present application.

[0016] Figure numerals: 100, LED packaging structure; 110, substrate layer; 111, bearing surface; 120, bracket; 121, accommodating groove; 122, first inner annular surface; 123, second inner annular surface; 124, step surface; 130, LED chip; 140, first packaging glue layer; 150, second packaging glue layer; 151, upper light emitting surface; 152, peripheral light emitting surface; 160, solid crystal glue layer; 170, welding wire. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0018] Please refer to Figure 1-Figure 2 As shown, in the first aspect, the present application proposes an LED packaging structure 100 , which can effectively increase the light emission angle of the LED chip 130 .

[0019] The LED packaging structure 100 includes a substrate layer 110, a bracket 120, an LED chip 130, a first packaging glue layer 140 and a second packaging glue layer 150; the substrate layer 110 has a bearing surface 111; the bracket 120 is at least partially located on the side where the bearing surface 111 of the substrate layer 110 is located and is connected to the substrate layer 110 to enclose a receiving groove 121; the LED chip 130 is located in the receiving groove 121 and is electrically connected to the substrate layer 110; the first packaging glue layer 140 is completely located in the receiving groove 121 And it covers the LED chip 130; the second packaging glue layer 150 is arranged on the side of the first packaging glue layer 140 away from the supporting surface 111 and is partially located in the accommodating groove 121, and the second packaging glue layer 150 has an upper light emitting surface 151 arranged away from the supporting surface 111, and a peripheral light emitting surface 152 arranged around the upper light emitting surface 151; the light projected by the LED chip 130 passes through the first packaging glue layer 140 and then goes out of the second packaging glue layer 150 from the upper light emitting surface 151 and the peripheral light emitting surface 152.

[0020] The following combination Figure 1-Figure 4 The specific structure of the LED packaging structure 100 is introduced in detail.

[0021] like Figure 1-Figure 2As shown, the LED packaging structure 100 can be but not limited to being applied to the field of vehicle-mounted backlights, and when the LED packaging structure 100 is applied to the field of vehicle-mounted backlights, it can be but not limited to being made into a liquid crystal backlight module, a central control screen, etc. The LED packaging structure 100 includes a substrate layer 110, a bracket 120, an LED chip 130, a first packaging adhesive layer 140, and a second packaging adhesive layer 150.

[0022] The substrate layer 110 serves as a conductive substrate of the LED packaging structure 100; the substrate layer 110 may be a conductive substrate made of a single conductive material, for example, the specific preparation material of the substrate layer 110 may be but is not limited to metal materials such as copper, aluminum, iron or silver; the substrate layer 110 may also be a conductive substrate mixed with conductive materials and other materials, for example, the specific preparation material of the substrate layer 110 may be but is not limited to conductive rubber.

[0023] The substrate layer 110 has a bearing surface 111, which is the surface of the substrate layer 110 for bearing components such as a bracket 120 and an LED chip 130. The specific shape of the bearing surface 111 is not limited here, and designers can make reasonable designs according to actual needs. For example, the specific shape of the bearing surface 111 can be, but is not limited to, a rectangle or a circle.

[0024] The bracket 120 serves as a cup body of the LED packaging structure 100 and is used to support the first packaging adhesive layer 140 and the second packaging adhesive layer 150 . The specific structure of the bracket 120 will be described in detail below.

[0025] The bracket 120 is at least partially located on the side of the substrate layer 110 where the bearing surface 111 is located; for example, the entire bracket 120 may be located on the side of the substrate layer 110 where the bearing surface 111 is located; or a portion of the bracket 120 may be located on the side of the substrate layer 110 where the bearing surface 111 is located, and the remaining portion of the bracket 120 is located on the side of the substrate layer 110 opposite to the bearing surface 111.

[0026] The bracket 120 is connected to the substrate layer 110 to enclose a receiving groove 121; wherein the bracket 120 is annular, and the annular bracket 120 is connected to the substrate layer 110 to form a bowl-like structure, and the hollow area of ​​the bowl-like structure is the above-mentioned receiving groove 121; the specific connection method between the bracket 120 and the substrate layer 110 is not limited here, and the designer can make a reasonable design according to actual needs. For example, the bracket 120 can be but is not limited to forming an integrated structure with the substrate layer 110 by injection molding.

[0027] like Figure 1-Figure 2As shown, the LED chip 130 serves as the light source of the LED package structure 100. The LED chip 130 is located in the receiving groove 121 and is electrically connected to the substrate layer 110. The LED chip 130 may be a normal LED chip 130, in which case the LED chip 130 and the substrate layer 110 may be electrically connected via a welding wire 170. The LED chip 130 may also be a flip-chip LED chip 130, in which case the LED chip 130 and the substrate layer 110 may be electrically connected via a eutectic process. In the embodiment of the present application, the LED chip 130 is a normal LED chip 130, and the LED package structure 100 further includes a welding wire 170. The positive pin of the LED chip 130 is electrically connected to the positive electrode of the substrate layer 110 via the welding wire 170, and the negative pin of the LED chip 130 is electrically connected to the negative electrode of the substrate layer 110 via the welding wire 170.

[0028] The first encapsulation adhesive layer 140 is a structural member in the LED packaging structure 100 for refracting or diffusing the light projected by the LED chip 130 to increase the light output angle of the LED chip 130. The specific manifestation of the first encapsulation adhesive layer 140 will be described in detail below. It is understandable that after the light projected by the LED chip 130 enters the first encapsulation adhesive layer 140 from the air, the light is refracted or diffused in the first encapsulation adhesive layer 140, which can change the propagation path of the light, thereby achieving the effect of increasing the light output angle of the LED chip 130.

[0029] The first packaging adhesive layer 140 is completely located in the receiving groove 121 and covers the LED chip 130. The first packaging adhesive layer 140 is filled in the receiving groove 121 by dispensing, and the first packaging adhesive layer 140 completely covers the LED chip 130, refracting or diffusing the light projected from the surface of the LED chip 130 onto the second packaging adhesive layer 150, thereby increasing the light output angle of the LED chip 130.

[0030] The second packaging adhesive layer 150 is a structural component in the LED packaging structure 100 for further refracting or diffusing the light refracted or diffused by the first packaging adhesive layer 140 to further increase the light output angle of the LED chip 130. The specific form of the second packaging adhesive layer 150 will be introduced in detail below.

[0031] The second packaging adhesive layer 150 is disposed on a side of the first packaging adhesive layer 140 away from the carrying surface 111 and is partially located in the receiving groove 121 ; the second packaging adhesive layer 150 covers the side of the first packaging adhesive layer 140 away from the carrying surface 111 by dispensing.

[0032] The second packaging glue layer 150 has an upper light emitting surface 151 and a peripheral light emitting surface 152, the upper light emitting surface 151 is arranged to face away from the supporting surface 111, and the peripheral light emitting surface 152 is arranged circumferentially around the upper light emitting surface 151; wherein, the upper light emitting surface 151 (the peripheral light emitting surface 152) can be a plane, a curved surface, or a combination of a plane and a curved surface.

[0033] Based on the LED packaging structure 100 in the embodiment of the present application, after the light projected by the LED chip 130 enters the first packaging adhesive layer 140 from the air, the light is refracted or diffused in the first packaging adhesive layer 140, which can change the propagation path of the light. Subsequently, after the light with the changed propagation path enters the second packaging adhesive layer 150 from the first packaging adhesive layer 140, the light is refracted or diffused again in the second packaging adhesive layer 150, which can change the propagation path of the light again, and passes through the second packaging adhesive layer 150 from the upper light emitting surface 151 and the peripheral light emitting surface 152, thereby achieving the effect of further increasing the light emitting angle of the LED chip 130. In addition, it is worth mentioning that the light projected by the LED chip 130 is refracted and scattered by the first packaging layer 140 and the second packaging layer 150, and then passes through the second packaging layer 150 from the upper light-emitting surface 151 and the peripheral light-emitting surface 152 of the second packaging layer 150, so that the ratio of the peripheral light and the light directly above the LED chip 130 is evenly distributed, so that the backlight mixing uniformity of the LED chip 130 is better.

[0034] Furthermore, if Figure 2-Figure 3 As shown, the bracket 120 has a first inner annular surface 122, a second inner annular surface 123 and a step surface 124; the first inner annular surface 122 is closer to the bearing surface 111 than the second inner annular surface 123; the step surface 124 is connected to the first inner annular surface 122 on the side close to the center line of the accommodating groove 121, and the step surface 124 is connected to the second inner annular surface 123 on the side away from the center line of the accommodating groove 121; the edge of the second encapsulation glue layer 150 is supported by the step surface 124, and the peripheral light-emitting surface of the second encapsulation glue layer 150 is spaced from the second inner annular surface 123.

[0035] The first inner annular surface 122 , the second inner annular surface 123 , the step surface 124 and the bearing surface 111 are used to form the groove wall surface of the accommodating groove 121 . The first inner annular surface 122 (the second inner annular surface 123) can be a vertical surface or an inclined surface; for example, when the first inner annular surface 122 (the second inner annular surface 123) is a vertical surface, the distance between the first inner annular surface 122 (the second inner annular surface 123) and the center line of the accommodating groove 121 is equal everywhere from the side close to the bearing surface 111 to the side away from the bearing surface 111 (that is, the first inner annular surface 122 / the second inner annular surface 123 is perpendicular to the bearing surface 111 at this time); for another example, when the first inner annular surface 122 (the second inner annular surface 123) is an inclined surface, the distance between the first inner annular surface 122 (the second inner annular surface 123) and the center line of the accommodating groove 121 gradually increases from the side close to the bearing surface 111 to the side away from the bearing surface 111.

[0036] By designing the first inner annular surface 122, the step surface 124 and the second inner annular surface 123 on the bracket 120, the accommodating groove 121 of the bracket 120 is stepped. Compared with directly mounting the second encapsulation adhesive layer 150 on the first encapsulation adhesive layer 140 alone, this facilitates mounting the second encapsulation adhesive layer 150 on the bracket 120 and can also increase the light output angle of the LED chip 130. By designing the peripheral light output surface of the second encapsulation adhesive layer 150 to be spaced from the second inner annular surface 123 of the bracket 120, a reserved gap is formed between the second encapsulation adhesive layer 150 and the bracket 120, and the reserved gap can better position the second encapsulation adhesive layer 150 and enhance the adhesion of the second encapsulation adhesive layer 150.

[0037] Furthermore, if Figure 2-Figure 3 As shown, the bracket 120 is a non-transparent bracket 120. The specific preparation material of the bracket 120 can be but not limited to PPA (Polyphthalamide), PCT (4-cyclohexylendimethylene terephthalate), EMC (Epoxy molding compound), SMC (Sheet molding compound), etc. Of course, in some other embodiments, the bracket 120 can also be a transparent bracket or a translucent bracket 120.

[0038] Furthermore, if Figure 2-Figure 3As shown, the first encapsulation adhesive layer 140 has an upper surface disposed opposite to the bearing surface 111 of the substrate layer 110, and the upper surface of the first encapsulation adhesive layer 140 is further away from the bearing surface 111 of the substrate layer 110 than the step surface 124 of the bracket 120. That is to say, in a direction perpendicular to the bearing surface 111 of the substrate layer 110, the distance between the upper surface of the first encapsulation adhesive layer 140 and the bearing surface 111 of the substrate layer 110 is greater than the distance between the step surface 124 of the bracket 120 and the bearing surface 111 of the substrate layer 110. The distance between the upper surface of the first encapsulation adhesive layer 140 and the plane where the step surface 124 of the bracket 120 is located is not limited here, and it can be understood that for different display devices, the distance between the upper surface of the first encapsulation adhesive layer 140 and the plane where the step surface 124 of the bracket 120 is located is also different, and needs to be reasonably designed according to the requirements of different display devices. In this design, the upper surface of the first encapsulation adhesive layer 140 is designed to be higher than the step surface 124 of the bracket 120, so that the first encapsulation adhesive layer 140 protrudes out of the plane where the step surface 124 of the bracket 120 is located, so as to avoid a gap between the second encapsulation adhesive layer 150 and the first encapsulation adhesive layer 140, thereby affecting the light output angle of the LED chip 130.

[0039] Furthermore, if Figure 4 As shown, along the direction perpendicular to the bearing surface 111 of the substrate layer 110, the thickness of the first encapsulation glue layer 140 is a first dimension H1, the thickness of the second encapsulation glue layer 150 is a second dimension H2, and the first dimension H1 and the second dimension H2 satisfy the conditional formula: 0.2≤H2 / H1≤10.0. For example, the specific value of H2 / H1 can be, but is not limited to, 0.2, 1.2, 2.2, 3.2, 4.2, 5.2, 6.2, 7.2, 8.2, 9.2 or 10.0. By reasonably designing the values ​​of the first dimension H1 and the second dimension H2, when 0.2≤H2 / H1≤10.0, the light output angle of the LED chip 130 can be increased; when H2 / H1<0.2, the thickness of the second encapsulation adhesive layer 150 is too small or the thickness of the first encapsulation adhesive layer 140 is too large, resulting in a small light output angle of the LED chip 130; when H2 / H1>10.0, the thickness of the second encapsulation adhesive layer 150 is too large or the thickness of the first encapsulation adhesive layer 140 is too small, resulting in a small light output angle of the LED chip 130. It should be noted that the specific value of the thickness of the second encapsulation adhesive layer 150 (i.e., the second dimension H2) needs to be determined according to the specific application scenario of the LED chip packaging structure 100.

[0040] More specifically, Figure 1 and Figure 4 As shown, the specific forms of the first encapsulation adhesive layer 140 and the second encapsulation adhesive layer 150 may be, but are not limited to, one or more of the following embodiments.

[0041] In the first embodiment, the first packaging adhesive layer 140 is made of transparent resin or transparent epoxy. Of course, in other embodiments, the first packaging adhesive layer 140 may also be made of a mixture of silica gel and phosphor or a mixture of epoxy and phosphor.

[0042] In the second embodiment, the second encapsulation adhesive layer 150 is made of transparent resin or transparent epoxy. Of course, in other embodiments, the second encapsulation adhesive layer 150 may also be made of a mixture of silica gel and phosphor or a mixture of epoxy and phosphor.

[0043] In the third embodiment, along a direction parallel to the carrying surface 111 of the substrate layer 110 , the cross section of the second packaging adhesive layer 150 is circular or rectangular.

[0044] It should be noted that when the first encapsulation adhesive layer 140 and the second encapsulation adhesive layer 150 are transparent, the first encapsulation adhesive layer 140 and the second encapsulation adhesive layer 150 are made of pure silicone glue; when the first encapsulation adhesive layer 140 and the second encapsulation adhesive layer 150 are translucent, the first encapsulation adhesive layer 140 and the second encapsulation adhesive layer 150 are made of a mixture of silicone glue and diffusion powder (mainly silicon dioxide); when the first encapsulation adhesive layer 140 and the second encapsulation adhesive layer 150 are matte, the first encapsulation adhesive layer 140 and the second encapsulation adhesive layer 150 are made of a mixture of silicone glue and phosphor. In addition, when the first encapsulation adhesive layer 140 (the second encapsulation adhesive layer 150) is matte, the light output angle of the first encapsulation adhesive layer 140 (the second encapsulation adhesive layer 150) will increase by about 10% compared with the light output angle when it is transparent.

[0045] Furthermore, if Figure 1 and Figure 4 As shown, the LED packaging structure 100 also includes a solid crystal glue layer 160, which is disposed between the LED chip 130 and the substrate layer 110 to position the LED chip 130 on the substrate layer 110. The specific preparation material of the solid crystal glue layer 160 can be, but is not limited to, silver glue or insulating glue. In this design, the position between the LED chip 130 and the substrate layer 110 is relatively fixed by designing the solid crystal glue layer 160, and the processing technology is simple and easy to implement.

[0046] Furthermore, if Figure 1 and Figure 4 As shown, the LED chip 130 includes at least one of a red LED chip, a blue LED chip, and a green LED chip.

[0047] In a second aspect, the present application proposes a backlight module, which can effectively increase the light emission angle of the backlight module.

[0048] The backlight module includes a driving circuit and the above-mentioned LED package structure 100, and the driving end of the driving circuit is electrically connected to the LED package structure 100. The driving circuit is used to drive the LED chip 130 of the LED package structure 100 to light up according to a preset rule. The specific circuit structure of the driving circuit is not limited here, and the designer can reasonably design it according to the specific form of the display device. It is understandable that the specific circuit structure of the driving circuit is different for display devices with different forms of expression.

[0049] It should be noted that the LED packaging structure 100 can be applied to various lighting fields. For example, it can be made into a backlight module for use in the display backlight field (corresponding to the backlight modules of terminals such as televisions, monitors, and mobile phones). In addition, the LED packaging structure 100 can also be applied to, but not limited to, the key backlight field, the photography field, the home lighting field, the medical lighting field, the decoration field, the automobile field or the transportation field, the vehicle backlight field, and the like. For example, when the LED packaging structure 100 is applied to the field of key backlight, it can be used as a key backlight light source for mobile phones, calculators, keyboards and other devices with key devices; when the LED packaging structure 100 is applied to the field of photography, it can be made into a camera flash; when the LED packaging structure 100 is applied to the field of household lighting, it can be made into floor lamps, table lamps, projection lamps, etc.; when the LED packaging structure 100 is applied to the field of medical lighting, it can be made into surgical lamps, low electromagnetic lighting lamps, etc.; when the LED packaging structure 100 is applied to the field of decoration, it can be made into various decorative lamps such as various colored lights, landscape lighting lamps, advertising lights, etc.; when the LED packaging structure 100 is applied to the field of automobiles, it can be made into car lights, car indicator lights, etc.; when the LED packaging structure 100 is applied to the field of transportation, it can be made into traffic lights, street lights, etc.; when the LED packaging structure 100 is applied to the field of vehicle-mounted backlight, it can be made into liquid crystal backlight modules, central control screens, etc.

[0050] Based on the backlight module in the embodiment of the present application, with the above-mentioned LED packaging structure 100, the light output angle of the backlight module can be effectively increased and the light output uniformity of the backlight module can be improved.

[0051] On the third aspect, the present application proposes a display device that can effectively increase the light output angle of the display device.

[0052] The display device includes a housing and the above-mentioned backlight module, the housing has a receiving cavity, and the backlight module is installed in the receiving cavity. The housing is used to install and fix the backlight module. The specific structure / preparation material of the housing is not limited here. Designers can make reasonable designs according to the specific product form of the display device. It is understandable that the specific structure / preparation material of the housing is different for display devices of different product forms. The display device can be, but is not limited to, terminals such as televisions, computers, and mobile phones.

[0053] Based on the display device in the embodiment of the present application, with the above-mentioned backlight module, it is possible to effectively increase the light output angle of the display device and improve the light output uniformity of the display device.

[0054] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0055] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An LED packaging structure, characterized in that: include: A substrate layer having a bearing surface; A bracket, at least partially located on a side of the substrate layer where the bearing surface is located and connected to the substrate layer to enclose and form a receiving groove; An LED chip is located in the containing groove and is electrically connected to the substrate layer; A first packaging adhesive layer is completely located in the containing groove and covers the LED chip; A second packaging adhesive layer is arranged on a side of the first packaging adhesive layer away from the carrying surface and partially located in the containing groove, the second packaging adhesive layer having an upper light emitting surface arranged away from the carrying surface and a peripheral light emitting surface arranged around the upper light emitting surface; The light projected by the LED chip passes through the first packaging adhesive layer and then passes through the second packaging adhesive layer from the upper light emitting surface and the peripheral light emitting surface.

2. The LED packaging structure according to claim 1, characterized in that: The bracket has a first inner annular surface, a second inner annular surface and a step surface, the first inner annular surface is closer to the bearing surface than the second inner annular surface, the side of the step surface close to the center line of the accommodating groove is connected to the first inner annular surface, and the side of the step surface away from the center line of the accommodating groove is connected to the second inner annular surface; The edge of the second packaging adhesive layer rests on the step surface, and the peripheral light-emitting surface of the second packaging adhesive layer is spaced apart from the second inner annular surface.

3. The LED packaging structure according to claim 2, characterized in that: The first packaging adhesive layer has an upper surface disposed opposite to the carrying surface, and the upper surface of the first packaging adhesive layer is farther away from the carrying surface than the step surface.

4. The LED packaging structure according to claim 2, characterized in that: Along a direction perpendicular to the bearing surface, the thickness of the first packaging glue layer is a first dimension H1, the thickness of the second packaging glue layer is a second dimension H2, and the first dimension H1 and the second dimension H2 satisfy the condition: 0.2≤H2 / H1≤10.

0.

5. The LED packaging structure according to claim 1, characterized in that: The first encapsulation adhesive layer is made of transparent silicone or transparent epoxy; and / or The second packaging adhesive layer is made of transparent silicone or transparent epoxy.

6. The LED packaging structure according to claim 1, characterized in that: The LED packaging structure further includes a crystal-fixing glue layer, which is arranged between the LED chip and the substrate layer to position the LED chip on the substrate layer.

7. The LED packaging structure according to any one of claims 1 to 6, characterized in that: The support is a non-transparent support.

8. The LED packaging structure according to any one of claims 1 to 7, characterized in that: The LED chip includes at least one of a red LED chip, a blue LED chip and a green LED chip.

9. A backlight module, characterized in that: include: The LED packaging structure according to any one of claims 1 to 8; A driving circuit, wherein a driving end of the driving circuit is electrically connected to the LED packaging structure.

10. A display device, characterized in that: include: A housing having a receiving cavity; The backlight module as claimed in claim 9, wherein the backlight module is installed in the accommodating cavity.

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