Automatic cutting device for PCB (Printed Circuit Board)

By designing an automatic cutting device for PCB circuit board including a laser measuring instrument and a CMI probe, the problem of difficulty in automatically detecting plate thickness and copper thickness in the prior art is solved, automatic detection and abnormal plate sorting are realized, and the reliability and detection efficiency of product quality are improved.

CN222776391UActive Publication Date: 2025-04-18JIANG XI XU SHENG DIAN ZI GU FEN YOU XIAN GONG SI
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Patent Information

Application Number
CN202421388887.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-18
Publication Date
2025-04-18
Estimated Expiration
2034-06-18

AI Technical Summary

Technical Problem

The prior art is difficult to automatically detect the board thickness and copper thickness of PCB circuit boards, resulting in low manual detection efficiency, easy leakage and mixing of boards, affecting product reliability.

Method used

An automatic cutting device for PCB circuit board is designed, including a cutting machine, edge grinder, identification device, alarm device, plate separation device, plate collection device and control device. The laser measuring instrument and CMI probe are used to automatically detect the plate thickness and copper thickness, and the automatic sorting of abnormal plates is realized through the control device and plate separation device.

Benefits of technology

Automatic detection of plate thickness and copper thickness is achieved, detection efficiency is improved, manual errors are reduced, product quality is ensured, and manual inspection and sorting time is saved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a PCB circuit board automatic cutting device, including cutting machine, edging machine, identification device, alarm device, board splitting device, board receiving device and control device, identification device includes thickness measuring instrument and tagging machine, thickness measuring instrument includes laser measuring instrument for measuring substrate board thickness and CMI probe for measuring copper thickness, and the tagging machine includes laser measuring instrument for measuring substrate board thickness and CMI probe for measuring copper thickness. The code assigning machine is used for printing marks on a PCB, the thickness measuring instrument is electrically connected with the control device, the control device is electrically connected with the alarm device, the board dividing device and the board collecting device, and when the thickness measuring instrument detects that the thickness of a base material board or / and the thickness of copper are / is abnormal, the control device is electrically connected with the alarm device, the board dividing device and the board collecting device. And the control device controls the alarm device to give an alarm prompt and controls the board separation device to sort out abnormal boards. The PCB automatic cutting device provided by the utility model can automatically detect the board thickness and the copper thickness, and ensures the reliability of the product quality.
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Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit board production, in particular to an automatic cutting device for a PCB circuit board. Background Art

[0002] As electronic devices develop towards intelligence, high precision and high standards, it also means that PCB circuit boards need to carry these electronic product control systems. Circuit board design needs to consider many factors comprehensively. Any inadequate processing or detection omissions will lead to deviations in product functions or even failure. The thickness of the circuit board substrates often used when incoming materials are: 0.1mm, 0.15mm, 0.2mm, etc. The bottom copper thickness is 12um, 15um, 17um, 35um. There are slight differences in the thickness of the board and the thickness of the copper. Moreover, due to the design of the panel, the cutting size of these boards is consistent. It is difficult to tell from the naked eye whether the copper thickness and thickness of these boards meet the requirements. However, manual inspection is inefficient and prone to omissions and mixed boards, which affects product reliability.

[0003] Therefore, it is necessary to provide a cutting device that can automatically detect plate thickness and copper thickness to solve the above technical problems. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a PCB circuit board automatic cutting device, which can automatically detect the board thickness and copper thickness, and ensure the reliability of product quality.

[0005] The technical solution of the utility model is as follows:

[0006] A PCB circuit board automatic cutting device comprises a cutting machine, an edge grinding machine, an identification device, an alarm device, a board separation device, a board collection device and a control device, wherein the identification device comprises a thickness measuring instrument and a coding machine, the thickness measuring instrument comprises a laser measuring instrument for measuring the thickness of a substrate and a CMI probe for measuring the thickness of copper, the coding machine is used to print a mark on the PCB circuit board, the thickness measuring instrument is electrically connected to the control device, the control device is electrically connected to the alarm device, the board separation device and the board collection device, and when the substrate thickness or / and copper thickness detected by the thickness measuring instrument is abnormal, the control device controls the alarm device to give an alarm prompt, and controls the board separation device to sort out the abnormal boards.

[0007] Furthermore, the alarm device includes a three-color light and a buzzer.

[0008] Furthermore, the panel separation device is a panel separation robot.

[0009] Compared with the prior art, the PCB circuit board automatic cutting device provided by the utility model has the following beneficial effects:

[0010] 1. The utility model provides an automatic PCB circuit board cutting device. After the circuit board is cut and edged, the substrate thickness and copper thickness are detected by a thickness measuring instrument. When the substrate thickness and / or copper thickness are detected to be abnormal, the alarm device gives an alarm prompt. At this time, the board separation device sorts out the abnormal boards, and the remaining normal boards are collected by the board collection device, thereby ensuring the reliability of product quality.

[0011] 2. The automatic PCB circuit board cutting device provided by the utility model can realize continuous automatic operation after the cut board is fed into the device, saving the time of manual inspection and manual sorting and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0013] Figure 1 The utility model is a structural schematic diagram of a PCB circuit board automatic cutting device. DETAILED DESCRIPTION

[0014] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention and to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the specific implementation methods of the present invention are further described below.

[0015] It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each embodiment of the present invention described below can be combined with each other as long as there is no conflict between them.

[0016] See also Figure 1 , is a structural schematic diagram of the PCB circuit board automatic cutting device of the utility model. The PCB circuit board automatic cutting device of the utility model comprises a cutting machine 1, an edge grinding machine 2, an identification device 3, an alarm device 5, a board separation device 6, a board collection device 7 and a control device 8. Among them, the identification device 3 is electrically connected to the control device 8, and the control device 8 is electrically connected to the alarm device 5, the board separation device 6 and the board collection device 7.

[0017] The cutting machine 1 is used to cut the PCB circuit board, and the edge grinding machine 2 is used to grind the edge of the cut PCB circuit board. The structures of the cutting machine 1 and the edge grinding machine 2 are both prior art and will not be described in detail here.

[0018] The identification device 3 includes a thickness measuring instrument 31 and a coding machine 32. The thickness measuring instrument 31 includes a laser measuring instrument 311 for measuring the thickness of the substrate and a CMI probe 312 for measuring the copper thickness. First, the normal range of the substrate thickness and copper thickness of the PCB circuit board is input through the input unit of the control device 8 as the set value; after the thickness measuring instrument measures the substrate thickness and copper thickness, the detection data is sent to the control device, and the processing unit of the control device compares the detection value with the set value. When the detection values ​​of the substrate thickness and copper thickness are both within the set value range, it is determined that the substrate thickness and copper thickness values ​​are normal, and the PCB circuit board is a normal board; when the detection values ​​of the substrate thickness and / or copper thickness are outside the set value range, it is determined that the substrate thickness and / or copper thickness values ​​are abnormal, and the PCB circuit board is an abnormal board. Among them, the laser measuring instrument 311 measures the thickness of the circuit board substrate by means of laser, and the CMI probe 312 can match the copper thickness detection equipment of models such as CMI500, CMI563, and CMI700. Both of them accurately measure the substrate thickness and copper thickness by means of laser scanning.

[0019] The coding machine 32 is used to print a mark on the PCB circuit board, so that each PCB circuit board can be traced back to its source. The coding machine 32 is a laser coding machine, and its structure is a prior art, which will not be described in detail here.

[0020] The alarm device 5 includes a three-color light 51 and a buzzer 52. When the substrate thickness and / or copper thickness are detected to be abnormal, the control device 5 controls the alarm device 5 to give an alarm prompt, and controls the board separation device 6 to sort out the abnormal boards. Specifically, when the substrate thickness and / or copper thickness are detected to be abnormal, the three-color light 51 flashes, and the buzzer 52 emits a prompt sound to remind the staff that the circuit board is abnormal. At this time, the control device 8 controls the board separation device 6 to operate, sort out the abnormal boards, and the normal boards that are not detected to be abnormal are collected by the board collection device 7 for processing, thereby meeting the automatic stacking of abnormal boards and normal boards and ensuring the quality of the product. In this embodiment, the board separation device 6 is a board separation manipulator, and the control device controls the board separation manipulator to grab the abnormal boards so that the abnormal boards and normal boards are stored in categories; the structure of the board collection device 7 is a prior art and will not be described in detail here.

[0021] The above is a detailed description of the embodiments of the present invention, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations made to these embodiments without departing from the principle and spirit of the present invention still fall within the scope of protection of the present invention.

Claims

1. A PCB circuit board automatic cutting device, characterized in that: It includes a cutting machine, an edge grinding machine, an identification device, an alarm device, a board separating device, a board collecting device and a control device. The identification device includes a thickness measuring instrument and a coding machine. The thickness measuring instrument includes a laser measuring instrument for measuring the thickness of a substrate and a CMI probe for measuring the thickness of copper. The coding machine is used to print a mark on a PCB circuit board. The thickness measuring instrument is electrically connected to the control device. The control device is electrically connected to the alarm device, the board separating device and the board collecting device. When the substrate thickness or / and copper thickness detected by the thickness measuring instrument are abnormal, the control device controls the alarm device to give an alarm prompt and controls the board separating device to sort out the abnormal boards.

2. The PCB circuit board automatic cutting device according to claim 1, characterized in that: The alarm device comprises a three-color lamp and a buzzer.

3. The PCB circuit board automatic cutting device according to claim 1, characterized in that: The panel separation device is a panel separation robot.