Heat dissipation liquid cooling plate with efficient heat conduction

Abstract

The utility model discloses a heat dissipation liquid cooling plate with efficient heat conduction, which comprises a heat conduction mounting plate, a fan mounting plate, a connecting plate, a mounting side plate, two circulating heat dissipation pipes, heat dissipation fins, a soaking plate, a chip heat conduction plate and a video memory heat conduction sheet, the two second water inlet and outlet openings are formed in the middle of the heat conduction mounting plate, the two first water inlet and outlet openings are formed in the two sides of the end face of the heat conduction mounting plate respectively, when refrigerant fluid is introduced into the circulating heat dissipation pipe, the refrigerant fluid enters from the first water inlet and outlet openings firstly and then enters from the second water inlet and outlet openings, and when the refrigerant fluid is introduced into the circulating heat dissipation pipe again, the refrigerant fluid enters from the second water inlet and outlet openings. Refrigerating fluid can enter from the second water inlet and outlet and then enter from the first water inlet and outlet, the two cooling modes are alternately used, the heat conduction mounting plate can evenly dissipate heat of the chip and the video memories arranged around the chip, the heat dissipation uniformity is improved, and the service life of the video card is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to a heat dissipation liquid cooling plate with high efficiency and heat conduction. Background Art

[0002] Liquid cooling plate is a form of heat transfer that uses a cold plate (usually a closed cavity made of heat-conducting metals such as copper and aluminum) to indirectly transfer the heat of the heating device to the cooling liquid enclosed in the circulation pipeline, and the heat is taken away by the cooling liquid.

[0003] The high-temperature area on the graphics card motherboard is mainly concentrated on the chip and the multiple video memories arranged around the chip. The heat dissipation area is large. The existing liquid cooling mechanism usually cools on one side, resulting in poor heat dissipation uniformity. If the heat dissipation is uneven, it will cause the temperature of a single video memory to be too high, affecting the service life of the graphics card. Utility Model Content

[0004] The purpose of the utility model is to provide a high-efficiency heat-conducting liquid cooling plate to solve the technical problem that in the prior art, the high-temperature area on the graphics card motherboard is mainly concentrated on the chip and the multiple video memories arranged around the chip, the heat dissipation area is large, and the existing liquid cooling mechanism usually cools on one side, resulting in poor heat dissipation uniformity. If the heat dissipation is uneven, it will cause the temperature of a single video memory to be too high, affecting the service life of the graphics card.

[0005] The technical problem to be solved by the utility model can be achieved through the following technical solutions:

[0006] A highly efficient heat-conducting heat-dissipating liquid cold plate, comprising:

[0007] The circulating heat dissipation pipe comprises a water inlet and outlet 1 and a water inlet and outlet 2, the water inlet and outlet 1 is connected with an L-shaped connecting pipe 1, the water inlet and outlet 2 is connected with an L-shaped connecting pipe 2, and a U-shaped pipe is connected between the L-shaped connecting pipe 1 and the L-shaped connecting pipe 2;

[0008] A heat-conducting mounting plate, a circulating heat dissipation pipe is fixedly connected to one end surface of the heat-conducting mounting plate, a heat spreader is fixedly connected to the other end surface of the heat-conducting mounting plate, a chip heat-conducting plate and a memory heat-conducting sheet are respectively fixedly connected to the heat spreader, the circulating heat dissipation pipe is symmetrically arranged on the heat-conducting mounting plate, heat dissipation fins are arranged on the circulating heat dissipation pipe, and the heat dissipation fins are clamped on the L-shaped connecting pipe 1, the L-shaped connecting pipe 2 and the U-shaped pipe of the circulating heat dissipation pipe.

[0009] As a further solution of the utility model: two circulating heat dissipation pipes are arranged on the heat-conducting mounting plate, two water inlet and outlet 2 are arranged in the middle of the heat-conducting mounting plate, and two water inlet and outlet 1 are respectively arranged on both sides of the end surface of the heat-conducting mounting plate.

[0010] As a further solution of the utility model: a fan mounting plate is fixedly connected to one end surface of the heat-conducting mounting plate, and the fan mounting plate is arranged at one end of the heat dissipating fins.

[0011] As a further solution of the utility model: the heat dissipation fin comprises a fin body, and a plurality of card interfaces are provided on the fin body.

[0012] As a further solution of the utility model: the fin body is respectively connected to the outer wall of L-shaped connecting tube 1, L-shaped connecting tube 2 and U-shaped tube through a plurality of card interfaces, and the heat dissipation fins, L-shaped connecting tube 1, L-shaped connecting tube 2 and U-shaped tube are all made of copper metal.

[0013] As a further solution of the utility model: a connecting plate is fixedly connected to an end surface of one side of the heat-conducting installation plate close to the water inlet and outlet 1 and the water inlet and outlet 2, and a mounting side plate is fixedly connected to the connecting plate.

[0014] Beneficial effects of the utility model:

[0015] 1. Two circulating heat dissipation pipes are symmetrically arranged on the heat-conducting mounting plate of the utility model. The two water inlets and outlets are arranged in the middle of the heat-conducting mounting plate. The two water inlets and outlets are arranged on both sides of the end surface of the heat-conducting mounting plate. When the refrigerant is introduced into the circulating heat dissipation pipe, the refrigerant can first be introduced from the water inlet and outlet one and then from the water inlet and outlet two. When the refrigerant is introduced into the circulating heat dissipation pipe again, the refrigerant can be introduced from the water inlet and outlet two and then from the water inlet and outlet one. The above two cooling modes are used alternately, so that the heat-conducting mounting plate can evenly dissipate heat to the chip and the multiple video memories arranged around the chip, thereby improving the uniformity of heat dissipation and extending the service life of the graphics card.

[0016] 2. The heat dissipation fins of the utility model are respectively connected to the L-shaped connecting tube 1, the L-shaped connecting tube 2 and the outer wall of the U-shaped tube through a plurality of card interfaces. The heat dissipation fins and the circulating heat dissipation tube are fixed by brazing, which can improve the thermal conductivity of the heat dissipation fins. A fan mounting plate is fixedly connected to an end face of one side of the heat conduction mounting plate, and the fan mounting plate can be used to install a heat dissipation fan. The heat dissipation efficiency of the heat dissipation fins can be improved by directly blowing the heat dissipation fan to the heat dissipation fins. A connecting plate is fixedly connected to an end face of one side of the heat conduction mounting plate close to the water inlet and outlet 1 and the water inlet and outlet 2, and a mounting side plate is fixedly connected to the connecting plate. The mounting side plate is used to install a decorative plate for covering the water inlet and outlet 1 and the water inlet and outlet 2, so as to improve the aesthetics of the device when it is set in a side-transparent chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The utility model is further described below in conjunction with the accompanying drawings.

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0019] Figure 2This is a schematic diagram of the three-dimensional structure of the utility model after removing the heat dissipation fins Figure 1 ;

[0020] Figure 3 This is a schematic diagram of the three-dimensional structure of the utility model after removing the heat dissipation fins Figure 2 ;

[0021] Figure 4 It is a schematic diagram of the three-dimensional structure of the heat dissipation fin of the utility model.

[0022] In the figure: 1. Heat conduction mounting plate; 2. Fan mounting plate; 3. Connecting plate; 4. Mounting side plate; 5. Threaded hole one; 6. Threaded hole two; 7. Circulating heat pipe; 71. Water inlet and outlet one; 72. Water inlet and outlet two; 73. L-shaped connecting pipe one; 74. L-shaped connecting pipe two; 75. U-shaped pipe; 8. Heat sink fins; 81. Fin body; 82. Card interface; 9. Heat spreader; 10. Chip heat conduction plate; 11. Video memory heat conduction sheet. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] like Figure 1-Figure 4 As shown, a highly efficient heat-conducting heat-dissipating liquid cold plate comprises:

[0025] The circulating heat dissipation pipe 7 includes a water inlet and outlet 1 71 and a water inlet and outlet 2 72. The water inlet and outlet 1 71 is connected to an L-shaped connecting pipe 1 73, the water inlet and outlet 2 72 is connected to an L-shaped connecting pipe 2 74, and a U-shaped pipe 75 is connected between the L-shaped connecting pipe 1 73 and the L-shaped connecting pipe 2 74;

[0026] A heat-conducting mounting plate 1, a circulating heat dissipation pipe 7 is fixedly connected to one end surface of the heat-conducting mounting plate 1, a heat spreader 9 is fixedly connected to the other end surface of the heat-conducting mounting plate 1, a chip heat-conducting plate 10 and a memory heat-conducting plate 11 are respectively fixedly connected to the heat spreader 9, the circulating heat dissipation pipe 7 is symmetrically arranged on the heat-conducting mounting plate 1, and heat dissipation fins 8 are arranged on the circulating heat dissipation pipe 7, and the heat dissipation fins 8 are clamped on the L-shaped connecting pipe 1 73, the L-shaped connecting pipe 2 74 and the U-shaped pipe 75 of the circulating heat dissipation pipe 7.

[0027] Two circulating heat dissipation pipes 7 are arranged on the heat-conducting mounting plate 1 , two water inlet and outlet ports 72 are arranged in the middle of the heat-conducting mounting plate 1 , and two water inlet and outlet ports 71 are arranged on both sides of the end surface of the heat-conducting mounting plate 1 .

[0028] A fan mounting plate 2 is fixedly connected to one end surface of the heat-conducting mounting plate 1. The fan mounting plate 2 is arranged at one side end of the heat dissipation fins 8. The fan mounting plate 2 can be used to install a cooling fan. By directly blowing the cooling fins 8 with the cooling fan, the heat dissipation efficiency of the cooling fins 8 can be improved.

[0029] The heat dissipation fin 8 includes a fin body 81, on which a plurality of card interfaces 82 are provided. The fin body 81 is respectively connected to the outer walls of the L-shaped connecting tube 1 73, the L-shaped connecting tube 2 74 and the U-shaped tube 75 through the plurality of card interfaces 82. The heat dissipation fin 8, the L-shaped connecting tube 1 73, the L-shaped connecting tube 2 74 and the U-shaped tube 75 are all made of copper metal. The heat dissipation fin 8 and the circulating heat dissipation tube 7 are fixed by brazing.

[0030] A connecting plate 3 is fixedly connected to the end face of one side of the heat-conducting mounting plate 1 close to the water inlet and outlet 1 71 and the water inlet and outlet 2 72, and a mounting side plate 4 is fixedly connected to the connecting plate 3. The mounting side plate 4 is used to install a decorative plate for covering the water inlet and outlet 1 71 and the water inlet and outlet 2 72, thereby improving the aesthetics of the device when it is set in a side-transparent chassis.

[0031] In some specific implementation schemes, a threaded hole 1 5 is provided on the fan mounting plate 2 for facilitating the installation of the cooling fan, and a threaded hole 2 6 is provided on the mounting side plate 4 for facilitating the installation of the decorative plate.

[0032] In order to facilitate the understanding of the embodiments of this solution by those skilled in the art, the working principle of this solution is briefly described in combination with specific application scenarios:

[0033] Two circulating heat dissipation pipes 7 are symmetrically arranged on the heat-conducting mounting plate 1. The two water inlet and outlet ports 72 are both arranged in the middle of the heat-conducting mounting plate 1. The two water inlet and outlet ports 71 are respectively arranged on both sides of the end surface of the heat-conducting mounting plate 1. When the refrigerant is introduced into the circulating heat dissipation pipe 7, the refrigerant can first be introduced into the circulating heat dissipation pipe 7 from the water inlet and outlet port 71 and then from the water inlet and outlet port 72. When the refrigerant is introduced into the circulating heat dissipation pipe 7 again, the refrigerant can be introduced into the circulating heat dissipation pipe 7 from the water inlet and outlet port 72 and then from the water inlet and outlet port 71. The above two cooling modes are used alternately, so that the heat-conducting mounting plate 1 can evenly dissipate the heat of the chip and the multiple video memories arranged around the chip, improve the uniformity of heat dissipation, and extend the service life of the graphics card. The heat dissipation fins 8 are respectively connected to the L through a plurality of card interfaces 82. On the outer walls of the L-shaped connecting tube 1 73, the L-shaped connecting tube 2 74 and the U-shaped tube 75, the heat dissipation fins 8 and the circulating heat dissipation tube 7 are fixed by brazing, which can improve the thermal conductivity of the heat dissipation fins 8. A fan mounting plate 2 is fixedly connected to the end face of one side of the heat conduction mounting plate 1, and the fan mounting plate 2 can be used to install a heat dissipation fan. By directly blowing the heat dissipation fins 8 by the heat dissipation fan, the heat dissipation efficiency of the heat dissipation fins 8 can be improved. A connecting plate 3 is fixedly connected to the end face of one side of the heat conduction mounting plate 1 close to the water inlet and outlet 1 71 and the water inlet and outlet 2 72. A mounting side plate 4 is fixedly connected to the connecting plate 3. The mounting side plate 4 is used to install a decorative plate for covering the water inlet and outlet 1 71 and the water inlet and outlet 2 72, so as to improve the aesthetics of the device when it is set in a side-transparent chassis.

[0034] Several embodiments of the utility model are described in detail above, but the embodiments of the utility model are not limited thereto and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A highly efficient heat-conducting heat-dissipating liquid cold plate, characterized in that: include: The circulating heat dissipation pipe (7) comprises a first water inlet and outlet (71) and a second water inlet and outlet (72); the first water inlet and outlet (71) is connected to an L-shaped connecting pipe (73); the second water inlet and outlet (72) is connected to an L-shaped connecting pipe (74); and a U-shaped pipe (75) is connected between the first L-shaped connecting pipe (73) and the second L-shaped connecting pipe (74); A heat-conducting mounting plate (1), a circulating heat-dissipating pipe (7) is fixedly connected to one end surface of the heat-conducting mounting plate (1), a heat-spreading plate (9) is fixedly connected to the other end surface of the heat-conducting mounting plate (1), a chip heat-conducting plate (10) and a memory heat-conducting plate (11) are respectively fixedly connected to the heat-spreading plate (9), the circulating heat-dissipating pipe (7) is symmetrically arranged on the heat-conducting mounting plate (1), a heat-dissipating fin (8) is arranged on the circulating heat-dissipating pipe (7), and the heat-dissipating fin (8) is clamped to an L-shaped connecting pipe 1 (73), an L-shaped connecting pipe 2 (74) and a U-shaped pipe (75) of the circulating heat-dissipating pipe (7).

2. The high-efficiency heat-conducting heat-dissipating liquid cold plate according to claim 1, characterized in that: Two circulating heat dissipation pipes (7) are arranged on the heat-conducting mounting plate (1), two water inlet and outlet ports 2 (72) are arranged in the middle of the heat-conducting mounting plate (1), and two water inlet and outlet ports 1 (71) are arranged on both sides of the end surface of the heat-conducting mounting plate (1).

3. The high-efficiency heat-conducting heat-dissipating liquid cold plate according to claim 1, characterized in that: A fan mounting plate (2) is fixedly connected to one end surface of the heat-conducting mounting plate (1), and the fan mounting plate (2) is arranged at one end of the heat dissipation fin (8).

4. The high-efficiency heat-conducting heat-dissipating liquid cold plate according to claim 1, characterized in that: The heat dissipation fin (8) comprises a fin body (81), and a plurality of card interfaces (82) are provided on the fin body (81).

5. The high-efficiency heat-conducting heat-dissipating liquid cold plate according to claim 4, characterized in that: The fin body (81) is respectively connected to the outer walls of the L-shaped connecting tube (73), the L-shaped connecting tube (74) and the U-shaped tube (75) through a plurality of card interfaces (82); the heat dissipation fin (8), the L-shaped connecting tube (73), the L-shaped connecting tube (74) and the U-shaped tube (75) are all made of copper metal.

6. The high-efficiency heat-conducting heat-dissipating liquid cold plate according to claim 1, characterized in that: A connecting plate (3) is fixedly connected to the end surface of one side of the heat-conducting installation plate (1) close to the first water inlet and outlet (71) and the second water inlet and outlet (72), and a mounting side plate (4) is fixedly connected to the connecting plate (3).

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