Mounting bracket and sensor module

Abstract

The utility model provides a mounting bracket and a sensor module, and relates to the technical field of sensor mounting. The mounting bracket is applied to the movable equipment and comprises a bracket body, the bracket body comprises a mounting surface, the mounting surface is provided with a mounting groove, the mounting groove is used for fixedly mounting a sensor, and the sensor is used for detecting motion parameters of the movable equipment. According to the mounting bracket provided by the embodiment of the invention, reliable connection between the sensor and the mounting bracket can be realized, and the use reliability of the sensor module is ensured.

Description

Technical Field

[0001] The present application relates to the technical field of sensor installation, and in particular to a mounting bracket and a sensor module. Background Art

[0002] A sensor is a detection device that can receive measured information and convert it into electrical signals or other signals according to certain rules. Based on the different basic sensing functions of sensors, sensors can be divided into pressure sensors, acceleration sensors, position sensors, gas sensors, etc.

[0003] Based on the development of sensor-related technologies, a sensor can have multiple basic sensing functions at the same time, such as inertial sensors. Based on the performance of inertial sensors, inertial sensors can be widely used in aerospace, military, automobiles, robots, unmanned vehicles and other fields.

[0004] A plurality of inertial sensors can be integrated with a mounting bracket to form a sensor module. However, the structure of the existing mounting bracket easily affects the reliability of the sensor module. Utility Model Content

[0005] The present application provides a mounting bracket and a sensor module to achieve a reliable connection between the sensor and the mounting bracket, thereby ensuring the reliability of the sensor module.

[0006] In a first aspect, the present application provides a mounting bracket, which is applied to a movable device. The mounting bracket includes a bracket body, the bracket body includes a mounting surface, the mounting surface is provided with a mounting groove, the mounting groove is used to fix and install a sensor, and the sensor is used to detect the motion parameters of the movable device.

[0007] Compared with the prior art, in which the sensor is welded to the circuit board, and then the circuit board is welded to the mounting bracket to achieve a fixed connection between the sensor and the mounting bracket, in the example of the present application, a mounting groove is provided on the mounting surface of the mounting bracket, and the groove wall of the mounting groove can limit the sensor, thereby reducing the possibility of the sensor moving relative to the mounting bracket.

[0008] In the example of this application, the heat generated by the sensor during operation can be transferred to the air through the mounting bracket. In the prior art, the sensor is directly exposed to the air. When the air flow rate is low, the heat dissipation efficiency of the sensor through the mounting bracket will be relatively high.

[0009] In addition, since the sensor is directly fixed in the mounting groove, the transmission medium between the sensor and the mounting bracket can be reduced, reducing the possibility of affecting the sensor's benchmark due to multiple welding, thereby improving the sensor's setting flatness and improving the sensor's reliability.

[0010] The setting flatness of the sensor refers to the flatness of the contact between the sensor and the installation reference surface during the installation of the sensor. In the example of this application, the installation reference surface refers to the groove wall of the installation groove, specifically the bottom wall of the installation groove.

[0011] In some possible implementations, the mounting bracket further includes a heat-conducting connection layer, and the heat-conducting connection layer is disposed between the groove wall of the mounting groove and the sensor to fixedly connect the sensor and the groove wall of the mounting groove.

[0012] Compared with the prior art in which the fixed connection between the sensor and the groove wall of the mounting groove is achieved by welding, the example of the present application achieves the fixed connection between the sensor and the groove wall of the mounting groove by setting a thermal conductive connection layer, which can reduce the number of welding points, and thus make the distance between the sensor and the groove wall of the mounting groove more uniform, so that the sensor is set more flat, further improve the setting flatness of the sensor, and thus improve the reliability of the sensor.

[0013] In addition, since the thermally conductive connection layer has thermal conductivity and is disposed between the sensor and the mounting bracket, the heat dissipation efficiency of the sensor can be further improved.

[0014] In some possible implementations, a groove wall of the mounting groove is provided with at least one first glue overflow hole.

[0015] By providing the first glue overflow hole, when the sensor squeezes the thermally conductive connection layer and is fixedly connected to the groove wall of the mounting groove through the thermally conductive connection layer, the sensor can apply force to the thermally conductive connection layer, so that the excess thermally conductive connection layer enters the first glue overflow hole, or reaches the inside of the mounting bracket through the first glue overflow hole, thereby improving the connection reliability between the sensor and the groove wall of the mounting groove. Since the mounting groove is provided on the mounting bracket, the reliable connection between the sensor and the groove wall of the mounting groove can achieve a reliable connection between the sensor and the mounting bracket.

[0016] In some possible implementations, the mounting bracket is an integrated structure.

[0017] Compared with the prior art, which requires processing multiple parts, fine-machining the multiple parts, and then welding the multiple parts into a whole to form a mounting bracket, in the example of the present application, only the one-piece molded mounting bracket needs to be fine-machined, which simplifies the processing technology of the mounting bracket and reduces the time cost of manufacturing the mounting bracket.

[0018] In some possible implementations, the mounting surface includes a first mounting surface, the mounting groove includes a first mounting groove, the first mounting groove is arranged on one side of the first mounting surface, the first mounting groove is used to fix the first sensor, and the first sensor is used to detect the motion parameters of the movable device along the first direction.

[0019] The first mounting surface of the bracket body is provided with a first mounting groove, the first sensor is fixedly mounted in the first mounting groove, and the first sensor can detect the motion parameters of the movable device along the first direction. Since the first sensor is fixedly mounted in the first mounting groove, compared with the prior art in which the sensor is welded to the circuit board and then the circuit board is welded to the mounting bracket to achieve a fixed connection between the sensor and the mounting bracket, the transmission medium between the first sensor and the mounting bracket can be reduced, the possibility of multiple welding affecting the reference of the first sensor can be reduced, the setting flatness of the first sensor can be improved, and the detection accuracy of the first sensor can be improved.

[0020] In some possible implementations, the mounting surface further includes a second mounting surface and a first side wall that are spaced apart from each other, and the second mounting surface and the first side wall are connected via the first mounting surface.

[0021] The mounting groove also includes a second mounting groove, which is arranged on the side of the second mounting surface away from the second side wall. The second mounting groove is used to fix the second sensor, and the second sensor is used to detect the motion parameters of the movable device along the second direction, and the second direction is perpendicular to the first direction.

[0022] The mounting bracket can provide mounting space for the first sensor and the second sensor at the same time. The first sensor can detect the motion parameters of the movable device along the first direction, and the second sensor can detect the motion parameters of the movable device along the second direction. The first direction and the second direction can cooperate to form a plane. Therefore, the motion parameters of the movable device within a certain plane can be detected by the first sensor and the second sensor, thereby expanding the application scope of the sensor module.

[0023] In some possible implementations, the mounting surface further includes a third mounting surface and a fourth mounting surface that are spaced apart from each other, and the third mounting surface and the fourth mounting surface are connected via the first mounting surface.

[0024] The mounting slot also includes a third mounting slot, which is disposed on a side of the third mounting surface away from the fourth mounting surface, and is used to fix and install a third sensor, which is used to detect motion parameters of the movable device along a third direction, which is perpendicular to the first direction and perpendicular to the second direction. And / or, the mounting slot also includes a fourth mounting slot, which is disposed on a side of the fourth mounting surface away from the third mounting surface, and is used to fix and install a fourth sensor, which is used to detect motion parameters of the movable device along a third direction, which is perpendicular to the first direction and perpendicular to the second direction.

[0025] The mounting bracket can provide mounting space for the first sensor, the second sensor, and the third sensor at the same time. The first sensor can detect the motion parameters of the movable device along the first direction, the second sensor can detect the motion parameters of the movable device along the second direction, and at least one of the third sensor and the fourth sensor can detect the motion parameters of the movable device along the third direction. The first direction, the second direction, and the third direction can cooperate to form a spatial coordinate system. Therefore, the motion parameters of the movable device in space can be detected by at least one of the third sensor and the fourth sensor, the first sensor, and the second sensor, further expanding the scope of application of the sensor module.

[0026] In some possible implementations, the mounting bracket further includes a connecting column, which is disposed on a side of the bracket body facing away from the mounting surface, and is used to connect the bracket body with an external component.

[0027] The connection between the bracket body and the external component can be achieved by providing the connecting column.

[0028] In some possible implementations, there are three connecting posts, and the three connecting posts are arranged in a triangle.

[0029] Compared with the prior art in which four connecting columns are set to achieve the connection between the mounting bracket and the external component, in the example of the present application, three connecting columns are set to achieve the connection between the mounting bracket and the external component. The three connecting columns can improve the consistency of the installation coplanarity, improve the connection reliability between the mounting bracket and the external component, and reduce the possibility of the mounting bracket shaking relative to the external component.

[0030] In addition, compared with the prior art that provides four connecting columns, the example of the present application provides three connecting columns, which can reduce the manufacturing cost of the mounting bracket.

[0031] In a second aspect, the present application provides a sensor module installed on a movable device, the sensor module comprising any possible mounting bracket mentioned above, at least one sensor and at least one circuit board, one side of the sensor being connected to the mounting bracket, and the other side of the sensor being connected to the circuit board.

[0032] The beneficial effects provided in the above-mentioned second aspect and various possible designs of the above-mentioned second aspect can refer to the beneficial effects brought about by the above-mentioned first aspect and various possible implementation methods of the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic diagram of the structure of a sensor module provided as an example of this application.

[0034] Figure 2 A schematic structural diagram of a mounting bracket from a first perspective provided as an example in this application.

[0035] Figure 3 A schematic structural diagram of a mounting bracket from a second viewing angle provided for an example of this application.

[0036] Figure 4 A schematic diagram of the structure of another mounting bracket provided for this application example.

[0037] Description of reference numerals:

[0038] 100. Mounting bracket; 110. Bracket body; 111. First mounting surface; 1111. First mounting groove; 1112. First glue overflow hole; 1113. First mounting boss; 1114. Second glue overflow hole; 112. Second mounting surface; 1121. Second mounting groove; 1122. Second mounting boss; 113. Third mounting surface; 1131. Third mounting groove; 1132. Third mounting boss; 114. Fourth mounting surface; 1141. Fourth mounting groove; 1142. Fourth mounting boss; 115. First side wall; 1151. Mounting mark; 120. Connecting column; 200. Circuit board. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the examples of this application clearer, the technical solution in the examples of this application will be clearly and completely described below in conjunction with the drawings in the examples of this application. Obviously, the described examples are part of the examples of this application, not all of them. Based on the examples in this application, all other examples obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used in the specification of the application herein are only for the purpose of describing specific examples and are not intended to limit this application; the terms "including" and "having" in the specification, claims and drawings of this application and any variations thereof are intended to cover non-exclusive inclusions.

[0041] Reference to "examples" herein means that a particular feature, structure, or characteristic described in conjunction with the examples may be included in at least one example of the present application. The appearance of the phrase "example" in various locations in the specification does not necessarily refer to the same example, nor is it an independent or alternative example that is mutually exclusive with other examples. It is explicitly and implicitly understood by those skilled in the art that the examples described herein may be combined with other examples.

[0042] The term "and / or" in this article is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0043] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the mounting bracket and the sensor module of the present application.

[0044] In addition, the terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects rather than to describe a specific order, and may explicitly or implicitly include one or more of the features.

[0045] In the description of the present application, unless otherwise specified, "plurality" means more than two (including two), and similarly, "multiple groups" means more than two groups (including two).

[0046] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, the "connection" or "connection" of a mechanical structure may refer to a physical connection. For example, the physical connection may be a fixed connection, such as a fixed connection through a barrier, such as a fixed connection through screws, bolts or other barrier; the physical connection may also be a detachable connection, such as a mutual snap-on or snap-fit ​​connection; the physical connection may also be an integral connection, such as a connection formed by welding, bonding or integral molding. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0047] A sensor is a detection device that can receive measured information and convert it into electrical signals or other signals according to certain rules. Based on the different basic sensing functions of sensors, sensors can be divided into pressure sensors, temperature sensors, acceleration sensors, position sensors, gas sensors, etc.

[0048] With the development of sensor-related technologies, a sensor can have multiple basic sensing functions at the same time, such as an inertial sensor. At least one inertial sensor can be combined with other sensors, a circuit board, and a mounting bracket to form a sensor module.

[0049] The existing mounting bracket is generally welded by multiple parts, the outer side of the bracket structure is welded with a circuit board, and the side of the circuit board away from the mounting bracket is welded with a sensor. Since there are multiple welding points between the mounting bracket and the sensor, the flatness between the sensor and the mounting surface may be affected, thereby affecting the measurement reliability of the sensor.

[0050] In addition, when there are multiple circuit boards, operators need to solder the multiple circuit boards to achieve connections between adjacent circuit boards, which makes the molding process of the mounting module more complicated and the manufacturing cost higher.

[0051] Based on the above, the present application example provides a mounting bracket and a sensor module.

[0052] In order to enable those skilled in the art to better understand the present application, the mounting bracket and sensor module provided in the example of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0053] Exemplarily, the present application provides a sensor module, which can be installed in a movable device.

[0054] Figure 1 For a schematic diagram of the structure of a sensor module provided for this application example, please refer to Figure 1 The sensor module may include a mounting bracket 100 , at least one sensor, and one side of the at least one sensor is connected to the mounting bracket 100 , and the other side of the sensor is connected to the circuit board 200 .

[0055] The movable devices can be drones, industrial robots, cars, ships, industrial robotic arms, etc.

[0056] The sensor may be provided with one or more sensors. A sensor may have only one detection function, or a sensor may have multiple detection functions. The specific type of sensor may be determined according to the usage scenario of the sensor module.

[0057] The sensor may be directly fixedly connected to the mounting bracket 100 , or the sensor may be fixedly connected to the mounting bracket 100 via a connecting piece.

[0058] The sensor module may include at least one sensor, and each sensor may be connected to a corresponding circuit board 200. The sensor and the corresponding circuit board may be fixedly connected by welding or other means.

[0059] In the case where multiple sensors are provided, the detection functions of the multiple sensors may be different or the same. Each sensor is connected to a corresponding adjacent circuit board 200 which may be electrically connected via a flexible connection structure.

[0060] Compared with the prior art, in which connection between different circuit boards is achieved through welding, in the example of the present application, adjacent circuit boards can be connected through a soft connection structure during the external processing of the circuit boards, thereby reducing the workload of operators.

[0061] The structure of the sensor may be the same as that of the sensor in the prior art, and this example of the application will not be described in detail.

[0062] Next, the structure of the mounting bracket 100 will be described in detail.

[0063] Exemplarily, the present application example provides a mounting bracket for use in a movable device.

[0064] Figure 2 For a schematic diagram of the structure of a mounting bracket from a first perspective provided for this application example, please refer to Figure 2 The mounting bracket 100 may include a bracket body 110, and the bracket body 110 may include a mounting surface. The mounting surface may be provided with a mounting groove, and the mounting groove is used to fix and install a sensor, and the sensor is used to detect the motion parameters of the movable device.

[0065] The movable device can move in different directions. The movable device can only move in a straight line in a certain direction. The movable device can also move in a certain plane, and the movable device can also move arbitrarily in space. This application example does not specifically limit the moving direction of the movable device.

[0066] The motion parameter may be a moving speed, acceleration, moving direction of the movable device, or a related parameter such as the magnetic field strength at the location where the movable device is located.

[0067] The sensor may be at least one of a gyroscope sensor, an acceleration sensor, a magnetic field sensor, or other sensors.

[0068] The mounting bracket 100 may be made of metal material, may be integrally formed, or may be assembled from a plurality of parts.

[0069] The bracket body 110 may include only one mounting surface. One mounting surface may be provided with only one mounting groove, or one mounting surface may be provided with multiple mounting grooves, and the mounting groove is used to fix and install the sensor. One side of the sensor is fixedly connected to the groove wall of the mounting groove, and specifically can be connected to the bottom wall of the mounting groove. The side of the sensor facing away from the bottom wall of the mounting groove can be fixedly connected to the circuit board.

[0070] The sensor can be fixedly installed in the installation groove by welding, bonding or other methods.

[0071] The bracket body 110 may also include a plurality of mounting surfaces. Each mounting surface may have only one mounting groove, or each mounting surface may have a plurality of mounting grooves, and the mounting grooves are used to fix and mount the sensor.

[0072] Regardless of whether the bracket body 110 includes one mounting surface or multiple mounting surfaces, based on the division of basic sensing functions of the sensors, only one sensor may be fixedly installed in one mounting slot, or multiple sensors may be fixedly installed in one mounting slot.

[0073] The sensor may be in a cubic, cylindrical or other regular shape. The shape of the mounting groove may be the same as the shape of the sensor, or may be different from the shape of the sensor, as long as at least part of the sensor can be inserted into the mounting groove and the sensor can be fixedly connected to the groove wall of the mounting groove.

[0074] Along the assembly direction of the sensor, the size of the mounting surface is equal to the size of the sensor. The size of the mounting surface may also be larger than the size of the sensor, as long as the sensor can be fixedly mounted on the groove wall of the mounting groove.

[0075] Based on the above, compared with the prior art, in which the sensor is welded to the circuit board, and then welded to the mounting bracket 100 through the circuit board, a fixed connection between the sensor and the mounting bracket 100 is achieved. In the example of the present application, a mounting groove is provided on the mounting surface of the mounting bracket 100, and the groove wall of the mounting groove can limit the sensor, thereby reducing the possibility of the sensor moving relative to the mounting bracket 100.

[0076] In the example of the present application, the heat generated by the sensor during operation can be transferred to the air through the mounting bracket 100. In the prior art, the sensor is directly exposed to the air. When the air flow rate is low, the heat dissipation efficiency of the sensor through the mounting bracket 100 will be relatively high.

[0077] In addition, since the sensor is directly fixed in the mounting groove, the transmission medium between the sensor and the mounting bracket 100 can be reduced, reducing the possibility of multiple welding affecting the sensor's reference, thereby improving the sensor's installation flatness and improving the sensor's reliability.

[0078] The setting flatness of the sensor refers to the degree of flatness of the contact between the sensor and the installation reference surface during the installation of the sensor. In the example of this application, the installation reference surface refers to the groove wall of the installation groove, specifically the bottom wall of the installation groove.

[0079] Based on the mounting bracket 100 provided in the above example, the mounting bracket 100 may be an integrated structure.

[0080] The mounting bracket 100 can be integrally formed by casting, the mounting bracket 100 can also be integrally formed by metal additive manufacturing, the mounting bracket 100 can also be integrally formed by hot isostatic pressing technology or other methods. The example of this application does not specifically limit the molding method of the mounting bracket 100.

[0081] Compared with the prior art, which requires processing multiple parts, fine-machining the multiple parts, and then welding the multiple parts into a whole to form the mounting bracket 100, in the example of the present application, only the one-piece molded mounting bracket 100 needs to be fine-machined, which simplifies the processing technology of the mounting bracket 100 and reduces the time cost of manufacturing the mounting bracket 100.

[0082] Based on the mounting bracket 100 provided in the above example, the mounting bracket 100 may further include a thermally conductive connection layer, which may be disposed between the groove wall of the mounting groove and the sensor to fixedly connect the sensor to the groove wall of the mounting groove.

[0083] The heat-conducting connection layer can be formed by a colloid with heat-conducting properties, such as organic silicon heat-conducting glue, epoxy resin heat-conducting glue, polyurethane heat-conducting glue, etc.

[0084] The thermally conductive connection layer may have a certain fluidity. Based on this, when the sensor is fixedly installed on the groove wall of the installation groove, the operator will directly or indirectly apply a force to the sensor toward the installation groove, so that the distance between the sensor and the groove wall of the installation groove becomes smaller, and the thermally conductive connection layer can flow under the pressure of the sensor, so that the thermally conductive connection layer between the sensor and the groove wall of the installation groove is more evenly distributed, thereby ensuring the bonding reliability between the sensor and the groove wall of the installation groove.

[0085] Compared with the prior art in which the fixed connection between the sensor and the groove wall of the mounting groove is achieved by welding, the example of the present application achieves the fixed connection between the sensor and the groove wall of the mounting groove by setting a thermal conductive connection layer, which can reduce the number of welding points, and thus make the distance between the sensor and the groove wall of the mounting groove more uniform, so that the sensor is set more flat, further improve the setting flatness of the sensor, and thus improve the reliability of the sensor.

[0086] In addition, since the thermally conductive connection layer has thermal conductivity and is disposed between the sensor and the mounting bracket 100 , the heat dissipation efficiency of the sensor can be further improved.

[0087] Based on the mounting bracket 100 provided in the above example, please refer to Figure 2 The groove wall of the installation groove may be provided with at least one first glue overflow hole 1112 .

[0088] The first glue overflow hole 1112 may be a blind hole, or a through hole. One first glue overflow hole 1112 may be provided, or a plurality of first glue overflow holes 1112 may be provided. The first glue overflow hole 1112 may be circular, oval, rectangular or other regular shapes, or may be composed of a plurality of regular shapes, or may be irregular in shape.

[0089] When there are multiple first glue overflow holes 1112, the multiple first glue overflow holes 1112 can be arranged regularly or randomly. The distances between adjacent first glue overflow holes 1112 can be equal or unequal.

[0090] Exemplarily, three first glue overflow holes 1112 may be provided, and the three first glue overflow holes 1112 may be arranged in a regular triangle, an isosceles triangle, or any triangle.

[0091] Exemplarily, four first glue overflow holes 1112 may be provided, and the four first glue overflow holes 1112 may be arranged in a square, a rectangle, a parallelogram, or any quadrilateral.

[0092] For example, five first glue overflow holes 1112 may be provided, and the five first glue overflow holes 1112 may be provided in a pentagon; four of the five first glue overflow holes 1112 may be provided in a quadrilateral, and the other first glue overflow hole 1112 may be provided in the quadrilateral; or the five first glue overflow holes 1112 may be arranged in other shapes. The specific arrangement of the first glue overflow holes 1112 is not limited in the examples of this application.

[0093] Based on the above, by providing the first glue overflow hole 1112, in the process of the sensor squeezing the thermally conductive connection layer and being fixedly connected to the groove wall of the mounting groove through the thermally conductive connection layer, the sensor can apply force to the thermally conductive connection layer, so that the excess thermally conductive connection layer can enter the first glue overflow hole 1112, or reach the inside of the mounting bracket 100 through the first glue overflow hole 1112, thereby improving the connection reliability between the sensor and the groove wall of the mounting groove. Since the mounting groove is provided on the mounting bracket 100, the reliable connection between the sensor and the groove wall of the mounting groove can achieve a reliable connection between the sensor and the mounting bracket 100.

[0094] Based on the mounting bracket 100 provided in the above example, along the assembly direction of the sensor, the size of the mounting groove may be smaller than the size of the sensor.

[0095] Along the installation direction of the sensor, the size of the installation groove may be the depth of the installation groove, and the size of the sensor may be the thickness of the sensor.

[0096] The mounting groove may be provided on the mounting surface, and the mounting groove may be fixedly connected to a sensor. A circuit board 200 is fixedly connected to a side of the sensor away from the mounting bracket 100 .

[0097] Based on this, when the sensor is fixedly installed in the mounting groove, since the thickness of the sensor is greater than the depth of the mounting groove, part of the sensor can be located outside the mounting groove. In this way, a gap can be maintained between the circuit board and the mounting bracket 100, reducing the possibility of a short circuit between the circuit board and the mounting bracket 100, thereby ensuring the reliability of the sensor module.

[0098] Based on the mounting bracket 100 provided in the above example, the portion of the mounting surface where the mounting groove is not provided can form a mounting boss relative to the mounting groove, and the mounting boss can be fixedly connected to at least part of the circuit board. The mounting boss can be fixedly connected to the circuit board by welding, or by bonding or other methods.

[0099] At least part of the circuit board can be fixedly connected to the mounting surface through the mounting boss. The circuit board can be fixedly connected to the mounting surface through the mounting boss by welding, bonding, etc.

[0100] The sensor is fixedly mounted in the mounting groove, and part of the circuit board is fixedly connected to the sensor. Since the mounting groove is part of the mounting bracket 100, part of the circuit board can be fixedly connected to the mounting bracket 100 through the fixed connection between the sensor and the groove wall of the mounting groove. Part of the circuit board can be connected to the mounting bracket 100 through the mounting boss, further ensuring the connection reliability between the circuit board and the mounting bracket 100.

[0101] In addition, since the sensor is arranged between the circuit board and the mounting bracket 100, the fixed connection between the circuit board and the mounting bracket 100 can further ensure the connection reliability between the sensor and the mounting bracket 100, reduce the possibility of shaking of the sensor relative to the mounting bracket 100, and further improve the detection reliability of the sensor.

[0102] Based on the mounting bracket 100 provided in the above example, the area of ​​the mounting surface may be smaller than the area of ​​the circuit board.

[0103] Compared with the prior art, the circuit board is welded to the mounting bracket 100, and the area of ​​the mounting surface is equal to the area of ​​the circuit board. In the example of the present application, the circuit board is fixedly connected to the mounting bracket 100 through the sensor, and the area of ​​the mounting surface can be smaller than the area of ​​the circuit board, thereby reducing the volume of the mounting bracket 100 and reducing the manufacturing cost of the mounting bracket 100.

[0104] Based on the mounting bracket 100 provided in the above example, please refer to Figure 2 The mounting boss may be provided with a second glue overflow hole 1114 .

[0105] The second glue overflow hole 1114 is set in a similar manner to the first glue overflow hole 1112 and plays a similar role. Please refer to the relevant description of the first glue overflow hole 1112 for details. This application example will not be described in detail here.

[0106] Next, the specific setting of the installation slot is illustrated with examples.

[0107] Based on the mounting bracket 100 provided in the above example, please refer to Figure 2 The mounting surface may include a first mounting surface 111, the mounting groove may include a first mounting groove 1111, the first mounting groove 1111 is arranged on one side of the first mounting surface 111, the first mounting groove 1111 is used to fix and install a first sensor, and the first sensor is used to detect the motion parameters of the movable device along the first direction.

[0108] When only relevant motion parameters of the movable device along the first direction are required, the movable device may be a device that can only move along the first direction, a device that can move within a certain plane, or a device that can move in space.

[0109] The first direction may be any direction. A coordinate axis is established with the initial position of the movable device as the origin and the moving direction of the movable device as the first direction. As shown in the figure, the first direction may be along the OX direction, the OY direction, or the OZ direction.

[0110] Taking the first direction along the OX direction as an example, the first direction may be the same as the OX direction, or the first direction may be opposite to the OX direction.

[0111] Taking the initial position of the movable device on the ground as an example, the first direction can be parallel to the ground, the first direction can be perpendicular to the ground, or there can be an angle between the first direction and the ground. This application example does not impose any specific restrictions on the first direction.

[0112] There may be only one first installation slot 1111, or there may be multiple first installation slots 1111. The present application example does not limit the specific implementation of the first installation slot 1111.

[0113] There may be one first sensor or a plurality of first sensors.

[0114] For example, the first sensor may be a first inertial sensor, and the first sensor may include at least one of a first acceleration sensor, a first angular velocity sensor, a first magnetic sensor, or other sensors. The specific type of the first sensor may be selected according to the usage scenario of the first sensor, and the present application does not impose any specific restrictions on this.

[0115] Based on the above, the first mounting surface 111 of the bracket body 110 is provided with a first mounting groove 1111 , the first sensor is fixedly mounted in the first mounting groove 1111 , and the first sensor can detect the motion parameters of the movable device along the first direction.

[0116] The portion of the first mounting surface 111 where the first mounting groove 1111 is not provided may form a first mounting boss 1113 relative to the first mounting groove 1111, and the first mounting boss 1113 may be fixedly connected to at least a portion of the first circuit board. The first mounting boss 1113 may be fixedly connected to the first circuit board by welding, or by bonding or other methods.

[0117] Compared with the prior art in which the sensor is welded to the circuit board and then welded to the mounting bracket through the circuit board to achieve a fixed connection between the sensor and the mounting bracket, in the example of the present application, the first sensor is fixedly mounted in the first mounting groove 1111, which can reduce the transmission medium between the first sensor and the mounting bracket 100, reduce the possibility of affecting the benchmark of the first sensor due to multiple welding, improve the setting flatness of the first sensor, and thereby improve the detection accuracy of the first sensor.

[0118] Based on the mounting bracket 100 provided in the above example, Figure 3 For a schematic diagram of the structure of a second viewing angle of a mounting bracket provided for this application example, please refer to Figure 2 and Figure 3 The mounting surface may further include a second mounting surface 112 and a first side wall 115 that are spaced apart from each other, and the second mounting surface 112 and the first side wall 115 are connected via the first mounting surface 111 .

[0119] The mounting groove may also include a second mounting groove 1121, which is arranged on the side of the second mounting surface 112 away from the second side wall. The second mounting groove 1121 is used to fix the second sensor, and the second sensor is used to detect the motion parameters of the movable device along the second direction, and the second direction may be perpendicular to the first direction.

[0120] The second mounting surface 112 may be located on a first side of the first mounting surface 111 , the first side wall 115 may be located on a second side of the first mounting surface 111 , and the first side and the second side may be disposed opposite to each other.

[0121] The second mounting surface 112 may be provided with one second mounting groove 1121 , or the second mounting surface 112 may be provided with a plurality of second mounting grooves 1121 .

[0122] There may be one second sensor, or there may be a plurality of second sensors.

[0123] For example, the second sensor may be a second inertial sensor, and the second sensor may include at least one of a second acceleration sensor, a second angular velocity sensor, a second magnetic sensor, or other sensors. The specific type of the second sensor may be selected according to the usage scenario of the second sensor, and the present application does not impose any specific restrictions on this.

[0124] The second sensor can detect the motion parameter of the movable device along the second direction. The second direction can be perpendicular to the first direction. When the first direction is set along the OX direction, the second direction can be set along the OY direction, or the second direction can be set along the OZ direction.

[0125] The portion of the second mounting surface 112 where the second mounting groove 1121 is not provided may form a second mounting boss 1122 relative to the second mounting groove 1121, and the second mounting boss 1122 may be fixedly connected to at least a portion of the second circuit board. The second mounting boss 1122 may be fixedly connected to the second circuit board by welding, or by bonding or other methods.

[0126] As described above, the mounting bracket 100 can provide mounting space for the first sensor and the second sensor at the same time. The first sensor can detect the motion parameters of the movable device along the first direction, and the second sensor can detect the motion parameters of the movable device along the second direction. The first direction and the second direction can cooperate to form a plane. Therefore, the motion parameters of the movable device within a certain plane can be detected by the first sensor and the second sensor, thereby expanding the application scope of the sensor module.

[0127] Based on the mounting bracket 100 provided in the above example, please refer to Figure 3 A mounting mark 1151 may be provided on a side of the first side wall 115 facing away from the second mounting surface 112 .

[0128] The installation mark 1151 may be at least one of text, letters, and patterns.

[0129] The installation mark 1151 can be used to indicate the moving direction of the movable device, and the direction indicated by the installation mark 1151 can be parallel to the first direction.

[0130] By setting the installation mark 1151, the installation accuracy of the installation bracket 100 and the movable device can be improved, and the assembly efficiency of the installation bracket 100 and the movable device can be improved.

[0131] Based on the mounting bracket 100 provided in the above example, please refer to Figure 2 and Figure 3The mounting surface may further include a third mounting surface 113 and a fourth mounting surface 114 that are spaced apart from each other, and the third mounting surface 113 and the fourth mounting surface 114 may be connected via the first mounting surface 111 .

[0132] The mounting slot may also include a third mounting slot 1131, which is disposed on a side of the third mounting surface 113 away from the fourth mounting surface 114, and is used to fix and install a third sensor, which is used to detect motion parameters of the movable device along a third direction, which is perpendicular to the first direction and perpendicular to the second direction. And / or, the mounting slot may also include a fourth mounting slot 1141, which is disposed on a side of the fourth mounting surface 114 away from the third mounting surface 113, and is used to fix and install a fourth sensor, which is used to detect motion parameters of the movable device along a third direction, which is perpendicular to the first direction and perpendicular to the second direction.

[0133] The mounting bracket 100 may include any one of the third mounting surface 113 and the fourth mounting surface 114, or the mounting bracket 100 may include both the third mounting surface 113 and the fourth mounting surface 114. The basic sensing functions of the third sensor and the fourth sensor may be different.

[0134] The third mounting surface 113 and the fourth mounting surface 114 have similar structures, and the third mounting surface 113 and the fourth mounting surface 114 will be described below by taking the third mounting surface 113 as an example.

[0135] The third mounting surface 113 may be provided with one third mounting groove 1131 , or the third mounting surface 113 may be provided with a plurality of third mounting grooves 1131 that are spaced apart from each other.

[0136] There may be one or more third sensors.

[0137] For example, the third sensor may be a third inertial sensor, and the third sensor may also include at least one of a third acceleration sensor, a third angular velocity sensor, a third magnetic sensor, or other sensors. The specific type of the third sensor may be selected according to the usage scenario of the third sensor, and the present application does not impose any specific restrictions on this.

[0138] The third direction may be perpendicular to the first direction and perpendicular to the second direction.

[0139] Please refer to 2 and Figure 3 , when the first direction is set along the OX direction and the second direction is set along the OY direction, the third direction can be set along the OZ direction. Based on this, the first direction, the second direction and the third direction can cooperate to form a spatial coordinate system, and the first sensor, the second sensor and the third sensor can monitor the movable device at the same time.

[0140] The portion of the third mounting surface 113 where the third mounting groove 1131 is not provided may form a third mounting boss 1132 relative to the third mounting groove 1131, and the third mounting boss 1132 may be fixedly connected to at least a portion of the third circuit board. The third mounting boss 1132 may be fixedly connected to the third circuit board by welding, or by bonding or other methods.

[0141] The portion of the fourth mounting surface 114 where the fourth mounting groove 1141 is not provided may form a fourth mounting boss 1142 relative to the fourth mounting groove 1141, and the fourth mounting boss 1142 may be fixedly connected to at least a portion of the fourth circuit board. The fourth mounting boss 1142 may be fixedly connected to the fourth circuit board by welding, or by bonding or other methods.

[0142] Based on the above, the mounting bracket 100 can provide mounting space for the first sensor, the second sensor, and the third sensor at the same time. The first sensor can detect the motion parameter of the movable device along the first direction, the second sensor can detect the motion parameter of the movable device along the second direction, and at least one of the third sensor and the fourth sensor can detect the motion parameter of the movable device along the third direction.

[0143] In addition, the first direction, the second direction and the third direction can cooperate to form a spatial coordinate system. Therefore, the motion parameters of the movable device in space can be detected by at least one of the third sensor and the fourth sensor, the first sensor and the second sensor, further expanding the application scope of the sensor module.

[0144] The mounting bracket 100 can be connected to the external component by welding, or by threading, riveting, etc. The external component can be a movable device, or another mounting frame or other component.

[0145] For example, Figure 4 Please refer to the structural diagram of another mounting bracket provided for this application example. Figure 4 The mounting bracket 100 may further include a connecting column 120, which is disposed on a side of the bracket body 110 away from the mounting surface, and is used to connect the bracket body 110 with an external component.

[0146] One or more connecting pillars 120 may be provided.

[0147] For example, the mounting bracket 100 may include a second side wall, and the second side wall may be spaced apart from the first mounting surface 111. The connecting column 120 may be disposed on a side of the second side wall away from the first mounting surface 111.

[0148] Exemplarily, the number of the connecting posts 120 may be two, three, four or even more. In this case, the mounting bracket 100 may include the second side wall, or the mounting bracket 100 may not include the second side wall. As long as the connection between the mounting bracket 100 and the external component can be achieved through the connecting posts 120, it will be sufficient.

[0149] The connecting column 120 can be connected to the external component by riveting, threading or other connection methods.

[0150] Based on the above, the connection between the bracket body 110 and the external component can be achieved by providing the connection column 120 .

[0151] Based on the mounting bracket 100 provided in the above example, three connecting posts 120 may be provided, and the three connecting posts 120 are arranged in a triangle.

[0152] Compared with the prior art in which four connecting columns 120 are provided to achieve the connection between the mounting bracket 100 and the external component, in the example of the present application, three connecting columns 120 are provided to achieve the connection between the mounting bracket 100 and the external component. The three connecting columns 120 can improve the consistency of the installation coplanarity, improve the connection reliability between the mounting bracket 100 and the external component, and reduce the possibility of the mounting bracket 100 shaking relative to the external component.

[0153] In addition, compared with the prior art in which four connection columns are provided, the example of the present application provides three connection columns 120 , which can reduce the manufacturing cost of the mounting bracket 100 .

[0154] Finally, it should be noted that the above embodiments are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A mounting bracket, characterized in that: Applied to a movable device, the mounting bracket comprises: The bracket body comprises a mounting surface, the mounting surface is provided with a mounting groove, the mounting groove is used for fixing and mounting a sensor, and the sensor is used for detecting the motion parameters of the movable device.

2. The mounting bracket according to claim 1, characterized in that: It also includes a heat-conducting connection layer, which is arranged between the groove wall of the installation groove and the sensor to fixedly connect the sensor and the groove wall of the installation groove.

3. The mounting bracket according to claim 2, characterized in that: The groove wall of the installation groove is provided with at least one first glue overflow hole.

4. The mounting bracket according to any one of claims 1 to 3, characterized in that: The mounting bracket is an integrated structure.

5. The mounting bracket according to claim 1, characterized in that: The mounting surface includes a first mounting surface, and the mounting groove includes a first mounting groove, wherein the first mounting groove is arranged on one side of the first mounting surface, and the first mounting groove is used for fixing and installing a first sensor, and the first sensor is used for detecting a motion parameter of the movable device along a first direction.

6. The mounting bracket according to claim 5, characterized in that: The mounting surface further comprises a second mounting surface and a first side wall which are spaced apart from each other, and the second mounting surface and the first side wall are connected via the first mounting surface; The mounting groove also includes a second mounting groove, which is arranged on the side of the second mounting surface away from the first side wall, and the second mounting groove is used to fix the second sensor, and the second sensor is used to detect the motion parameters of the movable device along a second direction, and the second direction is perpendicular to the first direction.

7. The mounting bracket according to claim 6, characterized in that: The mounting surface further comprises a third mounting surface and a fourth mounting surface which are spaced apart from each other, and the third mounting surface and the fourth mounting surface are connected via the first mounting surface; The mounting groove further includes a third mounting groove, the third mounting groove is arranged on a side of the third mounting surface away from the fourth mounting surface, the third mounting groove is used to fix and install a third sensor, and the third sensor is used to detect the motion parameters of the movable device along a third direction, the third direction is perpendicular to the first direction and perpendicular to the second direction; and / or, The mounting groove also includes a fourth mounting groove, which is arranged on a side of the fourth mounting surface away from the third mounting surface, and the fourth mounting groove is used to fix a fourth sensor, and the fourth sensor is used to detect motion parameters of the movable device along a third direction, and the third direction is perpendicular to the first direction and perpendicular to the second direction.

8. The mounting bracket according to claim 1, characterized in that: The mounting bracket also includes: A connecting column is arranged on a side of the bracket body away from the mounting surface, and the connecting column is used to connect the bracket body with an external component.

9. The mounting bracket according to claim 8, characterized in that: There are three connecting posts, and the three connecting posts are arranged in a triangle.

10. A sensor module, characterized in that: Installed on a movable device, the sensor module comprises a mounting bracket according to any one of claims 1 to 9, at least one sensor and at least one circuit board, one side of the sensor is connected to the mounting bracket, and the other side of the sensor is connected to the circuit board.

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