Stacked silicon wafer visual inspection mechanism and production equipment

Abstract

The utility model relates to a stacked silicon wafer visual inspection mechanism and production equipment with the same, and the stacked silicon wafer visual inspection mechanism comprises a detection platform which is used for placing silicon wafers; the positioning table is used for arranging the silicon wafers on the detection table; the visual assembly is provided with a camera used for detecting the appearance quality of the silicon wafer, and the visual assembly can move in the opposite angle and / or side edge direction of the silicon wafer; and the detection table is driven to drive the silicon wafer to penetrate through the positioning table to move to a range surrounded by the visual assembly and drive the silicon wafer to horizontally rotate, so that all side vertical surfaces of the silicon wafer are monitored by the visual assembly. The stacked silicon wafers can be put in order and then subjected to appearance inspection on the same operation platform, auxiliary clamping control of a mechanical arm is not needed in the quality inspection process, and the whole structure is reasonable in design, easy to operate and control, safe and stable.

Description

Technical Field

[0001] The present application belongs to the technical field of solar photovoltaic appearance inspection, and in particular, relates to a stacked silicon wafer inspection mechanism and production equipment provided with the inspection mechanism. Background Art

[0002] When inspecting the appearance of a stack of silicon wafers, a robot clamps a set of alignment surfaces or diagonal surfaces of the silicon wafer, suspends and positions the silicon wafer in a certain position, and then inspects the appearance of the silicon wafer. However, this inspection method of clamping the silicon wafer cannot fully inspect the four side elevations and four diagonal surfaces of the stack of silicon wafers, which not only affects the effect of the visual camera on the side elevation of the silicon wafer, but also affects the shooting range of the visual camera, resulting in unsatisfactory visual inspection results. In addition, during the appearance inspection, once the silicon wafer is out of position or irregular, the inspection result will be abnormal, and it needs to be reworked and regularized before the appearance inspection can be carried out, which has low production efficiency. Summary of the invention

[0003] The present application provides a stacked silicon wafer inspection mechanism and production equipment equipped with the inspection mechanism, which solves the technical problems of no re-regularization before inspection, incomplete appearance inspection and unsatisfactory inspection effect caused by unreasonable design of existing inspection mechanisms.

[0004] In order to solve at least one of the above technical problems, the technical solution adopted in this application is:

[0005] A stacked silicon wafer inspection mechanism, comprising:

[0006] A test table for placing silicon wafers;

[0007] A positioning table, used for regularizing the silicon wafer placed on the detection table;

[0008] A vision component, which is provided with a camera for detecting the appearance quality of the silicon wafer and can be moved along the diagonal and / or lateral direction of the silicon wafer;

[0009] Driving the detection platform can drive the silicon wafer to pass through the positioning platform and move into the range surrounded by the visual component, and drive the silicon wafer to rotate horizontally, so that all side elevations of the silicon wafer can be monitored by the visual component.

[0010] Furthermore, it also includes a flat platform for setting the positioning platform and the visual component, and the positioning platform is suspended above the visual component.

[0011] Furthermore, a lifting mechanism and a rotating mechanism are provided under the detection platform. The detection platform is connected to the rotating mechanism and is driven by the lifting mechanism to pass through the range enclosed by the visual component and the positioning platform to move up and down.

[0012] Furthermore, the lifting mechanism includes a lifting electric cylinder, a connecting shaft connected to the lifting electric cylinder, and a servo motor for driving the lifting electric cylinder, wherein the servo motor is located below the lifting electric cylinder, and the two ends of the lifting electric cylinder are respectively connected to the servo motor and the connecting shaft, and the lifting electric cylinder is connected to the rotating mechanism through the connecting shaft.

[0013] Furthermore, it also includes a guide column for guiding, and a push plate seat arranged on the upper end surface of the lifting electric cylinder, and the push plate seat is connected to the rotating mechanism through the guide column.

[0014] Furthermore, the rotating mechanism includes a rotating motor fixed on a fixed seat, a rotating shaft connected to the rotating motor, a fixed plate located below the detection platform, and a support rod for connecting the fixed seat and the fixed plate. It is arranged that the lifting electric cylinder is directly connected to the fixed seat through a connecting shaft, and the rotating shaft passes through the fixed plate and is connected to the detection platform.

[0015] Furthermore, the positioning platform is constructed as a "mouth"-shaped structure, and its position is lower than the position of the detection platform when the silicon wafer is received.

[0016] Furthermore, two groups of alignment cylinders are arranged on the positioning platform and extend toward one side of the center position thereof to regularize the side elevations of the opposite sides of the silicon wafer.

[0017] Further, the visual assembly includes a group of cameras arranged diagonally, a group of cameras arranged in a positional manner, and a sliding platform for fixing the group of cameras one and the group of cameras two;

[0018] The first group of cameras can move along the diagonal direction of the silicon wafer, and the second group of cameras can move along the side direction of the silicon wafer.

[0019] A production equipment is provided with the visual inspection mechanism as described above.

[0020] The visual inspection mechanism for stacked silicon wafers designed by the present application can firstly regularize the stacked silicon wafers and then inspect their appearance on the same operating platform. No robot is required to assist in clamping and control during the quality inspection process. The overall structural design is reasonable, and the operation is simple, safe and stable. In addition, the visual inspection mechanism of the present application can continuously inspect the appearance of two groups of diagonal side elevations and all edge side elevations of the stacked silicon wafers, and can quickly and accurately obtain the appearance image of the silicon wafers, and can accurately judge their quality. The present application also proposes a production equipment equipped with the visual inspection mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a three-dimensional diagram of the visual inspection mechanism in this application;

[0022] Figure 2It is a three-dimensional diagram of the visual inspection mechanism from another angle in this application;

[0023] Figure 3 It is a three-dimensional diagram of the cooperation between the jacking structure and the rotating mechanism in this application.

[0024] In the figure:

[0025] 100, visual inspection mechanism 10, platform 20, testing platform

[0026] 30, positioning table 40, alignment cylinder 50, lifting mechanism

[0027] 51. Lifting electric cylinder 52. Servo motor 53. Guide column

[0028] 54, push plate seat 60, rotating mechanism 61, rotating motor

[0029] 62, fixed plate 63, rotating shaft 64, supporting rod

[0030] 70. Visual component 71. Camera group 1 72. Camera group 2

[0031] 73, diagonal slide rail 74, side slide rail 75, sliding table

[0032] 80. Silicon wafer DETAILED DESCRIPTION

[0033] The present application is described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] This embodiment provides a stacked silicon wafer inspection mechanism 100. Figure 1-2 As shown, it includes a device for visual inspection of a stack of silicon wafers 80, including a test table 20 for placing the silicon wafers 80, a positioning table 30 for aligning the silicon wafers 80 placed on the test table 20, and a visual component 70 for visual inspection of the appearance of the silicon wafers 80. The positioning table 30 is suspended and fixed on the platform 10, and is provided with a hole groove passed by the test table 20; the visual component 70 is arranged on the platform 10, and can be moved along the diagonal and / or side direction of the platform 10 to inspect the diagonal and side elevations of the silicon wafers 80. The height of the positioning table 30 is located above the visual component 70, that is, the silicon wafers 80 are first aligned, and then the appearance of the aligned silicon wafers is inspected.

[0035] In this embodiment, the silicon wafers 80 are collectively referred to as a stack of stacked substrates, which may be square-structured substrates or rectangular-structured substrates, both of which meet all the units in this application and are within the protection scope of this case.

[0036] Before being placed on the inspection table 20, there may be misalignment or misalignment between individual single pieces or packaging materials and the silicon wafer, so before visual inspection, the silicon wafer 80 needs to be straightened to ensure that the visual component 70 can accurately inspect the diagonal corners and four side elevations of the silicon wafer to ensure the appearance quality of the silicon wafer.

[0037] A lifting mechanism 50 and a rotating mechanism 60 are provided under the test platform 20. The test platform 20 is directly connected to the rotating mechanism 60 and driven by the lifting mechanism 50 to move up and down. The test platform 20 passes through the flat platform 10 and the positioning platform 30 in sequence through the lifting mechanism 50 to move up and down, that is, after the test platform 20 receives the silicon wafer 80, it drives the silicon wafer 80 to move downward and passes through the positioning platform 30 to descend to the range surrounded by the visual component 70; the rotating mechanism 60 can drive the silicon wafer 80 to rotate horizontally through the test platform 20, so that all side elevations of the silicon wafer can be monitored by the visual component 70, thereby realizing the visual component 70 to inspect the appearance of the silicon wafer 80 around.

[0038] The position of the test platform 20 when receiving the silicon wafer is higher than the position of the positioning platform 30. Since the gap between the positioning platform 30 and the test platform 20 is limited, it is preferred that the initial position of the test platform 20 when receiving the silicon wafer is the highest position of the test platform 20, which is higher than the position of the positioning platform 30. The test platform 20 then drives the silicon wafer to move downward to the height of the positioning platform 30, and after being regulated by the alignment cylinder 40, it descends to the lowest position of the test platform 20 to prepare for visual inspection of the appearance. Correspondingly, the lowest position of the test platform 20 is the position monitored by the visual component 70, which is at the same height as the position of the platform 10. In the visual component 70, a group of cameras 71 for inspecting the diagonal side elevations of the silicon wafer moves along the diagonal of the silicon wafer, and a group of cameras 72 for inspecting the side elevations of the opposite sides of the silicon wafer moves along the side direction of the silicon wafer.

[0039] The testing table 20 is a flat table with negative pressure suction holes to facilitate the adsorption and fixation of the silicon wafer placed thereon. Specifically, the platform 10 is a rectangular platform plate, the length direction of which is arranged along the length direction of the packaging machine, and is supported by the frame. The testing table 20 is located at the center of the platform 10, and a lifting mechanism 50 for controlling the lifting and lowering of the testing table 20 and a rotating mechanism 60 for controlling the rotation of the testing table 20 are arranged below it.

[0040] like Figure 3As shown, the lifting mechanism 50 includes a lifting cylinder 51, a coupling shaft connected to the lifting cylinder 51, a servo motor 52 for driving the lifting cylinder 51, and a guide column 53 for guiding and fixing the lifting cylinder 51 up and down, wherein the servo motor 52 is located below the lifting cylinder 51, and the two ends of the lifting cylinder 51 are respectively connected to the servo motor 52 and the coupling shaft, and the lifting cylinder 51 is connected to the fixing seat of the rotating motor 61 through the coupling shaft. A push plate seat 54 is provided on the upper end surface of the lifting cylinder 51, and is connected to the fixing plate 62 in the rotating mechanism 60 through the guide column 53, the upper end of the guide column 53 is fixed to the lower bottom surface of the fixing plate 62, and the lower end thereof directly penetrates the push plate seat 54, and is used for accurately guiding the lifting position.

[0041] The rotating mechanism 60 includes a rotating motor 61 fixed on a fixed seat, a rotating shaft 63 connected to the rotating motor 61, a fixed plate 62 located below the test bench 20, and four support rods 64 for connecting the fixed seat and the fixed plate 62. The lifting cylinder 51 is directly connected to the fixed seat through a connecting shaft, and it can drive the entire rotating mechanism 60 and the test bench 20 to move up and down together. The rotating shaft 63 passes through the fixed plate 62 and is directly connected to the test bench 20, and the fixed plate 62 and the test bench 20 are set with a gap. Then, when the rotating motor 61 is working, it directly drives the rotating shaft 63 to drive the test bench 20 to rotate, wherein the rotation angle of the test bench 20 can be preset based on needs. In this embodiment, since the silicon wafer 80 is a quadrilateral structure, when monitoring the appearance of the opposite side facade, it is only necessary to control the test bench 20 to rotate 90°.

[0042] The positioning platform 30 is suspended on the flat platform 10 through the positioning brackets arranged in alignment. In order to avoid the position of the second camera group 72 for inspecting the opposite side elevations of the silicon wafer, the positioning brackets are arranged on the alignment surface where the second camera group 72 is not located. In order to ensure that the four side elevations and four oblique side surfaces of the silicon wafer, that is, the two groups of opposite side elevations and the two groups of diagonal side surfaces can be visually inspected and monitored, it is necessary to control the inspection platform 20 to rotate 90° through the rotating mechanism 60 after inspecting one group of opposite side elevations and diagonal side elevations, and then visually inspect and monitor the other group of opposite side elevations and diagonal side elevations, so that all side elevations of the silicon wafer can be fully inspected to check whether there are defects such as notches, scratches, cracks or depressions on the side elevations of the silicon wafer.

[0043] The positioning platform 30 is constructed as a "mouth"-shaped structure, and the space reserved therein is for the detection platform 20 carrying the silicon wafer to pass through, and the silicon wafer can be regulated by four alignment cylinders 40 thereon. The structure of the positioning platform 30 is adapted to the structure of the silicon wafer 80, and a square silicon wafer structure is used as an example here; accordingly, the detection platform 20 and the positioning platform 30 used for rectangular silicon wafers are omitted in the drawings.

[0044] The size of the inspection platform 20 is smaller than the inner wall size of the positioning platform 30, which is not only convenient for the manipulator to hold the silicon wafer, but also convenient for the silicon wafer to move up and down. The alignment cylinder 40 is controlled to extend and retract toward the position of the silicon wafer in the middle to regularize the four side elevations of the silicon wafer.

[0045] The visual component 70 includes a camera group 71 for detecting the diagonal side elevation of the silicon wafer, a camera group 72 for detecting the side elevation of the opposite side of the silicon wafer, and a slide table 75 for fixing the camera group 71 and the camera group 72. At the same time, a diagonal slide rail 73 for driving the camera group 71 to move diagonally along the silicon wafer and a side slide rail 74 for driving the camera group 72 to slide along the length direction of the opposite side of the silicon wafer are also provided on the flat platform 10. The slide table 75 is arranged on the diagonal slide rail 73 and the side slide rail 74 and drives the camera to slide along the length direction thereof respectively to adjust its inspection position on the silicon wafer so that the side elevation of the silicon wafer is covered by the camera. Among them, the working principle of the camera taking pictures of the side elevation of the silicon material to inspect the appearance of the silicon wafer is common knowledge in the art and will not be described in detail here.

[0046] Since the diagonal side elevation of the silicon wafer is small in area, the camera group 71 can directly take photos of it for inspection, and a comprehensive visual inspection can be obtained with only one operation. Since the diagonal cameras are close to the diagonal side elevation, before the next diagonal visual inspection, the camera group 71 needs to be withdrawn away from the silicon wafer along the diagonal slide rail 73. After the silicon wafer is rotated 90° and positioned completely, it is approached to the diagonal side elevation of the silicon wafer again for photo inspection. After each diagonal side elevation visual inspection is completed, it is necessary to control the camera group 71 to withdraw to its initial position, that is, a safe position away from the position of the silicon wafer.

[0047] However, the side length of the silicon wafer is relatively long, and the second camera group 72 cannot obtain a full view of the entire length at a certain position on the side of the silicon wafer. Therefore, when inspecting each set of side elevations of the silicon wafer, it is necessary to control the second camera group 72 to move along the length direction of the side slide rail 74, and gradually illuminate the full view of the side, so that the side elevation inspection of the side is completed. Then, the rotating mechanism 60 drives the inspection table 20 to rotate the silicon wafer 90°, and then the second camera group 72 is controlled to take photos of the other set of side elevations.

[0048] If the position of the second camera group 72 when taking pictures is close to the position of the silicon wafer, it is necessary to control the second camera group 72 to withdraw to the end of the silicon wafer along the side slide rail 74 during the process of the silicon wafer rotating 90° to avoid bumping the silicon wafer. The initial position of the second camera group 72 can be set at the end side of the side of the silicon wafer, wherein the cameras on both sides can be set at different ends, that is, set along the counter angle of the silicon wafer; during detection, the cameras on both sides move synchronously towards each other. Of course, the cameras on both sides can also be set at the same end side, that is, located at the same side end of the silicon wafer; during detection, the cameras on both sides move synchronously in the same direction.

[0049] In this process, the silicon wafer 80 is moved by the robot to the testing table 20 at its highest position, and the robot withdraws; at this time, the testing table 20 is located above the positioning table 30. The lifting mechanism 50 then drives the testing table 20 down to the same height as the positioning table 30, and it is left there to wait for adjustment.

[0050] The alignment cylinders 40 disposed on the positioning platform 30 begin to synchronously push toward the side elevations of the four sides of the silicon wafer to abut against the side elevations of the silicon wafer to make the silicon wafer regular.

[0051] After the silicon wafer is tidied, the inspection platform 20 carrying the silicon wafer is driven by the lifting mechanism 50, passes through the positioning platform 30 and moves down to the flat platform 10, so as to be located in the space surrounded by the visual component 70, and the silicon wafer is arranged at the same height as the visual component 70. The first camera group 71 takes pictures to inspect the diagonal side elevations of the silicon wafer, and the second camera group 72 takes pictures to inspect the side elevations of the silicon wafer. The first camera group 71 and the second camera group 72 first inspect one group of diagonal side elevations and one group of side elevations, and then control the inspection platform 20 to drive the silicon wafer to rotate 90°. After the inspection is completed, the first camera group 71 and the second camera group 72 are controlled to inspect the other group of diagonal side elevations and the other group of side elevations.

[0052] During the entire video appearance inspection process, the silicon wafer is controlled to rotate 90°, while the position of the visual component 70 remains unchanged. Only the horizontal position of the camera needs to be moved to fully and clearly inspect all the side elevations of the silicon wafer. The structure is simple and easy to operate. After the visual inspection is completed, the lifting mechanism 50 directly pushes the inspection table 20 and drives the silicon wafer 80 to pass through the positioning table 30 and rise to the top of the positioning table 30, that is, it moves up to the highest position of the inspection table 20 and rests.

[0053] If the inspection result of the silicon wafer 80 is qualified, it will be moved to the next process by the robot. If the inspection result of the silicon wafer 80 is abnormal, the system determines that it is unqualified, and it will be moved to the abnormal product circulation collection place by the robot.

[0054] A production equipment is provided with the visual inspection mechanism 100 as described above.

[0055] The visual inspection mechanism for stacked silicon wafers designed by the present application can firstly regularize the stacked silicon wafers and then inspect their appearance on the same operating platform. No robot is required to assist in clamping and control during the quality inspection process. The overall structural design is reasonable, and the operation is simple, safe and stable. In addition, the visual inspection mechanism of the present application can continuously inspect the appearance of two groups of diagonal side elevations and all edge side elevations of the stacked silicon wafers, and can quickly and accurately obtain the appearance image of the silicon wafers, and can accurately judge their quality. The present application also proposes a production equipment equipped with the visual inspection mechanism.

[0056] The above detailed description of the embodiments of the present application is only a preferred embodiment of the present application and cannot be considered to limit the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application should still fall within the scope of the patent coverage of the present application.

Claims

1. A stacked silicon wafer inspection mechanism, characterized in that: include: A test table for placing silicon wafers; A positioning table, used for regularizing the silicon wafer placed on the detection table; A vision component, which is provided with a camera for detecting the appearance quality of the silicon wafer and can be moved along the diagonal and / or lateral direction of the silicon wafer; Driving the detection platform can drive the silicon wafer to pass through the positioning platform and move into the range surrounded by the visual component, and drive the silicon wafer to rotate horizontally, so that all side elevations of the silicon wafer can be monitored by the visual component.

2. The stacked silicon wafer inspection mechanism according to claim 1, characterized in that: The invention also comprises a flat platform for setting the positioning platform and the visual component, and the positioning platform is suspended above the visual component.

3. A stacked silicon wafer inspection mechanism according to claim 1 or 2, characterized in that: A lifting mechanism and a rotating mechanism are arranged under the detection platform. The detection platform is connected to the rotating mechanism and is driven by the lifting mechanism to pass through the range surrounded by the visual component and the positioning platform to move up and down.

4. The stacked silicon wafer inspection mechanism according to claim 3, characterized in that: The lifting mechanism includes a lifting electric cylinder, a connecting shaft connected to the lifting electric cylinder, and a servo motor for driving the lifting electric cylinder, wherein the servo motor is located below the lifting electric cylinder, and the two ends of the lifting electric cylinder are respectively connected to the servo motor and the connecting shaft, and the lifting electric cylinder is connected to the rotating mechanism through the connecting shaft.

5. The stacked silicon wafer inspection mechanism according to claim 4, characterized in that: It also includes a guide column for guiding, and a push plate seat arranged on the upper end surface of the lifting electric cylinder, and the push plate seat is connected to the rotating mechanism through the guide column.

6. The stacked silicon wafer inspection mechanism according to claim 4, characterized in that: The rotating mechanism includes a rotating motor fixed on a fixed seat, a rotating shaft connected to the rotating motor, a fixed plate located below the detection platform, and a support rod for connecting the fixed seat and the fixed plate. The lifting electric cylinder is directly connected to the fixed seat through a connecting shaft, and the rotating shaft passes through the fixed plate and is connected to the detection platform.

7. A stacked silicon wafer inspection mechanism according to any one of claims 1-2, 4-6, characterized in that: The positioning platform is constructed as a "mouth"-shaped structure, and its position is lower than the position of the detection platform when the silicon wafer is received.

8. The stacked silicon wafer inspection mechanism according to claim 7, characterized in that: Two groups of alignment cylinders extending toward one side of the center position are arranged on the positioning platform to regularize the side elevations of the opposite sides of the silicon wafer.

9. A stacked silicon wafer inspection mechanism according to any one of claims 1-2, 4-6, and 8, characterized in that: The visual assembly includes a camera group arranged diagonally, a camera group arranged in a positional manner, and a sliding platform for fixing the camera group and the camera group; The first group of cameras can move along the diagonal direction of the silicon wafer, and the second group of cameras can move along the side direction of the silicon wafer.

10. A production equipment, characterized in that: The device is provided with a visual inspection mechanism as described in any one of claims 1 to 9.

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