Novel energy-saving server mainboard
By designing structures such as vertical board, mounting board, vertical rack, main heat dissipation fan on the server motherboard, the problem of low heat dissipation efficiency in the existing technology is solved, and more efficient heat dissipation effect and more uniform heat dissipation distribution are achieved, and energy waste is avoided.
Patent Information
- Application Number
- CN202421775278.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-25
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-07-25
AI Technical Summary
The heat dissipation efficiency of existing server motherboards leads to the need to add multiple fans to increase airflow speed, resulting in waste of energy and low heat dissipation efficiency.
A new server motherboard was designed, which adopts structures such as vertical board, mounting board, vertical frame, main heat dissipation fan, air concentrating pipe, branch pipe, air concentrating bucket and air outlet ring. The main heat dissipation fan drives heat outward through the main heat dissipation fan. The air concentrating bucket accurately dissipates heat to the electronic components, and the branch pipe and air concentrating pipe gather heat to the air outlet ring to improve heat dissipation efficiency.
It achieves better heat dissipation effect and higher heat dissipation efficiency, avoids the waste of energy from increasing fans to improve heat dissipation effect, and directly aims at the electronic components for heat dissipation, ensuring uniform heat dissipation of each component.
Smart Images

Figure CN222801100U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of server mainboards, in particular to a novel energy-saving server mainboard. Background Art
[0002] The server motherboard is one of the core components of the server. It carries various important electronic components and provides various interfaces and slots to connect other hardware components and external devices. The server motherboard provides support for the normal operation and performance of the server, including the connection of the CPU and memory, the provision of expansion slots, the configuration of storage interfaces and network interfaces, etc. It coordinates and connects the various components of the server to ensure that they can work properly and coordinate with each other.
[0003] When the server is running, the motherboard will generate a lot of heat. The heat dissipation problem is particularly important, and fans are generally used to cool it down. However, existing cooling fans often drive the airflow to flow from the side of the motherboard. Since the motherboard is equipped with electronic components of various heights, the higher electronic components will block the airflow, affecting the heat dissipation effect of the lower electronic components at the rear. In order to ensure the heat dissipation of each electronic component, multiple fans need to be added to increase the airflow speed, which causes energy waste and the heat dissipation efficiency needs to be improved. To this end, a new energy-saving server motherboard is proposed for improvement. Utility Model Content
[0004] The purpose of the present invention is to solve at least one of the above technical deficiencies.
[0005] Therefore, one purpose of the present invention is to provide a novel energy-saving server motherboard to solve the problems mentioned in the background technology and overcome the deficiencies in the prior art.
[0006] In order to achieve the above-mentioned purpose, an embodiment of one aspect of the utility model provides a new energy-saving server motherboard, including a motherboard and a mounting plate, wherein the front of the motherboard is fixedly connected to a plurality of vertical plates, the bottom surface of the mounting plate is fixedly connected to a vertical frame, the vertical frame and the vertical plate are fixedly connected, a main cooling fan is arranged on the mounting plate, an air collecting pipe is arranged inside the mounting plate, an air outlet ring is opened on the mounting plate at the main cooling fan, the air collecting pipe is connected to the air outlet ring, a plurality of branch pipes are fixedly connected to the bottom of the air collecting pipe, and an air collecting bucket is fixedly connected to the bottom end of the branch pipe;
[0007] The back of the mainboard is fixedly connected with a leg, the bottom surface of the leg is fixedly connected with a fixing plate, the back of the mainboard is fixedly connected with a heat dissipation rod, one end of the mainboard is fixedly connected with a blowing fan, and the other end of the mainboard is fixedly connected with an exhaust fan.
[0008] Preferably, any of the above schemes is that a plurality of the vertical plates are fixedly connected to the edges and corners of the main board, and a plurality of through holes are formed on the vertical plates.
[0009] Preferably, any of the above schemes is that the stand is fixedly connected to the stand plate by bolts, and the main cooling fan is arranged in the middle of the mounting plate.
[0010] Adopting the above technical solution: the motherboard provides a mounting platform for various electronic components, and provides various interfaces and slots to connect other hardware components and external devices, including the connection of CPU and memory, the provision of expansion slots, the configuration of storage interface and network interface, etc. The vertical plate is used to cooperate with the vertical frame to support the mounting plate, so that the mounting plate is connected to the motherboard. The mounting plate is installed on the motherboard through the vertical plate and the vertical frame, which is convenient for connecting other electronic components to the motherboard. A number of through holes are opened on the vertical plate to facilitate the adjustment of the installation height of the mounting plate according to actual needs.
[0011] Preferably, any of the above schemes is that a plurality of branch pipes are also provided at the bottom of the air outlet ring, and the air collecting hopper is provided corresponding to the electronic components on the mainboard.
[0012] Preferably, any of the above schemes is that the legs are arranged at the corners of the main board, and a plurality of fixing holes are formed on the fixing plate.
[0013] The above technical solution is adopted: the main cooling fan is responsible for dissipating the main heat on the motherboard. It is installed in the middle of the mounting plate to facilitate the flow of heat in the middle of the motherboard. The air outlet ring collects and gathers the hot air in the air collecting pipe and the branch pipe so that the main cooling fan can discharge this part of the heat. The branch pipe provides a circulation path for the hot air and guides the hot air to the air outlet ring. The air collecting bucket collects the heat from the electronic components, accurately dissipates the heat of the electronic components, and improves the heat dissipation efficiency. The legs provide support for the motherboard, so that the back of the motherboard has a certain space. The fixing plate can be used to connect the motherboard with the external foundation.
[0014] Preferably, any of the above schemes has a plurality of heat dissipation rods which are evenly arranged on the back of the mainboard, and the height of the heat dissipation rods is not greater than the height of the legs.
[0015] Preferably, any of the above solutions has the middle parts of the blowing fan and the exhaust fan fixedly connected to the mainboard by bolts.
[0016] The above technical solution is adopted: the heat dissipation rod can increase the contact area between the motherboard and the air, and dissipate the heat into the air faster. Several heat dissipation rods are evenly arranged on the back of the motherboard to ensure the uniformity of heat dissipation in various parts of the motherboard. The blowing fan drives the gas flow at one end of the motherboard to promote the heat dissipation on the motherboard. The exhaust fan drives the gas flow at the other end of the motherboard to increase the air flow speed and further improve the heat dissipation efficiency. The middle part of the two is connected to the motherboard by bolts, so that the effect of the two driving the gas flow can affect the front and back sides of the motherboard at the same time, further improving the heat dissipation effect.
[0017] Compared with the prior art, the advantages and beneficial effects of the utility model are:
[0018] 1. This new energy-saving server motherboard is equipped with vertical plates, mounting plates, vertical frames, main cooling fans, and structures such as air collecting pipes, branch pipes, air collecting buckets, and air outlet rings. The main cooling fan is started, and the air collecting buckets collect the heat from the electronic components on the motherboard. The hot air is gathered to the air outlet ring through the branch pipes and air collecting pipes, and then driven by the main cooling fan to flow to the outside. The heat dissipation effect is directly aimed at each electronic component, and the heat is directly dissipated from the heat source. The airflow will not be blocked due to the different heights of the electronic components. The heat dissipation effect is better and the heat dissipation efficiency is higher. There is no need to accumulate more fans to ensure the heat dissipation effect at each electronic component, which is more energy-saving.
[0019] 2. The new energy-saving server motherboard is provided with legs, heat dissipation rods, blowing fans, exhaust fans and other components. The legs provide support for the motherboard, so that the back of the motherboard has a certain space, which is convenient for the heat on the back of the motherboard to dissipate outward. The heat dissipation rod can increase the contact area between the motherboard and the air, and dissipate the heat into the air faster. Several heat dissipation rods are evenly arranged on the back of the motherboard to ensure the uniformity of heat dissipation in various parts of the motherboard.
[0020] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0022] Figure 1 This is a schematic diagram of the structure of the utility model from a first perspective;
[0023] Figure 2 This is a schematic diagram of the structure of the utility model from a second viewing angle;
[0024] Figure 3 This is a schematic diagram of the structure of the utility model from a third viewing angle;
[0025] Figure 4 It is a schematic diagram of the cutaway structure of the utility model.
[0026] In the figure: 1-mainboard, 2-vertical board, 3-mounting board, 4-vertical frame, 5-main cooling fan, 6-gas collecting pipe, 7-branch pipe, 8-gas collecting bucket, 9-support leg, 10-fixing plate, 11-heat dissipation rod, 12-blowing fan, 13-exhaust fan. DETAILED DESCRIPTION
[0027] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.
[0028] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0029] like Figures 1 to 4 As shown, the utility model comprises a main board 1 and a mounting plate 3, a plurality of vertical boards 2 are fixedly connected to the front of the main board 1, a vertical frame 4 is fixedly connected to the bottom of the mounting plate 3, the vertical frame 4 and the vertical board 2 are fixedly connected, a main cooling fan 5 is arranged on the mounting plate 3, an air collecting pipe 6 is arranged inside the mounting plate 3, an air outlet ring 14 is opened at the main cooling fan 5 of the mounting plate 3, the air collecting pipe 6 is connected to the air outlet ring 14, a plurality of branch pipes 7 are fixedly connected to the bottom of the air collecting pipe 6, and an air collecting bucket 8 is fixedly connected to the bottom end of the branch pipe 7;
[0030] A leg 9 is fixedly connected to the back of the mainboard 1, a fixing plate 10 is fixedly connected to the bottom of the leg 9, a heat dissipation rod 11 is fixedly connected to the back of the mainboard 1, a blowing fan 12 is fixedly connected to one end of the mainboard 1, and an exhaust fan 13 is fixedly connected to the other end of the mainboard 1.
[0031] Embodiment 1: Several vertical plates 2 are fixedly connected to the edges and corners of the mainboard 1, and several through holes are opened on the vertical plates 2. The stand 4 is fixedly connected to the vertical plates 2 by bolts, and the main cooling fan 5 is arranged in the middle of the mounting plate 3. The mainboard 1 provides a mounting platform for various electronic components, and provides various interfaces and slots to connect other hardware components and external devices, including the connection of the CPU and memory, the provision of expansion slots, the configuration of storage interfaces and network interfaces, etc. The vertical plates 2 are used to cooperate with the stand 4 to support the mounting plate 3, so that the mounting plate 3 is connected to the mainboard 1. The mounting plate 3 is installed on the mainboard 1 through the vertical plates 2 and the stand 4, which is convenient for connecting other electronic components to the mainboard 1. Several through holes are opened on the vertical plates 2 to facilitate the adjustment of the installation height of the mounting plate 3 according to actual needs.
[0032] Embodiment 2: Several branch pipes 7 are also provided at the bottom of the air outlet ring 14, and the air collecting hopper 8 is provided corresponding to the electronic components on the main board 1. The legs 9 are provided at the corners of the main board 1, and several fixing holes are provided on the fixing plate 10. The main cooling fan 5 is responsible for dissipating the main heat on the main board 1 to the outside. It is installed in the middle of the mounting plate 3 to facilitate the flow of heat in the middle of the main board 1. The air outlet ring 14 collects and gathers the hot air in the air collecting pipe 6 and the branch pipe 7 so that the main cooling fan 5 can discharge this part of the heat. The branch pipe 7 provides a circulation path for the hot air and guides the hot air to the air outlet ring 14. The air collecting hopper 8 collects the heat at the electronic components, accurately dissipates the heat of the electronic components, and improves the heat dissipation efficiency. The legs 9 provide support for the main board 1, so that a certain space is obtained on the back of the main board 1. The fixing plate 10 can be connected to the external foundation for the main board 1.
[0033] Embodiment 3: There are several heat dissipation rods 11 and they are evenly arranged on the back of the mainboard 1. The height of the heat dissipation rods 11 is not greater than the height of the legs 9. The middle parts of the blowing fan 12 and the exhaust fan 13 are fixedly connected to the mainboard 1 by bolts. The heat dissipation rod 11 can increase the contact area between the mainboard 1 and the air, and dissipate the heat into the air faster. Several heat dissipation rods 11 are evenly arranged on the back of the mainboard 1 to ensure the uniformity of heat dissipation in various parts of the mainboard 1. The blowing fan 12 promotes the gas flow at one end of the mainboard 1 to promote the heat on the mainboard 1 to dissipate outward. The exhaust fan 13 drives the gas flow at the other end of the mainboard 1, increases the air flow speed, and further improves the heat dissipation efficiency. The middle parts of the two are connected to the mainboard by bolts, so that the action of the two driving the gas flow can affect the front and back sides of the mainboard 1 at the same time, further improving the heat dissipation effect.
[0034] The working principle of the utility model is as follows:
[0035] S1, start the main cooling fan 5, the air collecting bucket 8 collects the heat from the electronic components on the mainboard 1, the hot air is gathered to the air outlet ring 14 through the branch pipe 7 and the air collecting pipe 6, and then driven by the main cooling fan 5 to flow to the outside;
[0036] S2. The legs 9 provide support for the mainboard 1, so that a certain amount of space is available on the back of the mainboard 1. The heat dissipation rods 11 increase the contact area between the mainboard 1 and the air, dissipating the heat into the air more quickly;
[0037] S3. The blowing fan 12 cooperates with the exhaust fan 13 to drive the air flow on both sides of the mainboard 1 to further improve the heat dissipation effect.
[0038] Compared with the prior art, the present invention has the following beneficial effects:
[0039] 1. The new energy-saving server motherboard is provided with a vertical plate 2, a mounting plate 3, a vertical frame 4, a main cooling fan 5, a gas collecting pipe 6, a branch pipe 7, a gas collecting bucket 8, an air outlet ring 14 and other structures. The main cooling fan 5 is started, and the gas collecting bucket 8 collects the heat of each electronic component on the motherboard 1. The hot air is gathered to the air outlet ring 14 through the branch pipe 7 and the gas collecting pipe 6, and then driven by the main cooling fan 5 to flow to the outside. The heat dissipation effect is directly aimed at each electronic component, and the heat is directly dissipated from the heat source. The airflow will not be blocked due to the different heights of the electronic components, and the heat dissipation effect is better and the heat dissipation efficiency is higher. There is no need to accumulate more fans to ensure the heat dissipation effect at each electronic component, which is more energy-saving.
[0040] 2. The new energy-saving server motherboard is provided with components such as legs 9, heat dissipation rods 11, blowing fans 12, and exhaust fans 13. The legs 9 provide support for the motherboard 1, so that the back of the motherboard 1 has a certain space, which is convenient for the heat on the back of the motherboard 1 to dissipate outward. The heat dissipation rods 11 can increase the contact area between the motherboard 1 and the air, and dissipate the heat into the air faster. A plurality of heat dissipation rods 11 are evenly arranged on the back of the motherboard 1, which can ensure the uniformity of heat dissipation at various places of the motherboard 1.
Claims
1. A novel energy-saving server motherboard, comprising a motherboard (1) and a mounting plate (3); characterized in that: The front surface of the main board (1) is fixedly connected to a plurality of vertical boards (2); the bottom surface of the mounting plate (3) is fixedly connected to a vertical frame (4); the vertical frame (4) and the vertical board (2) are fixedly connected; a main cooling fan (5) is arranged on the mounting plate (3); an air collecting pipe (6) is arranged inside the mounting plate (3); an air outlet ring (14) is provided on the mounting plate (3) at the main cooling fan (5); the air collecting pipe (6) is connected to the air outlet ring (14); a plurality of branch pipes (7) are fixedly connected to the bottom of the air collecting pipe (6); and a gas collecting bucket (8) is fixedly connected to the bottom end of the branch pipe (7); The back of the mainboard (1) is fixedly connected to a support leg (9), the bottom surface of the support leg (9) is fixedly connected to a fixing plate (10), the back of the mainboard (1) is fixedly connected to a heat dissipation rod (11), one end of the mainboard (1) is fixedly connected to a blower fan (12), and the other end of the mainboard (1) is fixedly connected to an exhaust fan (13).
2. A new energy-saving server motherboard as claimed in claim 1, characterized in that: A plurality of the vertical plates (2) are fixedly connected to the edges and corners of the main plate (1), and a plurality of through holes are provided on the vertical plates (2).
3. A new energy-saving server motherboard as claimed in claim 2, characterized in that: The stand (4) is fixedly connected to the stand plate (2) by means of bolts, and the main cooling fan (5) is arranged in the middle of the mounting plate (3).
4. A new energy-saving server motherboard as claimed in claim 3, characterized in that: A plurality of branch pipes (7) are also arranged at the bottom of the air outlet ring (14), and the air collecting hopper (8) is arranged corresponding to the electronic components on the main board (1).
5. A new energy-saving server motherboard as claimed in claim 4, characterized in that: The supporting legs (9) are arranged at the corners of the main board (1), and a plurality of fixing holes are provided on the fixing plate (10).
6. A new energy-saving server motherboard as claimed in claim 5, characterized in that: There are a plurality of heat dissipation rods (11) which are evenly arranged on the back of the mainboard (1), and the height of the heat dissipation rods (11) is not greater than the height of the supporting legs (9).
7. A new energy-saving server motherboard as claimed in claim 6, characterized in that: The middle parts of the blowing fan (12) and the exhaust fan (13) are fixedly connected to the main board (1) via bolts.