High-temperature-resistant eye-protection lamp bead packaging structure
By adopting a combined structure of multi-layer thermal conductivity and high-temperature resistant materials in the eye protection lamp bead packaging, the problem of low thermal stability in the prior art is solved, and excellent high-temperature resistance and extended service life are achieved.
Patent Information
- Application Number
- CN202420683016.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-03
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2034-04-03
AI Technical Summary
The thermal stability of existing eye protection lamp bead packaging is low, which leads to an increase in the internal temperature of the lamp bead, which easily leads to rapid aging and affects the stability and life of use.
The packaging structure includes an insulating base, reflector, thermal pad, LED chip, copper plate, heat sink, high-temperature resistant plate and lens is adopted. The heat is quickly dissipated through the combination of thermal pad and copper plate, and the intrusion of water vapor is prevented by the clamping of the phosphor layer and the packaging glue, thereby improving stability.
It effectively improves the heat dissipation effect of lamp beads, enhances the anti-high temperature performance, avoids rapid aging, and extends service life.
Smart Images

Figure CN222814801U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of lamp bead packaging, in particular to a high-temperature resistant eye-protecting lamp bead packaging structure. Background Art
[0002] LED lighting technology has developed by leaps and bounds. With the development of power LED device technology and its own advantages of energy saving and high brightness, LED has been widely used in the field of lighting. The packaging of eye protection lamp beads usually adopts transparent materials to better spread light and protect LED chips.
[0003] For example, publication number CN217468475U discloses an LED lamp bead packaging structure, including a base, a heat sink and a lamp bead body, the heat sink is installed above the base, a diode crystal is installed in the lamp bead body, a bottom bowl is provided at the bottom of the lamp bead body, the bottom bowl is installed on the heat sink, a lens is provided on the outside of the lamp bead body, the lens covers the heat sink and the lamp bead body and is fixedly connected to the base, a first high temperature resistant layer, a phosphor layer and a second high temperature resistant layer are sequentially provided on the inner wall of the lens facing the lamp bead, a packaging layer is filled between the second high temperature resistant layer and the lamp bead body, a heat dissipation device is installed in the base, a fixing block is installed at the bottom of the base, and an external thread is provided on the fixing block.
[0004] However, in the prior art, the thermal stability of the packaging of eye-protection lamp beads is low, and the heat generated during long-term lighting work is difficult to dissipate, causing the temperature inside the lamp beads to continue to accumulate and rise. Long-term high temperature can easily lead to rapid aging of the lamp beads, affecting the stability and life of the lamp beads. Utility Model Content
[0005] The purpose of the utility model is to solve the problem in the prior art that the thermal stability of the packaging of the current eye protection lamp beads is low, and the heat generated during long-term lighting work is difficult to dissipate, so that the temperature inside the lamp beads continues to accumulate and rise, and long-term high temperature easily leads to rapid aging of the lamp beads, affecting the stability and life of the lamp beads. A high-temperature resistant eye protection lamp bead packaging structure is proposed.
[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a high-temperature resistant eye-protection lamp bead packaging structure, comprising an insulating base, the inner wall of the insulating base is fixedly connected with a reflective plate, the top surface of the reflective plate is fixedly connected with a first thermal pad, the top surface of the first thermal pad is fixedly connected with an LED chip, the bottom surface of the insulating base is fixedly connected with a copper plate, the bottom surface of the copper plate is fixedly connected with a second thermal pad, the bottom surface of the second thermal pad is fixedly connected with a heat sink, the top of the insulating base is fixedly connected with a high-temperature resistant plate, and the top surface of the high-temperature resistant plate is fixedly connected with a lens.
[0007] Preferably, pins are fixedly connected to both side outer walls of the insulating base, and gold wires are fixedly connected between the LED chip and the pins.
[0008] Preferably, a second packaging glue is filled between the outer wall of the LED chip and the reflective plate.
[0009] Preferably, a phosphor layer is provided on the top surface of the LED chip and the second packaging adhesive.
[0010] Preferably, a first packaging glue is filled between the top surface of the phosphor layer and the bottom surface of the high temperature resistant board.
[0011] Preferably, a pad is fixedly connected to the center of the bottom surface of the heat sink.
[0012] Compared with the prior art, the advantages and positive effects of the utility model are:
[0013] 1. In the present invention, the heat generated by the light emission of the LED chip is conducted by using the first thermal pad and the thermally conductive copper column at the bottom of the LED chip. The heat conducted by the thermally conductive copper column is quickly exchanged and dissipated with the outside by using the copper plate on the bottom of the insulating base, the second thermally conductive pad and the heat sink, thereby improving the heat dissipation effect of the present invention. As a result, the present invention has excellent high temperature resistance after packaging and avoids rapid aging.
[0014] 2. In the present invention, by sandwiching a phosphor layer between the first packaging glue and the second packaging glue, the present invention prevents the phosphor layer from being invaded by external water vapor during use, effectively improves the stability of the phosphor layer, ensures stable luminescence of the present invention, and increases service life. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 The utility model provides a three-dimensional structural schematic diagram of a high-temperature resistant eye protection lamp bead packaging structure;
[0016] Figure 2 The utility model provides a bottom structural diagram of a high temperature resistant eye protection lamp bead packaging structure;
[0017] Figure 3 The utility model provides a schematic diagram of the internal structure of a high-temperature resistant eye protection lamp bead packaging structure.
[0018] Legend: 1. Insulating base; 2. Lens; 3. Pin; 4. Heat sink; 5. Pad; 6. Reflector; 7. High temperature resistant board; 8. Phosphor layer; 9. LED chip; 10. First thermal pad; 11. Gold wire; 12. Copper plate; 13. Second thermal pad; 14. First packaging glue; 15. Second packaging glue; 16. Thermal copper column. DETAILED DESCRIPTION
[0019] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.
[0020] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.
[0021] Embodiment 1
[0022] like Figure 1-3 As shown, the utility model provides a high-temperature resistant eye-protection lamp bead packaging structure, including an insulating base 1, an inner wall of the insulating base 1 is fixedly connected with a reflective plate 6, the top surface of the reflective plate 6 is fixedly connected with a first thermal pad 10, the top surface of the first thermal pad 10 is fixedly connected with an LED chip 9, the bottom surface of the insulating base 1 is fixedly connected with a copper plate 12, the bottom surface of the copper plate 12 is fixedly connected with a second thermal pad 13, the bottom surface of the second thermal pad 13 is fixedly connected with a heat sink 4, the top of the insulating base 1 is fixedly connected with a high-temperature resistant plate 7, and the top surface of the high-temperature resistant plate 7 is fixedly connected with a lens 2.
[0023] The specific settings and functions of this embodiment are described in detail below. The heat generated by the light emission of the LED chip 9 is conducted by utilizing the first thermal pad 10 and the thermally conductive copper column 16 at the bottom of the LED chip 9. By using the copper plate 12 on the bottom of the insulating base 1, the second thermally conductive pad 13 and the heat sink 4, the heat conducted by the thermally conductive copper column 16 is quickly exchanged and dissipated with the outside, thereby improving the heat dissipation effect of the utility model, so that the utility model has excellent high temperature resistance after packaging. By utilizing the settings of the lens 2 and the high temperature resistant plate 7, the heat resistance of the utility model is further improved while ensuring the light transmission effect.
[0024] Embodiment 2
[0025] like Figure 1-3 As shown, the outer walls on both sides of the insulating base 1 are fixedly connected with pins 3, a gold wire 11 is fixedly connected between the LED chip 9 and the pin 3, a second packaging glue 15 is filled between the outer wall of the LED chip 9 and the reflective plate 6, a phosphor layer 8 is provided on the top surface of the LED chip 9 and the second packaging glue 15, a first packaging glue 14 is filled between the top surface of the phosphor layer 8 and the bottom surface of the high temperature resistant plate 7, and a pad 5 is fixedly connected to the center of the bottom surface of the heat sink 4.
[0026] The effect achieved by the entire embodiment is that the pin 3 is connected to the power supply, the gold wire 11 is used to power the LED chip 9 to emit light, and the phosphor layer 8 is sandwiched between the first packaging glue 14 and the second packaging glue 15, so that the phosphor layer 8 is prevented from being invaded by external water vapor during use, the stability of the phosphor layer 8 is effectively improved, the stable light emission of the utility model is guaranteed, and the service life is increased.
[0027] The use method and working principle of the device are as follows: the pin 3 is connected to the power supply, and the LED chip 9 is powered on and emits light through the gold wire 11. The first thermal pad 10 and the thermally conductive copper column 16 at the bottom of the LED chip 9 are used in combination to conduct the heat generated by the light emission of the LED chip 9. With the use of the copper plate 12 on the bottom of the insulating base 1, the second thermally conductive pad 13 and the heat sink 4, the heat conducted by the thermally conductive copper column 16 is quickly exchanged and dissipated with the outside, thereby improving the heat dissipation effect of the utility model. By sandwiching the phosphor layer 8 between the first packaging glue 14 and the second packaging glue 15, the utility model can prevent the phosphor layer 8 from being invaded by external water vapor during use, and effectively improve the stability of the phosphor layer 8.
[0028] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.
Claims
1. A high temperature resistant eye protection lamp bead packaging structure, comprising an insulating base (1), characterized in that: The inner wall of the insulating base (1) is fixedly connected to a reflective plate (6); the bottom surface of the insulating base (1) is penetrated by a heat-conducting copper column (16); the top surface of the heat-conducting copper column (16) is fixedly connected to a first heat-conducting pad (10); the top surface of the first heat-conducting pad (10) is fixedly connected to an LED chip (9); the bottom surface of the insulating base (1) is fixedly connected to a copper plate (12); the bottom surface of the copper plate (12) is fixedly connected to a second heat-conducting pad (13); the bottom surface of the second heat-conducting pad (13) is fixedly connected to a heat sink (4); the top of the insulating base (1) is fixedly connected to a high-temperature resistant plate (7); the top surface of the high-temperature resistant plate (7) is fixedly connected to a lens (2).
2. The high temperature resistant eye protection lamp bead packaging structure according to claim 1 is characterized in that: Pins (3) are fixedly connected to the outer walls on both sides of the insulating base (1), and gold wires (11) are fixedly connected between the LED chip (9) and the pins (3).
3. The high temperature resistant eye protection lamp bead packaging structure according to claim 1 is characterized in that: A second packaging glue (15) is filled between the outer wall of the LED chip (9) and the reflective plate (6).
4. The high temperature resistant eye protection lamp bead packaging structure according to claim 3 is characterized in that: A phosphor layer (8) is provided on the top surface of the LED chip (9) and the second packaging adhesive (15).
5. The high temperature resistant eye protection lamp bead packaging structure according to claim 4 is characterized in that: A first packaging glue (14) is filled between the top surface of the phosphor layer (8) and the bottom surface of the high temperature resistant board (7).
6. The high temperature resistant eye protection lamp bead packaging structure according to claim 1 is characterized in that: A pad (5) is fixedly connected to the center of the bottom surface of the heat sink (4).
Citation Information
Patent Citations
LED lamp bead packaging structure
CN217468475U