Laser radar system

Abstract

The utility model discloses a laser radar system, and relates to the technical field of laser radars, and the laser radar system comprises a transmitting assembly, a receiving assembly, a processor chip, a logic device chip and a circuit board, and the processor chip and the logic device chip are arranged on the circuit board at an interval. Data interaction is carried out between the processor chip and the logic device chip through a communication interface; wherein the logic device chip is used for controlling the transmitting assembly to output a detection signal, the processor chip is used for processing an echo signal received by the receiving assembly, and the echo signal is a signal formed based on the detection signal. Therefore, the heat dissipation effect of the laser radar system is improved.

Description

Technical Field

[0001] The present application belongs to the field of laser radar technology, and specifically relates to a laser radar system. Background Art

[0002] The main control chip of the laser radar in the related art usually adopts an integrated main control chip, and the laser radar's receiving unit, transmitting unit and other peripheral units are connected to the integrated main control chip to realize the detection function of the laser radar. However, due to the large number of functions integrated on the integrated main control chip, it generates more heat per unit time, which in turn affects the heat dissipation performance of the laser radar.

[0003] It can be seen that the laser radar in the related technology has the problem of poor heat dissipation. Utility Model Content

[0004] The present application aims to provide a laser radar system that can solve the problem of poor heat dissipation existing in the laser radar in the related art.

[0005] The embodiment of the present application proposes a laser radar system, comprising: a transmitting component, a receiving component, a processor chip, a logic chip and a circuit board, wherein the processor chip and the logic chip are arranged on the circuit board at intervals, and data is exchanged between the processor chip and the logic chip through a communication interface;

[0006] Among them, the logic chip is used to control the transmitting component to output a detection signal, and the processor chip is used to process the echo signal received by the receiving component, and the echo signal is a signal formed based on the detection signal.

[0007] In an embodiment of the present application, by arranging the processor chip and the logic chip on the circuit board at intervals, compared to setting an integrated main control chip to realize the functions of the processor chip and the logic chip, the heat generated by the laser radar system during operation can be dispersed, which is beneficial to improving the heat dissipation effect of the laser radar system.

[0008] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0010] Figure 1 is a schematic diagram of the composition of the laser radar system provided in an embodiment of the present application;

[0011] Figure 2It is one of the structural diagrams of the laser radar system provided in the embodiment of the present application;

[0012] Figure 3 This is the second structural diagram of the laser radar system provided in the embodiment of the present application;

[0013] Figure 4 This is the third structural diagram of the laser radar system provided in the embodiment of the present application. DETAILED DESCRIPTION

[0014] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0015] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0016] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0017] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0018] like Figures 1 to 4 As shown, the embodiment of the present application provides a laser radar system 100, which can be used to detect the distance and / or speed of a target object, and the laser radar system 100 includes a transmitting component 110, a receiving component 120, a processor chip 130, a logic chip 140 and a circuit board 150, the processor chip 130 and the logic chip 140 can be arranged on the circuit board 150 at intervals, and the processor chip 130 and the logic chip 140 can exchange data through a communication interface;

[0019] The logic chip 140 is used to control the transmitting component 110 to output a detection signal, and the processor chip 130 is used to process the echo signal received by the receiving component 120, and the echo signal is a signal formed based on the above detection signal.

[0020] In this embodiment, by setting the processor chip 130 and the logic chip 140 at intervals on the circuit board 150, compared with setting an integrated main control chip to realize the functions of the processor chip 130 and the logic chip 140, the heat generated by the laser radar system 100 during operation can be dispersed, which is beneficial to improving the heat dissipation effect of the laser radar system 100.

[0021] Moreover, compared with setting up an integrated main control chip to realize the functions of the processor chip 130 and the logic chip 140, the manufacturing cost of the laser radar system 100 can also be reduced by setting the processor chip 130 and the logic chip 140 at intervals on the circuit board 150.

[0022] In addition, by spacing the processor chip 130 and the logic chip 140 on the circuit board 150 , it is beneficial to the layout of the heat dissipation device and the division of the board functions of the circuit board 150 , making it easier to meet the application requirements of the miniaturized lidar system 100 .

[0023] The detection signal output by the transmitting component 110 can be understood as a laser beam emitted by the transmitting component 110. The echo signal is usually a signal formed by the detection signal being reflected by the detection target.

[0024] In some embodiments, the processor chip 130 and the logic chip 140 may be spaced apart and disposed on the same side of the circuit board 150 .

[0025] In some embodiments, the processor chip 130 and the logic chip 140 may be disposed on two back sides of the circuit board 150 , respectively, so as to increase the spatial distance between the processor chip 130 and the logic chip 140 .

[0026] In some embodiments, the processor chip 130 and the logic chip 140 may be respectively disposed on two back sides of the circuit board 150 and staggered in distribution to further increase the spatial distance between the processor chip 130 and the logic chip 140 .

[0027] In some embodiments, the transmitting component 110 may be mounted on the logic chip 140 so that the logic chip 140 directly controls the transmitting component 110 to output a detection signal, such as emitting a laser beam.

[0028] In some embodiments, Figure 2 As shown, the receiving component 120 can be mounted on the processor chip 130 so that the processor chip 130 can directly process the echo signal received by the receiving component 120 to improve the working efficiency of the laser radar system 100.

[0029] Moreover, when the receiving component 120 is directly mounted on the processor chip 130, since the processor chip 130 can process the echo signal received by the receiving component 120, such as outputting the received echo signal, that is, less data needs to be exchanged between the processor chip 130 and the logic chip 140, a first communication interface can be set between the processor chip 130 and the logic chip 140 for data exchange, so as to reduce the resource requirements of the logic chip 140 and optimize the resource configuration of the lidar system 100.

[0030] Among them, the above-mentioned first communication interface can be a low-speed communication interface such as an asynchronous serial communication interface or a synchronous serial communication interface to reduce the resource requirements of the logic chip 140 and optimize the resource configuration of the lidar system 100.

[0031] In some embodiments, Figure 3 As shown, the receiving component 120 can be mounted on the logic chip 140, that is, the transmitting component 110 and the receiving component 120 are both mounted on the logic chip 140, so that the transmitting component 110 and the receiving component 120 can be synchronized in timing, thereby improving the detection accuracy of the laser radar system 100.

[0032] However, since the echo signal received by the receiving component 120 needs to be sent to the processor chip 130 for processing, a second communication interface can be set between the processor chip 130 and the logic chip 140 for data exchange, and the communication rate of the second communication interface is higher than the communication rate of the above-mentioned first communication interface to improve the information interaction efficiency between the processor chip 130 and the logic chip 140.

[0033] In some embodiments, the logic chip 140 may pre-process the echo signal received by the receiving component 120 to obtain corresponding point cloud coordinates, distance and other information, and transmit the obtained point cloud coordinates, distance and other information to the processor chip 130 through the second communication interface, so that the processor chip 130 can process the received point cloud coordinates, distance and other information.

[0034] In some embodiments, since the logic chip 140 needs to transmit the echo signal received by the receiving component 120 to the processor chip 130, that is, the data transmission volume between the logic chip 140 and the processor chip 130 is large; therefore, the second communication interface can be set to a high-speed communication interface to meet the data interaction requirements between the logic chip 140 and the processor chip 130.

[0035] Among them, the second communication interface includes any one of the following: a low voltage differential signal communication interface; a mobile industry processor communication interface; a high-speed serial computer expansion bus standard communication interface; a universal serial bus communication interface.

[0036] In some embodiments, the laser radar system 100 also includes a communication module 170 and a memory 180, and the communication module 170 and the memory 180 are both connected to the processor chip 130, that is, the communication module 170 and the memory 180 are both mounted on the processor chip 130, and the processor chip 130 can communicate with external devices through the communication module 170, such as using the communication module to send the received echo signal or the processed echo signal or the coordinates, distance and other information obtained after processing the echo signal to the vehicle terminal, computer terminal or cloud server, etc.

[0037] In some embodiments, the memory 180 may store laser radar programs, related configuration information, data cache, etc. Moreover, the processor chip 130 may upgrade the laser radar system 100 based on the data stored in the memory 180 .

[0038] In some embodiments, the laser radar system 100 also includes a scanning module 160 , which can be mounted on the processor chip 130 or the logic chip 140 .

[0039] In some embodiments, the processor chip 130 may be an embedded microprocessor based on a certain architecture, such as a microcontroller unit (MCU), a system on chip (SoC), a microprocessor unit (MPU), a microcontroller unit (MCU), etc.

[0040] In some embodiments, the logic chip 140 can be an editable logic device, such as an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or a programmable logic device (CPLD) having control over corresponding peripheral logic.

[0041] In some embodiments, the communication module 170 may be an in-vehicle Ethernet, a mobile hotspot (WiFi) module, a Bluetooth module, or a wired communication module, for implementing communication between the processor chip 130 and external devices.

[0042] In some embodiments, the memory 180 can be a dynamic random access memory (DRAM), a static random access memory (SRAM), a double data rate synchronous dynamic random access memory (DDR), FLASH, an electrically erasable programmable read-only memory (EEPROM), a ferroelectric, or other storage device that can realize corresponding storage functions.

[0043] Combine the following Figure 1 The laser radar system 100 provided in the present application is specifically described, and for the purpose of illustration, Figure 1 The XYZ coordinate system is marked in .

[0044] In some embodiments, the transmitting assembly 110 can be configured to transmit a transmission beam having a uniform energy distribution. Here, uniform energy distribution can also be interpreted as uniform illumination or light intensity. In some embodiments, such a transmission beam having a uniform energy distribution can be obtained by shaping (homogenizing) using the transmitting optical module 112.

[0045] In some embodiments, the emission light beam is divergent in a first direction perpendicular to the optical axis of the emission component 110, with a corresponding first divergence angle.

[0046] In addition, the emission light beam is either parallel in a second direction that is perpendicular to the optical axis of the emission component 110 and perpendicular to the first direction, or divergent and the corresponding second divergence angle is smaller than a preset threshold.

[0047] In practical applications, the first direction ( Figure 1 The Y-axis direction shown in the figure) can usually refer to the vertical direction (V direction), while the second direction ( Figure 1 The Z-axis direction shown in the figure may generally refer to the horizontal direction (H direction). For ease of understanding, the following description is made by taking the case where the first direction corresponds to the vertical direction and the second direction corresponds to the horizontal direction as an example. However, it is easy for those skilled in the art to understand that the present application is not limited thereto. For example, the first direction may also refer to the horizontal direction, and the second direction may refer to the vertical direction.

[0048] On the one hand, the emitted light beam diverges in the vertical direction, and the corresponding first divergence angle is defined as Δθ V That is, the emitted light beam is at an angle Δθ in the vertical direction. V Fan-shaped beam emission.

[0049] On the other hand, the emission light beam may be parallel in the horizontal direction. Alternatively, the emission light beam may also be divergent in the horizontal direction, but the corresponding second divergence angle is less than the preset threshold. That is, the emission light beam is emitted in the horizontal direction as parallel light or at a very small angle. The selection of the preset threshold will be discussed in detail later.

[0050] That is, the emission light beam is a uniform linear or narrow rectangular light beam. As a result, the light spot projected in the field of view can appear as a narrow rectangle or even a line. The long side of the rectangle corresponds to the vertical direction, and the short side corresponds to the horizontal direction. Here, "narrow" may mean that the aspect ratio of the rectangle is greater than a preset aspect ratio threshold. Advantageously, by using an emission light beam that is linear or narrow rectangular, the laser radar system 100 of the present application can achieve a more concentrated field of view angle energy, a longer distance detection, and a higher resolution.

[0051] The inventors of the present application have recognized that an emission light beam having the above-mentioned specific illumination distribution can be obtained by shaping a laser beam emitted from a common light source.

[0052] In some embodiments, the emission assembly 110 includes a light source 111 and an emission optical module 112. The emission optical module 112 is configured to shape the laser beam emitted from the light source 111 to convert it into the emission light beam.

[0053] In some embodiments, the light source 111 may be a laser, such as a solid-state laser (such as a vertical-cavity surface-emitting laser (VCSEL), an edge-emitting laser (EEL), an external-cavity diode laser (ECDL), a laser diode, or a fiber laser. In some embodiments, the light source 111 may also include a light emitting diode (LED). However, it is easy for those skilled in the art to understand that the present application does not impose any specific restrictions on the type of device of the light source 111, as long as the output power of the light source 111 is large enough.

[0054] In some embodiments, the light source 111 may be an array light source. For example, the light source 111 may be a VCSEL array including a plurality of VCSELs. In a non-limiting example, the plurality of VCSELs may be configured to light up all at the same time during measurement, rather than lighting up in partitions and / or time divisions.

[0055] Alternatively, in some embodiments, the light source 111 may also be a single point light source. It is easy for those skilled in the art to understand that the present application does not impose any specific limitation on the arrangement of the light source 111.

[0056] In some embodiments, the light source 111 can emit light beams in different forms, including pulsed light, continuous wave (CW) and quasi-continuous light. The operating wavelength of the light source can be 650nm to 1150nm, 800nm ​​to 1000nm, 850nm to 950nm or 1300nm to 1600nm. In some embodiments, the light source 111 can also include an optical component optically coupled to the light source 111 for collimating or focusing the light beam emitted by the light source 111. Each emitted light beam emitted by the light source 111 can be continuous light lasting a certain period of time, or it can be one or more light pulses.

[0057] In some embodiments, the emission optical module 112 may include a diffusion unit configured to diffuse and shape the input laser beam. For example, the diffusion unit may diffuse and shape the beam based on diffraction and / or refraction, etc., to emit the above-mentioned uniform linear or narrow rectangular beam. However, it is easy for those skilled in the art to understand that the present application may also obtain the above-mentioned emission beam through other shaping processes.

[0058] In some embodiments, the diffusion unit may include at least one of the following optical devices: an optical diffuser, a diffractive optical element (DOE), and an aspherical cylindrical mirror. However, those skilled in the art will readily appreciate that the above devices are merely examples of the diffusion unit, and the present application is not limited thereto.

[0059] In the case of using an optical diffuser or DOE to perform diffusion shaping, the emission optical module 112 may further include a collimating unit, wherein the collimating unit may be configured to collimate the laser beam emitted from the light source to obtain a collimated laser beam to be input into the diffuser or DOE.

[0060] In some embodiments, the collimating unit may include at least one of the following optical devices: a microlens or a collimating mirror. For example, the collimating unit may be an array of microlenses. However, it is easy for those skilled in the art to understand that the above devices are only examples of collimating units, and the present application is not limited thereto.

[0061] In some embodiments, the laser radar system 100 further includes a transceiver separation device. The transceiver separation device may be a plane mirror 190 or a beam splitter having a hole 191. Specifically, taking a plane mirror with a hole as an example, the plane mirror 190 uses the hole 191 to transmit the emission light beam to guide the emission light beam to the scanning module 160, and uses a mirror to reflect the receiving light beam to guide the receiving light beam to the receiving component 120. That is, the emission light beam emitted from the transmitting component 110 can be directly transmitted through the plane mirror 190 via the hole 191, and the reflected receiving light beam can be reflected by the mirror in the plane mirror 190. That is, the reverse receiving path can be separated from the forward transmitting path at the plane mirror 190. Thus, with the help of the plane mirror 190 with a hole, the laser radar system 100 can realize the coaxial transmission and reception. Advantageously, the coaxial transmission and reception can avoid the imaging position deviation problem of the return light spot of the close-range and long-range detection caused by the separation of the optical axes of the two, thereby avoiding the additional calibration caused by this problem, which is conducive to mass production of products. However, it is easy for those skilled in the art to understand that the present application may also be a non-coaxial lidar system.

[0062] The inventor of the present application realizes that the plane reflector with a hole has relatively loose requirements on the precision of the manufacturing and adjustment of the hole, as long as the emitted light beam can pass through. On this basis, by reducing the size of the hole, the loss of reflected light can be reduced.

[0063] Therefore, in some embodiments, the emission light beam is in a focused state when passing through the hole. For example, by designing the light beam characteristics of the emission light beam and / or adjusting the position of the plane reflector relative to the emission device, it can be ensured that the emission light beam is in a focused state when passing through the hole. Advantageously, by focusing the emission light beam at the hole, the hole can be minimized while ensuring that the emission light beam passes through the hole, thereby minimizing the loss of reflected light and further reducing the precision requirements for the manufacture and adjustment of the hole. However, it is easy to understand for those skilled in the art that the present application is not limited to this.

[0064] The hole is usually located at the center of the plane reflector, but the present application is not limited thereto. In addition, to reduce the loss of reflected light, the shape of the hole can correspond to the cross-sectional shape of the emitted light beam when passing through the hole, and therefore is not necessarily circular.

[0065] It is easy for those skilled in the art to understand that the present application can also use other methods to achieve coaxial transmission and reception. However, compared with other methods such as a beam splitter, the plane reflector with holes proposed in the present application can reduce light loss and improve efficiency.

[0066] In some embodiments, a scanning module 160 such as a rotating mirror can be configured to rotate around a rotating shaft 161 oriented in a vertical direction (a first direction, the Y-axis direction in the figure) to guide the emission light beam to scan the target object in the field of view. The target object can be any object that can reflect the scanning laser within the scanning field of view of the laser radar system, such as vehicles, pedestrians, animals, road signs, obstacles, trees, shelves, furniture, etc.

[0067] After irradiating the target object, the transmitted light beam is scattered back, a portion of which returns to the laser radar system 100 as a received light beam and is received by the receiving component 120.

[0068] In some embodiments, the receiving component 120 may be configured to receive and detect a receiving light beam returned from a target object. For example, the receiving light beam scattered and returned by the target object may return to the scanning module 160 along the original path, and then be guided by the scanning module 160 to the plane reflector 190, and then reflected to the receiving component 120 by the plane reflector 190.

[0069] In some embodiments, the receiving component 120 may include a photodetector 121. The photodetector 121 may measure the power, phase, or time characteristics of the received light and generate a corresponding current output.

[0070] In some embodiments, Figure 1As shown, the photodetector 121 may include a plurality of photodetection units 1210 arranged in one direction. Different photodetection units 1210 are configured to receive and detect light signals returned from target objects at different relative angles in the vertical direction of the field of view. The photodetector 121 may also include a receiving circuit (not shown) associated with each photodetection unit 1210. Each receiving circuit may be used to process the output electrical signal of the corresponding photodetection unit 1210.

[0071] The photodetection unit 1210 may include various forms of photodetection devices or one-dimensional or two-dimensional arrays of photodetection devices, and accordingly, the receiving circuit may be an array of one circuit or multiple circuits. In various embodiments, the photodetection device may be an avalanche diode (APD), a single photon avalanche diode (SPAD), a PN photodiode, or a PIN photodiode.

[0072] For example, the photodetection unit 1210 can be a photodetection device SPAD or a one-dimensional or two-dimensional array thereof, so the photodetector 121 is an array of SPADs. Advantageously, since the spacing between SPADs is very small and they are closely arranged, the spatial resolution can be greatly improved. Moreover, different SPADs can simultaneously and individually perform direct Time-of-Flight (dToF) measurements without the need to light up the light source in different zones and at different times, which can greatly improve the temporal resolution.

[0073] In some embodiments, the receiving component 120 may further include a receiving optical module 122. The receiving optical module 122 may be configured to image the received light onto the photodetector 121. For example, in some embodiments, the receiving optical module 122 may include a receiving lens and an aperture. The receiving lens and the aperture are located upstream of the photodetector 121 on the receiving path. For example, the receiving lens may include an imaging system lens so that the focus of the received light beam is in front of or behind the receiving surface of the photodetector or just above the receiving surface. In some cases, instead of existing as a separate component, the receiving lens may also be integrated into the photodetector 121. The aperture is used to limit the angle of incident light incident on the photodetector 121, block stray light, etc.

[0074] As described above, the light spot projected into the field of view by the laser radar system 100 can be a uniform line or a narrow rectangle extending in the vertical direction, so the received light beam returned from the target object will form a similar pattern on the receiving surface of the photodetector 121. By arranging a plurality of photodetection units 1210 correspondingly along the direction of the long side of the line or rectangle, and imaging the light returned from the target object at different relative angles in the vertical direction of the field of view to different photodetection units 1210 using the receiving optical module 122, these photodetection units 1210 can correspond to the target objects at different relative angles in the vertical direction of the field of view, respectively. That is, different photodetection units 1210 are configured to receive and detect light signals returned from target objects at different relative angles in the vertical direction of the field of view. Therefore, according to the arrangement information of the photodetection unit 1210 and the parameter information of the optical system, the relative angle of the corresponding target object can be accurately calculated.

[0075] Since a uniform linear (or narrow rectangular) transmitting light beam is adopted, it is only necessary to perform a simple adjustment on the laser radar system 100 so that the receiving light spot imaged by the receiving optical module 122 on the photodetector 121 can cover the receiving surface of the photodetection unit 1210 (i.e., the photosensitive surface of all photodetection units 1210), and there is no need to perform separate alignment of the transmitting module and the receiving module. Here, the receiving light spot "covering" the receiving surface can be understood as the receiving light spot at least partially overlapping with the receiving surface, so that each photodetection unit can receive the light signal returned from the target object. For example, in some embodiments, the size of the receiving light spot can be made relatively small, and can only cover a portion of the receiving surface, so that the returned light signal can be received by the photodetection unit as much as possible to reduce waste. Therefore, advantageously, the scheme proposed in the present application can greatly simplify the difficulty of adjustment and is conducive to realizing automated production.

[0076] The angular resolution δθ of the laser radar system 100 in the vertical direction according to the embodiment of the present application is V =Δθ V / Q, where Q is the number of photodetection units 1210 included in the photodetector 121. By reducing the emission angle Δθ V And / or increasing the number Q of the photodetection units 1210 in the photodetector 121 can reduce the angular resolution δθ in the vertical direction. V value, thereby improving the angular resolution in the vertical direction.

[0077] It is worth noting that, in some embodiments, each photodetection unit 1210 may include a plurality of photodetection devices (such as SPADs) arranged along one direction, wherein the arrangement direction of the plurality of photodetection devices is perpendicular to the arrangement direction of the plurality of photodetection units 1210. With this arrangement, the number of photodetection devices in each photodetection unit 1210 can be increased without affecting the spacing of the photodetection units 1210, thereby improving the detection accuracy without affecting the spatial resolution.

[0078] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0079] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A laser radar system, characterized in that: include: A transmitting component, a receiving component, a processor chip, a logic chip and a circuit board, wherein the processor chip and the logic chip are arranged on the circuit board at intervals, and data is exchanged between the processor chip and the logic chip via a communication interface; Among them, the logic chip is used to control the transmitting component to output a detection signal, and the processor chip is used to process the echo signal received by the receiving component, and the echo signal is a signal formed based on the detection signal.

2. The laser radar system according to claim 1, characterized in that: The laser radar system also includes a communication module and a memory, both of which are connected to the processor chip, and the processor chip communicates with external devices through the communication module.

3. The laser radar system according to claim 1, characterized in that: The receiving component is mounted on the processor chip, and data is exchanged between the processor chip and the logic chip via a first communication interface.

4. The laser radar system according to claim 3, characterized in that: The first communication interface includes any one of the following: Asynchronous serial communication interface; Synchronous serial communication interface.

5. The laser radar system according to claim 1, characterized in that: The receiving component is mounted on the logic chip, and the processor chip and the logic chip perform data exchange via a second communication interface; The logic chip is also used to transmit the echo signal received by the receiving component to the processor chip.

6. The laser radar system according to claim 5, characterized in that: The second communication interface includes any one of the following: Low voltage differential signaling communication interface; Processor communication interface for mobile industry; High-speed serial computer expansion bus standard communication interface; Universal Serial Bus communications interface.

7. The laser radar system according to any one of claims 1 to 6, characterized in that: The transmitting assembly includes a light source and a transmitting optical module. The transmitting optical module is configured to perform shaping processing on the laser beam emitted from the light source and convert it into a detection signal.

8. The laser radar system according to claim 7, characterized in that: The light source includes any one of the following: Vertical Cavity Surface Emitting Lasers; Edge emitting lasers; External cavity semiconductor laser; Laser diodes; Fiber laser.

9. The laser radar system according to any one of claims 1 to 6, characterized in that: The receiving component includes a photodetector and a receiving optical module, and the receiving optical module is configured to image the received light onto the photodetector.

10. The laser radar system according to any one of claims 1 to 6, characterized in that: The laser radar system also includes a scanning module, which is mounted on the processor chip or the logic chip.

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