EDP transmission line
By designing the Typc-C interface and a signal transmission line group arranged side by side, combined with the shielding layer and the protective adhesive layer, the existing EDP interface connector has solved the problem of large size and short transmission distance, and has achieved improvement in signal transmission quality and distance, which is suitable for video transmission inside and outside the product.
Patent Information
- Application Number
- CN202420776585.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-15
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-04-15
AI Technical Summary
The existing EDP interface connectors are not uniform in form, are too large in size, have poor protection, are not good in strength, and have a short signal transmission distance, usually around 0.5 meters.
An EDP transmission line is designed, using a Typc-C interface and a signal transmission line group. The signal transmission line group includes two sets of line lines arranged side by side, which reduces the width of the signal transmission line group, increases the stability and durability of signal transmission, and improves the transmission quality of the signal and the reliability of grounding through the shielding layer and the protective adhesive layer.
It achieves the improvement of signal transmission quality and the extension of effective transmission distance, while reducing the cost of wires, making EDP transmission lines suitable for video transmission inside and outside the product, unifying the product's interface type and in line with future development trends.
Smart Images

Figure CN222826136U_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of connecting wires, and in particular to an EDP transmission wire. Background Art
[0002] The EDP interface is a fully digital interface based on the DisplayPort architecture and protocol. It can transmit high-resolution signals with simpler connectors and fewer pins, and can realize simultaneous transmission of multiple data. The EDP interface is also a commonly used communication interface for LCD screens. Generally, LCD screens that use the EDP interface have higher resolutions.
[0003] In recent years, in order to improve the data transmission speed between the panel and the processor and obtain a better user experience, a large number of high-definition LCD screens with EDP interfaces are used in industrial computers and industrial tablets. However, the existing EDP interfaces are all used as follows Figure 1 The WTB (Wire Train Bus) connector 100 shown is not of uniform form and is too large in size and can only be used inside a product. If a product needs to transmit a video signal from the outside, such a connector has poor protection and strength, and the existing EDP signal line transmission distance is relatively small, generally around 0.5. Utility Model Content
[0004] In view of this, the purpose of this specification is to provide an EDP transmission line with high signal transmission quality and a large effective transmission distance.
[0005] In order to achieve at least one of the above purposes, this specification provides the following technical solutions:
[0006] In the first aspect, an embodiment of the present specification provides an EDP transmission line, which includes: a connecting board, wherein a first connection area and a second connection area are respectively arranged on two oppositely arranged board surfaces of the connecting board, and solder pads are arranged in the first connection area and the second connection area; a Typc-C interface, wherein two connecting parts are symmetrically arranged at one end of the Typc-C interface, and the connecting parts include a plurality of connecting pins, and there is a gap between the two connecting parts, the connecting board is inserted into the gap, and the plurality of connecting pins in the two connecting parts are respectively connected to the solder pads in the two first connection areas; and a signal transmission line group, wherein the signal transmission line group includes two groups of wiring, and the two groups of wiring are arranged side by side in a direction perpendicular to the board surface of the connecting board, and the two groups of wiring are respectively connected to the solder pads in the two second connection areas.
[0007] In some embodiments, the signal transmission line group further includes a shielding layer, and the shielding layer is disposed on the flat cable.
[0008] In some embodiments, a ground connection area is provided on the connection board, a soldering pad is provided in the ground connection area, and the shielding layer is connected to the soldering pad in the ground connection area.
[0009] In some embodiments, the outer surface of each of the cables is wrapped with the shielding layer.
[0010] In some embodiments, the shielding layer is wrapped around the outer surface of the whole formed by the two groups of cables.
[0011] In some embodiments, the cable includes a conductor and a shielding layer wrapped around an outer surface of the conductor, and the conductor and the shielding layer are insulated from each other.
[0012] In some embodiments, among the plurality of conductive wires of the cable, at least a portion of the conductive wires have outer surfaces wrapped with the shielding layer.
[0013] In some embodiments, in a direction perpendicular to a plate surface of the connecting plate, a thickness of the connecting plate is greater than a width of the gap.
[0014] In some embodiments, a protective adhesive layer is coated at the connection between the wiring and the pad in the second connection area.
[0015] Compared with the prior art, the above technical solution has the following advantages:
[0016] The signal transmission line group includes two groups of cables, which reduces the width of the signal transmission line group and can reduce the impedance and loss of the signal transmission of the signal transmission line group. On the one hand, it can reduce the attenuation and distortion of the signal in the signal transmission line group, so that the signal transmitted by the signal transmission line group is clearer and more stable; on the other hand, the signal loss is small during the transmission process of the signal transmission line group, which can make the signal transmission distance longer, and at the same time, it can also improve the transmission efficiency of the signal transmission line group to improve the signal transmission speed; in addition, on the one hand, the Typc-C interface can support multiple protocols, such as USB, HDMI, DP, etc., to achieve the integration of multiple functions, so that the EDP transmission line is suitable for both internal and external video transmission of the product, unifying the interface type of the product and making the product more in line with future development trends; on the other hand, the signal transmission method of the Typc-C interface can provide more stable data transmission and reduce the risk of data loss and interference. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the embodiments of this specification, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0018] Figure 1 It is a structural diagram of the EDP interface described in the prior art;
[0019] Figure 2 It is a partial structural schematic diagram of a first embodiment of an EDP transmission line provided in some embodiments of this specification;
[0020] Figure 3 yes Figure 2 a schematic diagram of the exploded structure of the structure shown;
[0021] Figure 4 It is a partial structural schematic diagram of a second embodiment of an EDP transmission line provided in some embodiments of this specification;
[0022] Figure 5 yes Figure 4 a schematic diagram of the exploded structure of the structure shown;
[0023] Figure 6 yes Figure 5 A schematic diagram of the local structure of the wiring arrangement shown in ;
[0024] Figure 7 is a schematic cross-sectional structural diagram of a first embodiment of the signal transmission line assembly described in this specification;
[0025] Figure 8 It is a schematic cross-sectional structural diagram of the second embodiment of the signal transmission line group described in this specification.
[0026] The reference numerals are as follows:
[0027] 10. Connecting plate; 11. First connecting area; 12. Second connecting area; 13. Ground connecting area;
[0028] 20. Solder pad;
[0029] 30. Typc-C interface; 31. Connecting part; 311. Connecting pin; 32. Gap;
[0030] 40. signal transmission line group; 41. cable arrangement; 42. shielding layer; 43. conductor;
[0031] 100.WTB connector. DETAILED DESCRIPTION
[0032] The present invention is further described in detail below through the accompanying drawings and embodiments. Through these descriptions, the characteristics and advantages of the present invention will become more clear and distinct.
[0033] Unless otherwise defined, all technical and scientific terms used in this specification have the same meanings as those commonly understood by technicians in the technical field to which this specification belongs; the terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit this specification; the terms "including" and "having" and any variations thereof in the description of this specification and the above-mentioned drawings are intended to cover non-exclusive inclusions.
[0034] The "embodiment" mentioned in this specification means that the specific features, structures or characteristics described in conjunction with the embodiment can be included in at least one embodiment of this specification. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this specification can be combined with other embodiments.
[0035] The special word "exemplary" mentioned in this specification means "used as an example, embodiment or illustrative". Any embodiment described as "exemplary" is not necessarily interpreted as being superior or better than other embodiments. Although various aspects of the embodiments are shown in the drawings, the drawings are not necessarily drawn to scale unless otherwise specified.
[0036] In the description of this specification, the technical terms "first", "second", etc. are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features.
[0037] In the description of this specification, the technical term "and / or" is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.
[0038] In the description of this specification, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "connection", "fixation" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this specification can be understood according to specific circumstances.
[0039] In the description of this specification, "plurality" means two or more (including two), unless otherwise clearly and specifically defined.
[0040] In the description of this specification, the same reference numerals represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length and other dimensions of various components in the embodiments of this specification shown in the drawings, as well as the overall thickness, length and other dimensions of the integrated device are only exemplary descriptions and should not constitute any limitation to this specification.
[0041] The technical solutions of the embodiments of this specification are described in detail below in conjunction with the accompanying drawings. The technical features involved in different implementations of this specification described below can be combined with each other as long as there is no conflict between them.
[0042] like Figure 2 and Figure 3 As shown, the EDP (Embedded DisplayPort) transmission line provided by the present invention includes: a connecting board 10, a Typc-C interface 30 and a signal transmission line group 40.
[0043] A first connection area 11 and a second connection area 12 are respectively arranged on two oppositely arranged board surfaces of the connection board 10 , and welding pads 20 are arranged in both the first connection area 11 and the second connection area 12 .
[0044] One end of the Typc-C interface 30 is symmetrically provided with two connecting parts 31, the connecting part 31 includes a plurality of connecting pins 311, there is a gap 32 between the two connecting parts 31, the connecting board 10 is inserted into the gap 32, and the plurality of connecting pins 311 in the two connecting parts 31 are respectively connected to the pads 20 in the two first connecting areas 11.
[0045] The signal transmission line group 40 includes two groups of wiring lines 41 , and the two groups of wiring lines 41 are arranged side by side in a direction perpendicular to the board surface of the connection board 10 , and the two groups of wiring lines 41 are respectively connected to the pads 20 in the two second connection areas 12 .
[0046] The EDP transmission line provided in this specification, the signal transmission line group includes two groups of cables 41, which reduces the width of the signal transmission line group, and can reduce the impedance and loss of the signal transmission of the signal transmission line group. On the one hand, it can reduce the attenuation and distortion of the signal in the signal transmission line group, so that the signal transmitted by the signal transmission line group is clearer and more stable; on the other hand, the signal loss is small during the transmission process of the signal transmission line group, which can make the signal transmitted over a longer distance. At the same time, it can also improve the transmission efficiency of the signal transmission line group to the signal, so as to increase the transmission speed of the signal; on the other hand, the signal transmission line group has a certain thickness, so that the signal transmission line group is not easily affected by bending and twisting, thereby increasing the durability of the signal transmission line group; on the other hand, the signal transmission line group can be arranged more closely, occupying less space, making the EDP transmission line lighter and more portable.
[0047] In addition, on the one hand, the Type-C interface 30 can support multiple protocols, such as USB, HDMI, DP, etc., to achieve the integration of multiple functions, so that the EDP transmission line is suitable for both internal and external video transmission of the product, unifying the interface type of the product and making the product more in line with future development trends; on the other hand, the signal transmission method of the Type-C interface 30 can provide more stable data transmission and reduce the risk of data loss and interference; on the other hand, the Type-C interface is smaller in size and occupies less space, making the EDP transmission line lighter and more portable.
[0048] In summary, through the cooperation of the Typc-C interface 30 and the signal transmission line group 40, the effective transmission distance of the signal is greatly improved, and the cost of the entire cable is also controlled, so that the EDP transmission line is suitable for both internal and external video transmission of the product, unifying the interface type of the product, making the product more in line with future development trends.
[0049] like Figures 4 to 6 As shown, in some embodiments of the present specification, the signal transmission line set 40 further includes a shielding layer 42 .
[0050] The shielding layer 42 is disposed on the flat cable 41 .
[0051] In the above embodiment, on the one hand, the shielding layer 42 can block external electromagnetic interference, ensure that the signal in the transmission line is not interfered with, and improve the stability and accuracy of the signal; on the other hand, the shielding layer 42 can also prevent the signal in the transmission line from radiating outward, reducing interference with the surrounding environment; on the other hand, the shielding layer 42 helps to maintain the integrity of the signal, reduce signal attenuation and distortion, and enable the signal to be transmitted more clearly.
[0052] like Figures 4 to 6 As shown, in some embodiments of the present specification, a ground connection area 13 is provided on the connection plate 10.
[0053] A pad 20 is disposed in the ground connection area 13 , and the shielding layer 42 is connected to the pad 20 in the ground connection area 13 , that is, the shielding layer 42 is grounded.
[0054] On the one hand, the grounded shielding layer 42 can introduce external electromagnetic interference into the ground, reducing interference to the internal signal of the cable 41. On the other hand, after the shielding layer 42 is grounded, the shielding layer 42 forms a complete shielding system, which can better block external electromagnetic radiation. On the other hand, the induced voltage generated by the wire 43 in the electromagnetic field is effectively reduced, and the stability and reliability of the system are improved. On the other hand, it helps to maintain the integrity of the signal, reduce signal attenuation and distortion, and improve the quality of signal transmission.
[0055] like Figures 4 to 6As shown, in some embodiments of the present specification, in a direction perpendicular to the plate surface of the connecting plate 10 , the thickness of the connecting plate 10 is greater than the width of the gap 32 .
[0056] The above structure makes the connecting plate 10 and the gap 32 have an interference fit, which can increase the reliability of the connection between the connecting plate 10 and the connecting part 31, reduce the probability of movement when the connecting needle 311 and the solder pad 20 are welded, and thus increase the welding speed of the connecting needle 311 and the solder pad 20.
[0057] In some embodiments of the present specification, a protective adhesive layer is coated at the connection between the wiring 41 and the pad 20 in the second connection area 12 .
[0058] In the above embodiment, on the one hand, the protective adhesive layer can isolate the pad 20 from the external environment, reduce the risk of corrosion, and extend the service life of the connecting plate 10. On the other hand, the pad 20 is effectively protected from physical damage, such as collision, bending, etc., thereby improving the reliability of the connecting plate 10. On the other hand, accidental contact between the pads 20 or between the pads 20 and other metal parts is avoided, reducing the possibility of short circuit. On the other hand, the insulation between the pads 20 and other circuit parts is increased, thereby improving the safety of the connecting plate 10.
[0059] Several configurations of the shielding layer 42 are described in detail below with reference to the accompanying drawings.
[0060] Embodiment 1
[0061] like Figures 4 to 6 As shown, the cable 41 includes a conductor 43 and a shielding layer 42 wrapped around the outer surface of the conductor 43 .
[0062] The conductive wire 43 is insulated from the shielding layer 42 .
[0063] A shielding layer 42 is provided on the outer surface of the wire 43. The wire 43 of the above structure is a micro-coaxial wire.
[0064] On the one hand, the micro-coaxial line is much thinner than the traditional wire 43, and the signal transmission line group 40 can be arranged more closely, occupying less space, making the EDP transmission line lighter and more portable; on the other hand, the micro-coaxial line can transmit data at a speed of up to 10Gbps, which improves the transmission efficiency of the signal transmission line group 40 for signals, thereby increasing the signal transmission speed; on the other hand, the signal attenuation of the micro-coaxial line is small, and the signal strength and quality can be maintained over a longer distance, and it is not easily interfered with, making the signal transmitted by the signal transmission line group 40 clearer and more stable.
[0065] In a specific embodiment of the present specification, a shielding layer 42 is disposed on the outer surface of each wire 43. That is, each wire 43 is a micro-coaxial line.
[0066] On the one hand, it can more effectively shield external interference sources, such as electromagnetic waves, static electricity, etc., so that the EDP transmission line can still work stably in a complex electromagnetic environment. On the other hand, the shielding layer 42 can more effectively reduce the attenuation of the signal during the transmission process, ensuring that the signal can be transmitted over a longer distance.
[0067] In some other specific embodiments of the present specification, among the plurality of conductive wires 43 of the flat cable 41 , at least a portion of the conductive wires 43 have outer surfaces covered with a shielding layer 42 .
[0068] For those key parts that require high signal quality, using micro-coaxial lines for signal transmission can provide better anti-interference ability and signal integrity. For other parts, using ordinary wires 43 for data transmission can reduce the cost of materials and manufacturing processes. This design can reduce the cost and complexity of EDP transmission lines while ensuring signal quality.
[0069] Embodiment 2
[0070] like Figure 7 As shown, the outer surface of each row of wires 41 is wrapped with a shielding layer 42 .
[0071] On the one hand, each cable 41 is wrapped with a shielding layer 42 to provide more comprehensive electromagnetic shielding, effectively reducing electromagnetic interference between adjacent cables 41 and ensuring signal stability and integrity. On the other hand, the shielding layers 42 of multiple cables 41 can together form an integrated shielding system to enhance the protection against external electromagnetic interference.
[0072] Embodiment 3
[0073] like Figure 8 As shown, the shielding layer 42 is wrapped around the outer surface of the whole formed by the two groups of wiring 41 .
[0074] On the one hand, the number of shielding layers 42 can be reduced, reducing costs. At the same time, the wiring can be simplified, making the entire system more compact and neat. On the other hand, a more uniform electromagnetic shielding effect can be provided, reducing signal interference between the flat cables 41. This helps to improve the quality and stability of the signal and ensure the normal operation of the system.
[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this specification, rather than to limit them; although this specification has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of this specification, and they should all be included in the claims and the scope of this specification. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. This specification is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.
Claims
1. An EDP transmission line, characterized in that: The EDP transmission line comprises: A connecting plate, wherein a first connecting area and a second connecting area are respectively arranged on two oppositely arranged plate surfaces of the connecting plate, and welding pads are arranged in the first connecting area and the second connecting area; A Typc-C interface, wherein one end of the Typc-C interface is symmetrically provided with two connection parts, the connection parts include a plurality of connection pins, a gap is provided between the two connection parts, the connection board is inserted into the gap, and the plurality of connection pins in the two connection parts are respectively connected to the pads in the two first connection areas; and The signal transmission line group includes two groups of flat cables, and the two groups of flat cables are arranged side by side in a direction perpendicular to the board surface of the connecting board, and the two groups of flat cables are respectively connected to the two pads in the second connection areas.
2. The EDP transmission line according to claim 1, characterized in that: The signal transmission line group further includes a shielding layer, and the shielding layer is arranged on the flat cable.
3. The EDP transmission line according to claim 2, characterized in that: A ground connection area is provided on the connection plate, a soldering pad is provided in the ground connection area, and the shielding layer is connected to the soldering pad in the ground connection area.
4. The EDP transmission line according to claim 2, characterized in that: The outer surface of each of the cables is wrapped with the shielding layer.
5. The EDP transmission line according to claim 2, characterized in that: The shielding layer is wrapped around the outer surface of the whole formed by the two groups of cables.
6. The EDP transmission line according to claim 2, characterized in that: The cable arrangement includes a conductor and a shielding layer wrapped around the outer surface of the conductor, and the conductor and the shielding layer are insulated from each other.
7. The EDP transmission line according to claim 6, characterized in that: Among the plurality of conductive wires of the cable arrangement, at least a portion of the conductive wires have outer surfaces wrapped with the shielding layer.
8. The EDP transmission line according to any one of claims 1 to 7, characterized in that: In a direction perpendicular to a plate surface of the connecting plate, a thickness of the connecting plate is greater than a width of the gap.
9. The EDP transmission line according to any one of claims 1 to 7, characterized in that: A protective adhesive layer is coated at the connection between the wiring and the pad in the second connection area.