Wafer double-sided cleaning device
By designing a device that can clean simultaneously on both sides of the wafer, the problem of single-side cleaning in the prior art causes wafer lifting or rupture, the effective solution to double-side cleaning of the wafer is achieved, and the yield rate of the wafer is improved.
Patent Information
- Application Number
- CN202420803255.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-17
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-04-17
AI Technical Summary
Existing single-sided cleaning devices cannot effectively clean both sides of the wafer, causing the wafer to rise or break during the cleaning process.
A double-sided wafer cleaning device is designed, including a support mechanism and a pair of cleaning mechanisms. The cleaning mechanism is arranged on the upper and lower sides of the wafer respectively, and can be bonded to the wafer and synchronized in the radial direction under the action of external forces.
Through the use of a double-sided cleaning device, the upper and lower surfaces of the wafer can be effectively cleaned, the cleaning pressure can be adjusted, the wafer can be avoided from rising or rupturing, and the yield of the wafer can be improved.
Smart Images
Figure CN222826392U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer double-side cleaning device. Background Art
[0002] In the field of semiconductor manufacturing, it is usually necessary to perform a chemical mechanical polishing process on the wafer. When performing chemical mechanical polishing on the wafer, a chemical polishing fluid is required. However, after the wafer is polished, a large amount of polishing fluid particles and polishing by-products will adhere to the surface of the wafer, so the surface of the wafer needs to be cleaned. However, existing cleaning devices are usually single-sided cleaning, and during the cleaning process, the washing pressure on the wafer surface cannot be too large, otherwise it will cause the wafer to warp or break. Utility Model Content
[0003] Therefore, the technical problem to be solved by the utility model is to overcome the defect in the prior art that the wafer is warped or broken because the existing cleaning device cannot clean the double-sided surface of the wafer.
[0004] To this end, the utility model provides a wafer double-sided cleaning device, comprising:
[0005] The supporting mechanism is provided with a rotating table, on which a wafer is arranged; when the rotating table rotates, the wafer rotates along with the rotating table;
[0006] A pair of cleaning mechanisms, respectively disposed on the upper side and the lower side of the wafer; under the action of external force, the cleaning mechanisms have a first state of being attached to the wafer, and a second state of being separated from the wafer;
[0007] After a pair of cleaning mechanisms are attached to the wafer, they synchronously reciprocate on the upper surface and the lower surface of the wafer along the radial direction of the wafer.
[0008] Optionally, the supporting mechanism is composed of a plurality of rotating shafts, and the rotating shafts are suitable for driving the wafer to rotate.
[0009] Optionally, a slot is provided at one end of the rotating shaft close to the wafer, and the slot is suitable for clamping the wafer.
[0010] Optionally, the cleaning mechanism comprises:
[0011] Cleaning components are respectively arranged on the upper and lower sides of the wafer;
[0012] The driving components are respectively arranged on the upper and lower sides of the wafer and connected to the cleaning component. The driving components are suitable for driving the cleaning component to perform reciprocating motion on the surface of the wafer.
[0013] Optionally, the cleaning component comprises:
[0014] A cleaning brush is arranged on the upper and lower sides of the wafer, and the cleaning brush is suitable for contacting with and moving away from the wafer;
[0015] A lifting member, disposed on the driving assembly, and adapted to lift the cleaning brush;
[0016] A rotating member, disposed on the driving assembly, and adapted to rotate the cleaning brush;
[0017] Under the action of the lifting member, the cleaning brush and the upper and lower surfaces of the wafer move closer to and farther away from each other, and at the same time, under the action of the rotating member, the cleaning brush itself rotates.
[0018] Optionally, different circular areas are sequentially arranged on the wafer surface, and when the cleaning brush moves from the center to the edge of the wafer or from one edge to the other edge, different pressures and moving speeds are arranged on the different circular areas on the wafer surface.
[0019] Optionally, the cleaning brushes on the upper and lower sides of the wafer move synchronously and apply pressure to the wafer at the same time.
[0020] Optionally, cleaning liquid nozzles are further provided on the upper and lower sides of the wafer, and the cleaning liquid is sprayed on the surface of the wafer through the cleaning liquid nozzles.
[0021] The technical solution of the utility model has the following advantages:
[0022] 1. The utility model provides a double-sided wafer cleaning device, comprising a supporting mechanism and a pair of cleaning mechanisms, wherein the supporting mechanism is provided with a rotating table, and a wafer is provided on the rotating table; when the rotating table rotates, the wafer rotates along with the rotating table; a pair of cleaning mechanisms are respectively arranged on the upper side and the lower side of the wafer; under the action of external force, the cleaning mechanism has a first state of being bonded to the wafer, and a second state of being separated from the wafer; after the pair of cleaning mechanisms are bonded to the wafer, they synchronously reciprocate on the upper surface and the lower surface of the wafer along the radial direction of the wafer.
[0023] During the wafer polishing process, a large amount of grinding liquid particles and grinding by-products will adhere to the wafer surface, so the wafer surface needs to be cleaned, but the existing cleaning device is usually single-sided cleaning, and during the cleaning process, the pressure on the wafer surface cannot be too large, otherwise it will cause the wafer to warp or break. In the embodiment of the utility model, by arranging cleaning mechanisms on the upper and lower sides of the wafer, the cleaning mechanisms on the upper and lower sides of the wafer move synchronously on the upper and lower surfaces of the wafer, and the pressure on the upper and lower surfaces of the wafer can be adjusted at the same time, so as not to cause the wafer to warp or break, thereby improving the yield rate of the wafer.
[0024] 2. The utility model provides a double-sided wafer cleaning device, wherein the cleaning mechanism includes a cleaning component and a driving component, wherein the cleaning components are respectively arranged on the upper and lower sides of the wafer; the driving component is respectively arranged on the upper and lower sides of the wafer and connected to the cleaning component, and the driving component is suitable for driving the cleaning component to perform reciprocating motion on the surface of the wafer. In an embodiment of the utility model, by arranging the cleaning component and the driving component, the driving component can control the cleaning component to apply different pressures at different positions of the wafer, thereby making the cleaning of the wafer more flexible and convenient; in addition, the driving component can be used to individually control the cleaning components on the upper and lower sides of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0026] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0027] Figure 2 This is the overall structural front view of the utility model;
[0028] Figure 3 This is a schematic diagram of the position of the cleaning brush of the utility model;
[0029] Figure 4 This is a schematic diagram of the movement path of the cleaning brush of the utility model;
[0030] Figure 5 It is a schematic diagram of dividing the wafer surface into different areas according to the utility model;
[0031] Figure 6 A schematic diagram of the movement of the cleaning brush of the utility model moving from one edge of the wafer to another edge;
[0032] Figure 7 A schematic diagram of the speed of the cleaning brush of the utility model moving from one edge of the wafer to another edge;
[0033] Figure 8 A schematic diagram of the pressure of the upper cleaning brush of the utility model when it moves from one edge of the wafer to another edge;
[0034] Fig. 9 It is a schematic diagram of the pressure when the lower cleaning brush of the utility model moves from one edge of the wafer to another edge;
[0035] Fig.10 It is a schematic diagram of the movement of the cleaning brush of the utility model from the edge of the wafer to the center of the wafer;
[0036] Fig.11 A schematic diagram of the speed of the cleaning brush of the utility model moving from the edge of the wafer to the center of the wafer;
[0037] Fig.12 It is a schematic diagram of the pressure of the upper cleaning brush of the utility model moving from the edge of the wafer to the center of the wafer;
[0038] Fig.13 It is a schematic diagram of the pressure when the lower cleaning brush of the utility model moves from the edge of the wafer to the center of the wafer.
[0039] Description of the accompanying drawings in the embodiments:
[0040] 1. Support mechanism; 2. Cleaning mechanism; 3. Cleaning liquid nozzle; 100. Wafer;
[0041] 11. Rotation axis;
[0042] 21. Cleaning assembly; 22. Driving assembly;
[0043] 211. Cleaning brush; 212. Lifting member; 213. Rotating member. DETAILED DESCRIPTION
[0044] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0045] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0046] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0047] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0048] Example
[0049] like Figures 1 to 13 As shown, this embodiment provides a wafer double-sided cleaning device, including a supporting mechanism 1 and a pair of cleaning mechanisms 2, the supporting mechanism 1 is provided with a rotating table, and a wafer 100 is arranged on the rotating table; when the rotating table rotates, the wafer 100 rotates along with the rotating table; the pair of cleaning mechanisms 2 are respectively arranged on the upper side and the lower side of the wafer 100; under the action of external force, the cleaning mechanism 2 has a first state of being bonded to the wafer 100, and a second state of being separated from the wafer 100; after the pair of cleaning mechanisms 2 are bonded to the wafer 100, they synchronously reciprocate on the upper surface and the lower surface of the wafer 100 along the radial direction of the wafer 100.
[0050] In an embodiment of the utility model, the wafer 100 is first placed on the rotating table of the supporting mechanism 1, and the wafer 100 is rotated by rotating the rotating table, and then the cleaning mechanisms 2 on the upper and lower sides of the wafer 100 are driven by external force to abut against the wafer 100, and then the cleaning mechanisms 2 are synchronously moved from the edge of the wafer 100 to the center of the wafer 100, or from the edge of the wafer 100 to the edge of the other side of the wafer 100, thereby cleaning the surface of the wafer 100.
[0051] During the wafer polishing process, a large amount of grinding liquid particles and grinding by-products will adhere to the wafer surface, so the wafer surface needs to be cleaned, but the existing cleaning device is usually single-sided cleaning, and during the cleaning process, the pressure on the wafer surface cannot be too large, otherwise it will cause the wafer to warp or break. In the embodiment of the utility model, by arranging the cleaning mechanism 2 on the upper and lower sides of the wafer 100, the cleaning mechanism 2 on the upper and lower sides of the wafer 100 moves synchronously on the upper and lower surfaces of the wafer 100, and the pressure on the upper and lower surfaces of the wafer 100 can be adjusted at the same time, so as not to cause the wafer to warp or break, thereby improving the yield rate of the wafer.
[0052] Specifically, Figure 1As shown, the support mechanism 1 is composed of a plurality of rotating shafts 11, and the rotating shafts 11 are suitable for driving the wafer 100 to rotate. In the embodiment of the utility model, four rotating shafts 11 are provided. Of course, the embodiment does not limit the number of the rotating shafts 11, and the technicians in this field can change the number of the rotating shafts 11 according to the actual situation, as long as the same technical effect can be achieved.
[0053] Furthermore, a slot is provided at one end of the rotating shaft 11 close to the wafer 100, and the slot is suitable for clamping the wafer 100 so that the wafer 100 rotates along with the rotating shaft 11. In other words, by synchronously rotating the rotating shaft 11, the wafer 100 is driven to rotate, so that the wafer 100 can be fully cleaned.
[0054] Specifically, the cleaning mechanism 2 includes a cleaning component 21 and a driving component 22, wherein the cleaning component 21 is respectively arranged on the upper and lower sides of the wafer 100; the driving component 22 is respectively arranged on the upper and lower sides of the wafer 100 and connected to the cleaning component 21, and the driving component 22 is suitable for driving the cleaning component 21 to reciprocate on the surface of the wafer 100. In the embodiment of the utility model, by setting the cleaning component 21 and the driving component 22, the driving component 22 can control the cleaning component 21 to apply different pressures at different positions of the wafer 100, thereby making the cleaning of the wafer 100 more flexible and convenient; in addition, the cleaning components 21 on the upper and lower sides of the wafer 100 can be individually controlled by the driving component 22.
[0055] In the embodiment of the utility model, the drive component 22 can be set to be electric drive, or can be set to be pneumatic drive or hydraulic drive. This embodiment does not limit the setting form of the drive component 22. Technical personnel in this field can change the setting form of the drive component 22 according to actual conditions as long as the same technical effect can be achieved.
[0056] Furthermore, if Figure 2As shown, the cleaning component 21 includes a cleaning brush 211, a lifting member 212 and a rotating member 213. The cleaning brush 211 is arranged on the upper and lower sides of the wafer 100, and the cleaning brush 211 is suitable for abutting against and moving away from the wafer 100; the lifting member 212 is arranged on the driving component 22, and the lifting member 212 is suitable for lifting and lowering the cleaning brush 211; the rotating member 213 is arranged on the driving component 22, and the rotating member 213 is suitable for rotating the cleaning brush 211; under the action of the lifting member 212, the cleaning brush 211 and the upper and lower surfaces of the wafer 100 approach and move away from each other, and under the action of the rotating member 213, the cleaning brush 211 itself rotates.
[0057] Furthermore, if Figure 4 As shown, when the cleaning brush 211 on the upper side of the wafer 100 moves to the edge of the wafer 100, the lifting member 212 drives the cleaning brush 211 to move downward until it abuts against the wafer 100, and at the same time, the rotating member 213 drives the cleaning brush 211 to rotate, and then the driving component 22 drives the cleaning brush 211 to reciprocate on the upper surface of the wafer 100; when the cleaning brush 211 on the lower side of the wafer 100 moves to the edge of the wafer 100, the lifting member 212 drives the cleaning brush 211 to move upward until it abuts against the wafer 100, and at the same time, the rotating member 213 drives the cleaning brush 211 to rotate, and then the driving component 22 drives the cleaning brush 211 to reciprocate on the lower surface of the wafer 100.
[0058] Furthermore, if Figure 5 As shown, the cleaning brush 211 applies different pressures and moving speeds at different positions on the surface of the wafer 100. The surface of the wafer 100 is divided into four annular areas, and different pressures can be applied in different areas. At the same time, the moving speed of the cleaning brush 211 is also different in different areas. During the same rotation speed of the wafer 100, since the friction between the wafer 100 and the cleaning brush 211 is different when the wafer 100 moves from the center to the edge or from one end edge to the other end edge, the cleaning brush 211 can achieve a better cleaning effect by applying different pressures and moving speeds in different annular areas.
[0059] Furthermore, if Figure 6 As shown, the cleaning brush 211 first moves from the edge of the wafer 100 to the center of the wafer 100, and then moves from the center of the wafer 100 to the other edge of the wafer 100. During this movement process, the moving speed of the cleaning brush 211 is as follows: Figure 7As shown, when the cleaning brush 211 moves from the initial position to the edge of the wafer 100, the moving speed of the cleaning brush 211 remains unchanged; when the cleaning brush 211 moves from the edge of the wafer 100 to the center of the wafer 100, the moving speed of the cleaning brush 211 gradually increases; when the cleaning brush 211 moves from the center of the wafer 100 to the other edge of the wafer 100, the moving speed of the cleaning brush 211 gradually decreases; when the cleaning brush 211 leaves from the other edge of the wafer 100, the moving speed of the cleaning brush 211 remains unchanged and is the same as the speed when the cleaning brush 211 enters the edge of the wafer 100.
[0060] Furthermore, in the process of the cleaning brush 211 moving from one side of the edge of the wafer 100 to the other side of the wafer 100, the pressure applied by the cleaning brush 211 on the upper side of the wafer 100 is as follows: Figure 8 As shown, when the cleaning brush 211 moves from the initial position to the edge of the wafer 100, the cleaning brush 211 does not apply pressure to the upper surface of the wafer 100; when the center of the cleaning brush 211 moves from the edge of the wafer 100 to the cleaning brush 211 completely enters the wafer 100, the pressure applied by the cleaning brush 211 to the upper surface of the wafer 100 remains unchanged; when the cleaning brush 211 moves from completely entering the wafer 100 to the center of the wafer 100, the pressure applied by the cleaning brush 211 to the upper surface of the wafer 100 gradually increases; when the cleaning brush 211 moves from completely entering the wafer 100 to the center of the wafer 100, the pressure applied by the cleaning brush 211 to the upper surface of the wafer 100 gradually increases; when the cleaning brush 211 moves from completely entering the wafer 100 to the center of the wafer 100, the pressure applied by the cleaning brush 211 to the upper surface of the wafer 100 gradually increases. When the cleaning brush 211 moves from the center of the wafer 100 to the point where the cleaning brush 211 just touches the other edge of the wafer 100, the pressure applied by the cleaning brush 211 to the upper surface of the wafer 100 gradually decreases; when the cleaning brush 211 moves from the other edge of the wafer 100 to the point where the cleaning brush 211 completely leaves the wafer 100, the pressure applied by the cleaning brush 211 to the upper surface of the wafer 100 remains unchanged; when the cleaning brush 211 completely leaves the other edge of the wafer 100, the pressure applied by the cleaning brush 211 to the upper surface of the wafer 100 gradually decreases.
[0061] Furthermore, in the process of the cleaning brush 211 moving from one side of the edge of the wafer 100 to the other side of the wafer 100, the pressure applied by the cleaning brush 211 on the lower side of the wafer 100 is as follows: Fig. 9As shown, when the cleaning brush 211 moves from the initial position to the process in which the cleaning brush 211 completely enters the wafer 100, the driving component 22 drives the cleaning brush 211 to move, and then moves the cleaning brush 211 upward to abut against the wafer 100. During this process, the cleaning brush 211 does not contact the wafer 100, and thus does not apply pressure to the lower surface of the wafer 100; when the cleaning brush 211 moves from completely entering the wafer 100 to the center of the wafer 100, the pressure applied by the cleaning brush 211 to the lower surface of the wafer 100 gradually increases; when the cleaning brush 211 moves from the wafer 100 to the center of the wafer 100, the pressure applied by the cleaning brush 211 to the lower surface of the wafer 100 gradually increases. When the center of the wafer 100 moves to the point where the cleaning brush 211 just touches the other edge of the wafer 100, the pressure applied by the cleaning brush 211 to the lower surface of the wafer 100 gradually decreases; when the cleaning brush 211 moves from just touching the other edge of the wafer 100 to the point where the cleaning brush 211 completely leaves the wafer 100, the cleaning brush 211 moves downward and separates from the wafer 100, and the cleaning brush 211 moves radially along the wafer 100 and then leaves the wafer 100. During this process, the cleaning brush 211 does not contact the wafer 100 and thus does not apply pressure to the lower surface of the wafer 100.
[0062] Furthermore, if Fig.10 As shown, the cleaning brush 211 moves from the edge of the wafer 100 to the center of the wafer 100. Similarly, during this movement, the moving speed of the cleaning brush 211 is as follows: Fig.11 As shown, when the cleaning brush 211 moves from the initial position to the edge of the wafer 100, the moving speed of the cleaning brush 211 remains unchanged; when the cleaning brush 211 moves from the edge of the wafer 100 to the center of the wafer 100, the moving speed of the cleaning brush 211 gradually increases; when the cleaning brush 211 continues to move a distance from the center of the wafer 100, the moving speed of the cleaning brush 211 remains unchanged.
[0063] Furthermore, in the process of the cleaning brush 211 moving from the edge of the wafer 100 to the center of the wafer 100, the pressure applied by the cleaning brush 211 on the upper side of the wafer 100 is as follows: Fig.12As shown, similarly, when the cleaning brush 211 moves from the initial position to the edge of the wafer 100, the cleaning brush 211 does not apply pressure to the upper surface of the wafer 100; when the center of the cleaning brush 211 moves from the edge of the wafer 100 to the cleaning brush 211 completely entering the wafer 100, the pressure applied by the cleaning brush 211 to the upper surface of the wafer 100 remains unchanged; when the cleaning brush 211 moves from completely entering the wafer 100 to the center of the wafer 100, the pressure applied by the cleaning brush 211 to the upper surface of the wafer 100 gradually increases; when the cleaning brush 211 continues to move a distance from the center of the wafer 100, the pressure applied by the cleaning brush 211 to the upper surface of the wafer 100 remains unchanged.
[0064] Furthermore, in the process of the cleaning brush 211 moving from the edge of the wafer 100 to the center of the wafer 100, the pressure applied by the cleaning brush 211 on the lower side of the wafer 100 is as follows: Fig.13 As shown, when the cleaning brush 211 moves from the initial position to the process in which the cleaning brush 211 completely enters the wafer 100, the driving component 22 drives the cleaning brush 211 to move, and then moves the cleaning brush 211 upward to abut against the wafer 100. During this process, the cleaning brush 211 does not contact the wafer 100, and thus does not apply pressure to the lower surface of the wafer 100; when the cleaning brush 211 moves from completely entering the wafer 100 to the center of the wafer 100, the pressure applied by the cleaning brush 211 to the lower surface of the wafer 100 gradually increases; when the cleaning brush 211 continues to move a distance from the center of the wafer 100, the pressure applied by the cleaning brush 211 to the lower surface of the wafer 100 remains unchanged.
[0065] Furthermore, the cleaning brushes 211 on the upper and lower sides of the wafer 100 move synchronously and apply pressure to the wafer 100 at the same time to prevent the wafer 100 from being deformed and broken due to the asynchronous application of pressure to the wafer 100. When the cleaning brushes 211 on the upper and lower sides of the wafer 100 are in contact with the wafer 100, the driving component 22 synchronously drives the cleaning brushes 211 on the upper and lower sides of the wafer 100 to move. Of course, when only one side of the wafer 100 needs to be cleaned, this embodiment can control the movement of the corresponding cleaning component 21 through the driving component 22, and the other cleaning component 21 remains stationary.
[0066] Furthermore, if Figure 3As shown, cleaning liquid nozzles 3 are also provided on the upper and lower sides of the wafer 100, and the cleaning liquid is sprayed on the surface of the wafer 100 through the cleaning liquid nozzles 3. In the embodiment of the utility model, at least one cleaning liquid nozzle 3 is provided on the upper and lower sides of the wafer 100. Of course, this embodiment does not limit the number of the cleaning liquid nozzles 3. Those skilled in the art can change the number of the cleaning liquid nozzles 3 according to actual conditions, as long as the same technical effect can be achieved.
[0067] The specific working process of the wafer double-sided cleaning device provided by the utility model is as follows:
[0068] First, the wafer 100 is placed on the support mechanism 1, and the wafer 100 is driven to rotate by rotating the rotating shaft 11, and then the cleaning component 21 on the upper side of the wafer 100 is moved to the edge of the wafer by the driving component 22, and then the cleaning brush 211 is moved down to abut against the wafer 100 by the lifting component 212, and then the cleaning brush 211 is rotated by the rotating component 213, and then the cleaning component 21 on the lower side of the wafer 100 is moved to the edge of the wafer by the driving component 22, and then The lifting member 212 moves the cleaning brush 211 upward to abut against the wafer 100, and then rotates the cleaning brush 211 through the rotating member 213, and finally, the driving assembly 22 synchronously drives the cleaning assemblies 21 on the upper and lower sides of the wafer 100 to reciprocate on the surface of the wafer 100. After cleaning is completed, the cleaning brushes 211 on the upper and lower sides of the wafer 100 are respectively separated from the wafer 100, and then the driving assembly 22 returns the cleaning assemblies to their initial positions, thereby completing the double-sided cleaning process of the wafer 100.
[0069] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.
Claims
1. A wafer double-sided cleaning device, characterized in that: include: A support mechanism (1) is provided with a rotating table, on which a wafer (100) is arranged; when the rotating table rotates, the wafer (100) rotates along with the rotating table; A pair of cleaning mechanisms (2) are respectively arranged on the upper side and the lower side of the wafer (100); under the action of an external force, the cleaning mechanism (2) has a first state of being bonded to the wafer (100), and a second state of being separated from the wafer (100); After a pair of cleaning mechanisms (2) are attached to the wafer (100), they synchronously reciprocate on the upper surface and the lower surface of the wafer (100) along the radial direction of the wafer (100).
2. The wafer double-side cleaning device according to claim 1, characterized in that: The support mechanism (1) is composed of a plurality of rotating shafts (11), and the rotating shafts (11) are suitable for driving the wafer (100) to rotate.
3. The wafer double-side cleaning device according to claim 2, characterized in that: A clamping groove is provided at one end of the rotating shaft (11) close to the wafer (100), and the clamping groove is suitable for clamping the wafer (100).
4. The wafer double-side cleaning device according to claim 3, characterized in that: The cleaning mechanism (2) comprises: Cleaning components (21) are respectively arranged on the upper and lower sides of the wafer (100); The driving components (22) are respectively arranged on the upper and lower sides of the wafer (100) and connected to the cleaning component (21); the driving component (22) is suitable for driving the cleaning component (21) to perform reciprocating motion on the surface of the wafer (100).
5. The wafer double-side cleaning device according to claim 4, characterized in that: The cleaning component (21) comprises: A cleaning brush (211) is arranged on the upper and lower sides of the wafer (100), and the cleaning brush (211) is suitable for contacting with and moving away from the wafer (100); A lifting member (212) is arranged on the driving assembly (22), and the lifting member (212) is suitable for performing a lifting operation on the cleaning brush (211); A rotating member (213) is arranged on the driving assembly (22), and the rotating member (213) is suitable for rotating the cleaning brush (211); Under the action of the lifting member (212), the cleaning brush (211) and the upper and lower surfaces of the wafer (100) move closer to and farther away from each other, and at the same time, under the action of the rotating member (213), the cleaning brush (211) itself rotates.
6. The wafer double-side cleaning device according to claim 5, characterized in that: The surface of the wafer (100) is sequentially provided with different annular areas, and during the movement of the cleaning brush (211) from the center to the edge of the wafer (100) or from one end edge to the other end edge, the cleaning brush (211) is provided with different pressures and moving speeds in different annular areas on the surface of the wafer (100).
7. The wafer double-side cleaning device according to claim 6, characterized in that: The cleaning brushes (211) on the upper and lower sides of the wafer (100) move synchronously and apply pressure to the wafer (100) at the same time.
8. The wafer double-side cleaning device according to any one of claims 1 to 7, characterized in that: Cleaning liquid nozzles (3) are also provided on the upper and lower sides of the wafer (100), and the cleaning liquid is sprayed on the surface of the wafer (100) through the cleaning liquid nozzles (3).