Sealed IGBT (Insulated Gate Bipolar Translator) module shell structure

Abstract

The utility model provides a sealed IGBT module housing structure comprising a module housing side frame and a module housing cover plate main body installed on the top of the module housing side frame, and a silica gel pad is arranged between the module housing side frame and the module housing cover plate main body. An annular clamping strip is further arranged between the module shell side frame and the module shell cover plate body, the silica gel pad is of an annular structure design, an inner cavity of the silica gel pad is matched with the outer portion of the annular clamping strip, and the upper side and the lower side of the silica gel pad are attached to the module shell cover plate body and the module shell side frame respectively. Therefore, interference fit is formed between the module shell side frame and the module shell cover plate main body, the sealing performance between the module shell side frame and the module shell cover plate main body is improved, water vapor, salt, dust and the like are effectively prevented from entering the module, the service life of the IGBT module in an extremely severe environment is prolonged, the use effect of the device is improved, and the actual use requirement is met.

Description

Technical Field

[0001] The utility model belongs to the technical field of IGBT modules, and in particular relates to a sealed IGBT module housing structure. Background Art

[0002] IGBT module is an important power semiconductor device, mainly used in the field of high-power power electronics. When designing the IGBT module packaging process, the assembly gap between the side frame of the IGBT module housing and the cover plate must be reserved, usually designed to be more than 0.2mm on one side. With the widespread application of IGBT modules in the field of new energy, such as solar power generation, wind power generation, new energy vehicles, etc., it is proposed that IGBT modules should meet the needs of long-term service in extremely harsh environments such as high humidity, high salt, and high dust.

[0003] The existing IGBT module housing structure cannot achieve reliable and complete sealing. Some water vapor, salt, dust, etc. will enter the IGBT module through the gap between the side frame and the cover of the IGBT module housing, causing the IGBT module to be unable to adapt to long-term service in extremely harsh environments, reducing the service life of the IGBT module and making it difficult to meet actual usage requirements.

[0004] In order to solve the above problems, a sealed IGBT module housing structure is proposed in the present application. Utility Model Content

[0005] To solve the problems raised in the above background technology. The utility model provides a sealed IGBT module housing structure, which has a win-win fit between the module housing side frame and the module housing cover body, increases the sealing between the module housing side frame and the module housing cover body, effectively isolates water vapor, salt, dust, etc. from entering the module, prolongs the service life of the IGBT module in extremely harsh environments, improves the use effect of the device, and meets the actual use requirements.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a sealed IGBT module housing structure, comprising a module housing side frame and a module housing cover body installed on the top of the module housing side frame, a silicone pad is arranged between the module housing side frame and the module housing cover body, and an annular clip is also arranged between the module housing side frame and the module housing cover body.

[0007] As a preferred sealed IGBT module housing structure of the utility model, the silicone pad is designed in an annular structure, and the internal cavity of the silicone pad is adapted to the outside of the annular clip, and the upper and lower sides of the silicone pad are respectively fitted with the module housing cover body and the module housing side frame.

[0008] As a preferred sealed IGBT module housing structure of the utility model, the surface of the module housing side frame is provided with a second slot that is compatible with the annular clip strip, and the lower surface of the module housing cover body is provided with a first slot that is compatible with the annular clip strip, and the upper and lower sides of the annular clip strip are respectively clamped in the inside of the first slot and the second slot.

[0009] As a preferred sealed IGBT module housing structure of the utility model, a plurality of groups of protrusions are fixed to the inner side wall of the module housing side frame, and a surface of the module housing cover plate body is provided with protrusion grooves matching with the protrusions.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] Through the coordinated use of the module housing side frame, the module housing cover body, the protrusion, the protruding groove, the annular clip strip, the silicone pad, the first clip groove and the second clip groove, a win-win fit is formed between the module housing side frame and the module housing cover body, thereby increasing the sealing between the module housing side frame and the module housing cover body, effectively isolating water vapor, salt, dust and the like from entering the module, thereby extending the service life of the IGBT module in extremely harsh environments, improving the use effect of the device, and meeting actual use needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 This is a structural cross-sectional view of the connecting parts such as the module housing side frame and the module housing cover plate body in the utility model;

[0015] Figure 3 For the utility model Figure 2 A schematic diagram of the enlarged structure at point A;

[0016] Figure 4 It is a structural schematic diagram of the module housing cover plate body and connecting parts such as annular clips in the utility model.

[0017] In the figure: 101, module housing side frame; 102, module housing cover body; 103, convex block; 104, convex groove; 105, annular clamping strip; 106, silicone pad; 107, first clamping groove; 108, second clamping groove. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] Example 1

[0020] like Figure 1 As shown:

[0021] A sealed IGBT module housing structure comprises a module housing side frame 101 and a module housing cover plate body 102 installed on the top of the module housing side frame 101 .

[0022] In this implementation scheme: This application makes further improvements on this existing subject, please refer to the disclosed technology below for details; to solve the technical problems existing in this prior art, such as the above background technology disclosed that "the currently existing IGBT module housing structure cannot achieve reliable and complete sealing, and some water vapor, salt, dust, etc. will enter the IGBT module from the gap between the IGBT module housing side frame 101 and the cover plate, causing the IGBT module to be unable to adapt to long-term service in extremely harsh environments, reducing the service life of the IGBT module, and making it difficult to meet actual use needs." In terms of use, this problem is obviously a real problem that exists and is relatively difficult to solve.

[0023] More specifically:

[0024] like Figure 1-Figure 4 As shown:

[0025] In combination with the above content: a silicone pad 106 is provided between the module housing side frame 101 and the module housing cover body 102, and an annular clamping strip 105 is also provided between the module housing side frame 101 and the module housing cover body 102;

[0026] The silicone pad 106 is designed in an annular structure, and the inner cavity of the silicone pad 106 is adapted to the outer portion of the annular clamping strip 105 , and the upper and lower sides of the silicone pad 106 are respectively fitted with the module housing cover plate body 102 and the module housing side frame 101 .

[0027] In this embodiment: when using the sealed IGBT module housing structure, first, the silicone pad 106 is put on the outside of the annular clip 105 and fits with the bottom surface of the inner cavity of the module housing side frame 101, and then the module housing cover body 102 is aligned with the module housing side frame 101, and then the module housing cover body 102 is pressed to install the module housing side frame 101 and the module housing cover body 102. Through the setting of the silicone pad 106, a win-win fit is formed between the module housing side frame 101 and the module housing cover body 102, thereby increasing the sealing between the module housing side frame 101 and the module housing cover body 102, effectively isolating water vapor, salt, dust, etc. from entering the module, thereby extending the service life of the IGBT module in extremely harsh environments, improving the use effect of the device, and meeting actual use needs.

[0028] Going further;

[0029] In an optional embodiment, a second card slot 108 compatible with the annular card strip 105 is provided on the surface of the module shell side frame 101, and a first card slot 107 compatible with the annular card strip 105 is provided on the lower surface of the module shell cover body 102, and the annular card strip 105 is respectively clamped in the first card slot 107 and the second card slot 108 on the upper and lower sides.

[0030] In this embodiment: the bottom of the annular clip 105 is inserted into the inside of the second clip groove 108 opened in the module shell side frame 101, and the top of the annular clip 105 is inserted into the inside of the first clip groove 107 opened in the module shell cover body 102, so that the annular clip 105 plays a limiting effect between the module shell side frame 101 and the module shell cover body 102, increases the stability of the connection between the module shell side frame 101 and the module shell cover body 102, and also plays a limiting effect on the silicone pad 106, which can ensure the accuracy of the installation of the silicone pad 106 and improve the sealing effect of this device.

[0031] Going further;

[0032] In an optional embodiment, a plurality of groups of protrusions 103 are fixed to the inner side wall of the module housing side frame 101 , and a protrusion groove 104 matching with the protrusion 103 is formed on the surface of the module housing cover body 102 .

[0033] In this embodiment: through the cooperation of the protrusion 103 and the protrusion groove 104, the module housing cover body 102 can be engaged inside the module housing side frame 101. Through the provision of the protrusion 103 and the protrusion groove 104, the installation efficiency of the module housing cover body 102 is improved.

[0034] Working principle and use process of the utility model: when using the sealed IGBT module housing structure, first insert the bottom of the annular clamping strip 105 into the inside of the second clamping groove 108 opened in the module housing side frame 101, then put the silicone pad 106 on the outside of the annular clamping strip 105 and fit it with the bottom surface of the inner cavity of the module housing side frame 101, then make the module housing cover plate body 102 correspond to the module housing side frame 101, and then press the module housing cover plate body 102. At this time, with the cooperation of the protrusion 103 and the protruding groove 104, the module housing cover plate body 102 can be clamped into the inside of the module housing side frame 101. The setting of the protrusion 103 and the protruding groove 104 improves the installation efficiency of the module housing cover plate body 102. After the module housing side frame 101 and the module housing cover plate body 102 are installed, the silicone pad 106 The arrangement forms an over-fit between the module housing side frame 101 and the module housing cover body 102, thereby increasing the sealing between the module housing side frame 101 and the module housing cover body 102, effectively isolating water vapor, salt, dust, etc. from entering the module, extending the service life of the IGBT module in extremely harsh environments, improving the use effect of the device, and meeting actual use requirements. At the same time, the top end of the annular clip 105 is stuck in the first clip groove 107 opened in the module housing cover body 102, so that the annular clip 105 plays a limiting effect between the module housing side frame 101 and the module housing cover body 102, increasing the stability of the connection between the module housing side frame 101 and the module housing cover body 102, and also playing a limiting effect on the silicone pad 106, which can ensure the accuracy of the installation of the silicone pad 106 and improve the sealing effect of the device.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A sealed IGBT module housing structure, comprising a module housing side frame (101) and a module housing cover plate body (102) mounted on the top of the module housing side frame (101), characterized in that: A silicone pad (106) is provided between the module housing side frame (101) and the module housing cover plate body (102), and an annular clip strip (105) is also provided between the module housing side frame (101) and the module housing cover plate body (102).

2. The sealed IGBT module housing structure according to claim 1, characterized in that: The silicone pad (106) is designed in an annular structure, and the internal cavity of the silicone pad (106) is adapted to the outside of the annular clamping strip (105), and the upper and lower sides of the silicone pad (106) are respectively fitted with the module housing cover plate body (102) and the module housing side frame (101).

3. The sealed IGBT module housing structure according to claim 2, characterized in that: The surface of the module housing side frame (101) is provided with a second card slot (108) adapted to the annular card strip (105), and the lower surface of the module housing cover plate body (102) is provided with a first card slot (107) adapted to the annular card strip (105), and the upper and lower sides of the annular card strip (105) are respectively clamped in the first card slot (107) and the second card slot (108).

4. The sealed IGBT module housing structure according to claim 3, characterized in that: A plurality of groups of protrusions (103) are fixed to the inner side wall of the module housing side frame (101), and a protrusion groove (104) matching with the protrusions (103) is provided on the surface of the module housing cover plate body (102).

Images