Waterproof foam tape capable of reducing viscosity by heating

Abstract

The utility model relates to the technical field of adhesive tapes, and discloses a heat-visbreaking waterproof foam adhesive tape which comprises a first structural adhesive layer, a foaming base layer, a second structural adhesive layer, a PET (polyethylene terephthalate) supporting layer and a heat-visbreaking layer which are sequentially arranged from bottom to top, the sum of the thickness of the first structural adhesive layer, the thickness of the foaming base layer, the thickness of the second structural adhesive layer, the thickness of the PET supporting layer and the thickness of the heated visbreaking layer is H, the thickness of the PET supporting layer is h, and h is larger than or equal to 5% H and smaller than or equal to 10% H. The SCF copper foil has the beneficial effects that the PET supporting layer is arranged to separate the foam layer from the heated visbreaking layer, so that the influence of the foam layer on the structural stability of the heated visbreaking layer when the foam layer is heated is avoided, and the heated visbreaking layer is prevented from remaining on the SCF copper foil.

Description

Technical Field

[0001] The utility model relates to the technical field of adhesive tapes, in particular to a heat-induced viscosity-reducing waterproof foam adhesive tape. Background Art

[0002] During the assembly process of smartphone OLED screens, in order to improve the electrical connection and efficiency of the OLED screen, an SCF copper foil is provided on the side of the OLED screen close to the phone case. The SCF copper foil is generally bonded and fixed to the phone case with a heat-resistant, anti-viscosity foam tape, making it easier to disassemble and assemble the SCF copper foil during subsequent phone maintenance.

[0003] The heat-resistant anti-viscosity foam tape in the prior art has a heat-resistant anti-viscosity layer used for bonding with the SCF copper foil, which is arranged on the foam layer. The foam layer includes a first structural adhesive layer, a foaming base layer and a second structural adhesive layer which are arranged in sequence, wherein the second structural adhesive layer is bonded to the anti-viscosity layer, and the first structural adhesive layer is bonded to the casing. Since the foam layer and the anti-viscosity layer are bonded to each other, the foam layer will shrink or deform microscopically when heated, and the structure of the heat-resistant anti-viscosity layer will also change slightly, which affects the bonding strength between the heat-resistant anti-viscosity layer and the foam layer, resulting in uncertain stratification between the heat-resistant anti-viscosity layer and the foam layer. When the SCF copper foil is disassembled and assembled, the heat-resistant anti-viscosity layer will remain on the SCF copper foil, which is not easy to clean. Utility Model Content

[0004] The utility model aims to provide a heat-resistant and anti-viscosity waterproof foam tape, in which a PET support layer is provided to separate the foam layer from the heat-resistant and anti-viscosity layer, so as to avoid the foam layer affecting the structural stability of the heat-resistant and anti-viscosity layer when heated, and to avoid the heat-resistant and anti-viscosity layer remaining on the SCF copper foil.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a heat-induced viscosity-reducing waterproof foam tape, comprising a first structural adhesive layer, a foaming base layer, a second structural adhesive layer, a PET support layer and a heat-induced viscosity-reducing layer arranged in sequence from bottom to top;

[0006] The sum of the thicknesses of the first structural adhesive layer, the foaming base layer, the second structural adhesive layer, the PET support layer and the heat-resistant viscosity-reducing layer is H, the thickness of the PET support layer is h, and 5%H≤h≤10%H is satisfied.

[0007] Furthermore, the thickness h of the PET support layer is 6um-25um.

[0008] Furthermore, the thickness of the heat-reducing viscosity-reducing layer is greater than or equal to 40 um.

[0009] Furthermore, the thickness of the first structural adhesive layer is greater than or equal to 40 um.

[0010] Furthermore, when heated at a given temperature of 75° C. for 10 minutes, the thermal peeling force of the heated anti-adhesive layer is n, and the thermal peeling force of the second structural adhesive layer is N, wherein n is less than 1000 gf and N is greater than 1000 gf.

[0011] Furthermore, the thermal peeling force of the first structural adhesive layer is M, Mn≥300gf.

[0012] Furthermore, under the given conditions of a temperature of 80° C. and a load of 1 kg, the adhesion time between the heated viscosity-reducing layer and the first structural adhesive layer is greater than 48 hours.

[0013] Furthermore, the foaming base layer is made by a closed-cell foaming process.

[0014] Furthermore, the density of the foamed base layer is greater than or equal to 200 kg / m 3 .

[0015] Compared with the prior art, the utility model embodiment of a heat-resistant and anti-viscosity waterproof foam tape has the following beneficial effects: a PET support layer is arranged between the second structural adhesive layer and the heat-resistant and anti-viscosity layer to avoid the foam layer from affecting the structural stability of the heat-resistant and anti-viscosity layer when heated, improve the stability of the heat-resistant and anti-viscosity layer structure, and avoid the heat-resistant and anti-viscosity layer remaining on the SCF copper foil when the SCF copper foil is disassembled and assembled. In addition, the thickness h of the PET support layer satisfies 5%H≤h≤10%H, which not only ensures the stability of the PET support layer structure, but also does not affect the overall shock absorption effect and winding of the tape. In addition, compared with the tape in the prior art, the utility model embodiment of a heat-resistant and anti-viscosity waterproof foam tape has a thinner thickness of the heat-resistant and anti-viscosity layer when the thickness of H is the same and the thickness of the foam layer is the same, which reduces the curing depth of the heat-resistant and anti-viscosity layer during coating production, shortens the curing time, and improves the production efficiency of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of the heat-resistant and anti-viscosity foam tape according to an embodiment of the utility model;

[0017] Figure 2 This is a reference diagram of the use status of the heated anti-viscosity foam tape according to an embodiment of the utility model.

[0018] In the figure, 1, foam layer; 11, first structural adhesive layer; 12, foam base layer; 13, second structural adhesive layer; 2, PET support layer; 3, heat-resistant viscosity-reducing layer; a, mobile phone case; b, SCF copper foil. DETAILED DESCRIPTION

[0019] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0020] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "inside", "outside", etc. used in the present invention to indicate the orientation or positional relationship are based on the positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred devices and elements must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0021] In the description of the present invention, it should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but these information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information.

[0022] like Figure 1 As shown, a heat-resistant and anti-viscosity foam tape according to a preferred embodiment of the utility model comprises a foam layer 1, a PET support layer 2 and a heat-resistant and anti-viscosity layer 3 arranged in sequence from bottom to top. Specifically, the foam layer 1 comprises a first structural adhesive layer 11, a foaming base layer 12 and a second structural adhesive layer 13. Therefore, in this embodiment, the first structural adhesive layer 11, the foaming base layer 12, the second structural adhesive layer 13, the PET support layer 2 and the heat-resistant and anti-viscosity layer 3 are arranged in sequence from bottom to top.

[0023] In this embodiment, see Figure 2 The first structural adhesive layer 11 is used to bond with the mobile phone shell a, the heat-reducing adhesion layer 3 is used to bond with the SCF copper foil b, and the other side of the SCF is connected to the OLED screen.

[0024] Since the PET support layer 2 has good heat resistance, the overall connection structure is relatively stable when combined with the heat-resistant and anti-viscosity layer 3 when heated, and the foam layer 1 is isolated from shrinking or deforming when heated, which affects the heat-resistant and anti-viscosity layer 3, thereby improving the stability of the structure of the heat-resistant and anti-viscosity layer 3 and preventing the heat-resistant and anti-viscosity layer 3 from remaining on the SCF copper foil when the SCF copper foil is disassembled and assembled. In addition, when verifying the anti-viscosity performance of the heat-resistant and anti-viscosity layer 3 in the early design of the tape, the influence of the foam layer 1 on the structural stability of the heat-resistant and anti-viscosity layer 3 is eliminated, which reduces the difficulty of the research and development of the tape and improves the research and development efficiency.

[0025] Furthermore, due to the addition of the PET support layer 2, in order to ensure the stability of the overall structure of the tape, in this embodiment, the sum of the thicknesses of the first structural adhesive layer 11, the foaming base layer 12, the second structural adhesive layer 13, the PET support layer 2, and the heat-reducing adhesive layer 3 is H, and the thickness of the PET support layer 2 is h, satisfying 5%H≤h≤10%H. Among them, when h<5%H, the structural strength of the PET support layer 2 is weak, the structure is not stable enough, and the tape is easy to break when rolled. When h>10%H, due to the hardness of the PET material, the overall shock absorption effect of the tape is affected. At the same time, the tape is not easy to roll, which affects the normal production of the tape. Therefore, in this embodiment, 5%H≤h≤10%H can be adaptively adjusted according to actual production needs. In addition, in order to set a more suitable thickness of the PET support layer 2, according to the different total thickness of the tape, in this embodiment, the thickness h of the PET support layer 2 is 6um-25um. Furthermore, compared with the adhesive tape in the prior art, the adhesive tape in the utility model has a thinner thickness of the heat-resistant and anti-viscosity layer 3 due to the provision of the PET support layer 2 when the thickness of H and the thickness of the foam layer 1 are the same, thereby reducing the curing depth of the heat-resistant and anti-viscosity layer 3 during coating production, shortening the curing time, and improving the production efficiency of the product.

[0026] Further, in order to facilitate the design of the thickness of the heated anti-viscosity layer 3 and meet the bonding requirements, in this embodiment, the thickness of the heated anti-viscosity layer 3 is greater than or equal to 40um. Further, in some embodiments, in order to avoid the thickness of the heated anti-viscosity layer 3 being too thick, resulting in a long heating time required for anti-viscosity, the thickness of the heated anti-viscosity layer 3 is less than or equal to 80um, which can be adjusted according to actual design requirements. Similarly, in order to make the first structural adhesive layer 11 have a good bonding strength, the thickness of the first structural adhesive layer 11 is greater than or equal to 40um.

[0027] Furthermore, in order to test the thermal peeling force of the first structural adhesive layer 11, the second structural adhesive layer 13 and the heated anti-adhesive layer 3 to determine the stability between the adhesive layers of the tape, in this embodiment, the thickness of the first structural adhesive layer 11, the second structural adhesive layer 13, and the heated anti-adhesive layer 3 are all 50um, the thickness of the PET support layer 2 is 25um, and the thermal peeling force is tested on a 180° peel strength testing machine after heating for 10 minutes at a given temperature of 75°C. Specifically, the thermal peeling force of the first structural adhesive layer 11 is M, the thermal peeling force of the second structural adhesive layer 13 is N, and the thermal peeling force of the heated anti-adhesive layer is n, wherein n is less than 1000gf, N is greater than 1000gf, and Mn≥300gf. According to actual needs, by controlling the thermal peeling force of the first structural adhesive layer 11 and the heated de-adhesive layer 3, it is possible to ensure that the tape is completely adhered to the mobile phone case a, and at the same time, the heated de-adhesive layer 3 is separated from the SCF copper foil b, thereby avoiding damage to the SCF copper foil b during disassembly and assembly, and avoiding the scrapping of high-value screen components.

[0028] Furthermore, in order to measure the adhesion time of the heated anti-tack layer 3 and the first structural adhesive layer 11, the adhesive tape provided by the utility model is cut into two sections, which are used to measure the adhesion time of the heated anti-tack layer 3 and the first structural adhesive layer 11, respectively, that is, the cut tapes are respectively adhered to the test plate of the high temperature holding power tester, and at a given temperature of 80°C, a 1kg load is hung at the lower end of the tape, and the sliding distance of the tape or the adhesion time of the tape is measured to evaluate the durability of the tape adhesion. The adhesion time of the heated anti-tack layer 3 is measured to be greater than 48h, and the adhesion time of the first structural adhesive layer 11 is greater than 48h. By controlling the adhesion time of the two, it is ensured that the overall structural strength and adhesion of the tape are good, which is conducive to bonding.

[0029] Furthermore, in order to improve the overall waterproof performance of the tape, in this embodiment, the foaming base layer 12 is made by a closed-cell foaming process, and the density of the foaming base layer 12 is greater than or equal to 200 kg / m 3 .

[0030] In addition, since a PET support layer 2 is provided between the heat-resistant and anti-viscosity layer 3 and the foam layer 1, during the disassembly of the mobile phone, when the foam layer 1 is accidentally delaminated or the heat-resistant and anti-viscosity layer 3 remains on the SCF copper foil b, the PET support layer 2 can be used as a carrier for cleaning, that is, the PET support layer 2 and the foam layer 1 are delaminated or the heat-resistant and anti-viscosity layer 3 can be cleaned as a whole. The adhesive tape in the prior art cannot achieve this processing effect.

[0031] In summary, the embodiment of the utility model provides a heat-resistant and anti-viscosity waterproof foam tape, in which a PET support layer 2 is arranged between the second structural adhesive layer 13 and the heat-resistant and anti-viscosity layer 3, so as to avoid the foam layer 1 affecting the structural stability of the heat-resistant and anti-viscosity layer 3 when heated, improve the structural stability of the heat-resistant and anti-viscosity layer 3, and avoid the heat-resistant and anti-viscosity layer 3 remaining on the SCF copper foil b when the SCF copper foil b is disassembled and assembled. In addition, the thickness h of the PET support layer 2 satisfies 5%H≤h≤10%H, which not only ensures the structural stability of the PET support layer 2, but also does not affect the overall shock absorption effect and winding of the tape. In addition, compared with the tape in the prior art, the heat-resistant and anti-viscosity waterproof foam tape of the utility model embodiment has a thinner thickness of the heat-resistant and anti-viscosity layer 3 when the thickness of H is the same and the thickness of the foam layer is the same, which reduces the curing depth of the heat-resistant and anti-viscosity layer 3 during coating production, shortens the curing time, and improves the production efficiency of the product.

[0032] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principle of the present invention. These improvements and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. A heat-resistant and anti-sticking waterproof foam tape, characterized in that: It includes a first structural adhesive layer, a foaming base layer, a second structural adhesive layer, a PET support layer and a heat-induced viscosity-reducing layer arranged in sequence from bottom to top; The sum of the thicknesses of the first structural adhesive layer, the foaming base layer, the second structural adhesive layer, the PET support layer and the heat-resistant viscosity-reducing layer is H, the thickness of the PET support layer is h, and 5%H≤h≤10%H is satisfied.

2. The heat-resistant and anti-viscosity-reducing waterproof foam tape according to claim 1, characterized in that: The thickness h of the PET support layer is 6um-25um.

3. The heat-resistant and anti-viscosity waterproof foam tape according to claim 1, characterized in that: The thickness of the heat-induced viscosity-reducing layer is greater than or equal to 40 um.

4. The heat-resistant and anti-viscosity-reducing waterproof foam tape according to claim 1, characterized in that: The thickness of the first structural adhesive layer is greater than or equal to 40 um.

5. The heat-resistant and anti-viscosity-reducing waterproof foam tape according to claim 1, characterized in that: When heated at a given temperature of 75° C. for 10 minutes, the thermal peeling force of the heated anti-adhesive layer is n, and the thermal peeling force of the second structural adhesive layer is N, wherein n is less than 1000 gf and N is greater than 1000 gf.

6. The heat-resistant and anti-viscosity-reducing waterproof foam tape according to claim 5, characterized in that: The thermal peeling force of the first structural adhesive layer is M, Mn≥300gf.

7. The heat-resistant and anti-viscosity waterproof foam tape according to claim 1, characterized in that: Under the conditions of a given temperature of 80° C. and a load of 1 kg, the adhesion time between the heated viscosity-reducing layer and the first structural adhesive layer is greater than 48 hours.

8. The heat-resistant and anti-viscosity-reducing waterproof foam tape according to any one of claims 1 to 7, characterized in that: The foaming base layer is made by adopting a closed-cell foaming process.

9. The heat-resistant and anti-viscosity-reducing waterproof foam tape according to claim 1, characterized in that: The density of the foaming base is greater than or equal to 200 kg / m 3 .

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