Shell of temperature and pressure sensor, temperature and pressure sensor and vehicle

Abstract

The utility model discloses a shell of a temperature pressure sensor, the temperature pressure sensor and a vehicle, a temperature sensing assembly mounting groove, a sealing element mounting groove and a circuit board mounting groove are formed in the shell, the temperature sensing assembly mounting groove and the sealing element mounting groove are arranged at intervals, and the circuit board mounting groove and the sealing element mounting groove are arranged in the axial direction of the shell. The temperature sensing assembly mounting groove and the sealing element mounting groove are located at one end of the circuit board mounting groove, the temperature sensing assembly mounting groove is used for mounting a temperature sensing assembly, the sealing element mounting groove is used for mounting a first sealing element, and the circuit board mounting groove is used for mounting a circuit board. According to the temperature pressure sensor, the temperature sensing assembly mounting groove, the sealing element mounting groove and the circuit board mounting groove are formed in the shell, so that the temperature sensing assembly, the sealing element and the circuit board can be correspondingly mounted in the mounting grooves, the temperature pressure sensor can be assembled and connected conveniently, the temperature sensing assembly, the sealing element and the circuit board are arranged in the temperature pressure sensor more compactly, and the temperature pressure sensor is more compact in structure. And the miniaturization design of the temperature and pressure sensor is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature and pressure sensors, in particular to a housing of a temperature and pressure sensor, a temperature and pressure sensor and a vehicle. Background Art

[0002] In the prior art, a plurality of electrical components are provided in the temperature and pressure sensor so that the temperature and pressure sensor is suitable for the use performance of the temperature and pressure sensor through the electrical components. In the related art, the electrical components provided in the temperature and pressure sensor are not only relatively difficult to be arranged in the temperature and pressure sensor, but also make the electrical components of the temperature and pressure sensor more easily affected during use, so that the use performance of the temperature and pressure sensor is relatively poor. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the utility model is to provide a housing of a temperature and pressure sensor, wherein a plurality of mounting grooves are provided in the housing so that other components in the temperature and pressure sensor can be correspondingly mounted in the mounting grooves, which simplifies the assembly process and makes the construction of the temperature and pressure sensor more reliable, thereby correspondingly improving the performance of the temperature and pressure sensor.

[0004] Another object of the present invention is to provide a temperature and pressure sensor, wherein the temperature and pressure sensor is provided with a housing as shown above.

[0005] Another object of the present invention is to provide a vehicle, wherein the temperature and pressure sensors as shown above are arranged in the vehicle.

[0006] According to the shell of the temperature and pressure sensor of the embodiment of the utility model, a temperature sensing component mounting groove, a sealing component mounting groove and a circuit board mounting groove are formed in the shell, and the temperature sensing component mounting groove and the sealing component mounting groove are arranged at intervals. In the axial direction of the shell, the temperature sensing component mounting groove and the sealing component mounting groove are located at one end of the circuit board mounting groove, the temperature sensing component mounting groove is used to install the temperature sensing component, the sealing component mounting groove is used to install the first seal, and the circuit board mounting groove is used to install the circuit board.

[0007] According to the housing of the temperature and pressure sensor of the embodiment of the utility model, a temperature sensing component installation groove, a seal installation groove and a circuit board installation groove are provided on the housing, so that the temperature sensing component, the seal and the circuit board can be installed in the above-mentioned installation grooves accordingly, so as to facilitate the assembly and connection of the temperature and pressure sensor, and make the arrangement of the temperature sensing component, the seal and the circuit board in the temperature and pressure sensor more compact, while realizing the miniaturized design of the temperature and pressure sensor, the use performance of the temperature and pressure sensor can be improved, so that the temperature and pressure sensor has higher applicability.

[0008] In some embodiments, in a plane perpendicular to the axial direction of the housing, a projection of the temperature sensing component mounting groove and a projection of the sealing component mounting groove are both located within a projection of the circuit board mounting groove.

[0009] In some embodiments, the sealing member installation groove is arranged around the temperature sensing component installation groove, and the housing is provided with a separation ring between the temperature sensing component installation groove and the sealing member installation groove.

[0010] In some embodiments, the inner wall of the separation ring is provided with a limiting portion protruding toward the temperature sensing component installation groove.

[0011] In some embodiments, a mounting hole is formed in the shell, the mounting hole is connected to the temperature sensing component mounting groove, and the inner wall of the limiting portion is flush with the inner wall of the mounting hole.

[0012] In some embodiments, an inner wall of the circuit board installation slot is provided with a fixing portion protruding toward the inside of the circuit board installation slot.

[0013] In some embodiments, there are a plurality of fixing portions, and the plurality of fixing portions are distributed at intervals along the circumference of the circuit board mounting slot.

[0014] In some embodiments, the cross-section of the circuit board mounting slot is polygonal, the plurality of fixing portions include a first fixing portion, and the plurality of first fixing portions correspond one-to-one to the plurality of ends of the circuit board mounting slot.

[0015] In some embodiments, the plurality of fixing portions include a plurality of second fixing portions, and the plurality of second fixing portions are respectively disposed on different side walls of the circuit board mounting slot.

[0016] In some embodiments, the circuit board mounting groove includes: first side walls arranged opposite to each other and second side walls arranged opposite to each other, the second side walls are connected between the first side walls, a plurality of first fixing portions are respectively arranged on the first side walls and extend from one end of the first side walls to the other end, and the second fixing portions are respectively arranged on the second side walls.

[0017] In some embodiments, in a plane perpendicular to the axial direction of the housing, a projection of the fixing portion is a rectangle.

[0018] A temperature and pressure sensor according to an embodiment of the utility model comprises: a temperature sensing component, a first sealing component, a circuit board, and a housing of the temperature and pressure sensor as described in any one of the above items.

[0019] According to the temperature and pressure sensor of the embodiment of the utility model, by providing a housing as shown above in the temperature and pressure sensor, since the housing is provided with the temperature sensing component installation groove, the seal installation groove and the circuit board installation groove as shown above, the temperature sensing component, the seal and the circuit board can be installed in the above installation grooves accordingly, so as to facilitate the assembly and connection of the temperature and pressure sensor, and make the arrangement of the temperature sensing component, the seal and the circuit board in the temperature and pressure sensor more compact, while realizing the miniaturization design of the temperature and pressure sensor, the use performance of the temperature and pressure sensor can also be improved, so that the temperature and pressure sensor has higher applicability. In some embodiments, the circuit board is a ceramic circuit board.

[0020] In some embodiments, the first seal is an elastic seal, and the first seal is elastically deformed under the pressure of the circuit board.

[0021] In some embodiments, the first seal is an O-ring.

[0022] In some embodiments, the temperature sensing component includes: a temperature sensing element and a protective cover, wherein the protective cover is sleeved on the temperature sensing element, and the protective cover is opened at one end away from the circuit board.

[0023] In some embodiments, the protective cover is provided with a limiting groove, and the limiting groove cooperates with the limiting portion of the shell in a circumferential limiting manner.

[0024] In some embodiments, it also includes: an elastic component connected between the circuit board and the temperature sensing component.

[0025] In some embodiments, it further includes: a second sealing member, the outer periphery of the shell is provided with a threaded section, the second sealing member is sleeved on the shell and is located at one end of the threaded section adjacent to the circuit board.

[0026] In some embodiments, it further includes: a connector, which is disposed on the housing, and the connector is located on a side of the circuit board away from the temperature sensing component and is electrically connected to the circuit board.

[0027] The vehicle according to the embodiment of the utility model includes: the temperature and pressure sensor as described above.

[0028] According to the vehicle of the embodiment of the utility model, by arranging the temperature and pressure sensor as shown above in the vehicle, the temperature and pressure sensor has more reliable performance, so that the temperature and pressure sensor can detect temperature and pressure more accurately and reliably and transmit signals, so that the vehicle can adjust the function according to the temperature and pressure sensor, so that the working performance of the vehicle is improved.

[0029] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0031] Figure 1 is a schematic structural diagram of a housing according to an embodiment of the utility model;

[0032] Figure 2 is a schematic structural diagram of a temperature and pressure sensor according to an embodiment of the utility model;

[0033] Figure 3 is an exploded schematic diagram of a temperature and pressure sensor according to an embodiment of the utility model;

[0034] Figure 4 is a cross-sectional schematic diagram of a temperature and pressure sensor according to an embodiment of the utility model;

[0035] Figure 5 is a schematic structural diagram of a temperature sensing component according to an embodiment of the utility model;

[0036] Reference numerals:

[0037] Housing 10, mounting hole 11,

[0038] Temperature sensing component installation slot 100,

[0039] Seal mounting groove 200,

[0040] Circuit board mounting slot 300, fixing portion 310, first fixing portion 311, second fixing portion 312, first side wall 320, second side wall 330,

[0041] Separating ring 400, limiting portion 410,

[0042] Temperature and pressure sensor 20,

[0043] Temperature sensing component 21, first sealing member 22, circuit board 23, temperature sensing element 24, protective cover 25, limiting groove 26, elastic component 27, second sealing member 28, connector 29, DETAILED DESCRIPTION

[0044] The embodiments of the present utility model are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present utility model are described in detail below.

[0045] Reference below Figure 1-Figure 5 The housing 10 of the temperature and pressure sensor according to the embodiment of the present utility model is described. A temperature sensing component mounting groove 100 , a sealing component mounting groove 200 and a circuit board mounting groove 300 are formed in the housing 10 .

[0046] Specifically, the temperature sensing component mounting groove 100 and the sealing component mounting groove 200 are arranged at intervals. In the axial direction of the shell 10, the temperature sensing component mounting groove 100 and the sealing component mounting groove 200 are located at one end of the circuit board mounting groove 300. The temperature sensing component mounting groove 100 is used to install the temperature sensing component 21, the sealing component mounting groove 200 is used to install the first sealing component 22, and the circuit board mounting groove 300 is used to install the circuit board 23.

[0047] It should be noted that according to the shell 10 of the temperature and pressure sensor 20 of the embodiment of the utility model, a plurality of mounting grooves are formed on the shell 10, and the mounting grooves are suitable for providing locations for the arrangement of other components, so as to simplify the assembly process of the components in the shell 10, and make the arrangement of the components in the shell 10 more reliable, so as to make the structural assembly of the temperature and pressure sensor 20 more reliable, so as to improve the performance of the temperature and pressure sensor 20.

[0048] Specifically, the installation groove includes a temperature sensing component installation groove 100, a sealing component installation groove 200 and a circuit board installation groove 300. The temperature sensing component installation groove 100 is suitable for providing a position for assembling the temperature sensing component 21, while the sealing component installation groove 200 is suitable for providing a position for arranging the seal, and the circuit board installation groove 300 is suitable for providing a position for setting the circuit board 23.

[0049] In some specific embodiments, the temperature sensing component mounting groove 100, the sealing component mounting groove 200 and the circuit board mounting groove 300 are spaced apart from each other, so that the temperature sensing component mounting groove 100 and the sealing component mounting groove 200 are arranged on one side of the circuit board mounting groove 300, so that the temperature sensing component 21, the seal and the circuit board 23 can be arranged in the housing 10 in a more compact manner, so that the structural setting of the temperature and pressure sensor 20 is more reliable, so as to improve the performance of the temperature and pressure sensor 20.

[0050] According to the housing 10 of the temperature and pressure sensor 20 of the embodiment of the utility model, a temperature sensing component installation groove 100, a sealing component installation groove 200 and a circuit board installation groove 300 are provided on the housing 10, so that the temperature sensing component 21, the sealing component and the circuit board 23 can be installed in the above-mentioned installation grooves accordingly, so as to facilitate the assembly and connection of the temperature and pressure sensor 20, and make the arrangement of the temperature sensing component 21, the sealing component and the circuit board 23 in the temperature and pressure sensor 20 more compact, while realizing the miniaturized design of the temperature and pressure sensor 20, the use performance of the temperature and pressure sensor 20 can also be improved, so that the temperature and pressure sensor 20 has higher applicability.

[0051] In some embodiments, in a plane perpendicular to the axial direction of the housing 10, the projection of the temperature sensing component installation groove 100 and the projection of the sealing component installation groove 200 are both located within the projection of the circuit board installation groove 300. It is understandable that, since in the vertical plane, the projection of the temperature sensing component installation groove 100 is set within the projection of the circuit board installation groove 300, so that the temperature sensing component 21 can be correspondingly set on the circuit board 23, so that the temperature sensing component 21 can transmit the detection effect to the circuit board 23 during use, so that the circuit board 23 can more reliably receive the signal to realize the detection and use of the temperature and pressure sensor 20. At the same time, the projection of the sealing component installation groove 200 can also be set within the projection of the circuit board installation groove 300, so that the first sealing component 22 can be correspondingly set on the circuit board 23, so that the first sealing component 22 can provide an isolation effect for the setting of the circuit board 23 in the housing 10, so that the use of the circuit board 23 is more reliable.

[0052] In some embodiments, the seal installation groove 200 is arranged around the temperature sensing component installation groove 100, and the housing 10 is provided with a separation ring 400 between the temperature sensing component installation groove 100 and the seal installation groove 200. In this way, since the seal installation groove 200 is arranged around the temperature sensing component installation groove 100, so that the first seal 22 can be arranged corresponding to the outer side of the temperature sensing component 21, the first seal 22 can provide a sealing effect to the temperature sensing component 21, so that the use reliability of the temperature sensing component 21 is improved. A separation ring 400 is also provided between the temperature sensing component installation groove 100 and the seal installation groove 200. The separation ring 400 is suitable for being arranged between the temperature sensing component 21 and the first seal 22, so that the setting stability of the first seal 22 outside the temperature sensing component 21 is improved, thereby improving the use accuracy of the temperature and pressure sensor 20 and reducing the error.

[0053] In some embodiments, the inner wall of the separator ring 400 is provided with a stopper 410 protruding toward the temperature sensing component installation groove 100. In this way, by providing the stopper 410 on the inner wall of the separator ring 400, the separator ring 400 is set in the temperature sensing component installation groove 100 by the stopper 410 corresponding to the stopper, so that the assembly process of the separator ring 400 is simpler, and the setting of the separator ring 400 in the temperature sensing component installation groove 100 is more reliable, so as to improve the performance of the temperature and pressure sensor 20.

[0054] In some embodiments, a mounting hole 11 is formed in the housing 10, the mounting hole 11 is communicated with the temperature sensing component mounting groove 100, and the inner wall of the limiting portion 410 is flush with the inner wall of the mounting hole 11. It can be understood that by providing the mounting hole 11 in the housing 10, since the mounting hole 11 is suitable for communicating with the temperature sensing component mounting groove 100, so that the mounting hole 11 is suitable for providing space for the assembly of the temperature sensing component 21, so as to facilitate the assembly and connection of the temperature sensing component 21, and the inner wall of the limiting portion 410 is flush with the inner wall of the mounting hole 11, so that the arrangement of the temperature sensing component 21 in the temperature sensing component mounting groove 100 is more reliable.

[0055] In some embodiments, the inner wall of the circuit board installation slot 300 is provided with a fixing portion 310 protruding toward the circuit board installation slot 300. It is understandable that the fixing portion 310 is provided on the inner wall of the circuit board installation slot 300 so that the fixing portion 310 can restrict the circuit board 23, which not only simplifies the arrangement process of the circuit board 23 in the circuit board installation slot 300, but also makes the arrangement of the circuit board 23 in the circuit board installation slot 300 more reliable, so as to improve the performance of the temperature and pressure sensor 20.

[0056] In some embodiments, there are multiple fixing parts 310, and the multiple fixing parts 310 are distributed at intervals along the circumference of the circuit board installation slot 300. In this way, by distributing the fixing parts 310 at intervals along the circumference of the circuit board installation slot 300, the fixing parts 310 can more reliably restrict the circuit board 23 into the circuit board installation slot 300, thereby making the assembly setting of the circuit board 23 more reliable and improving the performance of the temperature and pressure sensor 20.

[0057] In some embodiments, the cross section of the circuit board installation slot 300 is a polygon, and the plurality of fixing portions 310 include a first fixing portion 311, and the plurality of first fixing portions 311 correspond one-to-one to the plurality of ends of the circuit board installation slot 300. It can be understood that by setting the cross section of the circuit board installation slot 300 to a polygon, the structural arrangement of the circuit board 23 can be adjusted according to demand, and circuit boards 23 of different shapes can be restricted in the circuit board installation slot 300 according to the fixing portion 310, which not only makes the arrangement of the circuit board 23 in the circuit board installation slot 300 more applicable, but also improves the arrangement stability of the circuit board 23 in the circuit board installation slot 300.

[0058] In some embodiments, the plurality of fixing portions 310 include a plurality of second fixing portions 312, and the plurality of second fixing portions 312 are respectively disposed on different side walls of the circuit board mounting slot 300. Thus, since the plurality of fixing portions 310 also include the second fixing portions 312, and since the second fixing portions 312 are suitable for being fixed on different side walls of the circuit board mounting slot 300, the second fixing portions 312 and the first fixing portions 311 can fix the arrangement of the circuit board 23 in the circuit board mounting slot 300 together, thereby improving the structural stability of the circuit board 23 disposed in the circuit board mounting slot 300, so that the signal transmission between the temperature sensing component 21 and the circuit board 23 is more reliable.

[0059] In some embodiments, the circuit board installation slot 300 includes: a first side wall 320 and a second side wall 330 that are oppositely arranged, the second side wall 330 is connected between the first side walls 320, a plurality of first fixing portions 311 are respectively arranged on the first side wall 320 and extend from one end of the first side wall 320 to the other end, and a second fixing portion 312 is respectively arranged on the second side wall 330. It can be understood that the circuit board installation slot 300 includes a bottom wall that carries the circuit board 23 and a plurality of side walls that are limited to the side of the circuit board 23, the plurality of side walls include the first side wall 320 and the second side wall 330 that are oppositely arranged, the first fixing portion 311 is arranged on the first side wall 320 and extends along the end direction, and the second fixing portion 312 is arranged on the second side wall 330. In this way, when the circuit board 23 is limited in the circuit board installation slot 300, the first fixing portion 311 and the second fixing portion 312 can limit the circuit board 23 from different directions, so as to improve the reliability of the circuit board 23 being arranged in the circuit board installation slot 300.

[0060] In some embodiments, the projection of the fixing portion 310 is a rectangle in a plane perpendicular to the axial direction of the housing 10. It is understandable that by setting the projection of the fixing portion 310 to a rectangle, it is not only easy to set up and construct the fixing portion 310, simplify the production process, and improve production efficiency, but also allows the fixing portion 310 to better restrict the circuit board 23 in the circuit board mounting groove 300, so that the arrangement of the circuit board 23 in the circuit board mounting groove 300 is more reliable, so that the use accuracy of the temperature and pressure sensor 20 is improved.

[0061] According to the embodiment of the utility model, the temperature and pressure sensor 20 comprises: a temperature sensing component 21, a first sealing component 22, a circuit board 23 and a housing 10 of any one of the temperature and pressure sensors 20 as above. In this way, by providing the housing 10 as shown above in the temperature and pressure sensor 20, since the housing 10 is provided with the temperature sensing component mounting groove 100, the sealing component mounting groove 200 and the circuit board mounting groove 300 as above, the temperature sensing component 21, the first sealing component 22 and the circuit board 23 can be installed in the above mounting grooves accordingly, so as to facilitate the assembly and connection of the temperature and pressure sensor 20, and make the arrangement of the temperature sensing component 21, the sealing component and the circuit board 23 in the temperature and pressure sensor 20 more compact, while realizing the miniaturization design of the temperature and pressure sensor 20, the use performance of the temperature and pressure sensor 20 can also be improved, so that the temperature and pressure sensor 20 has higher applicability.

[0062] In some specific embodiments, the circuit board 23 is a ceramic circuit board 23. In this way, by setting the circuit board 23 as a ceramic circuit board 23, the ceramic circuit board 23 has higher performance, and the ceramic circuit board 23 also has higher structural performance, so that the first sealing member 22 can be better sealed between the circuit board 23 and the temperature sensing component 21, so that the performance of the temperature and pressure sensor 20 is improved.

[0063] In some embodiments, the first seal 22 is an elastic seal, and the first seal 22 is elastically deformed under the pressure of the circuit board 23. In this way, the first seal 22 can be set as an elastic seal, which not only facilitates the assembly of the first seal 22 between the circuit board 23 and the temperature sensing component 21, but also allows the first seal 22 to be elastically deformed under the resistance pressure of the circuit board 23, so that the sealing performance of the first seal 22 on the circuit board 23 is improved.

[0064] In some specific embodiments, the first sealing member 22 is an O-ring. Thus, by setting the first sealing member 22 as an O-ring, the O-ring has better sealing performance, so that the first sealing member 22 can be more reliably restricted on the circuit board 23, so that the sealing setting between the circuit board 23 and the temperature sensing component 21 is more reliable.

[0065] In some embodiments, the temperature sensing component 21 includes: a temperature sensing element 24, a protective cover 25, the protective cover 25 is sleeved on the temperature sensing element 24, and the end of the protective cover 25 away from the circuit board 23 is open. It can be understood that the protective cover 25 is suitable for sleeved on the temperature sensing element 24, so that the protective cover 25 is suitable for protecting the temperature sensing element 24, so that the performance of the temperature sensing element 24 is improved when it is used. At the same time, an opening is set at the end of the protective cover 25 away from the circuit board 23, so that the temperature sensing element 24 can pass through the protective cover 25 and contact the circuit board 23, so as to realize the signal transmission between the temperature sensing component 21 and the circuit board 23.

[0066] In some embodiments, the protective cover 25 is provided with a limiting groove 26, and the limiting groove 26 is circumferentially limited with the limiting portion 410 of the housing 10. It can be understood that by providing the limiting groove 26 on the protective cover 25, so that the limiting groove 26 and the limiting portion 410 provided on the housing 10 are limited, not only can a foolproof setting be achieved, but also the setting of the protective cover 25 on the housing 10 can be more reliable, so that the use of the temperature sensing element 24 is more reliable, thereby improving the performance of the temperature and pressure sensor 20.

[0067] In some embodiments, the temperature and pressure sensor 20 further includes: an elastic component 27, and the elastic component 27 is connected between the circuit board 23 and the temperature sensing component 21. In this way, the circuit board 23 and the temperature sensing component 21 can be connected through the elastic component 27 to achieve electrical connection between the circuit board 23 and the temperature sensing component 21, so that the signal transmission between the circuit board 23 and the temperature sensing component 21 is more reliable, thereby improving the performance of the temperature and pressure sensor 20.

[0068] In some embodiments, the temperature and pressure sensor 20 further includes: a second seal 28, a threaded section is provided on the outer periphery of the housing 10, and the second seal 28 is sleeved on the housing 10 and located at one end of the threaded section adjacent to the circuit board 23. In this way, by providing the threaded section on the housing 10, the temperature and pressure sensor 20 can be connected through the threaded section when connected, and the second seal 28 is provided at the end of the threaded section, so that the temperature and pressure sensor 20 is suitable for being sealed by the second seal 28 during the assembly process, so that the interference of the temperature and pressure sensor 20 during use can be reduced or even eliminated, so that the use performance of the temperature and pressure sensor 20 can be improved.

[0069] In some embodiments, the temperature and pressure sensor 20 further includes: a connector 29, which is disposed on the housing 10, and is located on a side of the circuit board 23 away from the temperature sensing component 21 and is electrically connected to the circuit board 23. In this way, the connector 29 is suitable for being disposed on the housing 10, so that the temperature and pressure sensor 20 is suitable for transmitting signals through the connector 29 during use, so that the temperature sensing component 21 is suitable for transmitting signals to the circuit board 23 for signal processing during use, and then the circuit board 23 transmits the signal through the connector 29 to form the use effect of the temperature and pressure sensor 20.

[0070] The vehicle according to the embodiment of the utility model includes: the temperature and pressure sensor 20 as described above. Therefore, by providing the temperature and pressure sensor 20 as described above in the vehicle, the temperature and pressure sensor 20 has a more reliable performance, so that the temperature and pressure sensor 20 can detect temperature and pressure more accurately and reliably and transmit signals, so that the vehicle can adjust the function according to the temperature and pressure sensor 20, so that the working performance of the vehicle is improved.

[0071] Other structures and operations of the vehicle according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0072] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example.

[0073] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A housing of a temperature and pressure sensor, characterized in that: A temperature sensing component mounting groove, a sealing component mounting groove and a circuit board mounting groove are formed in the shell, and the temperature sensing component mounting groove and the sealing component mounting groove are arranged at intervals. In the axial direction of the shell, the temperature sensing component mounting groove and the sealing component mounting groove are located at one end of the circuit board mounting groove, the temperature sensing component mounting groove is used to install the temperature sensing component, the sealing component mounting groove is used to install the first sealing component, and the circuit board mounting groove is used to install the circuit board.

2. The housing of the temperature and pressure sensor according to claim 1, characterized in that: In a plane perpendicular to the axial direction of the housing, a projection of the temperature sensing component installation groove and a projection of the sealing component installation groove are both located within a projection of the circuit board installation groove.

3. The housing of the temperature and pressure sensor according to claim 1, characterized in that: The sealing member installation groove is arranged around the temperature sensing component installation groove, and the housing is provided with a separation ring between the temperature sensing component installation groove and the sealing member installation groove.

4. The housing of the temperature and pressure sensor according to claim 3, characterized in that: The inner wall of the separation ring is provided with a limiting portion protruding toward the temperature sensing component installation groove.

5. The housing of the temperature and pressure sensor according to claim 4, characterized in that: A mounting hole is formed in the shell, the mounting hole is communicated with the temperature sensing component mounting groove, and the inner wall of the limiting portion is flush with the inner wall of the mounting hole.

6. The housing of the temperature and pressure sensor according to claim 1, characterized in that: The inner wall of the circuit board installation slot is provided with a fixing portion protruding toward the inside of the circuit board installation slot.

7. The housing of the temperature and pressure sensor according to claim 6, characterized in that: There are a plurality of fixing parts, and the plurality of fixing parts are distributed at intervals along the circumference of the circuit board installation slot.

8. The housing of the temperature and pressure sensor according to claim 7, characterized in that: The cross section of the circuit board installation slot is polygonal, the plurality of fixing portions include a first fixing portion, and the plurality of first fixing portions correspond one-to-one to the plurality of end portions of the circuit board installation slot.

9. The housing of the temperature and pressure sensor according to claim 8, characterized in that: The plurality of fixing portions include a plurality of second fixing portions, and the plurality of second fixing portions are respectively arranged on different side walls of the circuit board mounting slot.

10. The housing of the temperature and pressure sensor according to claim 9, characterized in that: The circuit board mounting groove includes: first side walls and second side walls that are arranged opposite to each other, the second side walls are connected between the first side walls, a plurality of first fixing portions are respectively arranged on the first side walls and extend from one end of the first side walls to the other end, and the second fixing portions are respectively arranged on the second side walls.

11. The housing of the temperature and pressure sensor according to claim 7, characterized in that: In a plane perpendicular to the axial direction of the housing, a projection of the fixing portion is a rectangle.

12. A temperature and pressure sensor, characterized in that: include: Temperature sensing components; a first seal; Circuit boards; as well as The housing of the temperature and pressure sensor according to any one of claims 1 to 11.

13. The temperature and pressure sensor according to claim 12, characterized in that: The circuit board is a ceramic circuit board.

14. The temperature and pressure sensor according to claim 12, characterized in that: The first sealing member is an elastic sealing member, and the first sealing member is elastically deformed under the pressure of the circuit board.

15. The temperature and pressure sensor according to claim 14, characterized in that: The first sealing member is an O-ring.

16. The temperature and pressure sensor according to claim 12, characterized in that: The temperature sensing component comprises: Temperature sensing element; A protective cover is sleeved on the temperature sensing element, and an end of the protective cover facing away from the circuit board is opened.

17. The temperature and pressure sensor according to claim 16, characterized in that: The protective sleeve is provided with a limiting groove, and the limiting groove is matched with the limiting portion of the shell in a circumferential limiting manner.

18. The temperature and pressure sensor according to claim 12, characterized in that: Also includes: An elastic component is connected between the circuit board and the temperature sensing component.

19. The temperature and pressure sensor according to claim 12, characterized in that: Also includes: A second sealing member, a threaded section is arranged on the outer periphery of the housing, and the second sealing member is sleeved on the housing and is located at one end of the threaded section adjacent to the circuit board.

20. The temperature and pressure sensor according to claim 12, characterized in that: Also includes: A connector is arranged on the housing, and the connector is located on a side of the circuit board away from the temperature sensing component and is electrically connected to the circuit board.

21. A vehicle, characterized in that: include: The temperature and pressure sensor according to any one of claims 12 to 19.

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