Temperature-controllable semiconductor device test system
By designing a semiconductor device test system with controllable temperatures, the problem that the prior art cannot accurately reflect the characteristics of the device at different temperatures is solved, and testing at any temperature is realized, which improves the test accuracy and reduces the risk of failure.
Patent Information
- Application Number
- CN202421544705.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-01
- Publication Date
- 2025-05-09
- Estimated Expiration
- 2034-07-01
AI Technical Summary
The prior art tests semiconductor devices at room temperature, but cannot accurately reflect the characteristics of the devices at different operating temperatures, resulting in hidden dangers in safe operation of the equipment.
Design a semiconductor device testing system with controllable temperature, monitor the substrate temperature through a thermostat, control the heat source device to adjust the substrate temperature, and ensure that the working temperature of the semiconductor device is controllable during the test.
The working characteristics of semiconductor devices are achieved at any temperature, reducing the impact of temperature on test accuracy, and reducing the risk of failure caused by temperature stress.
Smart Images
Figure CN222850706U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of power semiconductor device testing, and in particular to a temperature-controllable semiconductor device testing system. Background Art
[0002] Semiconductor devices are used in the field of power electronic equipment, such as frequency converters, photovoltaic inverters, wind power converters, energy storage converters, hydrogen production power supplies, etc. Semiconductor devices are regularly turned on and off to control the current, voltage, frequency, phase and other parameters of the equipment to ensure the normal operation of the equipment.
[0003] Equipment manufacturers generally perform double pulse tests on semiconductor devices at room temperature to ensure the safe operation of the equipment. However, due to the characteristics of semiconductor materials, the characteristics of semiconductor devices vary greatly at different operating temperatures. When working, semiconductor devices generate a lot of heat, and usually their operating temperature is controlled within a suitable range through appropriate heat dissipation methods. This results in the characteristics of semiconductor devices tested at room temperature being different from those at the actual operating temperature, leaving hidden dangers for the safe operation of the equipment.
[0004] With the improvement of semiconductor material technology and the increasingly advanced packaging technology, the size of semiconductor chips is developing in the direction of increasing area and reducing thickness. By reducing the heat generation of semiconductor devices themselves, the power density of devices is improved. At the same time, the application temperature of semiconductor devices has also increased. Taking IGBT (Insulated Gate Bipolar Transistor) devices as an example, mainstream manufacturers can currently provide devices with a maximum operating temperature of 175°C. However, the risk of temperature stress caused by this has also increased accordingly.
[0005] It should also be noted that semiconductor device manufacturers usually provide operating characteristics at typical operating temperatures, but their test conditions and key configurations (such as drive resistance, loop parasitic parameters, etc.) are quite different from those of equipment manufacturers and can only be used as a reference. Taking IGBT and thyristor as an example, in the information provided by the manufacturer, the chip operating characteristics usually include typical temperature data such as 25℃, 125℃, 150℃, and 175℃. There is no data support outside of this temperature point. Utility Model Content
[0006] The present application provides a temperature-controllable semiconductor device testing system to control the temperature during the semiconductor device testing process, thereby obtaining the working characteristics of the semiconductor device at any temperature, reducing the impact of temperature on test accuracy, and reducing the risk of failure caused by temperature stress.
[0007] The present application provides a temperature-controllable semiconductor device testing system, comprising a temperature control component, a temperature controller, and a semiconductor device to be tested;
[0008] The temperature control assembly comprises a substrate, a heat source device and a temperature measuring device, wherein at least one semiconductor device to be tested is mounted on the substrate; the temperature measuring device is arranged close to the substrate to detect the temperature of the substrate;
[0009] The temperature controller is configured to monitor the temperature of the substrate detected by the temperature measuring device to control the heat source device to adjust the temperature of the substrate.
[0010] In one example, the temperature measuring device is disposed on the surface of the substrate or the temperature measuring device is at least partially disposed inside the substrate.
[0011] In one example, the substrate has a first surface exposed outside the temperature control component and a second surface opposite to the first surface;
[0012] The semiconductor device to be tested is mounted on the first surface, and the heat source device is disposed close to the second surface or at least partially disposed inside the substrate.
[0013] In one example, the heat source device includes a semiconductor cooling and heating plate, and the semiconductor cooling and heating plate is arranged close to the second surface.
[0014] In one example, a heat conductive material is filled between the semiconductor cooling and heating plate and the second surface.
[0015] In one example, a plurality of the semiconductor cooling and heating sheets are stacked or arranged side by side.
[0016] In one example, a heat sink and a fan are further included. The semiconductor cooling and heating plate is installed on the heat sink, and the fan is used to provide ventilation for the heat sink.
[0017] In one example, the heat source device includes an electric heater, and the electric heater is at least partially disposed inside the substrate.
[0018] In one example, a bracket is further included, and the temperature control component is installed on the bracket.
[0019] In one example, the bracket includes a first guide rail and at least two second guide rails, one end of the first guide rail is connected to one of the second guide rails, and the other end of the first guide rail is connected to another second guide rail; the first guide rail can slide along the extension direction of the second guide rail; and the temperature control component is installed on the first guide rail.
[0020] The temperature-controllable semiconductor device testing system provided in the present application monitors the temperature of a substrate on which the semiconductor device is mounted through a temperature controller, and then controls a heat source device to adjust the temperature of the substrate, thereby controlling the operating temperature of the semiconductor device during the test, making the test conditions more closely aligned with the actual application environment of the device, effectively improving the test accuracy, and reducing the risk of failure caused by temperature stress. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.
[0022] Figure 1 It is a schematic diagram of a temperature-controllable semiconductor device testing system provided by one embodiment of the present application;
[0023] Figure 2 is a schematic diagram of a bracket provided in one embodiment of the present application;
[0024] Figure 3 is a schematic diagram of a temperature control component provided in one embodiment of the present application;
[0025] Figure 4 is a cross-sectional schematic diagram of a temperature control assembly provided in one embodiment of the present application;
[0026] Figure 5 is a schematic diagram of a temperature-controllable semiconductor device testing system provided by another embodiment of the present application;
[0027] Figure 6 is a schematic diagram of a temperature control component provided by another embodiment of the present application;
[0028] Figure 7 is a cross-sectional schematic diagram of a temperature control assembly provided in another embodiment of the present application;
[0029] Figure 8 is a schematic diagram of a temperature-controllable semiconductor device testing system provided by another embodiment of the present application;
[0030] Fig. 9 is a schematic diagram of a temperature control component provided by another embodiment of the present application;
[0031] Fig.10 This is another schematic diagram of a temperature control component provided in yet another embodiment of the present application. DETAILED DESCRIPTION
[0032] In order to facilitate the understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art of the present application. The terms used in this specification in the specification of the present application are only for the purpose of describing specific embodiments and are not used to limit the present application. The term "and / or" used in this specification includes any and all combinations of one or more related listed items.
[0033] like Figure 1 As shown, the temperature-controllable semiconductor device testing system provided in the embodiment of the present application is used for semiconductor device testing. The temperature-controllable semiconductor device testing system includes a bracket 10 , a temperature control component 20 , a semiconductor device to be tested 30 , and a temperature controller 40 .
[0034] The bracket 10 may be a fixed bracket, and preferably the bracket 10 is an adjustable bracket.
[0035] like Figure 2 As shown, the adjustable bracket 10 includes a first guide rail 11 , a second guide rail 12 , a slider 13 and a transition component 14 .
[0036] The first guide rail 11 extends along a first direction of the bracket 10, and the second guide rail 12 extends along a second direction of the bracket 10. The first direction and the second direction may be perpendicular, for example, the first direction is a horizontal direction, and the second direction is a vertical direction. The number of the first guide rail 11 and the second guide rail 12 may be multiple, for example, as shown in the figure, the number of the first guide rail 11 is 2, and the number of the second guide rail 12 is 2.
[0037] The slider 13 is arranged on the first guide rail 11 and the second guide rail 12. In the example in the figure, one end of one of the first guide rails 11 is connected to the slider 13 on one of the second guide rails 12, and the other end of one of the first guide rails 11 is connected to the slider 13 on the other second guide rail 12; the other first guide rail 11 is arranged in the same manner. By sliding the sliders 13 on the two second guide rails 12, the first guide rail 11 can slide along the extension direction of the second guide rail 12, that is, slide along the vertical direction. The second guide rail 12 has a size scale, so the sliding distance can be accurately adjusted.
[0038] The adapter component 14 is mounted on the slider 13 on the first guide rail 11. By sliding the slider 13 on the first guide rail 11, the adapter component 14 can slide along the first guide rail 11. Similarly, there is a size scale on the first guide rail 11, so the sliding distance can be accurately adjusted.
[0039] The slide block 13 also has a locking handle. After the slide block 13 is slid, the locking handle can be used to fix the slide block 13 on the first guide rail 11 or the second guide rail 12 .
[0040] The temperature control assembly 20 is disposed on the adapter component 14. Figure 3 As shown, the temperature control assembly 20 includes a housing 21 , a heat sink 22 , a heat conducting material 23 , a heat source device 24 , a heat insulating material 25 , a substrate 26 and a temperature measuring device 27 arranged inside the housing 21 , and a fan 28 arranged outside the housing 21 .
[0041] The substrate 26 has an upper surface (first surface) exposed outside the temperature control assembly 20 and a lower surface (second surface) opposite to the upper surface. The semiconductor device 30 to be tested is mounted on the upper surface of the substrate 26. The temperature measuring device 27 is at least partially disposed inside the substrate 26.
[0042] The substrate 26 is located above the heat source device 24. The heat source device 24 is mounted on the radiator 22 and is arranged close to the lower surface of the substrate 26. The heat source device 24 includes a semiconductor cooling and heating sheet, which can achieve the conversion of cooling and heating functions by adjusting the current direction or reverse installation. The heat source device 24 can be installed in a single layer or in multiple layers, for example, a three-layer stacking installation is used in the figure.
[0043] The heat conductive material 23 is disposed between two adjacent heat source devices 24, and can also be disposed between the heat source device 24 and the lower surface of the substrate 26. The heat conductive material 13 includes but is not limited to silicone grease, silicone pad, silicone cloth, phase change heat conductive material, and the like.
[0044] The heat-insulating material 25 wraps around the heat source device 24 to provide heat insulation.
[0045] The fan 28 is used to provide ventilation for the radiator 22, and its blowing direction can be toward the radiator 22, or opposite (i.e., exhaust). The fan 28 can ensure that the temperature of the radiator 22 is close to the ambient temperature.
[0046] The temperature controller 40 is used to monitor the temperature of the substrate 26 detected by the temperature measuring device 27 to control the heat source device 24 to adjust the temperature of the substrate 26, thereby controlling the operating temperature of the semiconductor device 30 during the test process, making the test conditions more closely aligned with the actual application environment of the device, effectively improving the test accuracy, and reducing the risk of failure caused by temperature stress.
[0047] Figure 5 FIG. 1 is a schematic diagram of a temperature-controllable semiconductor device testing system provided by another embodiment of the present application. Figure 5 As shown, in this embodiment, the bracket 10 is not provided with the adapter component 14, and some of the sliders 13 and the temperature control assembly 20 can be used to form a variety of combined applications.
[0048] like Figure 6-Figure 7 As shown, Figure 1-Figure 4 The difference in the example is that the temperature control assembly 20 includes a plurality of fans 28 , which are installed inside the housing 21 , and the blowing direction of the fans 28 can be toward the radiator 22 or the opposite direction.
[0049] and Figure 1-Figure 4 The difference in the example is that the heat source devices 24 are arranged side by side, and the thermal conductive material 23 is disposed between the heat source device 24 and the heat sink 22 , or between the heat source device 24 and the lower surface of the substrate 26 .
[0050] and Figure 1-Figure 4 The difference in this example is that the temperature measuring device 27 is mounted on the surface of the substrate 26 .
[0051] and Figure 1-Figure 4 The difference between the examples is that the upper surface area of the substrate 26 is larger, and a plurality of semiconductor devices 30 can be mounted thereon.
[0052] Figure 8 This is a schematic diagram of a temperature-controllable semiconductor device testing system provided in yet another embodiment of the present application.
[0053] like Figure 9-10 As shown, Figure 1-Figure 4 The difference in the example is that the heat source device 24 is replaced by an electric heater 240 , and the electric heater 240 is at least partially disposed inside the base plate 26 ; when the electric heater 240 is used to replace the heat source device 24 , the radiator 22 and the fan 28 can be omitted.
[0054] and Figure 1-Figure 4 Similarly, the electric heater 240 can be controlled by the thermostat 40 and its temperature can be adjusted, thereby adjusting the temperature of the substrate 26 .
[0055] and Figure 1-Figure 4 Similarly, the temperature measuring device 27 is at least partially installed inside the substrate 26 .
[0056] and Figure 1-Figure 4 The difference between the examples is that the upper surface area of the substrate 26 is larger, and a plurality of semiconductor devices 30 can be mounted thereon.
[0057] and Figure 1-Figure 4 The difference is that the bracket 10 is not provided with the adapter component 14, and the temperature control assembly 20 further includes a heat insulation mounting member 220, and the temperature control assembly 20 is connected to the slider 13 via the heat insulation mounting member 220. The heat insulation mounting member 220 can be air-cooled, water-cooled or naturally cooled.
[0058] It should be noted that the preferred embodiments of the present application are given in the specification and drawings of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described in the specification. These embodiments are not used as additional limitations on the content of the present application. The purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. In addition, the above-mentioned technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as the scope of the description of the present application; further, for ordinary technicians in this field, they can be improved or transformed according to the above description, and all these improvements and transformations should belong to the scope of protection of the claims attached to the present application.
Claims
1. A temperature-controllable semiconductor device testing system, characterized in that: including a temperature control component, a temperature controller, and a semiconductor device to be tested; The temperature control assembly comprises a substrate, a heat source device and a temperature measuring device, and at least one semiconductor device to be tested is mounted on the substrate; The temperature measuring device is arranged close to the substrate to detect the temperature of the substrate; The temperature controller is configured to monitor the temperature of the substrate detected by the temperature measuring device to control the heat source device to adjust the temperature of the substrate.
2. The semiconductor device testing system as claimed in claim 1, characterized in that: The temperature measuring device is disposed on the surface of the substrate or the temperature measuring device is at least partially disposed inside the substrate.
3. The semiconductor device testing system as claimed in claim 1, characterized in that: The substrate has a first surface exposed outside the temperature control component and a second surface opposite to the first surface; The semiconductor device to be tested is mounted on the first surface, and the heat source device is disposed close to the second surface or at least partially disposed inside the substrate.
4. The semiconductor device testing system as claimed in claim 3, characterized in that: The heat source device includes a semiconductor cooling and heating sheet, and the semiconductor cooling and heating sheet is arranged close to the second surface.
5. The semiconductor device testing system as claimed in claim 4, characterized in that: A heat-conducting material is filled between the semiconductor refrigeration and heating plate and the second surface.
6. The semiconductor device testing system as claimed in claim 4, characterized in that: A plurality of the semiconductor cooling and heating sheets are stacked or arranged side by side.
7. The semiconductor device testing system as claimed in claim 4, characterized in that: It also includes a radiator and a fan. The semiconductor refrigeration and heating plate is installed on the radiator, and the fan is used to provide ventilation for the radiator.
8. The semiconductor device testing system as claimed in claim 3, characterized in that: The heat source device includes an electric heater, and the electric heater is at least partially disposed inside the substrate.
9. The semiconductor device testing system as claimed in claim 1, characterized in that: A bracket is also included, and the temperature control component is installed on the bracket.
10. The semiconductor device testing system as claimed in claim 9, characterized in that: The bracket includes a first guide rail and at least two second guide rails, one end of the first guide rail is connected to one of the second guide rails, and the other end of the first guide rail is connected to another second guide rail; the first guide rail can slide along the extension direction of the second guide rail; and the temperature control component is installed on the first guide rail.