Multiple constant temperature device
By designing multiple constant temperature devices in constant temperature control circuits, using temperature storage blocks, TEC refrigeration plates and temperature detection components, the forward and reverse constant temperature function is achieved, which solves the problem that traditional constant temperature control circuits cannot operate normally in extreme environments, extends the service life of the equipment and simplifies the maintenance process.
Patent Information
- Application Number
- CN202421892463.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-06
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-08-06
AI Technical Summary
Traditional constant temperature control circuits cannot operate normally in extremely harsh temperature environments, and long-term full-load operation will shorten product life, increase maintenance costs, and may lead to equipment failure.
A multi-constant temperature device is designed, using a built-in temperature storage block, a TEC refrigeration plate and temperature detection components in the insulation case, and is equipped with a multi-constant temperature control circuit, including an ARM controller, a power supply circuit and a TEC drive multiplex circuit, to realize the forward and reverse bidirectional constant temperature function.
The device can operate stably in an extreme environment of -100℃-130℃, extending the service life of the constant temperature circuit, ensuring that the equipment can still work normally when a fault occurs, and making it easier to quickly replace the faulty part.
Smart Images
Figure CN222867032U_ABST
Abstract
Description
Technical field:
[0001] The utility model relates to the technical field of sensor detection equipment manufacturing, in particular to a multiple constant temperature device which can operate in an environment of -100°C to 130°C for a long time and can meet the operating requirements of all extremely harsh temperature environments. Background technology:
[0002] Sensor detection devices operating outdoors need to adapt to different harsh environments, especially for unmanned remote areas, where the ambient temperature is extremely harsh, with extreme temperatures as low as -70°C and as high as 60°C. Metal equipment may even reach over 90°C under exposure to the sun. Key components in sensor detection products, especially optical components, are significantly affected by temperature. In outdoor environments, there may be risks such as indicator deterioration or even failure, which seriously affects the actual application effect. The traditional constant temperature control circuit generally has a constant temperature operating range of -40°C-70°C, which cannot meet the extremely harsh temperature conditions in outdoor environments. In addition, the long-term full-load operation of the traditional constant temperature control circuit will greatly reduce the product life and increase the product maintenance cost. In addition, the traditional constant temperature control circuit will cause the product to fail to work after a fault occurs, and cannot work normally during the fault discovery and fault handling period. Summary of the invention:
[0003] In view of the problem of short life of constant temperature circuits in the prior art, the utility model proposes a multiple constant temperature device that can greatly improve the life of constant temperature circuits. Through bidirectional constant temperature, it can still operate stably when a fault occurs in one path, avoiding the inability of equipment to operate continuously and stably due to constant temperature failure, and can quickly replace the faulty constant temperature part without stopping the machine.
[0004] The utility model achieves this through the following measures:
[0005] A multiple constant temperature device is provided with a heat-insulating shell, characterized in that a temperature storage block, a TEC refrigeration sheet, and a temperature detection component are provided in the heat-insulating shell, at least two temperature storage blocks are provided in the heat-insulating shell, each temperature storage block is correspondingly provided with a temperature detection component and a TEC refrigeration sheet, and a multiple constant temperature control circuit is also provided. The multiple constant temperature control circuit is provided with an ARM controller, a power supply circuit and a TEC drive multiplexing circuit, the ARM controller is respectively connected to the power supply circuit, the temperature detection component, and the TEC drive multiplexing circuit, and the TEC drive multiplexing circuit is respectively connected to more than two TEC refrigeration sheets.
[0006] The utility model provides a heat sink on the outer side of the thermal insulation shell corresponding to the TEC cooling sheet setting area, and further provides a heat dissipation fan matched with the heat sink. The thermal insulation shell provides a window corresponding to the TEC cooling sheet area, and the heat dissipation side of the TEC cooling sheet is exposed outside the thermal insulation shell.
[0007] The utility model discloses a heat-insulating shell with three heat storage blocks, wherein the first heat storage block is located in the center of the heat-insulating shell, and the first heat storage block has an enlarged upper end and a supporting portion with an outer diameter significantly smaller than the upper end, and the upper end of the first heat storage block is used to place the thermostatic device, and temperature detection components are symmetrically arranged on both sides of the supporting portion of the first heat storage block, and TEC refrigeration sheets are also symmetrically arranged on both sides of the first heat storage block; the second heat storage block and the third heat storage block are arranged on both sides of the first heat storage block with the same specifications, and one side of the second heat storage block / the third heat storage block is close to the TEC refrigeration sheet on the side of the first heat storage block, and the other side is provided with a temperature detection component and is close to the TEC refrigeration sheet corresponding to the second heat storage block / the third heat storage block, so that the second heat storage block and the third heat storage block can be used to absorb the heat output by the TEC refrigeration sheets on both sides of the first heat storage block, or the second heat storage block and the third heat storage block can be used to transfer heat to the first heat storage block, and the TEC refrigeration sheets corresponding to the second heat storage block or the third heat storage block can be further used to dissipate the heat to the outside of the heat-insulating shell or absorb the heat from the outside of the heat-insulating shell.
[0008] The power supply circuit of the utility model comprises a 5.5V power supply circuit for supplying power to the TEC multiplexing circuit and a 3.3V power supply circuit for supplying power to the ARM controller and peripheral components.
[0009] The temperature detection component of the utility model adopts a negative temperature coefficient thermistor, and the temperature measurement range is -103°C-153°C.
[0010] The TEC cooling sheet of the utility model is an electronic semiconductor device, which controls the flow direction of electric current to cool and heat at the same time.
[0011] The TEC drive multiplexing circuit of the utility model adopts the MAX1968 / MAX1969 series products of ADI manufacturer, which are used to drive 4 TEC cooling plates to work respectively. The TEC drive multiplexing circuit adopts a hot-swappable design, so that it can be replaced without power failure without affecting the normal operation of the equipment.
[0012] The utility model realizes a positive and negative bidirectional constant temperature function by arranging more than two temperature storage blocks in a heat-insulating shell, and correspondingly arranging temperature detection components and TEC cooling sheets corresponding to the more than two temperature storage blocks. Specifically, the scheme can set multiple levels of constant temperature values according to the ambient temperature through an ARM controller and multiple TEC cooling sheets. If four levels of constant temperature values are set, the constant temperature load (i.e., TEC cooling sheet) corresponding to each level of constant temperature value is 1 / 4 of that under normal working conditions, thereby ensuring that the constant temperature circuit will not accelerate aging and shorten the service life due to long-term full-load operation. In addition, the TEC drive multiplexing circuit adopts a hot-swappable design, and can be in the event of a failure in any one of the constant temperature drives, while the other constant temperature drive circuits can still work normally, thereby facilitating subsequent repair and maintenance, and ensuring that the equipment will not fail in the event of a failure.
[0013] Compared with the prior art, the utility model has the remarkable advantages of reasonable structure, reliable operation, convenient repair and maintenance, long service life and the like. Description of the drawings:
[0014] Attached Figure 1 It is a structural schematic diagram of the utility model.
[0015] Attached Figure 2 It is a circuit principle block diagram of the utility model.
[0016] Attached Figure 3 It is a circuit structure diagram of the ARM controller in the utility model.
[0017] Attached Figure 4 It is a structural schematic diagram of the power supply circuit in the utility model.
[0018] Attached Figure 5 It is a schematic diagram of the circuit structure of the temperature detection component in the utility model.
[0019] Attached Figure 6 It is a structural schematic diagram of the TEC drive multiplexing circuit in the utility model.
[0020] Figure numerals: heat-insulating shell 1, temperature storage block 2, TEC cooling sheet 3, temperature detection component 4, ARM controller 5, power supply circuit 6, TEC drive multiplexing circuit 7, heat sink 8, heat dissipation fan 9. Specific implementation method:
[0021] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0022] Example:
[0023] As attached Figure 1As shown, the utility model proposes a multiple constant temperature device, which is provided with a heat-insulating shell 1, in which a temperature storage block 2, a TEC cooling plate 3, and a temperature detection component 4 are arranged. The heat-insulating shell 1 is provided with at least two temperature storage blocks 2, and each temperature storage block 2 is correspondingly provided with a temperature detection component 4 and a TEC cooling plate 3. A multiple constant temperature control circuit is also provided, and an ARM controller 5, a power supply circuit 6 and a TEC drive multiplexing circuit 7 are provided in the multiple constant temperature control circuit. The ARM controller 5 is respectively connected to the power supply circuit 6, the temperature detection component 4, and the TEC drive multiplexing circuit 7, and the TEC drive multiplexing circuit 7 is respectively connected to more than two TEC cooling plates 3.
[0024] The outer side of the thermal insulation shell 1 of the utility model is provided with a heat sink 8 in the area corresponding to the TEC refrigeration plate 3, and is further provided with a heat dissipation fan 9 matched with the heat sink 8, wherein the thermal insulation shell is provided with a window in the area corresponding to the TEC refrigeration plate, and the heat dissipation side of the TEC refrigeration plate is exposed outside the thermal insulation shell.
[0025] Three temperature storage blocks 2 are arranged in the heat-insulating shell 1 of the utility model. The first temperature storage block is located in the center of the heat-insulating shell 1. The first temperature storage block has an enlarged upper end and a supporting portion with an outer diameter significantly smaller than the upper end. The upper end of the first temperature storage block is used to place the thermostatic device. Temperature detection components 4 are symmetrically arranged on both sides of the supporting portion of the first temperature storage block, and TEC refrigeration sheets 3 are also symmetrically arranged on both sides of the first temperature storage block; the second temperature storage block and the third temperature storage block are arranged on both sides of the first temperature storage block with the same specifications, one side of the second temperature storage block / the third temperature storage block is close to the TEC refrigeration sheet 3 on the side of the first temperature storage block, and the other side is provided with a temperature detection component 4 and is close to the TEC refrigeration sheet 3 corresponding to the second temperature storage block / the third temperature storage block, so that the second temperature storage block and the third temperature storage block can be used to absorb the heat output by the TEC refrigeration sheets 3 on both sides of the first temperature storage block, or the second temperature storage block and the third temperature storage block can be used to transfer heat to the first temperature storage block, and the TEC refrigeration sheets 3 corresponding to the second temperature storage block or the third temperature storage block can be further used to dissipate the heat to the outside of the heat-insulating shell 1 or absorb the heat from the outside of the heat-insulating shell 1.
[0026] The power supply circuit 6 of the present invention includes a 5.5V power supply circuit for supplying power to the TEC multiplexing circuit and a 3.3V power supply circuit for supplying power to the ARM controller and peripheral components.
[0027] The temperature detection component 4 of the present invention adopts a negative temperature coefficient thermistor, and the temperature measurement range is -103°C-153°C.
[0028] The TEC cooling sheet 3 of the utility model is an electronic semiconductor device, which controls the direction of current flow to cool and heat at the same time.
[0029] The TEC drive multiplexing circuit 7 of the utility model adopts the MAX1968 / MAX1969 series products of ADI manufacturer, which are used to drive 4 TEC cooling plates 3 to work respectively. The TEC drive multiplexing circuit adopts a hot-swappable design, so that it can be replaced without interrupting power supply without affecting the normal operation of the equipment.
[0030] The utility model realizes a positive and negative bidirectional constant temperature function by arranging more than two temperature storage blocks 2 in a heat-insulating shell 1, and correspondingly arranging temperature detection components 4 and TEC cooling sheets 3 corresponding to the more than two temperature storage blocks 2. Specifically, the present scheme can set multiple levels of constant temperature values according to the ambient temperature through an ARM controller and multiple TEC cooling sheets 3. If four levels of constant temperature values are set, the constant temperature load (i.e., TEC cooling sheet) corresponding to each level of constant temperature value is 1 / 4 of that under normal working conditions, thereby ensuring that the constant temperature circuit will not accelerate aging and shorten the service life due to long-term full-load operation. In addition, the TEC drive multiplexing circuit adopts a hot-swappable design, and can operate normally when any one of the constant temperature drives fails, thereby facilitating subsequent repair and maintenance and ensuring that the equipment will not fail when a failure occurs.
[0031] Compared with the prior art, the utility model has the remarkable advantages of reasonable structure, reliable operation, convenient repair and maintenance, long service life and the like.
Claims
1. A multiple constant temperature device, provided with a heat-insulating housing, characterized in that: A temperature storage block, a TEC cooling sheet, and a temperature detection component are provided in the thermal insulation shell. At least two temperature storage blocks are provided in the thermal insulation shell. Each temperature storage block is correspondingly provided with a temperature detection component and a TEC cooling sheet. There are also multiple constant temperature control circuits. The multiple constant temperature control circuits are provided with an ARM controller, a power supply circuit, and a TEC drive multiplexing circuit. The ARM controller is respectively connected to the power supply circuit, the temperature detection component, and the TEC drive multiplexing circuit. The TEC drive multiplexing circuit is respectively connected to more than two TEC cooling sheets.
2. A multiple constant temperature device according to claim 1, characterized in that: The outer side of the heat-insulating shell is provided with a heat sink in an area corresponding to the TEC refrigeration fin setting area, and a heat dissipation fan matched with the heat sink is provided.
3. A multiple constant temperature device according to claim 1, characterized in that: Three temperature storage blocks are arranged in the heat-insulating shell, and the first temperature storage block is located in the center of the heat-insulating shell. The first temperature storage block has an enlarged upper end and a supporting part with an outer diameter significantly smaller than the upper end. The upper end of the first temperature storage block is used to place the thermostatic device, and temperature detection components are symmetrically arranged on both sides of the supporting part of the first temperature storage block, and TEC refrigeration sheets are also symmetrically arranged on both sides of the first temperature storage block; the second temperature storage block and the third temperature storage block are arranged on both sides of the first temperature storage block with the same specifications, one side of the second temperature storage block / the third temperature storage block is close to the TEC refrigeration sheet on the side of the first temperature storage block, and the other side is provided with a temperature detection component and is close to the TEC refrigeration sheet corresponding to the second temperature storage block / the third temperature storage block, so that the second temperature storage block and the third temperature storage block can be used to absorb the heat output by the TEC refrigeration sheets on both sides of the first temperature storage block, or the second temperature storage block and the third temperature storage block can be used to transfer heat to the first temperature storage block, and the TEC refrigeration sheets corresponding to the second temperature storage block or the third temperature storage block can be further used to dissipate the heat to the outside of the heat-insulating shell or absorb the heat from outside the heat-insulating shell.
4. A multiple constant temperature device according to claim 1, characterized in that: The power supply circuit includes a 5.5V power supply circuit for supplying power to the TEC multiplexing circuit and a 3.3V power supply circuit for supplying power to the ARM controller and peripheral components.
5. A multiple constant temperature device according to claim 1, characterized in that: The temperature detection component adopts a negative temperature coefficient thermistor, and the temperature measurement range is -103°C-153°C.
6. A multiple constant temperature device according to claim 1, characterized in that: The TEC cooling sheet is an electronic semiconductor device that controls the direction of current flow to cool and heat at the same time.
7. A multiple constant temperature device according to claim 1, characterized in that: The TEC drive multiplexing circuit adopts the MAX1968 / MAX1969 series products of ADI manufacturer, which are used to drive 4 TEC cooling sheets to work respectively. The TEC drive multiplexing circuit adopts hot-swap design.