Double-sided blue film wafer detection device

Abstract

The utility model belongs to the technical field of semiconductor detection equipment, and particularly relates to a double-sided blue film wafer detection device which comprises a first mounting frame, a Z-axis moving module is mounted on the first mounting frame, and an upper camera module and a lower camera module are arranged on the outer wall of one side of the Z-axis moving module. The upper camera module is located above the lower camera module, a wafer rotating module is arranged between the upper camera module and the lower camera module, a light-transmitting plate is arranged on the inner side of the wafer rotating module, a wafer body is arranged on the surface of the light-transmitting plate, a wafer rotating motor is arranged on one side of the wafer rotating module, and the wafer rotating motor is arranged on the other side of the wafer rotating module. And the wafer rotating motor is mounted at the top end of the second mounting frame. According to the utility model, the problem that the back of the blue film wafer cannot be automatically detected is solved; according to the utility model, the front and back surfaces of the wafer body can be detected at the same time, the detection time is saved, the detection efficiency is improved, and the practicability is strong.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor detection equipment, and in particular relates to a double-sided blue film wafer detection device. Background Art

[0002] In semiconductor testing, as the demand for semiconductor testing increases, the blue film wafer after segmentation needs to be fully tested on both the front and back sides of the wafer, and a wafer testing device is required at this time.

[0003] However, the main detection method on the market is the front-side detection of blue film wafers, and the back side still needs to be manually inspected, which is costly and inefficient. Therefore, we propose a double-sided blue film wafer detection device to solve the existing problems. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a double-sided blue film wafer detection device to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0006] A double-sided blue film wafer inspection device, comprising a first mounting frame: a Z-axis moving module is mounted on the first mounting frame, an upper camera module and a lower camera module are arranged on one side outer wall of the Z-axis moving module, and the upper camera module is located above the lower camera module, a wafer rotation module is arranged between the upper camera module and the lower camera module, a light-transmitting plate is arranged on the inner side of the wafer rotation module, a wafer body is arranged on the surface of the light-transmitting plate, a wafer rotation motor is arranged on one side of the wafer rotation module, the wafer rotation motor is mounted on the top of a second mounting frame, and the bottom end of the second mounting frame is arranged on the top of the X-axis moving module;

[0007] The upper camera module and the lower camera module both include a camera fixing frame, a housing, a light source, a micro-adjustment slide, a camera and a lens. A micro-adjustment slide is arranged inside the housing, a camera is arranged on one side of the micro-adjustment slide, a lens is installed at the bottom end of the camera, and a light source is arranged below the lens.

[0008] Furthermore, a second driving motor is arranged on an outer wall at one end of the X-axis moving module.

[0009] Furthermore, a first driving motor is arranged on an outer wall at one end of the Z-axis moving module.

[0010] Furthermore, the shell is mounted on an outer wall of a camera fixing frame.

[0011] By means of the above technical scheme, the utility model provides a double-sided blue film wafer inspection device, which has at least the following beneficial effects: the utility model is provided through a series of coordinated structures. When the staff needs to perform inspection operations on the wafer body, the staff places the wafer body on the light-transmitting plate, and the wafer body is located between the upper camera module and the lower camera module. The cameras on the upper camera module and the lower camera module adopt the same camera configuration and are adjusted to a concentric state. When the wafer body moves to the middle between the upper camera module and the lower camera module, the upper camera module and the lower camera module simultaneously take pictures of the front and back sides of the wafer body. At this time, the images of the front and back sides of the wafer body under the camera can be obtained, and the images can be inspected. By starting the first drive motor, the upper camera module After each movement of the lower camera module by a distance of the camera field of view, the upper camera module and the lower camera module collect images of the front and back sides of the wafer body and detect the images until the wafer body in the Z-axis direction is collected. When the Z-axis direction scanning is completed, the second drive motor is started, and the X-axis moving module drives the wafer body to move to the next row along the X-axis direction. The entire wafer body is inspected in sequence, and the wafer body is placed on a transparent plate to fix and support the wafer body. The setting of the wafer rotation module plays a role in correcting the rotation of the wafer core and the camera. Therefore, the utility model solves the problem that the back side of the blue film wafer cannot be automatically inspected; the utility model realizes that the front and back sides of the wafer body can be inspected simultaneously, which saves inspection time, improves inspection efficiency, and has strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application:

[0013] Figure 1 A schematic diagram of the three-dimensional structure of a double-sided blue film wafer inspection device provided in an embodiment of the present application;

[0014] Figure 2 A schematic diagram of the internal structure of a double-sided blue film wafer inspection device provided in an embodiment of the present application;

[0015] Figure 3 A schematic diagram of the structure of an upper camera module and a lower camera module of a double-sided blue film wafer inspection device provided in an embodiment of the present application;

[0016] Figure 4 A cross-sectional view of the upper camera module and the lower camera module of the double-sided blue film wafer inspection device provided in an embodiment of the present application.

[0017] In the figure: 1. first mounting frame; 2. lower camera module; 201. camera fixing frame; 202. housing; 203. light source; 204. micro-adjusting slide; 205. camera; 206. lens; 3. Z-axis moving module; 4. upper camera module; 5. first driving motor; 6. wafer body; 7. light-transmitting plate; 8. wafer rotation module; 9. wafer rotation motor; 10. second driving motor; 11. X-axis moving module; 12. second mounting frame. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figures 1 to 4The double-sided blue film wafer detection device of the utility model mainly comprises a first mounting frame 1: a Z-axis moving module 3 is installed on the first mounting frame 1, an upper camera module 4 and a lower camera module 2 are arranged on the outer wall of one side of the Z-axis moving module 3, and the upper camera module 4 is located above the lower camera module 2, a wafer rotation module 8 is arranged between the upper camera module 4 and the lower camera module 2, a light-transmitting plate 7 is arranged on the inner side of the wafer rotation module 8, a wafer body 6 is arranged on the surface of the light-transmitting plate 7, a wafer rotation motor 9 is arranged on one side of the wafer rotation module 8, and the wafer rotation motor 9 is installed on the top of the second mounting frame 12, and the bottom end of the second mounting frame 12 is arranged on the X At the top of the axis moving module 11, the upper camera module 4 and the lower camera module 2 both include a camera fixing frame 201, a housing 202, a light source 203, a micro-adjustment slide 204, a camera 205 and a lens 206. The housing 202 is provided with a micro-adjustment slide 204, a camera 205 is provided on one side of the micro-adjustment slide 204, a lens 206 is installed at the bottom of the camera 205, and a light source 203 is provided below the lens 206. When the staff needs to perform an inspection operation on the wafer body 6, the staff places the wafer body 6 on the light-transmitting plate 7, and the wafer body 6 is located between the upper camera module 4 and the lower camera module 2. The camera 205 on the upper camera module 4 and the lower camera module 2 adopt the same camera configuration and are adjusted to a concentric state. When the wafer body 6 moves to the middle between the upper camera module 4 and the lower camera module 2, the upper camera module 4 and the lower camera module 2 simultaneously take pictures of the front and back sides of the wafer body 6. At this time, the images of the front and back sides of the wafer body 6 can be obtained under the camera, and the images are detected. By starting the first driving motor 5, the upper camera module 4 and the lower camera module 2 move a distance of the camera field of view each time, and the upper camera module 4 and the lower camera module 2 collect images of the front and back sides of the wafer body 6, and detect the images. The detection is performed until the acquisition of the wafer body 6 in the Z-axis direction is completed. When the scanning in the Z-axis direction is completed, the second drive motor 10 is started, and the X-axis moving module 11 drives the wafer body 6 to move to the next row along the X-axis direction. The detection of the entire wafer body 6 is completed in a cycle, and the wafer body 6 is placed on the transparent plate to fix and support the wafer body 6. The setting of the wafer rotation module 8 plays a role in correcting the rotation of the wafer core and the camera. Therefore, the utility model solves the problem that the back side of the blue film wafer cannot be automatically detected; the utility model realizes that the front and back sides of the wafer body 6 can be detected simultaneously, which saves detection time and improves detection efficiency.

[0020] A second driving motor 10 is arranged on the outer wall of one end of the X-axis moving module 11, and the second driving motor 10 can provide a driving force to the X-axis moving module 11. A first driving motor 5 is arranged on the outer wall of one end of the Z-axis moving module 3, and the first driving motor 5 can provide a driving force to the Z-axis moving module 3. The outer shell 202 is installed on the outer wall of the camera fixing frame 201.

[0021] It should be noted that the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0022] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A double-sided blue film wafer detection device, characterized in that: The invention comprises a first mounting frame (1): a Z-axis moving module (3) is mounted on the first mounting frame (1); an upper camera module (4) and a lower camera module (2) are arranged on an outer wall of one side of the Z-axis moving module (3); the upper camera module (4) is located above the lower camera module (2); a wafer rotation module (8) is arranged between the upper camera module (4) and the lower camera module (2); a light-transmitting plate (7) is arranged on the inner side of the wafer rotation module (8); a wafer body (6) is arranged on the surface of the light-transmitting plate (7); a wafer rotation motor (9) is arranged on one side of the wafer rotation module (8); the wafer rotation motor (9) is mounted on the top of a second mounting frame (12); and the bottom of the second mounting frame (12) is arranged on the top of the X-axis moving module (11); The upper camera module (4) and the lower camera module (2) both comprise a camera fixing frame (201), a housing (202), a light source (203), a micro-adjustment slide (204), a camera (205) and a lens (206); the housing (202) is provided with a micro-adjustment slide (204) inside, the camera (205) is provided on one side of the micro-adjustment slide (204), the bottom end of the camera (205) is mounted with a lens (206), and the bottom of the lens (206) is provided with a light source (203).

2. The double-sided blue film wafer detection device according to claim 1, characterized in that: A second driving motor (10) is arranged on an outer wall at one end of the X-axis moving module (11).

3. The double-sided blue film wafer detection device according to claim 1, characterized in that: A first driving motor (5) is arranged on an outer wall at one end of the Z-axis moving module (3).

4. The double-sided blue film wafer detection device according to claim 1, characterized in that: The housing (202) is mounted on the outer wall of the camera fixing frame (201).

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