Temperature acquisition device and battery formation and capacity grading equipment

Abstract

The utility model relates to the technical field of temperature acquisition equipment, in particular to a temperature acquisition device and battery formation and capacity grading equipment. A temperature acquisition device comprises: an acquisition PCB assembly; the power supply module is electrically connected with the acquisition PCB assembly, and the power supply module is used for supplying power to the acquisition PCB assembly; the temperature detection element is integrated on the acquisition PCB assembly and electrically connected with the acquisition PCB assembly, the temperature detection element is used for detecting the temperature of an element to be detected to obtain an analog signal, and the acquisition PCB assembly is used for generating a digital signal according to the analog signal; and an output module, the output module is electrically connected with the acquisition PCB assembly, and the output module is used for outputting the digital signal. According to the temperature acquisition device provided by the invention, the temperature acquisition is relatively accurate, and the condition of deviation from the actual temperature does not occur or rarely occurs.

Description

Technical Field

[0001] The present application relates to the technical field of temperature acquisition equipment, and in particular to a temperature acquisition device and a battery capacity division device. Background Art

[0002] When the battery is being charged, the charging equipment needs to collect the battery temperature in real time through the temperature collection device, so as to adjust the battery temperature in time when it is abnormal, thereby ensuring the stability of the battery during the charging process.

[0003] When the temperature acquisition device in the related art collects the temperature of the battery, the temperature acquisition is often inaccurate and deviates from the actual temperature, resulting in the inability to take timely and accurate measures to adjust the battery temperature, and thus it is difficult to ensure the stability of the battery during the capacity division process. Utility Model Content

[0004] The present application discloses a temperature acquisition device and a battery capacity determination device, wherein the temperature acquisition is relatively accurate and there is no or little deviation from the actual temperature.

[0005] In order to achieve the above objectives, on the one hand, the present application discloses a temperature collection device, comprising:

[0006] Collect PCB components;

[0007] A power supply module, the power supply module is electrically connected to the acquisition PCB assembly, and the power supply module is used to supply power to the acquisition PCB assembly;

[0008] A temperature detection element, the temperature detection element is integrated in the acquisition PCB assembly and electrically connected to the acquisition PCB assembly, the temperature detection element is used to detect the temperature of the element to be detected to obtain an analog signal, and the acquisition PCB assembly is used to generate a digital signal according to the analog signal; and

[0009] An output module is electrically connected to the acquisition PCB component, and is used to output the digital signal.

[0010] Since the temperature detection element is integrated in the acquisition PCB assembly and electrically connected to the acquisition PCB assembly, the temperature detection element and the acquisition PCB assembly are designed as one-piece, and the temperature detection element is directly integrated on the acquisition PCB assembly. Compared with the split design of the temperature detection element and the acquisition PCB assembly, this one-piece design method requires shorter wires for electrical connection between the temperature detection element and the acquisition PCB assembly.

[0011] In this way, on the one hand, the layout of the wires can be made simpler without the need for special planning of the wiring. To a certain extent, the structure of the entire temperature acquisition device can be simplified and the cost of the wires can be reduced. On the other hand, the problems of signal attenuation, signal interference and internal resistance consumption caused by excessively long wires can be avoided, so that the acquisition PCB component can accurately acquire the temperature detected by the temperature detection element, so that the temperature acquired by the temperature acquisition device can be consistent with the actual temperature, and will not deviate from the actual temperature due to signal interference and signal attenuation. Accurate measures can be taken to adjust the temperature of the battery, thereby further ensuring the stability of the battery during the capacity division process.

[0012] Optionally, the temperature detection element includes:

[0013] A temperature detection probe, which is arranged on the acquisition PCB assembly and is used to directly contact the component to be detected to detect the temperature of the component to be detected; and

[0014] A first connector is electrically connected to the temperature detection probe, and a second connector is integrated on the acquisition PCB assembly. The first connector is detachably connected to the second connector.

[0015] Optionally, the acquisition PCB assembly includes:

[0016] A mounting frame, wherein the temperature detection element is arranged on the mounting frame; and

[0017] A collection PCB board is arranged on the mounting frame, the temperature detection element, the power supply module and the output module are all electrically connected to the collection PCB board, and the collection PCB board is used to generate the digital signal according to the analog signal.

[0018] Optionally, the mounting frame comprises:

[0019] A mounting member, wherein the temperature detection element is disposed on the mounting member; and

[0020] The shell is arranged on the mounting piece and enclosed with the mounting piece to form a containing space, the acquisition PCB board is arranged on the shell and located in the containing space, and at least a part of the temperature detection element is exposed from the containing space.

[0021] Optionally, the housing and / or the mounting member is a metal member.

[0022] Optionally, the housing comprises:

[0023] A first sheet metal plate, the first sheet metal plate comprises a first plate portion and a second plate portion connected to each other, the first plate portion is connected to the mounting member, the second plate portion is spaced apart from the mounting member, and the acquisition PCB board is arranged on the first plate portion; and

[0024] The second sheet metal plate is opposite to the first plate portion and is detachably disposed on the second plate portion and the mounting member. The first sheet metal plate, the mounting member and the second sheet metal plate enclose the accommodating space.

[0025] Optionally, heat dissipation holes are provided on the second sheet metal plate.

[0026] Optionally, a mounting hole is provided on the mounting member, the mounting hole passes through the accommodating space, and the temperature detection element is installed in the mounting hole.

[0027] Optionally, an opening is provided on the mounting member, and the opening penetrates the mounting member along the axial direction of the mounting hole and penetrates along the radial direction of the mounting hole to the hole wall of the mounting hole to be connected with the mounting hole.

[0028] Optionally, a first positioning member is further provided on the mounting member, and the first positioning member is used to position a second positioning member installed on the chemical fractionation and capacity device.

[0029] On the other hand, the present application discloses a battery capacity conversion device, comprising:

[0030] The temperature collection device described in any one of the above aspects; and

[0031] The output module is electrically connected to the monitoring device, and is used to transmit the digital signal to the monitoring device.

[0032] Compared with the prior art, the beneficial effects of this application are:

[0033] In the present application, since the temperature detection element is integrated in the acquisition PCB assembly and electrically connected to the acquisition PCB assembly, the temperature detection element and the acquisition PCB assembly are of an integrated design, and the temperature detection element is directly integrated on the acquisition PCB assembly. Compared with the split design of the temperature detection element and the acquisition PCB assembly, this integrated design method will result in shorter wires for electrical connection between the temperature detection element and the acquisition PCB assembly.

[0034] In this way, on the one hand, the layout of the wires can be made simpler without the need for special planning of the wiring. To a certain extent, the structure of the entire temperature acquisition device can be simplified and the cost of the wires can be reduced. On the other hand, the problems of signal attenuation, signal interference and internal resistance consumption caused by excessively long wires can be avoided, so that the acquisition PCB component can accurately acquire the temperature detected by the temperature detection element, so that the temperature acquired by the temperature acquisition device can be consistent with the actual temperature, and will not deviate from the actual temperature due to signal interference and signal attenuation. Accurate measures can be taken to adjust the temperature of the battery, thereby further ensuring the stability of the battery during the capacity division process. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 It is a structural schematic diagram of a temperature collection device provided in an embodiment of the present application;

[0037] Figure 2 yes Figure 1 A schematic diagram of the structure of the temperature collection device in another perspective (part of the structure is removed);

[0038] Figure 3 yes Figure 2 A partial enlarged view of the position A in the middle;

[0039] Figure 4 It is a structural schematic diagram of a battery capacity conversion device provided in an embodiment of the present application;

[0040] Figure 5 It is a structural schematic diagram of another battery capacity conversion device provided in an embodiment of the present application;

[0041] Figure 6 yes Figure 5 A partial enlarged view of position B in the middle.

[0042] Description of main reference numerals

[0043] 1-collection PCB assembly; 10-second connector; 11-mounting frame; 110-accommodation space; 111-mounting member; 1111-mounting hole; 1112-opening; 1113-first positioning member; 112-housing; 1121-first sheet metal plate; 1121a-first plate portion; 1121b-second plate portion; 1122-second sheet metal plate; 1122a-heat dissipation hole; 12-collection PCB board;

[0044] 2-power supply module; 21-power supply interface; 22-power supply; 221-power supply plug;

[0045] 3-temperature detection element; 31-temperature detection probe; 32-first connector;

[0046] 4-output module; 41-communication interface;

[0047] 100-temperature acquisition device; 200-monitoring equipment; 1000-battery capacity determination equipment. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0049] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0050] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0051] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0052] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0053] The technical solution of the present application will be further described below in conjunction with specific embodiments and drawings.

[0054] See also Figure 1 and Figure 2 The temperature acquisition device 100 includes: a collection PCB (Printed Circuit Board) component 1, a power supply module 2, a temperature detection element 3 and an output module 4, wherein the power supply module 2 is electrically connected to the collection PCB component 1, the power supply module 2 is used to supply power to the collection PCB component 1, the temperature detection element 3 is integrated in the collection PCB component 1 and is electrically connected to the collection PCB component 1, the temperature detection element 3 is used to detect the temperature of the component to be detected to obtain an analog signal, the collection PCB component 1 is used to generate a digital signal according to the analog signal, the output module 4 is electrically connected to the collection PCB component 1, and the output module 4 is used to output a digital signal.

[0055] In this embodiment, when the temperature of the element to be detected is collected by the temperature collection device 100, first, the temperature detection element 3 can be brought into contact with the element to be detected. When the temperature detection element 3 is in contact with the element to be detected, the temperature on the element to be detected can be transmitted to the temperature detection element 3, and the temperature detection element 3 can obtain an analog signal based on the temperature.

[0056] Then, since the temperature detection element 3 is electrically connected to the acquisition PCB assembly 1, the acquisition PCB assembly 1 can obtain the analog signal and process the analog signal to obtain a digital signal. After obtaining the digital signal, since the output module 4 is electrically connected to the acquisition PCB assembly 1, the output module 4 can output the digital signal to the outside.

[0057] Based on this, when the temperature acquisition device 100 is applied to the capacity conversion equipment to collect the temperature of the battery, the above-mentioned component to be detected is the battery. Obviously, the digital signal can be collected by the temperature acquisition device 100 and can be output to the outside. Personnel or other equipment can obtain the real-time temperature of the battery according to the digital signal, and can make timely adjustments when the temperature is abnormal (too high or too low, etc.), thereby ensuring that the temperature of the battery is within a reasonable temperature range, and further ensuring the stability of the battery during the capacity conversion process.

[0058] Among them, since the temperature detection element 3 is integrated in the acquisition PCB assembly 1 and is electrically connected to the acquisition PCB assembly 1, the temperature detection element 3 and the acquisition PCB assembly 1 are of one-piece design, and the temperature detection element 3 is directly integrated on the acquisition PCB assembly 1. Compared with the split design of the temperature detection element 3 and the acquisition PCB assembly 1, this one-piece design method requires shorter wires for electrical connection between the temperature detection element 3 and the acquisition PCB assembly 1.

[0059] In this way, on the one hand, the layout of the wires can be made simpler without the need for special planning of the wiring. To a certain extent, the structure of the entire temperature acquisition device 100 can be simplified and the cost of the wires can be reduced. On the other hand, the problems of signal attenuation, signal interference and internal resistance consumption caused by excessively long wires can be avoided, so that the acquisition PCB component 1 can accurately acquire the temperature detected by the temperature detection element 3, so that the temperature acquired by the temperature acquisition device 100 can be consistent with the actual temperature, and will not deviate from the actual temperature due to signal interference and signal attenuation. Accurate measures can be taken to adjust the temperature of the battery, thereby further ensuring the stability of the battery during the capacity division process.

[0060] It should be noted that the application of the temperature acquisition device 100 to the chemical component capacity device and the component to be detected being a battery is only a possible understanding of the component to be detected based on a specific scenario in this embodiment. Of course, the temperature acquisition device 100 can also be applied to other possible scenarios. When the temperature acquisition device 100 is applied to other possible scenarios, correspondingly, the component to be detected can also be understood in other possible ways, and this embodiment does not limit this.

[0061] In some embodiments, see Figure 2 and Figure 3 The temperature detection element 3 includes: a temperature detection probe 31 and a first connector 32, wherein the temperature detection probe 31 is arranged on the acquisition PCB assembly 1, and is used to directly contact the component to be detected to detect the temperature of the component to be detected, and the first connector 32 is electrically connected to the temperature detection probe 31. The acquisition PCB assembly 1 is integrated with a second connector 10, and the first connector 32 is detachably connected to the second connector 10.

[0062] Since the first connector 32 is electrically connected to the temperature detection probe 31 and the acquisition PCB assembly 1 is integrated with the second connector 10 , when the temperature detection probe 31 needs to be electrically connected to the acquisition PCB assembly 1 , it can be achieved by simply plugging the first connector 32 into the second connector 10 .

[0063] Among them, since the first connector 32 is detachably connected to the second connector 10, when it is necessary to disconnect the electrical connection between the temperature detection probe 31 and the acquisition PCB assembly 1, it can be achieved by simply unplugging the first connector 32 from the second connector 10.

[0064] It can be seen that by electrically connecting the first connector 32 to the temperature detection probe 31 and integrating the second connector 10 on the acquisition PCB assembly 1, when it is necessary to electrically connect or disconnect the temperature detection probe 31 and the acquisition PCB assembly 1, it is only necessary to plug the first connector 32 into the second connector 10 or unplug it from the second connector 10, which is very flexible.

[0065] In addition, since the temperature detection probe 31 can detect the temperature of the element to be detected by directly contacting the element to be detected, and direct contact can detect the temperature of the element to be detected more accurately than indirect contact, the temperature detection probe 31 can detect the temperature of the element to be detected more accurately.

[0066] It should be noted that the temperature detection probe 31 may be a thermistor or a thermocouple, etc., which is not limited in this embodiment.

[0067] When the temperature detection probe 31 is a thermistor or a thermocouple, since both the thermistor and the thermocouple can respond quickly to the temperature change on the surface of the element to be detected in a short time, the temperature detection efficiency of the temperature detection probe 31 can be improved.

[0068] Considering that the function of the output module 4 is to output a digital signal for personnel or other equipment to obtain the real-time temperature of the component to be detected based on the digital signal, in some embodiments, the above-mentioned output module 4 can be a display screen or a speaker, etc., so that the digital signal can be output to the outside in the form of video or audio, so that personnel or other equipment can obtain the real-time temperature of the component to be detected.

[0069] When the output module 4 is a display screen, the display screen can display the real-time temperature of the component to be detected. When personnel see that the temperature displayed on the display screen is too high or too low, they can take timely measures so that the temperature of the component to be detected can be kept within a reasonable range.

[0070] Of course, the output module 4 may also be other possible components. For example, in other embodiments, see Figure 3 and Figure 4 The output module 4 includes: a communication interface 41 , which is integrated in the acquisition PCB assembly 1 , and the acquisition PCB assembly 1 is also used to transmit the digital signal to the monitoring device 200 through the communication interface 41 .

[0071] When the output module 4 includes a communication interface 41, the digital signal can be directly transmitted to the monitoring device 200 through the communication interface 41. The monitoring device 200 can obtain the temperature of the component to be detected based on the digital signal, and directly take measures to adjust it when the temperature of the component to be detected exceeds a reasonable temperature range, so that the temperature acquisition device 100 has a higher degree of automation.

[0072] The communication interface 41 may be a RS485 communication interface. Since the RS485 communication interface is a wired interface and has stable transmission, it can be ensured that the communication interface 41 can stably transmit the digital signal to the monitoring device 200 .

[0073] Of course, in other embodiments, the communication interface 41 may also be other possible interfaces, for example, a wireless communication interface, etc., which is not limited in this embodiment.

[0074] The monitoring device 200 may be a host computer, etc., which is not limited in this embodiment.

[0075] In some embodiments, see Figure 5 and Figure 6 The power supply module 2 includes: a power supply interface 21 and a power supply 22, wherein the power supply interface 21 is integrated in the acquisition PCB component 1, and the power supply 22 has a power supply plug 221, which is detachably plugged into the power supply interface 21.

[0076] Since the power supply 22 has a power plug 221 and the acquisition PCB assembly 1 is integrated with a power supply interface 21 , when the power plug 221 is plugged into the power supply interface 21 , the purpose of supplying power to the acquisition PCB assembly 1 can be achieved.

[0077] Among them, since the power plug 221 is detachably plugged into the power supply interface 21, when it is necessary to stop supplying power to the acquisition PCB component 1, it is only necessary to unplug the power plug 221 from the power supply interface 21, which is very convenient.

[0078] It should be noted that the power source 22 may be a battery or a municipal power supply, etc., which is not limited in this embodiment.

[0079] In some embodiments, see Figure 1 and Figure 2 The acquisition PCB assembly 1 includes: a mounting frame 11 and an acquisition PCB board 12, wherein the temperature detection element 3 and the acquisition PCB board 12 are both arranged on the mounting frame 11, the temperature detection element 3, the power supply module 2 and the output module 4 are all electrically connected to the acquisition PCB board 12, and the acquisition PCB board 12 is used to generate a digital signal according to an analog signal.

[0080] By arranging the temperature detection element 3 and the acquisition PCB board 12 on the mounting frame 11, on the one hand, the mounting frame 11 can serve as a base for the temperature detection element 3 and the acquisition PCB board 12 to be installed thereon, facilitating the stable installation of the temperature detection element 3 and the acquisition PCB board 12 thereon, thereby ensuring the stability of the installation of the temperature detection element 3 and the acquisition PCB board 12. On the other hand, the mounting frame 11 can also improve the mechanical strength of the entire acquisition PCB assembly 1 to a certain extent.

[0081] In some embodiments, see Figure 1 and Figure 2 The mounting frame 11 includes: a mounting member 111 and a shell 112, wherein the temperature detection element 3 is arranged on the mounting member 111, the shell 112 is arranged on the mounting member 111 and is surrounded with the mounting member 111 to form an accommodating space 110, the collection PCB board 12 is arranged on the shell 112 and is located in the accommodating space 110, and at least part of the temperature detection element 3 is exposed from the accommodating space 110.

[0082] Since the shell 112 is arranged on the mounting member 111 and is enclosed with the mounting member 111 to form the accommodating space 110, the acquisition PCB board 12 is arranged in the shell 112 and is located in the accommodating space 110. Therefore, the shell 112 and the mounting member 111 can wrap up the acquisition PCB board 12. In this way, the environment in which the acquisition PCB board 12 is located can be made relatively closed, and then the situation in which the acquisition PCB board 12 is affected by the outside world can be avoided or reduced to a certain extent, so that the durability of the acquisition PCB board 12 is better.

[0083] In addition, by setting the temperature detection element 3 on the mounting part 111 and the acquisition PCB board 12 on the housing 112, the temperature detection element 3 and the acquisition PCB board 12 can be respectively set on two different parts. In this way, the possibility of the temperature detection element 3 and the acquisition PCB board 12 interfering with each other in position can be reduced to a certain extent.

[0084] In addition, by partially exposing the temperature detection element 3 from the accommodating space 110 , the temperature detection element 3 can be easily brought into contact with the element to be detected, thereby providing convenient conditions for detecting the temperature of the element to be detected through the temperature detection element 3 .

[0085] It should be noted that the above-mentioned mounting member 111 can be Figure 1 The long plate-shaped structure shown may also be a structure of other shapes, which is not limited in this embodiment.

[0086] In some embodiments, the housing 112 and / or the mounting member 111 are metal members.

[0087] By making the shell 112 and / or the mounting member 111 metal parts, when the acquisition PCB board 12 is located in the accommodating space 110 enclosed by the shell 112 and the mounting member 111, the shell 112 and the mounting member 111 can play a role in shielding the accommodating space 110 from external signal interference, thereby enhancing the anti-interference ability of the acquisition PCB board 12.

[0088] Specifically, the housing 112 and / or the mounting member 111 may be made of iron or stainless steel, etc., which is not limited in this embodiment.

[0089] In some embodiments, see Figure 1 and Figure 2 The shell 112 includes: a first sheet metal plate 1121 and a second sheet metal plate 1122, wherein the first sheet metal plate 1121 includes a first plate portion 1121a and a second plate portion 1121b connected to each other, the first plate portion 1121a is connected to the mounting member 111, and the second plate portion 1121b is spaced apart from the mounting member 111, the collection PCB board 12 is arranged on the first plate portion 1121a, the second sheet metal plate 1122 is opposite to the first plate portion 1121a and is detachably arranged on the second plate portion 1121b and the mounting member 111, and the first sheet metal plate 1121, the mounting member 111 and the second sheet metal plate 1122 enclose a containing space 110.

[0090] Since the acquisition PCB board 12 is arranged on the first plate portion 1121a, the second sheet metal board 1122 is opposite to the first plate portion 1121a and is detachably arranged on the second plate portion 1121b and the mounting member 111, when the acquisition PCB board 12 is abnormal and needs maintenance, it is only necessary to remove the second sheet metal board 1122 ( Figure 2 (Figure 1 shows the state after the second sheet metal plate is removed) the collection PCB board 12 can be exposed, making the maintenance of the collection PCB board 12 convenient and quick.

[0091] Considering that the acquisition PCB board 12 may release heat during operation, in order to enable the acquisition PCB board 12 to quickly dissipate heat, in some embodiments, see Figure 1 The second sheet metal plate 1122 is provided with heat dissipation holes 1122a.

[0092] By providing the heat dissipation holes 1122 a on the second sheet metal plate 1122 , the heat on the collection PCB board 12 can be timely transferred out of the accommodating space 110 through the heat dissipation holes 1122 a , thereby ensuring the normal operation of the collection PCB board 12 .

[0093] The shape of the heat dissipation hole 1122a can be as follows: Figure 1The rectangle shown can, of course, also be a circle or other possible shapes, which is not limited in this embodiment. The number of the heat dissipation hole 1122a can also be one or more, or multiple heat dissipation holes 1122a can be arranged in an array, etc., which is not limited in this embodiment.

[0094] In some embodiments, see Figure 5 and Figure 6 The mounting member 111 is provided with a mounting hole 1111 , the mounting hole 1111 passes through the accommodating space 110 , and the temperature detection element 3 is mounted in the mounting hole 1111 .

[0095] Since the mounting hole 1111 passes through the accommodating space 110, when the temperature detection element 3 is installed in the mounting hole 1111, the first connector 32 of the temperature detection element 3 can directly penetrate into the accommodating space 110, so that the temperature detection element 3 can be electrically connected to the second connector 10 on the acquisition PCB board 12 located in the accommodating space 110 through the first connector 32.

[0096] By installing the temperature detection element 3 in the mounting hole 1111, the temperature detection element 3 can be wrapped 360° by the hole wall of the mounting hole 1111, so that the temperature detection element 3 can be more stably fixed to the mounting member 111, thereby avoiding or reducing the possibility of the temperature detection element 3 falling off the mounting member 111.

[0097] It should be noted that see Figure 5 and Figure 6 The number of the above-mentioned mounting holes 1111 can be multiple, and correspondingly, the number of temperature detection elements 3 can also be multiple. The multiple temperature detection elements 3 correspond one-to-one to the multiple mounting holes 1111, and each temperature detection element 3 is installed in the corresponding mounting hole 1111.

[0098] When there are multiple temperature detection elements 3 , the temperatures of multiple elements to be detected can be collected simultaneously, so that the collection efficiency of the temperature collection device 100 is higher.

[0099] Considering that the temperature detection element 3 is usually connected with a wire and a first plug 32, in order to facilitate the removal of the temperature detection element 3 from the mounting hole 1111, in some embodiments, see Figure 6 The mounting member 111 is provided with an opening 1112, and the opening 1112 is axially ( Figure 6 The Z-axis direction) penetrates the mounting member 111 and along the radial direction of the mounting hole 1111 ( Figure 6 The outer wall of the mounting hole 1111 (in the Y-axis direction) penetrates through the hole wall of the mounting hole 1111 and is connected to the mounting hole 1111.

[0100] By allowing the opening 1112 to penetrate the mounting piece 111 along the axial direction of the mounting hole 1111 and penetrate the hole wall of the mounting hole 1111 along the radial direction of the mounting hole 1111 to be connected with the mounting hole 1111, an opening 1112 that passes through the mounting hole 1111 can be formed on the side of the mounting piece 111. In this way, during the process of removing the temperature detection element 3 from the mounting hole 1111, the wire of the temperature detection element 3 and the first connector 32 can be directly pulled out from the opening 1112, thereby avoiding the situation where the first connector 32 is too large to pass through the mounting hole 1111, resulting in the temperature detection element 3 being unable to be completely removed from the mounting piece 111.

[0101] When the temperature acquisition device 100 is applied to the battery cell device to collect the temperature of the battery, in order to ensure the installation accuracy of the temperature acquisition device 100 on the battery cell device, in some embodiments, see Figure 1 A first positioning member 1113 is also provided on the mounting member 111, and the first positioning member 1113 is used to position a second positioning member installed on the chemical fractionation and capacity device.

[0102] By setting the first positioning member 1113 on the mounting member 111, when the temperature acquisition device 100 needs to be installed on the chemical fractionation equipment, the first positioning member 1113 can be directly installed on the second positioning member of the chemical fractionation equipment that matches itself, so that the installation accuracy of the temperature acquisition device 100 when installed on the chemical fractionation equipment can be guaranteed.

[0103] Among them, the above-mentioned first positioning member 1113 can be a positioning pin, and the above-mentioned second positioning member can be a positioning hole or a groove, etc., as long as it can play the role of accurately installing the temperature collection device 100 on the chemical composition equipment, and this embodiment does not limit this.

[0104] The present application also provides a battery capacity conversion device 1000, see Figure 4 The battery capacity conversion device 1000 includes: a temperature acquisition device 100 and a monitoring device 200 , wherein the output module 4 is electrically connected to the monitoring device 200 , and the output module 4 is used to transmit the digital signal to the monitoring device 200 .

[0105] Among them, the structure of the temperature collection device 100 can be the same as the structure of the temperature collection device 100 in the above embodiment, and can bring the same or similar beneficial effects. For details, please refer to the description of the temperature collection device 100 in the above embodiment, and this embodiment will not be repeated here.

[0106] In this embodiment, since the temperature of the component to be detected collected by the temperature collection device 100 is very accurate and will not deviate from the actual temperature, based on this, when the temperature collection device 100 is applied to the battery capacity-splitting device 1000, the battery capacity-splitting device 1000 can collect the temperature of the component to be detected very accurately, and then can take accurate measures to adjust the temperature of the component to be detected according to the temperature of the component to be detected, so that the reliability of the battery capacity-splitting device 1000 is higher, and there will be no or less misleading situations.

[0107] The specific working process of the battery capacity conversion device 1000 may be:

[0108] First, the temperature of the component to be detected can be sensed by the temperature detection element 3, and the temperature can be converted into an analog signal. After the temperature is converted into an analog signal, the analog signal can be transmitted to the acquisition PCB component 1, and the analog signal can be converted into a digital signal through the acquisition PCB component 1.

[0109] After being converted into a digital signal, the acquisition PCB component 1 can also perform processing such as filtering, amplification and calibration on the digital signal to improve the quality and accuracy of the digital signal.

[0110] Then, the output module 4 can send the digital signal to the monitoring device 200 according to a predetermined communication protocol and frequency. After receiving the digital signal, the monitoring device 200 can analyze the digital signal and generate a control strategy to control and adjust the temperature of the component to be detected in real time.

[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A temperature collection device (100), characterized in that: include: Collect PCB components (1); A power supply module (2), the power supply module (2) being electrically connected to the acquisition PCB assembly (1), and the power supply module (2) being used to supply power to the acquisition PCB assembly (1); a temperature detection element (3), the temperature detection element (3) being integrated in the acquisition PCB assembly (1) and being electrically connected to the acquisition PCB assembly (1), the temperature detection element (3) being used to detect the temperature of the element to be detected to obtain an analog signal, and the acquisition PCB assembly (1) being used to generate a digital signal according to the analog signal; and An output module (4), the output module (4) is electrically connected to the acquisition PCB component (1), and the output module (4) is used to output the digital signal.

2. The temperature collection device (100) according to claim 1, characterized in that: The temperature detection element (3) comprises: A temperature detection probe (31), the temperature detection probe (31) being arranged on the acquisition PCB assembly (1) and being used for directly contacting the component to be detected to detect the temperature of the component to be detected; and A first connector (32), the first connector (32) being electrically connected to the temperature detection probe (31), a second connector (10) being integrated on the acquisition PCB assembly (1), the first connector (32) being detachably connected to the second connector (10).

3. The temperature collection device (100) according to claim 1 or 2, characterized in that: The acquisition PCB assembly (1) comprises: A mounting frame (11), wherein the temperature detection element (3) is arranged on the mounting frame (11); and A collection PCB board (12), the collection PCB board (12) is arranged on the mounting frame (11), the temperature detection element (3), the power supply module (2) and the output module (4) are all electrically connected to the collection PCB board (12), and the collection PCB board (12) is used to generate the digital signal according to the analog signal.

4. The temperature collection device (100) according to claim 3, characterized in that: The mounting frame (11) comprises: a mounting member (111), the temperature detection element (3) being arranged on the mounting member (111); and A housing (112), the housing (112) being arranged on the mounting member (111) and enclosing with the mounting member (111) to form a housing space (110), the acquisition PCB board (12) being arranged on the housing (112) and located in the housing space (110), and at least a portion of the temperature detection element (3) being exposed from the housing space (110).

5. The temperature collection device (100) according to claim 4, characterized in that: The housing (112) and / or the mounting member (111) are metal members.

6. The temperature collection device (100) according to claim 4, characterized in that: The housing (112) comprises: a first sheet metal plate (1121), the first sheet metal plate (1121) comprising a first plate portion (1121a) and a second plate portion (1121b) connected to each other, the first plate portion (1121a) being connected to the mounting member (111), the second plate portion (1121b) being spaced apart from and opposite to the mounting member (111), and the acquisition PCB board (12) being arranged on the first plate portion (1121a); ​​and, A second sheet metal plate (1122), the second sheet metal plate (1122) is opposite to the first plate portion (1121a) and is detachably arranged on the second plate portion (1121b) and the mounting member (111), and the first sheet metal plate (1121), the mounting member (111) and the second sheet metal plate (1122) enclose the accommodating space (110).

7. The temperature collection device (100) according to claim 6, characterized in that: The second sheet metal plate (1122) is provided with heat dissipation holes (1122a).

8. The temperature collection device (100) according to claim 4, characterized in that: The mounting member (111) is provided with a mounting hole (1111), the mounting hole (1111) passes through the accommodating space (110), and the temperature detection element (3) is mounted in the mounting hole (1111).

9. The temperature collection device (100) according to claim 8, characterized in that: The mounting member (111) is provided with an opening (1112), and the opening (1112) penetrates the mounting member (111) along the axial direction of the mounting hole (1111) and penetrates along the radial direction of the mounting hole (1111) to the hole wall of the mounting hole (1111) to communicate with the mounting hole (1111).

10. The temperature collection device (100) according to claim 4, characterized in that: The mounting member (111) is also provided with a first positioning member (1113), and the first positioning member (1113) is used to position a second positioning member installed on the chemical fractionation and capacity device.

11. A battery capacity conversion device (1000), characterized in that: include: The temperature collection device (100) according to any one of claims 1 to 10; and A monitoring device (200), wherein the output module (4) is electrically connected to the monitoring device (200), and the output module (4) is used to transmit the digital signal to the monitoring device (200).

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