Water vapor condensing device suitable for carbon dioxide absorber

Abstract

The utility model relates to the technical field of carbon dioxide absorbers, in particular to a water vapor condensing device suitable for a carbon dioxide absorber. The problems that in the prior art, in the using process of a traditional carbon dioxide absorber, a large amount of water vapor often enters a folding bag of an anesthesia machine, the telescopic resistance of the folding bag is increased, finally, the anesthesia machine cannot work normally, and if effective treatment is not carried out, the follow-up treatment difficulty and cost are increased; the anesthesia machine may be corroded and damaged, the stability and reliability of the whole system are affected, and the practicability of the device is reduced. A water vapor condensing device suitable for a carbon dioxide absorber comprises a shell, a heat insulation chamber arranged in the shell and a heat preservation chamber arranged on one side of the heat insulation chamber, and end covers are fixedly installed at the two ends of the shell. According to the utility model, the rapid and efficient refrigeration effect is effectively realized, the space utilization is optimized, and the overall performance and reliability of the condensing device are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of carbon dioxide absorbers, in particular to a water vapor condensing device suitable for carbon dioxide absorbers. Background Art

[0002] During medical surgery, especially surgery involving general anesthesia, the anesthesia circuit is a vital component. It refers to a series of pipes and devices connecting the anesthesia machine to the patient's respiratory tract. Through these pipes and devices, anesthetic gases (such as oxygen, nitrous oxide, etc.) and anesthetic drugs are delivered to the patient's lungs. If the carbon dioxide exhaled by the patient is not filtered, it will be repeatedly inhaled into the body, which can easily cause carbon dioxide poisoning, severe cases can lead to shock or even death, so a carbon dioxide absorber is needed to filter the carbon dioxide in the anesthesia circuit.

[0003] Traditional carbon dioxide absorbers, especially those installed in the inlet / outlet of anesthesia machines, are often accompanied by the generation of a large amount of water vapor during use. These water vapors will enter the folding bag of the anesthesia machine, causing the expansion and contraction resistance of the folding bag to increase, eventually causing the anesthesia machine to fail to work properly. At the same time, water vapor will also enter the entire circulation loop of the anesthesia machine. If it is not effectively handled, it will not only increase the difficulty and cost of subsequent processing, but may also cause corrosion and damage to the anesthesia machine, affecting the stability and reliability of the entire system, thereby reducing the practicality of the device. Therefore, we propose a water vapor condensation device suitable for carbon dioxide absorbers to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a water vapor condensation device suitable for a carbon dioxide absorber, which solves the problem in the prior art that a large amount of water vapor often enters the folding bag of the anesthesia machine during the use of the traditional carbon dioxide absorber, causing the expansion and contraction resistance of the folding bag to increase and eventually leading to the anesthesia machine being unable to work normally. If it is not effectively handled, it will not only increase the difficulty and cost of subsequent processing, but may also cause corrosion and damage to the anesthesia machine, affect the stability and reliability of the entire system, and cause the problem of reduced practicality of the device.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A water vapor condensing device suitable for a carbon dioxide absorber comprises an outer shell, an insulating chamber arranged inside the outer shell, and an insulation chamber arranged on one side of the insulating chamber, end caps are fixedly installed at both ends of the outer shell, interface pipes are connected to the insides of the two end caps, and air guide pipes are connected to the adjacent ends of the two interface pipes, a condensing pipe is arranged inside the outer shell and in the insulation chamber, one end of the two air guide pipes away from the end caps is respectively connected to the two ends of the condensing pipe, a semiconductor refrigeration mechanism connected to the condensing pipe is arranged inside the outer shell, a water collector is provided on one side of the condensing pipe, and a temperature controller is fixedly installed on the side of the water collector close to the condensing pipe.

[0007] Preferably, the semiconductor refrigeration mechanism includes a plurality of through grooves formed in a linear array on one side of the insulation chamber, a cold end ceramic is fixedly connected to one side of the condenser tube, a plurality of thermocouple pairs matched with the through grooves are provided on one side of the cold end ceramic, guide plates are fixedly connected to both ends of the plurality of thermocouple pairs, a side of one of the guide plates away from the thermocouple pairs is fixedly connected to an adjacent side wall of the cold end ceramic, a side of another guide plate away from the thermocouple pairs is fixedly connected to a hot end ceramic, a side of the hot end ceramic away from the guide plate is fixedly connected to a heat sink, and fans are fixedly installed on both sides of the top of the heat sink.

[0008] Preferably, one end of the condenser away from the air guide pipe is connected to the water collector through a water collecting joint.

[0009] Preferably, a water stop cap is connected to a side of the water collector away from the condenser, and an end of the water stop cap away from the water collector passes through the side wall of the shell and extends to the outside.

[0010] Preferably, the side of the water collector close to the condenser is installed on the adjacent side wall of the temperature controller.

[0011] Preferably, a plurality of heat dissipation grids are provided in a linear array outside the shell and inside the heat-insulating chamber.

[0012] The utility model has at least the following beneficial effects:

[0013] The heat conduction speed is increased by contacting the condenser with the cold-end ceramic. When current is passed, one end of the thermocouple absorbs heat and the other end releases heat. This design enables the cold end to absorb heat effectively and achieve a cooling effect. The heat sink on the hot-end ceramic increases the heat exchange area with the surrounding environment and improves the heat dissipation efficiency. At the same time, the addition of the fan further accelerates the flow of air around the heat sink, thereby improving the heat dissipation effect and ensuring that the semiconductor refrigeration mechanism can work continuously and stably. The guide plate connects the cold and hot ends of the thermocouple to the cold-end ceramic and the hot-end ceramic respectively, forming a complete refrigeration circuit. This design not only simplifies the structure, but also reduces heat loss, achieves a fast and efficient cooling effect, optimizes space utilization, improves the overall performance and reliability of the condensing device, and enhances the practicality of the condensing device.

[0014] The utility model also has the following beneficial effects:

[0015] The water stop cap can be used to close the drain port of the water collector, effectively preventing the water in the water collector from accidentally leaking when it is not needed. When the water collector needs to be cleaned or maintained, the water can be drained by simply operating the water stop cap, which improves the convenience of maintenance. At the same time, it is also convenient to check whether there is impurity blockage inside the water collector. Through multiple heat dissipation grids, the heat emitted by the heat sink can be discharged from the heat dissipation grid to the inside of the shell, thereby increasing the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the air guide tube of the utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the condenser tube of the utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the thermocouple pair of the utility model;

[0021] Figure 5 It is a structural schematic diagram of the heat sink of the utility model;

[0022] Figure 6 It is a structural schematic diagram of the temperature controller of the utility model.

[0023] In the figure: 1. outer shell; 2. end cover; 3. interface pipe; 4. fan; 5. heat sink; 6. air guide pipe; 7. temperature controller; 8. water collector; 9. water collection node; 10. water stop cap; 11. condenser; 12. cold end ceramic; 13. guide plate; 14. thermocouple pair; 15. hot end ceramic; 16. insulation chamber. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0025] Reference Figure 1-6 A water vapor condensation device suitable for a carbon dioxide absorber comprises a shell 1, an insulating chamber 16 arranged inside the shell 1, and a heat preservation chamber arranged on one side of the insulating chamber 16, end caps 2 are fixedly installed at both ends of the shell 1, interface pipes 3 are connected to the interior of the two end caps 2, and adjacent ends of the two interface pipes 3 are connected to air guide pipes 6, a condensing tube 11 is arranged inside the shell 1 and located in the heat preservation chamber, one end of the two air guide pipes 6 away from the end caps 2 is respectively connected to the two ends of the condensing tube 11, a semiconductor refrigeration mechanism connected to the condensing tube 11 is arranged inside the shell 1, a water collector 8 is provided on one side of the condensing tube 11, and a temperature controller 7 is fixedly installed on the side of the water collector 8 close to the condensing tube 11, specifically, through the setting of the condensing tube 11, the copper tube structure of the condensing tube 11 is Y-shaped, and the recycled gas is introduced into the left end, and condensed into water droplets under the action of the low-temperature copper tube, and the bifurcation of the copper tube on the right side is the air outlet, which is slightly inclined upward to prevent the water droplets from flowing out and entering the carbon dioxide absorber. The lower end of the copper tube is connected to the water collector 8 to collect water droplets. The specific method is: the condenser 11 is in contact with the cold end ceramic 12 to increase the heat conduction speed. When the current is passed, the thermocouple pair 14 at one end absorbs heat (cold end) and the other end releases heat (hot end). This design enables the cold end to effectively absorb heat and achieve a cooling effect. The heat sink 5 on the hot end ceramic 15 increases the heat exchange area with the surrounding environment and improves the heat dissipation efficiency. At the same time, the addition of the fan 4 further accelerates the flow of air around the heat sink 5, thereby improving the heat dissipation effect and ensuring that the semiconductor refrigeration mechanism can work continuously and stably. The guide plate 13 connects the cold end and hot end of the thermocouple pair 14 to the cold end ceramic 12 and the hot end ceramic 15 respectively, forming a complete refrigeration circuit. This design not only simplifies the structure, but also reduces heat loss, achieves a fast and efficient cooling effect, optimizes space utilization, improves the overall performance and reliability of the condensing device, and enhances the practicality of the condensing device.

[0026] Furthermore, the semiconductor refrigeration mechanism includes a plurality of through grooves formed in a linear array on one side of the insulation chamber 16, a cold end ceramic 12 is fixedly connected to one side of the condenser tube 11, a plurality of thermocouple pairs 14 adapted to the through grooves are provided on one side of the cold end ceramic 12, a plurality of thermocouple pairs 14 are fixedly connected to both ends of the plurality of thermocouple pairs 14, one of the guide plates 13 is fixedly connected to the adjacent side wall of the cold end ceramic 12 on one side away from the thermocouple pair 14, and the other guide plate 13 is fixedly connected to the adjacent side wall of the cold end ceramic 12 on the other side away from the thermocouple pair 14. One side of the heat-end ceramic piece 15 is fixedly connected, and the side of the hot-end ceramic piece 15 away from the guide plate 13 is fixedly connected with the heat sink 5. Fans 4 are fixedly installed on both sides of the top of the heat sink 5. Specifically, the gas is connected through one of the interface tubes 3, and then transmitted to the condenser 11 through the air guide pipe 6. The heat conduction speed can be increased by contacting the cold-end ceramic piece 12 on one side of the condenser 11. The thermocouple pair 14 uses the thermoelectric effect. When the current is passed, one end absorbs heat (cold end) and the other end releases heat (hot end). This design enables the cold end to effectively absorb heat and achieve a cooling effect. The heat sink 5 on the hot-end ceramic piece 15 increases the heat exchange area with the surrounding environment and improves the heat dissipation efficiency. At the same time, the addition of the fan 4 further accelerates the flow of air around the heat sink 5, thereby improving the heat dissipation effect and ensuring that the semiconductor refrigeration mechanism can work continuously and stably. The guide plate 13 connects the cold end and hot end of the thermocouple pair 14 to the cold-end ceramic piece 12 and the hot-end ceramic piece 15, respectively, to form a complete refrigeration circuit. This design not only simplifies the structure but also reduces heat loss.

[0027] Furthermore, one end of the condenser 11 away from the air duct 6 is connected to the water collector 8 via a water collecting joint 9. Specifically, through the setting of the water collecting joint 9, the water droplets in the condenser 11 can flow through the inside of the water collecting joint 9 to the water collector 8, thereby facilitating the collection of condensed liquefied water.

[0028] Furthermore, a water stop cap 10 is connected to the side of the water collector 8 away from the condenser 11, and the end of the water stop cap 10 away from the water collector 8 passes through the side wall of the shell 1 and extends to the outside. Specifically, through the setting of the water stop cap 10, the water stop cap 10 can close the drainage port of the water collector 8, effectively preventing the water in the water collector 8 from accidentally leaking when it is not needed to be discharged, and when the water collector 8 needs to be cleaned or maintained, the water can be drained by simply operating the water stop cap 10, which improves the convenience of maintenance. At the same time, it is also convenient to check whether the state inside the water collector 8 is blocked by impurities, etc.

[0029] Furthermore, the water collector 8 is installed on the side close to the condenser 11 and the adjacent side wall of the temperature controller 7. Specifically, through the setting of the temperature controller 7, the left end of the temperature controller 7 is the control circuit board, and the probe on the right end is the temperature sensor. The temperature sensor feeds back the temperature in the insulation board to the circuit board, and controls the current and voltage through the semiconductor refrigeration mechanism to achieve the effect of controlling the temperature. When the condensation temperature reaches 8.5°, it can play a good role in removing moisture from the gas. The copper tube is maintained between 1-8.5°, ensuring that the temperature can effectively remove moisture and prevent water droplets from freezing in the copper tube and causing customs clearance blockage. The temperature controller 7 is a prior art and will not be described in detail here.

[0030] Furthermore, a plurality of heat dissipation grids are provided in a linear array outside the housing 1 and inside the heat-insulating chamber 16. Specifically, through the provision of the plurality of heat dissipation grids, the heat emitted by the heat sink 5 can be discharged from the housing 1 through the heat dissipation grids, thereby increasing the heat dissipation effect.

[0031] In summary:

[0032] The gas is connected through one of the interface tubes 3, and then transmitted to the condenser 11 through the air guide tube 6. The heat conduction speed can be increased by contacting one side of the condenser 11 with the cold end ceramic 12. The thermocouple pair 14 uses the thermoelectric effect. When current is passed, one end absorbs heat (cold end) and the other end releases heat (hot end). This design enables the cold end to effectively absorb heat and achieve a cooling effect. The heat sink 5 on the hot end ceramic 15 increases the heat exchange area with the surrounding environment and improves the heat dissipation efficiency. At the same time, the addition of the fan 4 further accelerates the flow of air around the heat sink 5, thereby improving the heat dissipation effect and ensuring that the semiconductor refrigeration mechanism can work continuously and stably. The guide plate 13 connects the cold end and hot end of the thermocouple pair 14 to the cold end ceramic 12 and the hot end ceramic 15 respectively, forming a complete refrigeration circuit. This design not only simplifies the structure, but also reduces heat loss. The water droplets in the condenser 11 can flow into the water collector 8 through the water collecting joint 9, so as to facilitate the collection of condensed liquefied water. Therefore, it has higher reliability and longer service life. The semiconductor refrigeration mechanism combines the linear array of thermocouple pairs 14 with the cold-end and hot-end ceramic pieces and the efficient heat dissipation structure to achieve fast and efficient cooling effect, optimize space utilization, improve the overall performance and reliability of the system, and enhance the practicality of the condensing device.

[0033] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and the specification only describe the principles of the utility model. The utility model may be subject to various changes and improvements without departing from the spirit and scope of the utility model. These changes and improvements fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A water vapor condensation device suitable for a carbon dioxide absorber, comprising a housing (1), a heat-insulating chamber (16) arranged inside the housing (1), and a heat-insulating chamber arranged on one side of the heat-insulating chamber (16), characterized in that: End covers (2) are fixedly mounted on both ends of the shell (1), the interiors of the two end covers (2) are connected to interface pipes (3), the adjacent ends of the two interface pipes (3) are connected to air guide pipes (6), a condenser (11) is arranged inside the shell (1) and located in the heat preservation chamber, the ends of the two air guide pipes (6) away from the end covers (2) are respectively connected to the two ends of the condenser (11), a semiconductor refrigeration mechanism connected to the condenser (11) is arranged inside the shell (1), a water collector (8) is arranged on one side of the condenser (11), and a temperature controller (7) is fixedly mounted on the side of the water collector (8) close to the condenser (11).

2. A water vapor condensation device suitable for a carbon dioxide absorber according to claim 1, characterized in that: The semiconductor refrigeration mechanism comprises a plurality of through grooves formed in a linear array and opened on one side of a heat-insulating chamber (16); a cold-end ceramic sheet (12) is fixedly connected to one side of the condenser tube (11); a plurality of thermocouple pairs (14) matched with the through grooves are arranged on one side of the cold-end ceramic sheet (12); guide plates (13) are fixedly connected to both ends of the plurality of thermocouple pairs (14); a side of one of the guide plates (13) away from the thermocouple pairs (14) is fixedly connected to an adjacent side wall of the cold-end ceramic sheet (12); a side of another guide plate (13) away from the thermocouple pairs (14) is fixedly connected to a hot-end ceramic sheet (15); a side of the hot-end ceramic sheet (15) away from the guide plate (13) is fixedly connected to a heat sink (5); and fans (4) are fixedly mounted on both sides of the top of the heat sink (5).

3. A water vapor condensation device suitable for a carbon dioxide absorber according to claim 1, characterized in that: One end of the condenser pipe (11) away from the air guide pipe (6) is connected to the water collector (8) via a water collecting joint (9).

4. A water vapor condensation device suitable for a carbon dioxide absorber according to claim 1, characterized in that: A water stop cap (10) is connected to a side of the water collector (8) away from the condenser pipe (11), and an end of the water stop cap (10) away from the water collector (8) penetrates the side wall of the housing (1) and extends to the outside.

5. The water vapor condensation device suitable for a carbon dioxide absorber according to claim 1, characterized in that: The side of the water collector (8) close to the condenser tube (11) is installed on the adjacent side wall of the temperature controller (7).

6. The water vapor condensation device suitable for a carbon dioxide absorber according to claim 1, characterized in that: A plurality of heat dissipation grids are provided outside the housing (1) and in a linear array within the heat-insulating chamber (16).

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