Tool for detecting presser foot in evaporator

Abstract

The utility model provides a tool for detecting a presser foot in an evaporator, and the tool comprises a force measurement mechanism which is used for measuring the pressure applied to a cover plate by the presser foot. By detecting the pressure applied to the cover plate by the presser foot, the pressure can be found and adjusted in time, and production interruption or rework caused by improper pressure is avoided, so that the overall production efficiency is improved; wafer unfilled corners or fragments caused by deformation of the presser foot are reduced by detecting the pressure of the presser foot, so that material waste is reduced, and the overall manufacturing cost is reduced; by detecting and controlling the pressure of the presser foot, the stability of the wafer in the evaporation process is ensured, and the edge abrasion and unfilled corner risks of the wafer are reduced, so that the quality and reliability of a final product are improved; equipment damage caused by too large pressure is avoided, the service life of the jig and the equipment is prolonged, and the maintenance and replacement cost is reduced; the accurate control of the pressure of the presser foot is beneficial to the realization of more uniform metal film deposition, thereby improving the performance and consistency of the semiconductor device.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, and particularly relates to a tooling for detecting a pressing foot in an evaporation machine. Background Art

[0002] With the popularization of high-tech products such as consumer electronics and wearable devices, the requirements for the reliability and corrosion resistance of semiconductor technology are increasing day by day. In the process of semiconductor manufacturing, the backside metal evaporation process has attracted attention because it can provide a good metallization layer. This process deposits a metal thin film on the backside of a silicon wafer by evaporation to achieve better electrical connection and protection performance.

[0003] In the existing backside metal evaporation process, the evaporation stage uses electron beam evaporation technology to heat a metal material with a relatively high melting point to a molten state, and then forms a uniform metal coating on the backside of the wafer. In this process, the placement and fixation methods of the wafer are crucial for the uniformity and quality of the metal film. Existing equipment usually adopts a planetary disk structure. The wafer is installed in the hollow hole of the planetary disk through a carrier ring and a cover plate, and is fixed on the cover plate by a pressing foot to achieve rotation to maintain the uniformity of the coating.

[0004] In the above structure, the cooperation between the cover plate and the carrier ring is crucial. In the prior art, in order to reduce the scrap rate of wafers, the inspection and maintenance methods mainly focus on the cleaning and deformation inspection of the cover plate. Although the scrap rate of wafers is reduced to a certain extent, the scrap rate of wafers is still relatively high, and the production efficiency and product quality of wafers are still relatively low.

[0005] Therefore, in order to further reduce the scrap rate of wafers and improve the production efficiency and product quality of wafers, this application provides a tooling for detecting a pressing foot in an evaporation machine. Content of the Utility Model

[0006] In view of the problems of relatively high scrap rate of wafers, relatively low production efficiency and product quality of wafers in the prior art, this application provides a tooling for detecting a pressing foot in an evaporation machine. The tooling for detecting a pressing foot in an evaporation machine can timely detect and adjust the pressure by setting a force measuring mechanism for measuring the pressure exerted by the pressing foot on the cover plate, avoid production interruption or rework caused by improper pressure, and improve the overall production efficiency; reduce the wafer corner chipping or fragmentation caused by the deformation of the pressing foot, reduce the scrap rate of wafers, and improve the production efficiency and product quality of wafers.

[0007] An embodiment of the present application provides a tool for detecting the pressing feet in an evaporation coater. The evaporation coater includes a planetary disk, on which a plurality of through holes are provided. A wafer carrying mechanism for carrying wafers is arranged in the through holes. The wafer carrying mechanism includes a carrier ring arranged in the through holes and a cover plate covering the carrier ring. A plurality of pressing feet are arranged along the circumferences of each of the through holes, and the pressing feet are pressed against the upper surface of the cover plate. The tool includes:

[0008] A force measuring mechanism, which is used to measure the pressure exerted by the pressing feet on the cover plate when the pressing feet are pressed against the cover plate.

[0009] As an implementation manner, the force measuring mechanism includes a force measuring sensor and a reading meter. The force measuring sensor is electrically connected to the reading meter. The force measuring sensor is arranged in the cover plate, and the reading meter is used to read the pressure exerted by the pressing feet on the cover plate.

[0010] As an implementation manner, at least one opening for placing the force measuring sensor is provided on the cover plate.

[0011] As an implementation manner, one opening for placing the force measuring sensor is provided on the cover plate.

[0012] As an implementation manner, the upper surface of the force measuring sensor is flush with the upper surface of the cover plate.

[0013] As an implementation manner, a marking line is provided on the upper surface of the cover plate, and the marking line is used to locate the pressing point of the pressing feet and the cover plate.

[0014] As an implementation manner, the force measuring sensor is located on the marking line.

[0015] As an implementation manner, the center of the force measuring sensor is located on the marking line.

[0016] As an implementation manner, the pressing feet are arranged on the planetary disk along the peripheries of the through holes, and the pressing feet and the planetary disk are connected by a rotation locking mechanism.

[0017] As an implementation manner, the rotation locking mechanism is a locking screw.

[0018] As described above, the tool for detecting the pressing feet in the evaporation coater of the present application has the following beneficial effects:

[0019] The tooling for detecting the pressure foot in the evaporation coater of the present application is provided with a force measuring mechanism for measuring the pressure exerted by the pressure foot on the cover plate. By detecting the pressure exerted by the pressure foot on the cover plate, the pressure can be detected and adjusted in a timely manner, avoiding production interruption or rework caused by improper pressure, thereby improving the overall production efficiency; by detecting the pressure of the pressure foot, the wafer corner chipping or fragmentation caused by the deformation of the pressure foot is reduced, which helps to reduce material waste and thus reduce the overall manufacturing cost; by detecting and controlling the pressure of the pressure foot, the stability of the wafer during the evaporation process is ensured, and the risk of wafer edge wear and corner chipping is reduced, thereby improving the quality and reliability of the final product; avoiding equipment damage caused by excessive pressure helps to extend the service life of the fixture and equipment and reduce maintenance and replacement costs; precisely controlling the pressure of the pressure foot helps to achieve more uniform metal thin film deposition, thereby improving the performance and consistency of semiconductor devices. Description of the Drawings

[0020] Figure 1 It shows a partial structural schematic diagram of an evaporation coater in the prior art.

[0021] Figure 2 It shows Figure 2 a top view structural schematic diagram of the planetary disk and the wafer carrying mechanism in

[0022] Figure 3 It shows Figure 2 a structural schematic diagram of the wafer carrying mechanism arranged in a through hole of the planetary disk in

[0023] Figure 4 It shows a structural schematic diagram of the tooling for detecting the pressure foot in the evaporation coater according to an embodiment of the present invention.

[0024] Description of Component Labels

[0025] 100, evaporation coater; 110, evaporation source; 120, planetary disk; 130, wafer carrying mechanism; 131, carrier ring; 132, cover plate; 133, pressure foot; 134, force sensor; 135, opening; 136, marking line. Detailed Embodiments

[0026] The following specifically illustrates the embodiments of the present invention through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0027] Please refer to Figures 1 to 4It should be noted that the illustrations provided in this embodiment only schematically illustrate the basic concept of the present utility model. Therefore, only the components related to the present utility model are shown in the illustrations, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0028] With the rapid development of technology, the semiconductor industry, as the cornerstone of modern information technology, is undergoing unprecedented changes and growth. Especially in the fields of consumer electronics, wearable devices, etc., the trends of miniaturization, integration, and high performance of products are becoming increasingly significant, which puts more stringent requirements on the reliability, corrosion resistance, and manufacturing process precision of semiconductor devices. Against this background, the backside metal evaporation process, as an advanced semiconductor metallization technology, has gradually received extensive attention and application in the industry because it can effectively improve the electrical performance, heat dissipation efficiency, and environmental adaptability of devices.

[0029] Traditional semiconductor metallization processes often focus on the processing of the front side of the wafer, while the backside metal evaporation process innovatively focuses on the metallization of the backside of the wafer. Through high-precision technologies such as electron beam evaporation, high-melting-point metal materials are uniformly and densely deposited on the backside of the wafer, thus significantly improving the overall performance of the device. The realization of this process depends on complex equipment structures and precise operation procedures. Among them, the stable placement and uniform rotation of the wafer during the evaporation process are the keys to ensuring the quality of the metal thin film.

[0030] The general process of wafer processing is as follows: apply a film to the front side of the wafer; thin the back side of the wafer; remove the film from the front side of the wafer; etch silicon on the back side of the wafer; perform high-energy implantation on the back side of the wafer; anneal the back side of the wafer; etch silicon oxide on the back side of the wafer; perform metal evaporation on the back side of the wafer.

[0031] As Figure 1 shown in FIG. 100 is an evaporation machine 100 used in a backside metal evaporation process in the prior art. The evaporation machine 100 includes an evaporation source 110 and a planetary disk 120 disposed above the evaporation source 110. A plurality of through holes are provided on the planetary disk 120, and a wafer carrier mechanism 130 is disposed in the through holes. The evaporation source 110 is used to heat metal materials (such as Al, Ti, Ni, Ag, etc.) to a molten state, and then form a uniform metal coating on the back side of the wafer placed in the wafer carrier mechanism 130 of the planetary disk 120. The above-mentioned wafer is cleverly designed and installed in the through holes of the planetary disk 120, and is fixed and rotated through the wafer carrier mechanism 130. Although this unique placement method helps to improve the uniformity of the coating, its stability highly depends on the precise cooperation and appropriate pressure between components. Unfortunately, the current industry's inspection of the wafer carrier mechanism 130 mainly relies on regular cleaning and screening of abnormal parts.

[0032] As Figure 2 shown, a plurality of through holes (not marked in the figure, and their positions coincide with the positions of the marked 130) are provided on the planetary disk 120, and a wafer carrier mechanism 130 is correspondingly provided in each through hole. As Figure 3 shown, the wafer carrier mechanism 130 includes a carrier ring 131. The carrier ring 131 includes a bottom and a side wall, and is open. The carrier ring 131 is placed in the through hole, a wafer is placed in the carrier ring 131, and a cover plate 132 is provided at the open end of the carrier ring 131. The cover plate 132 is used to cover the carrier ring 131. Pressing feet 133 are provided around the through hole, and the pressing feet 133 apply pressure on the cover plate 132 to tightly cover the cover plate 132 and the carrier ring 131. The applicant found in the research that the pressure of the pressing feet 133 has a certain impact on the stability of the wafer. If the pressure of the pressing feet 133 is too small, the wafer may be edge-worn or even chipped due to vibration during rotation, seriously affecting the product quality; on the contrary, if the pressure of the pressing feet 133 is too large, the cover plate 132 may be deformed, thereby causing irreversible damage to the wafer, such as being crushed, etc. The above problems not only increase the scrap rate of the wafer during the production process, but also significantly increase the manufacturing cost and reduce the overall production efficiency.

[0033] In view of the above defects, the present application provides a tooling for detecting the pressing feet in an evaporation machine. The following embodiments will be used for detailed description.

[0034] This embodiment provides a tooling for detecting the pressing feet in an evaporation machine. As Figure 1 shown, the evaporation machine 100 includes a planetary disk 120. As Figure 2 shown, generally three planetary disks 120 are provided, and the three planetary disks 120 can rotate along the rotation axis. As Figure 2 and Figure 3 shown, a plurality of through holes are provided on each planetary disk 120, Figure 2 In which 5 through holes are provided, and the number of through holes can be set according to actual needs. A wafer carrier mechanism 130 is provided in the through hole, and the wafer carrier mechanism 130 is used to carry the wafer. As Figure 3 and Figure 4 shown, the wafer carrier mechanism 130 includes a carrier ring 131, a cover plate 132 and pressing feet 133. The carrier ring 131 includes a bottom surface and a side wall surrounding the bottom surface, and is open. The carrier ring 131 is placed in the through hole, a wafer is placed on the bottom surface of the carrier ring 131, the cover plate 132 is placed at the open end of the carrier ring 131, and the pressing feet 133 apply pressure on the cover plate 132 to press and seal the cover plate 132 and the carrier ring 131. As Figure 4As shown, the tooling for detecting the pressure foot in the evaporation coater further includes a force measuring mechanism. When the pressure foot 133 is pressed against the cover plate 132, the force measuring mechanism is used to measure the pressure exerted by the pressure foot 133 on the cover plate 132.

[0035] The tooling for detecting the pressure foot in the evaporation coater provided in this embodiment can detect the pressure exerted by the pressure foot 133 on the cover plate 132 by setting a force measuring mechanism, and can timely discover and adjust the pressure, avoiding production interruption or rework caused by improper pressure, thereby improving the overall production efficiency; by reducing the wafer corner chipping or fragmentation caused by the deformation of the pressure foot 133, it helps to reduce waste and rework costs, thereby reducing the overall manufacturing cost; detecting and controlling the pressure of the pressure foot 133 ensures the stability of the wafer during the evaporation process, reduces the risk of edge wear and corner chipping, thereby improving the quality and reliability of the final product; avoiding equipment damage caused by excessive pressure helps to extend the service life of the fixture and equipment, and reduces maintenance and replacement costs; precisely controlling the pressure of the pressure foot 132 helps to achieve more uniform metal thin film deposition, improving the performance and consistency of semiconductor devices.

[0036] In an alternative embodiment, as Figure 4 shown, the force measuring mechanism includes a force measuring sensor 134 and a reading meter. The force measuring sensor 134 is electrically connected to the reading meter. The force measuring sensor 134 is disposed within the cover plate 132, and the reading meter is used to read the pressure exerted by the pressure foot 133 on the cover plate 132 measured by the force measuring sensor 134.

[0037] In an alternative embodiment, as Figure 4 shown, the cover plate 132 is provided with at least one opening 135 for placing the force measuring sensor 134. By providing the opening 135 on the cover plate 132 and placing the force measuring sensor 134 within the opening 135, the pressure exerted by the pressure foot 133 on the cover plate 132 measured by the force measuring sensor 134 can be improved.

[0038] In an alternative embodiment, as Figure 4As shown, an opening 135 for placing a force measuring sensor 134 is provided on the cover plate 132. Since the position between the cover plate 132 and the bearing ring 131 can be changed by rotating the cover plate 132, when opening an opening 135, when it is necessary to test which pressing foot 133, the opening 135 can be made to correspond to the corresponding pressing foot 133 by rotating the cover plate 132, which can save costs, but may result in low test efficiency. The force measuring mechanism used includes a force measuring sensor 134 and a reading meter. If multiple openings 135 are provided on the cover plate 132 and a force measuring sensor 134 is placed in each opening 135 respectively, it can indeed improve the efficiency of testing the pressure of the pressing foot 133. However, when the force measuring sensor 134 and the reading meter are connected by wires, it may cause entanglement between multiple wires and may lead to chaotic readings. Specifically, it can be selected according to the actual situation to achieve a balance between high reading efficiency and low cost.

[0039] In an alternative embodiment, as Figure 4 shown, the upper surface of the force measuring sensor 134 is flush with the upper surface of the cover plate 132. Since the pressure between the pressing foot 133 and the upper surface of the cover plate 132 is to be tested, setting the upper surface of the force measuring sensor 134 flush with the upper surface of the cover plate 132 can further improve the accuracy of the pressure exerted by the pressing foot 133 on the cover plate 132 during testing.

[0040] In an alternative embodiment, as Figure 4 shown, a marking line 136 is provided on the upper surface of the cover plate 132. The marking line 136 is used to locate the pressing point of the pressing foot 133 and the cover plate 132. Figure 4 The marking line shown in

[0041] is a circle because the pressing foot 133 is arranged along the circumferential direction of the through hole, and the position between the cover plate 132 and the bearing ring 131 can be changed relatively. In some embodiments, the marking line 136 can be other markings to ensure that the force application point of the pressing foot 133 on the cover plate 132 is relatively fixed each time.

[0041] In an alternative embodiment, as Figure 4 shown, the center of the force measuring sensor 134 is located on the marking line 136. The center of the force measuring sensor 134 being located on the marking line 136 can further identify the position where the pressing foot 133 applies pressure to the cover plate 132 each time, and further improve the accuracy and consistency of the pressure test.

[0042] In an alternative embodiment, as Figure 4As shown, the presser foot 133 is disposed on the planetary disk 120 along the periphery of the through hole. The presser foot 133 is connected to the planetary disk 120 through a rotation locking mechanism. The presser foot 133 can rotate and be fixed along the rotation locking mechanism. When it is not necessary to cover between the cover plate 132 and the carrier ring 131, the presser foot 133 is rotated to the outside of the through hole. When it is necessary to press and seal between the cover plate 132 and the carrier ring 131, the presser foot 133 is rotated to the marking line 136 of the cover plate 132 and fixed, which improves the operation convenience.

[0043] In an alternative embodiment, the rotation locking mechanism is a locking screw, a locking pin, a locking clip, or the like.

[0044] The tooling for detecting the presser foot in the evaporation coater provided in this embodiment can timely detect and adjust the pressure by detecting the pressure change of the presser foot 133, avoiding production interruption or rework caused by improper pressure, thereby improving the overall production efficiency; it can timely detect the deformation between the presser foot 133 and the cover plate 132. Once abnormal deformation is found, the fixture can be replaced in time, thereby effectively avoiding quality problems such as wafer corner missing and fragmentation caused by fixture deformation, and significantly improving the product yield and the overall quality level.

[0045] The above embodiments are only illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A tool for detecting presser feet in a vapor deposition machine, the vapor deposition machine comprising a planetary disk, the planetary disk being provided with a plurality of through holes, a wafer bearing mechanism for bearing wafers being provided in the through holes, the wafer bearing mechanism comprising a bearing ring provided in the through holes, and a cover plate covering the bearing ring, a plurality of presser feet being provided along the circumference of each of the through holes, the presser feet being pressed against the upper surface of the cover plate, characterized in that: The tooling comprises: A force measuring mechanism is used to measure the pressure applied by the presser foot to the cover plate when the presser foot is pressed against the cover plate.

2. The tooling for detecting the presser foot in the vapor deposition machine according to claim 1, characterized in that: The force measuring mechanism comprises a force sensor and a reading meter, wherein the force sensor is electrically connected to the reading meter, the force sensor is arranged in the cover plate, and the reading meter is used to read the pressure applied by the presser foot to the cover plate.

3. The tooling for detecting the presser foot in the vapor deposition machine according to claim 2, characterized in that: The cover plate is provided with at least one opening for placing the force sensor.

4. The tooling for detecting the presser foot in the vapor deposition machine according to claim 3, characterized in that: The cover plate is provided with an opening for placing the force sensor.

5. The tool for detecting the presser foot in a vapor deposition machine according to any one of claims 2 to 4, characterized in that: The upper surface of the force sensor is flush with the upper surface of the cover plate.

6. The tooling for detecting the presser foot in the vapor deposition machine according to claim 5, characterized in that: The upper surface of the cover plate is provided with marking lines, and the marking lines are used to locate the pressing points between the presser foot and the cover plate.

7. The tooling for detecting the presser foot in the vapor deposition machine according to claim 6, characterized in that: The force sensor is located on the marking line.

8. The tooling for detecting the presser foot in the vapor deposition machine according to claim 7, characterized in that: The center of the force sensor is located on the marking line.

9. The tooling for detecting the presser foot in a vapor deposition machine according to claim 1, characterized in that: The presser foot is arranged on the planetary disc along the periphery of the through hole, and the presser foot is connected to the planetary disc via a rotation locking mechanism.

10. The tooling for detecting the presser foot in the vapor deposition machine according to claim 9, characterized in that: The rotation locking mechanism is a locking screw.

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