Parallel flow micro-channel condenser, refrigerator and freezer

Abstract

The embodiment of the utility model belongs to the refrigeration technology, and provides a parallel flow micro-channel condenser, a refrigerator and a freezer, and the parallel flow micro-channel condenser comprises a first collecting pipe, a second collecting pipe and a third collecting pipe, a second partition plate is arranged in the second collecting pipe, and a liquid separation hole is formed in the second partition plate; the heat exchange pipe is configured to be communicated with the first collecting pipe and the second collecting pipe so as to form a flow channel for a refrigerant to flow; and the shape memory part is located in the second collecting pipe and covers the liquid separation holes, and the shape memory part is configured to deform according to the temperature of the refrigerant so as to change the covering proportion of the liquid separation holes. According to the parallel flow micro-channel condenser, the liquid separation effect is good.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of refrigeration, and in particular, to a parallel flow microchannel condenser, a refrigerator, and a freezer. Background Art

[0002] Refrigerators and freezers are refrigeration devices that maintain a constant low temperature, and are also products that keep food or other items in a constant low temperature state. Refrigerators and freezers include a refrigeration system, and the refrigeration system includes a parallel flow microchannel condenser, which mainly relies on the phase change condensation of the refrigerant for heat exchange.

[0003] In the related art, a liquid distribution plate is provided in the header pipe of the parallel flow microchannel condenser, and liquid distribution holes are provided on the liquid distribution plate to remove the condensed liquid phase by using the liquid distribution holes.

[0004] However, the liquid distribution effect of the parallel flow microchannel condenser is poor. Summary of the Utility Model

[0005] The embodiments of the present application provide a parallel flow microchannel condenser, a refrigerator, and a freezer, and the parallel flow microchannel condenser has a better liquid distribution effect.

[0006] In a first aspect, the embodiments of the present application provide a parallel flow microchannel condenser for a refrigerator or a freezer, and the parallel flow microchannel condenser includes:

[0007] A first header pipe, in which at least two first partition plates are arranged at intervals;

[0008] A second header pipe, in which a second partition plate is arranged, and the second partition plate is configured with liquid distribution holes;

[0009] A heat exchange tube, which is configured to connect the first header pipe and the second header pipe to form a flow channel for the refrigerant to flow;

[0010] A shape memory element, which is located in the second header pipe and covers the liquid distribution holes, and the shape memory element is configured to deform according to the temperature of the refrigerant to change the covering ratio of the liquid distribution holes.

[0011] In this way, the flow area of the liquid distribution holes can be adjusted continuously and steplessly, and then the resistance coefficient can be adjusted to meet the different requirements for the bypass flow rate when the refrigerant flow rate is different under different ambient temperature conditions, so as to achieve high-performance liquid distribution at any temperature, thereby adaptively improving the heat exchange efficiency, reducing the overall energy consumption at each ambient temperature, realizing all-weather energy saving, and this adjustment does not consume additional electric energy.

[0012] In some embodiments of the present application, when the temperature of the refrigerant is the first temperature, the shape memory element covers the liquid distribution holes with a first ratio of the area;

[0013] When the temperature of the refrigerant is the second temperature, the second ratio of the area of the shape memory member covering the liquid distribution hole;

[0014] The first temperature is less than the second temperature, and the first ratio is greater than the second ratio.

[0015] In this way, when the ambient temperature rises, the refrigerant temperature rises, the liquid-phase refrigerant in the second header decreases, and it is necessary to increase the size of the liquid distribution hole, thereby reducing the resistance for the liquid phase to pass through, so that the liquid-phase refrigerant can pass through the liquid distribution hole as soon as possible.

[0016] In some embodiments of the present application, the first temperature is 25 - 35 °C, and the first ratio is 40 - 60%;

[0017] And / or, the second temperature is 50 - 60 °C, and the second ratio is 0 - 20%.

[0018] In this way, it is beneficial to meet the usage requirements of the product.

[0019] In some embodiments of the present application, the shape memory member abuts against the end face of the second partition.

[0020] In this way, the distance between the shape memory member and the second partition is small, and the shielding effect on the liquid distribution hole is good.

[0021] In some embodiments of the present application, the shape memory member is located on the side of the second partition facing downstream.

[0022] In this way, it can effectively avoid affecting the force on the gaseous refrigerant and the distribution of the liquid refrigerant in the upper header.

[0023] In some embodiments of the present application, it further includes an elastic member, one end of the elastic member is connected to the inner wall of the second header, and the other end is connected to the shape memory member.

[0024] In this way, it is beneficial to change the cantilever state of the shape memory member, thereby increasing the reliability of the shape memory member.

[0025] In some embodiments of the present application, when the shape memory member covers the first ratio of the liquid distribution hole, the elastic member has no pre-tightening force, and when the shape memory member covers the second ratio of the liquid distribution hole, the elastic member is subjected to a tensile force under the action of the shape memory member;

[0026] Or, when the shape memory member covers the second ratio of the liquid distribution hole, the elastic member has no pre-tightening force, and when the shape memory member covers the first ratio of the liquid distribution hole, the elastic member is subjected to a pressure under the action of the shape memory member.

[0027] In this way, the elastic member is unidirectionally stressed, which is beneficial to improving the service life of the elastic member.

[0028] In some embodiments of the present application, the number of the second partition plates is at least two. The at least two second partition plates include a first sub-partition plate and a second sub-partition plate, and the first sub-partition plate is located upstream of the second sub-partition plate.

[0029] The number of the shape memory elements is at least two. The at least two shape memory elements include a first shape memory element and a second shape memory element. The first shape memory element is configured to deform according to the temperature of the refrigerant so as to change the covering ratio of the liquid distribution holes of the first sub-partition plate, and the second shape memory element is configured to deform according to the temperature of the refrigerant so as to change the covering ratio of the liquid distribution holes of the second sub-partition plate.

[0030] The covering ratio of the liquid distribution holes of the first sub-partition plate by the first shape memory element is greater than the covering ratio of the liquid distribution holes of the second sub-partition plate by the second shape memory element.

[0031] In this way, it is beneficial to high-performance liquid distribution.

[0032] In a second aspect, an embodiment of the present application provides a refrigerator, including:

[0033] A refrigeration system, which includes the above-mentioned parallel flow microchannel condenser.

[0034] The parallel flow microchannel condenser has better liquid distribution efficiency and higher heat exchange efficiency. Therefore, the coefficient of performance of the refrigerator is higher and the overall energy consumption of the whole machine is lower.

[0035] In a third aspect, an embodiment of the present application provides a freezer, including:

[0036] A refrigeration system, which includes the above-mentioned parallel flow microchannel condenser.

[0037] The parallel flow microchannel condenser has better liquid distribution efficiency and higher heat exchange efficiency. Therefore, the coefficient of performance of the freezer is higher and the overall energy consumption of the whole machine is lower. Description of the Drawings

[0038] In order to more clearly illustrate the embodiments of the present application or the implementation manners in the related art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the related art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings.

[0039] Figure 1 It is a schematic structural diagram of the refrigerator provided by the embodiment of the present application;

[0040] Figure 2 It is a schematic structural diagram of the freezer provided by the embodiment of the present application;

[0041] Figure 3 It is a schematic structural diagram of the parallel flow microchannel condenser provided by the embodiment of the present application;

[0042] Figure 4 The front view of the parallel - flow micro - channel condenser provided by the embodiment of the present application;

[0043] Figure 5 Along Figure 4 The sectional view taken along the A - A direction in

[0044] Figure 6 The sectional view of the second header in the parallel - flow micro - channel condenser provided by the embodiment of the present application;

[0045] Figure 7 The sectional view state diagram when the shape - memory element covers the liquid - distribution holes at the first ratio in the parallel - flow micro - channel condenser provided by the embodiment of the present application;

[0046] Figure 8 Along Figure 7 The sectional view taken along the B - B direction in

[0047] Figure 9 The sectional view state diagram when the shape - memory element covers the liquid - distribution holes at the second ratio in the parallel - flow micro - channel condenser provided by the embodiment of the present application;

[0048] Figure 10 Along Figure 9 The sectional view taken along the C - C direction in

[0049] Explanation of reference numerals:

[0050] 100 - Refrigerator cabinet;

[0051] 200 - Parallel - flow micro - channel condenser;

[0052] 210 - First header;

[0053] 220 - First partition;

[0054] 230 - Second header;

[0055] 240 - Second partition;

[0056] 241 - Liquid - distribution hole;

[0057] 250 - Heat - exchange tube;

[0058] 260 - Shape - memory element;

[0059] 270 - Elastic element;

[0060] 300 - Compressor;

[0061] 400 - Throttling device;

[0062] 500 - Evaporator;

[0063] 600 - Freezer cabinet body. Detailed implementation mode

[0064] The condenser mainly relies on the phase change condensation of the refrigerant for heat exchange. As the liquid phase of the refrigerant increases, the thermal resistance of the liquid film on the inner wall of the tube rises, and the heat transfer deteriorates. Since the liquefaction of the refrigerant leads to a decrease in flow velocity, it also causes the heat transfer to deteriorate. Therefore, a liquid separation hole is provided in the header pipe of the condenser to timely remove the condensed liquid phase, and at the same time ensure that the gas phase does not bypass through the liquid separation hole. Leading the liquid refrigerant out from the front of the heat exchanger can reduce the pressure drop, and after introducing it to the rear of the heat exchanger, it can increase the mass flow rate at the rear, so as to ensure that both the pressure drop and the heat exchange capacity are in a better state, and improve the heat transfer coefficient. The overall performance of the heat exchanger is homogenized. Therefore, the size design of the liquid separation hole is relatively important, and it is necessary to make the liquid refrigerant easy to pass through while making the gas refrigerant difficult to pass through.

[0065] In small equipment, such as the field of refrigerators and freezers, there is no such technology yet.

[0066] In the related technology, a liquid separation plate is provided in the header pipe of the parallel flow microchannel condenser, and liquid separation holes are provided on the liquid separation plate to remove the condensed liquid phase by using the liquid separation holes. Among them, the size of the liquid separation holes is fixed. That is to say, under a certain working condition (for example, when the ambient temperature is 20 degrees), the size of the liquid separation holes is appropriate and the liquid separation effect is good. When the working condition changes (for example, when the ambient temperature is 30 degrees), the size of the liquid separation holes is too small, the liquid separation effect becomes poor, and the system performance declines.

[0067] To solve the technical problems of the present application, the present application provides a parallel flow microchannel condenser. By setting a shape memory element, the flow area of the liquid separation hole can be adjusted continuously and steplessly without power, and then the resistance coefficient can be adjusted to meet the different requirements of the bypass flow for different refrigerant flow rates when the ambient temperature changes, so as to achieve high-performance liquid separation at any temperature without additional power consumption.

[0068] To make the purpose, implementation mode and advantages of the present application clearer, the following will clearly and completely describe the exemplary implementation mode of the present application with reference to the drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0069] It should be noted that the brief description of the terms in the present application is only for the convenience of understanding the subsequent described implementation mode, rather than intending to limit the implementation mode of the present application. Unless otherwise specified, these terms should be understood according to their ordinary and common meanings.

[0070] Furthermore, the terms "comprising", "having", and any variations thereof are intended to cover a non-exclusive inclusion. For example, a product or device that comprises a series of components need not be limited to those components clearly listed, but may include other components not clearly listed or inherent to such product or device.

[0071] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0072] The terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0073] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0074] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0075] See Figure 1 As shown, in some embodiments, the present application provides a refrigerator.

[0076] Among them, the refrigerator includes a refrigerator cabinet 100 and a refrigeration system located inside the refrigerator cabinet 100. The refrigeration system includes a parallel flow microchannel condenser 200.

[0077] The refrigeration system may further include a compressor 300, a throttling device 400, and an evaporator 500. The compressor 300, the parallel flow microchannel condenser 200, the throttling device 400, and the evaporator 500 are connected in series through pipelines in sequence, and a refrigerant flows through the pipelines.

[0078] See Figure 2 As shown, in some embodiments, the present application provides a freezer.

[0079] Among them, the freezer includes a freezer cabinet body 600 and a refrigeration system located inside the freezer cabinet body 600. The refrigeration system includes a parallel flow microchannel condenser 200.

[0080] It can be understood that in this embodiment, the parallel flow microchannel condenser 200 has better liquid distribution efficiency and higher heat exchange efficiency. Therefore, the system COP (Coefficient of Performance) of the refrigerator and freezer in the present application is higher, and the overall energy consumption of the machine is lower.

[0081] See Figure 3 and Figure 4 As shown, the parallel flow microchannel condenser 200 provided in the embodiment of the present application includes: a first header 210.

[0082] Among them, the first header 210 may be cylindrical or the first header 210 may be D-shaped. The first partition may be circular or D-shaped.

[0083] Among them, at least two first partitions 220 are arranged at intervals inside the first header 210. The first partition 220 is used to axially divide the interior of the first header 210 into different regions.

[0084] In some embodiments, the first partitions 220 are arranged at intervals along the axial direction of the first header 210 and are parallel to each other. Among them, the extension plane of the first partition 220 may be perpendicular to the axial direction of the first header 210.

[0085] The first partition 220 may be arranged on the inner wall of the first header 210 by welding. The shape of the first partition 220 may match the inner wall of the first header 210.

[0086] It should be noted that the number of the first partitions 220 is set according to the process requirements of the parallel flow microchannel condenser 200.

[0087] See Figures 3 to 5 As shown, the parallel flow microchannel condenser 200 includes: a second header 230.

[0088] In some embodiments, the second header 230 may be cylindrical. Or, the second header 230 may be D-shaped.

[0089] A second manifold 230 is provided with a second partition 240, and the second partition 240 is configured with liquid distribution holes 241. The liquid distribution holes 241 are used for the refrigerant in the liquid phase to flow through.

[0090] In some embodiments, the outer wall of the second partition 240 matches the shape of the inner wall of the second manifold 230, and the outer wall of the second partition 240 abuts against the inner wall of the second manifold 230.

[0091] In some embodiments, the second partition 240 is welded to the second manifold 230.

[0092] In some embodiments, the number of the liquid distribution holes 241 can be one, two or more. And the liquid distribution holes 241 can be distributed at any position of the second partition 240.

[0093] In some embodiments, the shape of the liquid distribution holes 241 can be circular, rectangular or other shapes.

[0094] In some embodiments, the number of the liquid distribution holes 241 is one and is located at the central position of the second partition 240. The liquid distribution hole 241 is circular, that is to say, the center of the liquid distribution hole 241 coincides with the center of the second partition 240.

[0095] In some embodiments, the number of the liquid distribution holes 241 is multiple, and the multiple liquid distribution holes 241 are arranged at intervals along the radial direction of the second partition 240, and the shape memory member can block one or more of the liquid distribution holes 241.

[0096] Figure 3 and Figure 4 As shown in and, the parallel flow microchannel condenser 200 includes: a heat exchange tube 250. The heat exchange tube 250 is used to connect the first manifold 210 and the second manifold 230 to form a flow path for the refrigerant to flow through.

[0097] In some embodiments, the first manifold 210 and the second manifold 230 are located at opposite ends of the heat exchange tube 250 along the extending direction. The axes of the first manifold 210 and the second manifold 230 are parallel to each other. The extending direction of the heat exchange tube 250 is perpendicular to the axis of the first manifold 210.

[0098] In some embodiments, the heat exchange tube 250 can be connected to the first manifold 210 and the second manifold 230 by welding.

[0099] Exemplarily, the number of the first partitions 220 is two, and the number of the second partitions 240 is one.

[0100] The refrigerant enters the first header 210 through the inlet of the first header 210. The inlet is located above the first first partition 220, and the refrigerant flows through the heat exchange tubes 250 in the upper part of the first flow path to the second header 230.

[0101] The refrigerant entering the second header 230 is located above the second partition 240. Among them, the liquid-phase refrigerant moves through the liquid distribution holes 241 of the second partition 240 to the end of the second header 230, and then flows through the heat exchange tubes 250 in the lower part of the second flow path to the first header 210 and flows out through the outlet. The outlet is located below the second first partition 220.

[0102] Among them, the gas-phase refrigerant flows reversely through the heat exchange tubes 250 in the lower part of the first flow path to the lower part of the first first partition 220 in the first header 210, then flows through the heat exchange tubes 250 in the upper part of the second flow path to the lower part of the second partition 240 in the second header 230, and then flows through the heat exchange tubes 250 in the lower part of the second flow path to the first header 210 and flows out through the outlet.

[0103] See Figures 6 to 10 As shown, the parallel flow microchannel condenser 200 includes: a shape memory member 260.

[0104] Among them, the shape memory member 260 is located in the second header 230.

[0105] The shape memory member 260 is configured to deform according to the temperature of the refrigerant to change the coverage ratio of the liquid distribution holes 241. In this way, the flow area of the liquid distribution holes 241 can be adjusted continuously and steplessly, and then the resistance coefficient can be adjusted to meet the different requirements for the bypass flow rate when the refrigerant flow rate is different under different ambient temperature conditions, realizing high-performance liquid distribution at any temperature, thereby adaptively improving the heat exchange efficiency, reducing the overall energy consumption at each ambient temperature, realizing all-weather energy saving, and this adjustment does not consume additional electric energy.

[0106] In some embodiments, the shape memory member 260 can be in the form of a sheet.

[0107] Among them, the material of the shape memory member 260 is a memory metal. For example, a one-way memory metal, a shape memory alloy deforms at a lower temperature and can restore its shape before deformation after heating. Or a two-way memory metal, which restores its high-temperature phase shape when heated and can restore its low-temperature phase shape when cooled. Or, the material of the shape memory member 260 is a polymer material.

[0108] In some embodiments, the number of shape memory members 260 corresponding to one second partition 240 can be 1. Or, two or more shape memory members 260 can cooperate together to change the coverage ratio of the liquid distribution holes 241.

[0109] In some embodiments, the shape memory member 260 may be connected to the inner wall of the second header 230, or the shape memory member 260 may be connected to the second partition. For example, the connection may be made by welding.

[0110] In some embodiments of the present application, the shape memory member 260 abuts against the end face of the second partition. In this way, the distance between the shape memory member 260 and the second partition is small, and the shielding effect on the liquid distribution holes 241 is good.

[0111] In some embodiments, the shape memory member 260 is located on the upstream side of the second partition.

[0112] In some embodiments of the present application, the shape memory member 260 is located on the downstream side of the second partition. In this way, it is possible to effectively avoid affecting the force on the gaseous refrigerant and the distribution of the liquid refrigerant in the upper header.

[0113] See Figure 7 and Figure 8 As shown, in some embodiments of the present application, when the temperature of the refrigerant is the first temperature, the shape memory member 260 covers a first proportion of the area of the liquid distribution holes 241.

[0114] See Figure 9 and Figure 10 As shown, when the temperature of the refrigerant is the second temperature, the shape memory member 260 covers a second proportion of the area of the liquid distribution holes 241.

[0115] Wherein, the first temperature is less than the second temperature, and the first proportion is greater than the second proportion.

[0116] It can be understood that when the ambient temperature rises, the temperature of the refrigerant rises, the liquid-phase refrigerant in the second header 230 decreases, and it is necessary to increase the size of the liquid distribution holes 241, thereby reducing the resistance to the passage of the liquid phase, so that the liquid-phase refrigerant can pass through the liquid distribution holes 241 as soon as possible.

[0117] In some embodiments of the present application, the first temperature is 25 - 35 °C, and the first proportion is 40 - 60%. In this way, it can meet the use of the product at a relatively low ambient temperature.

[0118] For example, the first temperature may be 30 °C or 28 °C, and the first proportion may be 45% or 50%.

[0119] In some embodiments of the present application, the second temperature is 50 - 60 °C, and the second proportion is 0 - 20%. In this way, it can meet the use of the product at a relatively high ambient temperature.

[0120] For example, the second temperature may be 55 °C or 58 °C, and the second proportion may be 5% or 10%.

[0121] See Figures 7 to 10As shown, in some embodiments of the present application, the parallel flow microchannel condenser 200 further includes an elastic member 270. One end of the elastic member 270 is connected to the inner wall of the second header 230, and the other end is connected to the shape memory member 260. In this way, it is beneficial to change the cantilever state of the shape memory member 260, thereby increasing the reliability of the shape memory member 260.

[0122] Among them, the elastic member 270 can be a spring or elastic rubber.

[0123] In some embodiments, the spring can be connected to the inner wall of the second header 230 by welding and connected to the shape memory member 260 by welding. In this way, the parallel flow microchannel condenser 200 as a whole can be processed by welding, which is beneficial to improving the overall processing efficiency.

[0124] In some embodiments, the extending direction of the elastic member 270 is the same as the direction of the shape memory member 260 and is the same as the radial direction of the second partition.

[0125] In some embodiments, the elastic member 270 abuts against the second partition 240.

[0126] In some embodiments of the present application, when the shape memory member 260 covers the first ratio of the liquid distribution holes 241, the elastic member 270 has no pre-tightening force. When the shape memory member 260 covers the second ratio of the liquid distribution holes 241, the elastic member 270 is subjected to a tensile force under the action of the shape memory member 260.

[0127] For example, when the shape memory member 260 decreases as the refrigerant temperature increases.

[0128] When the shape memory member 260 covers the first ratio of the liquid distribution holes 241, the elastic member 270 has no pre-tightening force (in the original length state). When the refrigerant temperature increases, the size of the shape memory member 260 becomes smaller, and the shape memory member 260 applies a tensile force to the elastic member 270, and the length of the elastic member 270 increases.

[0129] In some embodiments of the present application, when the shape memory member 260 covers the second ratio of the liquid distribution holes 241, the elastic member 270 has no pre-tightening force. When the shape memory member 260 covers the first ratio of the liquid distribution holes 241, the elastic member 270 is subjected to a pressure under the action of the shape memory member 260.

[0130] For example, when the shape memory member 260 decreases as the refrigerant temperature increases.

[0131] When the shape memory member 260 covers the second ratio of the liquid distribution holes 241, the elastic member 270 has no pre-tightening force (in the original length state). When the refrigerant temperature decreases, the size of the shape memory member 260 increases, and the shape memory member 260 applies a pressure to the elastic member 270, and the length of the elastic member 270 decreases.

[0132] It can be understood that by making the elastic member 270 be subjected to unidirectional force, it is beneficial to improve the service life of the elastic member 270.

[0133] In some embodiments of the present application, the number of the second partition plates 240 is at least two. The at least two second partition plates 240 include a first sub-partition plate and a second sub-partition plate, and the first sub-partition plate is located upstream of the second sub-partition plate.

[0134] The number of the shape memory members 260 is at least two. The at least two shape memory members 260 include a first shape memory member and a second shape memory member. The first shape memory member is configured to deform according to the temperature of the refrigerant so as to change the covering ratio of the liquid distribution holes 241 of the first sub-partition plate, and the second shape memory member is configured to deform according to the temperature of the refrigerant so as to change the covering ratio of the liquid distribution holes 241 of the second sub-partition plate.

[0135] The covering ratio of the liquid distribution holes 241 of the first sub-partition plate by the first shape memory member is greater than the covering ratio of the liquid distribution holes 241 of the second sub-partition plate by the second shape memory member.

[0136] It can be understood that in each working condition, the content of the liquid-phase refrigerant in the upstream of the second header 230 is less than that in the downstream. That is to say, the flow resistance of the liquid distribution holes 241 located upstream needs to be less than that of the liquid distribution holes 241 located downstream. Therefore, the covering ratio of the liquid distribution holes 241 of the first sub-partition plate by the first shape memory member being greater than the covering ratio of the liquid distribution holes 241 of the second sub-partition plate by the second shape memory member is beneficial to high-performance liquid distribution.

[0137] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

[0138] For the sake of convenience of explanation, the above description has been made in combination with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. According to the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are for the purpose of better explaining the principles and actual applications, so that those skilled in the art can better use the embodiments and various different modified embodiments suitable for specific use considerations.

Claims

1. A parallel flow microchannel condenser for use in a refrigerator or freezer, characterized in that: The parallel flow microchannel condenser comprises: A first header (210), wherein at least two first partitions (220) are arranged in the first header (210); A second manifold (230), wherein a second partition plate (240) is disposed in the second manifold (230), and the second partition plate (240) is provided with a liquid separation hole (241); a heat exchange tube (250), wherein the heat exchange tube (250) is configured to connect the first header (210) and the second header (230) to form a flow channel for the refrigerant to flow; A shape memory element (260), the shape memory element (260) being located in the second manifold (230) and covering the liquid separation hole (241), the shape memory element (260) being configured to deform according to the temperature of the refrigerant so as to change the coverage ratio of the liquid separation hole (241).

2. The parallel flow microchannel condenser according to claim 1, characterized in that: When the temperature of the refrigerant is a first temperature, the shape memory element (260) covers a first proportion of the area of ​​the liquid separation hole (241); When the temperature of the refrigerant is a second temperature, the shape memory element (260) covers a second proportion of the area of ​​the liquid separation hole (241); The first temperature is lower than the second temperature, and the first ratio is higher than the second ratio.

3. The parallel flow microchannel condenser according to claim 2, characterized in that: The first temperature is 25-35°C, and the first ratio is 40-60%; And / or, the second temperature is 50-60° C., and the second ratio is 0-20%.

4. The parallel flow microchannel condenser according to any one of claims 1 to 3, characterized in that: The shape memory element (260) abuts against an end surface of the second partition plate (240).

5. The parallel flow microchannel condenser according to claim 4, characterized in that: The shape memory member (260) is located on the downstream side of the second partition plate (240).

6. The parallel flow microchannel condenser according to claim 2, characterized in that: It also includes an elastic member (270), one end of which is connected to the inner wall of the second collecting pipe (230), and the other end of which is connected to the shape memory member (260).

7. The parallel flow microchannel condenser according to claim 6, characterized in that: When the shape memory member (260) covers the liquid separation hole (241) at the first ratio, the elastic member (270) has no pre-tightening force, and when the shape memory member (260) covers the liquid separation hole (241) at the second ratio, the elastic member (270) is subjected to tension under the action of the shape memory member (260); Alternatively, when the shape memory member (260) covers the liquid separation hole (241) in the second proportion, the elastic member (270) has no pre-tightening force, and when the shape memory member (260) covers the liquid separation hole (241) in the first proportion, the elastic member (270) is subjected to pressure under the action of the shape memory member (260).

8. The parallel flow microchannel condenser according to any one of claims 1 to 3, characterized in that: The number of the second partitions (240) is at least two, and the at least two second partitions (240) include a first sub-partition and a second sub-partition, and the first sub-partition is located upstream of the second sub-partition; The number of the shape memory elements (260) is at least two, and the at least two shape memory elements (260) include a first shape memory element and a second shape memory element, the first shape memory element is configured to deform according to the temperature of the refrigerant to change the coverage ratio of the liquid separation hole (241) of the first sub-partition plate, and the second shape memory element is configured to deform according to the temperature of the refrigerant to change the coverage ratio of the liquid separation hole (241) of the second sub-partition plate; The coverage ratio of the first shape memory element to the liquid separation hole (241) of the first sub-partition plate is greater than the coverage ratio of the second shape memory element to the liquid separation hole (241) of the second sub-partition plate.

9. A refrigerator, characterized in that: include: A refrigeration system, comprising the parallel flow microchannel condenser according to any one of claims 1 to 8.

10. A refrigerator, characterized in that: include: A refrigeration system, comprising the parallel flow microchannel condenser according to any one of claims 1 to 8.

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