Wafer surface cleaning platform deck

Abstract

The utility model discloses a wafer surface cleaning platform deck which comprises a bottom plate, a collecting bin is arranged on the bottom plate, a vacuum rotating head is arranged on the bottom plate, the bottom of the vacuum rotating head is connected with a power mechanism, the vacuum rotating head is used for adsorbing and fixing a wafer and driving the wafer to rotate in the collecting bin, and the collecting bin comprises a conical base. A vertical annular supporting edge is arranged on the periphery of the conical base, the conical base and the vertical annular supporting edge are matched to form a liquid storage tank, a plurality of vacuum pipes are arranged at the bottom of the liquid storage tank, an upper cover is further arranged at the top of the vertical annular supporting edge, a first avoiding opening is formed in the upper cover, and a second avoiding opening is formed in the conical base. The bottom plate is further provided with a hot air pipe, the hot air pipe is arranged between the conical base and the bottom plate, and the hot air pipe supplies hot air into the collecting bin through the second receding opening. According to the utility model, the cleaning agent can be effectively collected, the cleaning agent is prevented from being retained in the collecting bin, and the wafer surface drying efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor preparation, in particular to a wafer surface cleaning carrier. Background Art

[0002] Wafer surface cleaning is a key step in semiconductor manufacturing, which aims to remove various contaminants attached to the surface to ensure device performance and quality. Cleaning technology can be roughly divided into two categories: wet and dry, among which wet chemical cleaning is the mainstream. Wet cleaning uses a mixture of detergent and deionized water to clean the wafer surface, which can effectively remove organic matter, inorganic residues and particles.

[0003] The existing cleaning device adopts a circular trough body, in which a chuck is arranged to fix the wafer and drive the wafer to rotate. The detergent is directly added to the wafer surface through a liquid supply pipe, and the chuck drives the wafer to rotate to remove the detergent on the wafer surface to achieve a cleaning effect.

[0004] This structure can also be used in conjunction with an ultrasonic generator or other auxiliary cleaning device. Although it has a good cleaning effect, its circular trough body is a fixed structure, and the cleaning agent is discharged by overflow. The cleaning liquid is corrosive to a certain extent, so the cleaning liquid in the circular trough body will place high demands on the seal between the chuck and the circular trough body.

[0005] Moreover, after the wafer is rotated to shake off the detergent, the surface cannot immediately meet the drying requirements, and the wafer needs to continue to rotate, which greatly prolongs the cleaning time. Summary of the invention

[0006] The technical problem to be solved by the utility model is to provide a wafer surface cleaning carrier, which can effectively collect cleaning agent, avoid the cleaning agent from being retained in the collection bin, and can also improve the drying efficiency of the wafer surface.

[0007] In order to solve the above technical problems, the utility model provides a wafer surface cleaning carrier, including a bottom plate, a collecting bin is arranged on the bottom plate, a vacuum rotating head is arranged on the bottom plate, the bottom of the vacuum rotating head is connected to a power mechanism, the vacuum rotating head is used to adsorb and fix the wafer and drive the wafer to rotate in the collecting bin, the collecting bin includes a conical base, a vertical annular supporting edge is arranged on the outer periphery of the conical base, the conical base and the vertical annular supporting edge cooperate to form a liquid storage tank, a plurality of vacuum tubes are arranged on the liquid storage tank, the vacuum tubes are connected to a vacuum suction device, an upper cover is also arranged on the top of the vertical annular supporting edge, a first avoidance port is arranged on the upper cover, a second avoidance port is arranged on the conical base, the vacuum rotating head is arranged in the collecting bin through the second avoidance port; a hot air pipe is also arranged on the bottom plate, the hot air pipe is arranged between the conical base and the bottom plate, and the hot air pipe supplies hot air to the collecting bin through the second avoidance port.

[0008] Further, a support ring is provided at the bottom of the vertical annular support edge. A limit ring is provided on the bottom plate corresponding to the support ring. The support ring is placed on the bottom plate through the limit ring. The bottom plate, the support ring and the conical base cooperate to form a hot air chamber.

[0009] Further, one end of the hot air pipe is provided with an annular portion, and the annular portion is sleeved on the vacuum rotating head.

[0010] Further, a first pipe joint and a second pipe joint are provided on the bottom plate. The first pipe joint is connected to the vacuum pipe, and the second pipe joint is connected to the hot air pipe.

[0011] Further, it further includes a particle size detector, a ranging sensor or a thickness sensor, and the particle size detector, the ranging sensor or the thickness sensor is provided on the robotic arm.

[0012] Further, an annular isolation plate is provided on the liquid storage tank, and vacuum holes are provided on the annular isolation plate.

[0013] Further, an L-shaped fixing seat is further provided on the bottom plate. The L-shaped fixing seat is provided with an oblong hole and is fixedly connected to the bottom plate by screws. A bent and inclined portion is provided at the top of the L-shaped fixing seat, and a pressing plate is provided on the bent and inclined portion. The bent and inclined portion and the pressing plate cooperate to clamp and fix the hot air pipe.

[0014] Advantages of the present utility model:

[0015] 1. The design of the conical base can effectively collect and drain the cleaning agent dripping from the edge of the wafer surface and the cleaning agent thrown off by rotation into the liquid storage tank, and then suck the cleaning liquid in the liquid storage tank out of the liquid storage tank through the vacuum pipe, ensuring that there will be no excessive cleaning agent staying in the collection chamber to pollute and corrode the components.

[0016] 2. The hot air pipe provides heat during and after the wafer cleaning process to ensure that the wafer surface can be quickly dried and improve the cleaning efficiency. Description of the Drawings

[0017] Figure 1 is the overall structural schematic diagram of the present utility model;

[0018] Figure 2 is the structural schematic diagram of the collection chamber of the present utility model;

[0019] Figure 3 is the structural schematic diagram of the surface of the bottom plate of the present utility model;

[0020] Figure 4 is the present utility model Figure 1 sectional structural schematic diagram;

[0021] Figure 5 It is a schematic structural diagram of the liquid storage tank part of the present utility model;

[0022] Figure 6 It is a schematic structural diagram of the present utility model with a detector. Specific embodiments

[0023] The present utility model will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present utility model and be able to implement it, but the embodiments cited are not intended to limit the present utility model.

[0024] Refer to Figures 1 to 5 As shown, an embodiment of the wafer surface cleaning stage of the present utility model includes a bottom plate 1. A collection bin 2 is provided on the bottom plate, and a vacuum rotating head 3 is provided on the bottom plate. The bottom of the vacuum rotating head is connected to a power mechanism 4. The vacuum rotating head is used to adsorb and fix the wafer and drive the wafer to rotate in the collection bin. The collection bin includes a conical base 5. A vertical annular support edge 6 is provided on the outer periphery of the conical base. The conical base and the vertical annular support edge cooperate to form a liquid storage tank 7. A plurality of vacuum tubes 8 are provided on the liquid storage tank. The vacuum tubes are connected to a vacuum suction device. A top cover 9 is further provided on the top of the vertical annular support edge. A first avoidance opening is provided on the top cover, and a second avoidance opening is provided on the conical base. The vacuum rotating head passes through the second avoidance opening and is arranged in the collection bin.

[0025] The power mechanism can drive the vacuum rotating head to rotate self - sufficiently, so as to achieve the effect of throwing the cleaning agent off the wafer surface. The vacuum rotating head is externally connected to a vacuum to be able to vacuum - adsorb the wafer. The power mechanism is a conventional structure and will not be described in detail. The power mechanism can also have a lifting function. It can drive the top of the vacuum rotating head to protrude above the top of the collection bin, so as to facilitate receiving the wafer. After receiving the wafer, through vacuum adsorption, and then drive the wafer to descend into the collection bin.

[0026] Specifically, during the cleaning process, the wafer is placed on the vacuum rotating head by an external manipulator. The vacuum rotating head adsorbs and fixes the wafer. The cleaning agent is released onto the wafer surface through a pipeline. The wafer rotates to make the cleaning agent cover the entire wafer surface. The cleaning agent can clean the dirt on the wafer surface. During the rotation process, the cleaning agent carrying the dirt is thrown towards the inner wall of the collection bin and enters the liquid storage tank along the inner wall. The liquid storage tank is of an annular structure. Then, the vacuum tubes cooperate with the vacuum suction device to suck away the cleaning agent for recycling, so as to ensure that the liquid level of the cleaning agent in the liquid storage tank will not rise, will not soak and corrode other components, and there is no need to set a sealing mechanism.

[0027] Of course, when the cleaning agent remains on the wafer surface, it can be left standing for a period of time to improve the cleaning effect. At this time, the cleaning agent will flow down from the wafer surface, and the conical base can effectively guide it to the liquid storage tank. The conical base and the vertical annular support edge are an integral structure, avoiding the risk of liquid leakage.

[0028] A hot air duct 10 is also provided on the bottom plate. The hot air duct is arranged between the conical base and the bottom plate. The hot air duct supplies hot air to the collection chamber through the second avoidance opening. During or after the wafer cleaning process, heating the wafer through the hot air duct can effectively improve the cleaning effect and also improve the drying efficiency of the wafer surface, thereby shortening the cleaning time. Of course, in order to provide hot air more stably, an annular portion is provided at one end of the hot air duct. The annular portion is sleeved on the vacuum rotating head, and air outlet holes are opened on the annular portion to achieve the effect of uniform hot air outlet and reduce the air flow disturbance in the collection chamber.

[0029] The above structure can also be used for wafer coating. Specifically, it is a wafer spin coating method. During the spin coating process, the glue liquid is dropped onto the wafer surface, and the wafer rotates, making the glue liquid evenly distributed on the wafer surface. The excess glue liquid will be thrown towards the inner wall of the collection chamber. Since a vacuum is applied in the liquid storage tank, the splashed liquid will gather along the inner wall towards the liquid storage tank. And the air flow direction is from the first avoidance opening along the gap between the wafer and the collection chamber towards the liquid storage tank. The liquid storage tank is located below the wafer spin coating height. Therefore, the thrown glue liquid moves roughly downward due to suction and gravity, reducing or avoiding upward splashing of the glue liquid, thereby ensuring the spin coating quality. And even if there are small particles of glue liquid splashing, they will move towards the liquid storage tank due to the vacuum. When there is a large amount of glue liquid collected in the collection chamber, the collection chamber can be quickly removed for cleaning. A support ring is provided at the bottom of the vertical annular support edge, and a limit ring 11 is provided on the corresponding bottom plate of the support ring to ensure the quickness of disassembly and assembly. For the cleaning of the collection chamber, since the upper cover is a detachable structure, the base structure formed by the conical base and the vertical annular support edge has a large opening, providing a large operating space for manual cleaning. The upper cover and the vertical annular support edge can be connected by screwing or by a rotary snap structure, with simple structure and convenient operation.

[0030] During the spin coating process, the temperature will continuously drop. The hot air duct can play an auxiliary heating effect on the wafer, reducing the rate of temperature drop of the wafer and improving the stability of wafer spin coating. The above-mentioned support ring is placed on the bottom plate through the limit ring. The bottom plate, the support ring and the conical base cooperate to form a hot air chamber, and the hot air flows upward along the second avoidance opening and enters the interior of the collection chamber.

[0031] For the above-mentioned vacuum tube and hot air tube, for the convenience of assembly and use, a first pipe joint 12 and a second pipe joint 13 are provided on the bottom plate. The first pipe joint is connected to the vacuum tube, and then the first pipe joint is connected to the vacuum suction device through a hose. The vacuum suction device is an existing device. The second pipe joint is connected to the hot air tube, and then the second pipe joint is connected to the hot air mechanism through a hose. An annular partition plate 16 is provided on the liquid storage tank, and a vacuum hole 17 is provided on the annular partition plate. The annular partition plate and the liquid storage tank cooperate to form a cavity, improving the vacuum effect, making the vacuum adsorption uniform, and avoiding the problem that the adsorption effect is good near the vacuum tube position and poor far away. While providing uniform vacuum suction, the cleaning agent or glue can also enter through the vacuum hole and flow into the liquid storage tank.

[0032] For the glue spreading operation, the above-mentioned detachable upper cover can facilitate the cleaning of the cured glue on the inner wall of the collection bin. After the upper cover is disassembled, there is a larger operating space.

[0033] When the above-mentioned vacuum tube and the liquid storage tank are installed, a quick connector can be used for connection, which is convenient for disassembly and assembly. However, the hot air tube cannot adopt the installation method of the vacuum tube. In order to prevent the hot air tube from vibrating and moving during air outlet, an L-shaped fixing seat 18 is also provided on the bottom plate. An oblong hole 19 is provided on the L-shaped fixing seat and is locked and connected to the bottom plate by screws. A bent and inclined part 20 is provided at the top of the L-shaped fixing seat, and a pressing plate 21 is provided on the bent and inclined part. The bent and inclined part and the pressing plate cooperate to clamp and fix the hot air tube. The hot air tube at the clamping position can be made of metal to ensure the clamping effect. The bent and inclined part can provide an inclined upward setting position for the hot air tube, so as to ensure that the air outlet position of the hot air tube faces the second avoidance port; the oblong hole provided on the L-shaped fixing seat can provide adjustment of the installation position of the L-shaped fixing seat, facilitating the adjustment of the end position of the hot air tube.

[0034] In an embodiment, referring to Figure 6 As shown, after the cleaning is completed, in order to quickly know the cleaning effect, a particle size detector 14 is also provided. The particle size detector is provided on the robotic arm 15. The robotic arm can drive the particle size detector to move above or away from the first avoidance port to detect the cleaning effect of the wafer surface. The robotic arm includes a rotating motor, the rotating motor is connected to a vertically arranged rotating rod, a mounting plate is horizontally clamped on the rotating rod, and the end of the mounting plate is fixed to the particle size detector. When the rotating motor rotates, it drives the rotating rod to rotate self, and the rotation of the rotating rod drives the mounting plate to swing. The swinging of the mounting plate can drive the particle size detector to rotate and move horizontally to ensure a moving effect when avoidance is needed.

[0035] If the spin coating operation is carried out using this structure, after the spin coating of the wafer is completed, the thickness of the colloid on the surface needs to be measured. Generally, a separate measuring device is used. However, during the transfer and measurement process, a large amount of time will be wasted and contamination will also be caused. Therefore, based on the above spin coating stage, according to different usage scenarios, the particle size detector can also be replaced by a distance measuring sensor or a thickness measuring sensor.

[0036] The above embodiments are only preferred embodiments given to fully illustrate the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present invention are within the protection scope of the present invention.

Claims

1. A wafer surface cleaning stage, characterized in that: It includes a bottom plate, a collecting bin is arranged on the bottom plate, a vacuum rotating head is arranged on the bottom plate, the bottom of the vacuum rotating head is connected to a power mechanism, the vacuum rotating head is used for adsorbing and fixing the wafer and driving the wafer to rotate in the collecting bin, the collecting bin includes a conical base, a vertical annular supporting edge is arranged on the outer periphery of the conical base, the conical base and the vertical annular supporting edge cooperate to form a liquid storage tank, a plurality of vacuum tubes are arranged on the liquid storage tank, an upper cover is also arranged on the top of the vertical annular supporting edge, a first avoidance port is arranged on the upper cover, a second avoidance port is arranged on the conical base, the vacuum rotating head is arranged in the collecting bin through the second avoidance port, a hot air pipe is also arranged on the bottom plate, the hot air pipe is arranged between the conical base and the bottom plate, and the hot air pipe supplies hot air to the collecting bin through the second avoidance port.

2. The wafer surface cleaning stage according to claim 1, characterized in that: A support ring is arranged at the bottom of the vertical annular support edge, a limiting ring is arranged on the bottom plate corresponding to the support ring, the support ring is placed on the bottom plate through the limiting ring, and the bottom plate, the support ring and the conical base cooperate to form a hot air chamber.

3. The wafer surface cleaning stage according to claim 1, characterized in that: One end of the hot air pipe is provided with an annular portion, and the annular portion is sleeved on the vacuum rotating head.

4. The wafer surface cleaning stage according to claim 2, characterized in that: The bottom plate is provided with a first pipe joint and a second pipe joint, the first pipe joint is connected to the vacuum pipe, and the second pipe joint is connected to the hot air pipe.

5. The wafer surface cleaning stage according to claim 1, characterized in that: It also includes a particle size detector, a distance sensor or a thickness sensor, and the particle size detector, the distance sensor or the thickness sensor is arranged on the mechanical arm.

6. The wafer surface cleaning stage according to claim 1, characterized in that: The liquid storage tank is provided with an annular isolation plate, and the annular isolation plate is provided with a vacuum hole.

7. The wafer surface cleaning stage according to claim 1, characterized in that: An L-shaped fixing seat is also provided on the bottom plate, an oblong hole is provided on the L-shaped fixing seat and is locked and connected to the bottom plate by screws, a bending inclined portion is provided on the top of the L-shaped fixing seat, a pressure plate is provided on the bending inclined portion, and the bending inclined portion cooperates with the pressure plate to clamp and fix the hot air pipe.

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