Packaging structure and display device

Abstract

The utility model provides a packaging structure and a display device, the packaging structure comprises a substrate, a plurality of light-emitting chips, a bottom film and a surface film, the plurality of light-emitting chips are arranged on the substrate at intervals, the bottom film is filled in gaps among the plurality of light-emitting chips, the bottom film at least comprises a first black adhesive layer, and the surface film is arranged on the substrate. The first black adhesive layer is filled in gaps among the plurality of light-emitting chips, the surface film is stacked on one side, deviating from the substrate, of the bottom film, the surface film at least comprises a second black adhesive layer, and the second black adhesive layer covers the light-emitting chips. According to the packaging structure and the display device provided by the utility model, through the structural arrangement of the double black adhesive layers, the problems that pits are caused by light reflection of a sapphire on the top surface of a light-emitting chip and black difference is generated due to non-uniform lamination of the black adhesive layers in the prior art are solved.

Description

Technical Field

[0001] The utility model relates to display device related technologies, in particular to a packaging structure and a display device. Background Art

[0002] At present, the mainstream improvement direction of the packaging structure of display devices on the market is to set a mask at the bottom of the light-emitting chip and the surface of the substrate, that is, to set a layer of black glue below the top surface of the light-emitting chip to cover the defects of the light board through the black glue layer and conceal the defects such as offset and tilt that may occur in the light-emitting chip.

[0003] However, after long-term accumulation of process experience and market feedback, it was found that in display devices, the sapphire reflection on the top surface of the light-emitting chip would cause pitting; and the black glue layer below the top surface of the light-emitting chip would also produce black differences due to uneven pressing. Utility Model Content

[0004] The main purpose of the utility model is to provide a packaging structure and a display device to solve the problems in the prior art that the sapphire reflection on the top surface of the light-emitting chip causes pitting and the black color difference of the black glue layer due to uneven pressing.

[0005] In order to achieve the above-mentioned purpose, according to one aspect of the utility model, a packaging structure is provided, which includes a substrate and a plurality of light-emitting chips spaced apart on the substrate; a base film, which fills the gaps between the plurality of light-emitting chips, and the base film includes at least a first black glue layer; a face mask, which is stacked on a side of the base film away from the substrate, and the face mask includes at least a second black glue layer, and the second black glue layer covers the light-emitting chips.

[0006] Furthermore, the face mask and the base film further include a light-transmitting adhesive layer disposed between the first black adhesive layer and the second black adhesive layer, and at least a portion of the light-transmitting adhesive layer covers the light-emitting chip.

[0007] Furthermore, the light-transmitting adhesive layer includes a first translucent adhesive layer, at least a portion of the first translucent adhesive layer fills the gaps between the plurality of light-emitting chips, and the first translucent adhesive layer is stacked on the side of the first black adhesive layer facing away from the substrate; a second transparent adhesive layer, the second transparent adhesive layer covers the light-emitting chip and is stacked on the side of the first translucent adhesive layer facing away from the substrate; a second translucent adhesive layer, the second translucent adhesive layer is stacked on the side of the second transparent adhesive layer facing away from the substrate, and the second black adhesive layer is stacked on the side of the second translucent adhesive layer facing away from the substrate.

[0008] Furthermore, the first translucent adhesive layer and the second translucent adhesive layer are made of the same material.

[0009] Furthermore, the thickness of the second translucent adhesive layer is not less than the thickness of the second transparent adhesive layer and the second black adhesive layer.

[0010] Further, the bottom surface of the second transparent adhesive layer is flush with the top surface of the light-emitting chip; or a part of the light-emitting chip extends into the interior of the second transparent adhesive layer.

[0011] Further, the bottom film further includes a first semi-transparent adhesive layer of a light-transmitting adhesive layer. At least a part of the first semi-transparent adhesive layer fills the gaps between the plurality of light-emitting chips. The first semi-transparent adhesive layer is stacked on the side of the first black adhesive layer away from the substrate, and the top film is stacked on the side of the first semi-transparent adhesive layer away from the substrate.

[0012] Further, the bottom film further includes a first transparent adhesive layer. The first transparent adhesive layer fills the gaps between the plurality of light-emitting chips. The first transparent adhesive layer is disposed between the substrate and the first black adhesive layer.

[0013] Further, the top film further includes a second transparent adhesive layer and a second semi-transparent adhesive layer of a light-transmitting adhesive layer. The second transparent adhesive layer covers the light-emitting chips and is stacked on the side of the bottom film away from the substrate. The second semi-transparent adhesive layer is stacked on the side of the second transparent adhesive layer away from the substrate. The second black adhesive layer is stacked on the side of the second semi-transparent adhesive layer away from the substrate.

[0014] Further, the first black adhesive layer and the second black adhesive layer are made of the same material.

[0015] Further, the top film further includes a coating for anti-reflection and anti-glare. The coating is disposed on the side of the second black adhesive layer away from the substrate.

[0016] According to another aspect of the present invention, a display device is provided. The display device includes the above-mentioned encapsulation structure.

[0017] Applying the technical solution of the present invention, the encapsulation structure includes a substrate, a plurality of light-emitting chips, a bottom film, and a top film. The plurality of light-emitting chips are spaced apart on the substrate. The bottom film fills the gaps between the plurality of light-emitting chips. The bottom film at least includes a first black adhesive layer. The first black adhesive layer fills the gaps between the plurality of light-emitting chips. The top film is stacked on the side of the bottom film away from the substrate. The top film at least includes a second black adhesive layer. The second black adhesive layer covers the light-emitting chips.

[0018] Wherein, the top film is used to cover the bottom film and the plurality of light-emitting chips.

[0019] In this application, by providing a top film with a second black adhesive layer, not only the structure of the first black adhesive layer covering the substrate is retained, but also the structure of the second black adhesive layer is added, thereby realizing the formation of a double black adhesive layer structure in which the first black adhesive layer and the second black adhesive layer cooperate. The second black adhesive layer has the effect of covering the defects of the first black adhesive layer and the sapphire reflection effect on the top surface of the light-emitting chip, so as to weaken the moire effect in sequence and is beneficial to improving the black consistency effect.

[0020] In this application, a coating is provided on the side of the second black glue layer facing away from the substrate, which is beneficial for anti-reflection and anti-glare, and can also protect the second black glue layer, improving the wear and stain resistance of the mask.

[0021] In this application, a first transparent glue layer is provided between the substrate and the first black glue layer, which is beneficial for providing a flat mounting surface for the first black glue layer, and the setting of the first transparent glue layer is also beneficial for improving the mounting stability of the first black glue layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings forming a part of this application are used to provide a further understanding of the present utility model. The schematic embodiments and descriptions thereof of the present utility model are used to explain the present utility model and do not constitute an improper limitation of the present utility model. In the drawings:

[0023] Figure 1 A schematic structural diagram of the substrate and the light-emitting chip of the present utility model is shown;

[0024] Figure 2 A schematic structural diagram of the bottom film of the present utility model is shown;

[0025] Figure 3 A schematic structural diagram of the cooperation and installation of the bottom film, the light-emitting chip and the substrate of the present utility model is shown;

[0026] Figure 4 A schematic structural diagram of the mask of the present utility model is shown;

[0027] Figure 5 A schematic structural diagram of the cooperation and installation of the bottom film, the mask, the light-emitting chip and the substrate of the present utility model is shown.

[0028] Among them, the above-mentioned drawings include the following reference numerals:

[0029] 10, lamp board; 11, substrate; 12, light-emitting chip; 20, bottom film; 21, top protective film; 22, first semi-transparent glue layer; 23, first black glue layer; 24, first transparent glue layer; 25, bottom protective film; 30, mask; 31, first protective film structure; 32, coating; 33, second black glue layer; 34, second semi-transparent glue layer; 35, second transparent glue layer; 36, second protective film structure. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] It should be noted that, without conflict, the embodiments in this application and the features in the embodiments can be combined with each other. The following will refer to the drawings and combine the embodiments to detail the present utility model.

[0031] It should be pointed out that unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs.

[0032] In the present utility model, unless otherwise specified, the orientation terms such as "upper, lower, top, bottom" are generally in reference to the direction shown in the drawings, or in reference to the vertical, perpendicular or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner, outer" refer to the inner and outer of the contour of each component itself, but the above orientation terms do not limit the present utility model.

[0033] Embodiment 1

[0034] In order to solve the problems in the prior art that the top surface sapphire reflection of the light-emitting chip causes pitting and the black glue layer has black differences due to uneven pressing, the present embodiment provides a packaging structure.

[0035] As Figures 1 to 5 shown, the packaging structure includes a substrate 11, a plurality of light-emitting chips 12, a bottom film 20 and a top film 30. The plurality of light-emitting chips 12 are arranged at intervals on the substrate 11 to form a lamp board 10. The bottom film 20 is filled in the gaps between the plurality of light-emitting chips 12. The bottom film 20 at least includes a first black glue layer 23, and the first black glue layer 23 is filled in the gaps between the plurality of light-emitting chips 12. The top film 30 is stacked on the side of the bottom film 20 away from the substrate 11. The top film 30 at least includes a second black glue layer 33, and the second black glue layer 33 covers the light-emitting chips 12.

[0036] Among them, the top film 30 is used to cover the bottom film 20 and the plurality of light-emitting chips 12, so as to realize that the second black glue layer 33 covers the first black glue layer 23 and the light-emitting chips 12.

[0037] Specifically, by providing the top film 30 with the second black glue layer 33 in the present application, not only the structure of the first black glue layer 23 covering the substrate 11 is retained, but also the structure of the second black glue layer 33 is added, so as to realize the formation of a double black glue layer structure in which the first black glue layer 23 and the second black glue layer 33 cooperate. The second black glue layer 33 has the effect of covering the defects of the first black glue layer 23 and the sapphire reflection effect on the top surface of the light-emitting chip 12, so as to weaken the pitting effect and improve the black uniformity.

[0038] Furthermore, the addition of the second black glue layer 33 in the top film 30 can completely cover the unevenness formed by the light-emitting chip 12 protruding from the bottom film 20, and improve the flatness and integrity of the black appearance of the product.

[0039] It should be noted that the first black glue layer 23 and the second black glue layer 33 are made of the same material. The first black glue layer 23 and the second black glue layer 33 both include a colloid and carbon black particles disposed inside the colloid. The light transmittance of the first black glue layer 23 and the second black glue layer 33 is adjusted by adjusting the thickness, that is, the greater the thickness of the first black glue layer 23 and the second black glue layer 33, the smaller the light transmittance. The first black glue layer 23 and the second black glue layer 33 can be changed into a molten state under conditions such as high temperature or high pressure.

[0040] It can be understood that if the thicknesses of the first black glue layer 23 and the second black glue layer 33 are too small, there will be no concealer effect. If the thickness of the first black glue layer 23 is too large, it will be difficult to ensure that the light-emitting chip 12 can be ejected from the bottom film 20. If the thickness of the second black glue layer 33 is too large, the brightness of the light-emitting chip 12 will be severely lost. Therefore, in setting the thicknesses of the first black glue layer 23 and the second black glue layer 33, an adaptable setting can be made according to the height of the light-emitting chip 12 and the overall requirements of the bottom film 20 and the top film 30.

[0041] In this embodiment, a light-transmitting glue layer is provided between the first black glue layer 23 and the second black glue layer 33, and at least a part of the light-transmitting glue layer covers the light-emitting chip 12. The light-transmitting glue layer can be formed by the cooperation of the top film 30 and the bottom film 20.

[0042] Among them, the light-transmitting glue layer includes a first semi-transparent glue layer 22, a second transparent glue layer 35, and a second semi-transparent glue layer 34. At least a part of the first semi-transparent glue layer 22 is filled in the gaps between the plurality of light-emitting chips 12, and the first semi-transparent glue layer 22 is stacked on the side of the first black glue layer 23 away from the substrate 11; the second transparent glue layer 35 covers the light-emitting chip 12 and is stacked on the side of the first semi-transparent glue layer 22 away from the substrate 11; the second semi-transparent glue layer 34 is stacked on the side of the second transparent glue layer 35 away from the substrate 11, and the second black glue layer 33 is stacked on the side of the second semi-transparent glue layer 34 away from the substrate 11. The light-transmitting glue layer is structured with the first semi-transparent glue layer 22, the second transparent glue layer 35, and the second semi-transparent glue layer 34, which is beneficial to avoiding the phenomena of screen color distortion and stippling caused by the first black glue layer 23 covering the top of the light-emitting chip 12; at the same time, it can also refract the light emitted by the light-emitting chip 12, playing a role in dispersing the light source and softening the light.

[0043] It should be further explained that the specific number of the plurality of light-emitting chips 12 in this application can be adaptively set, and there is no limitation on the arrangement manner of the plurality of light-emitting chips 12 here. It can be set in an array of N rows and M columns, or it can be a light bar, arranged in a single row. The specific arrangement manner is adjusted according to the actual situation. Specifically, N is a positive integer such as 1, 2, 3, etc., M is a positive integer such as 1, 2, 3, etc., and the values of N and M are determined according to the actual situation, and can be the same or different, and there is no limitation here.

[0044] In a specific implementation manner of this embodiment, asFigure 1 As shown, the light-emitting chip 12 has a single-row structure, and there are 15 light-emitting chips 12 provided.

[0045] As Figure 2 and Figure 3 shown, the bottom film 20 further includes a first semi-transparent adhesive layer 22 of a light-transmitting adhesive layer. At least a part of the first semi-transparent adhesive layer 22 is filled in the gaps between the plurality of light-emitting chips 12. The first semi-transparent adhesive layer 22 is stacked on the side of the first black adhesive layer 23 facing away from the substrate 11, and the top film 30 is stacked on the side of the first semi-transparent adhesive layer 22 facing away from the substrate 11.

[0046] Among them, the first semi-transparent adhesive layer 22 is a fog layer. The light transmittance of the first semi-transparent adhesive layer 22 is greater than that of the first black adhesive layer 23. The first semi-transparent adhesive layer 22 includes a colloid and diffusion particles provided inside the colloid.

[0047] Specifically, the first semi-transparent adhesive layer 22 is used to press the first black adhesive layer 23 so that the first black adhesive layer 23 presses the substrate 11; at the same time, the first semi-transparent adhesive layer 22 avoids the phenomenon of screen blooming and pitting caused by the first black adhesive layer 23 covering the top of the light-emitting chip 12; at the same time, the diffusion particles inside the first semi-transparent adhesive layer 22 refract the light emitted by the light-emitting chip 12, playing a role in dispersing the light source and softening the light.

[0048] It can be understood that the first black adhesive layer 23 is filled in the gaps between the plurality of light-emitting chips 12, and the thickness of the first black adhesive layer 23 is less than the height of the light-emitting chip 12.

[0049] Furthermore, the first semi-transparent adhesive layer 22 is lower than the top surface of the light-emitting chip 12 so that the top surfaces of the light-emitting chips 12 can all push out the first semi-transparent adhesive layer 22.

[0050] It should be noted that when the total height of the first black adhesive layer 23 and the first semi-transparent adhesive layer 22 remains unchanged, the respective thicknesses of the first black adhesive layer 23 and the first semi-transparent adhesive layer 22 can be adaptively set according to the actual situation of the light-emitting chip 12.

[0051] In this embodiment, the bottom film 20 further includes a first transparent adhesive layer 24. The first transparent adhesive layer 24 is filled in the gaps between the plurality of light-emitting chips 12, and the first transparent adhesive layer 24 is provided between the substrate 11 and the first black adhesive layer 23. By providing the first transparent adhesive layer 24 between the substrate 11 and the first black adhesive layer 23, it is beneficial to provide a flat mounting surface for the first black adhesive layer 23, thereby improving the flatness of the installation of the first black adhesive layer 23; at the same time, the setting of the first transparent adhesive layer 24 is used to bond the substrate 11 and the first black adhesive layer 23, which is beneficial to improving the installation stability of the first black adhesive layer 23.

[0052] As Figure 4 and Figure 5As shown, the facial mask 30 further includes a second transparent adhesive layer 35 and a second semi-transparent adhesive layer 34 of a light-transmitting adhesive layer. The second transparent adhesive layer 35 covers the light-emitting chip 12 and is stacked on the side of the bottom film 20 facing away from the substrate 11. The second semi-transparent adhesive layer 34 is stacked on the side of the second transparent adhesive layer 35 facing away from the substrate 11. The second black adhesive layer 33 is stacked on the side of the second semi-transparent adhesive layer 34 facing away from the substrate 11.

[0053] Specifically, the second transparent adhesive layer 35 functions to support and connect the second semi-transparent adhesive layer 34, which is beneficial to ensuring the flatness of the second semi-transparent adhesive layer 34 and the stability of the installation of the second semi-transparent adhesive layer 34. At the same time, the second transparent adhesive layer 35 serves as an adhesive layer for bonding and fixing with the bottom film 20, thereby improving the stability of the installation of the facial mask 30.

[0054] Furthermore, the second semi-transparent adhesive layer 34 covers the side of the light-emitting chip 12 and the first black adhesive layer 23 facing away from the substrate 11, which is beneficial to refracting the light emitted by the light-emitting chip 12, playing a role in dispersing the light source and softening the light.

[0055] Furthermore, the thickness of the second semi-transparent adhesive layer 34 is not less than the thicknesses of the second transparent adhesive layer 35 and the second black adhesive layer 33. The second semi-transparent adhesive layer 34 can adjust the light transmittance through its thickness. In this application, by setting the second semi-transparent adhesive layer 34 with a larger thickness, it is beneficial to achieve softening the light through the second semi-transparent adhesive layer 34. At the same time, the second semi-transparent adhesive layer 34 with a larger thickness also has the technical effect of improving the stable pressing of the facial mask 30 on the bottom film 20. At the same time, since the light transmittance of the second transparent adhesive layer 35 is greater than that of the second black adhesive layer 33, in this application, the second transparent adhesive layer 35 is used for initially covering the first black adhesive layer 23 and the light-emitting chip 12 and softening the light, and the second black adhesive layer 33 is used for further covering the first black adhesive layer 23 and the light-emitting chip 12 to achieve an improved covering effect and avoid the occurrence of problems such as screen blooming and pitting caused by the first black adhesive layer 23 covering the top of the light-emitting chip 12.

[0056] It can be understood that the thickness between the second semi-transparent adhesive layer 34 and the second black adhesive layer 33 can be adaptively set according to needs. Under the condition that the total height of the second semi-transparent adhesive layer 34 and the second black adhesive layer 33 remains unchanged, the thickness between the two can be adjusted according to the need for light transmittance.

[0057] Furthermore, the bottom surface of the second transparent adhesive layer 35 is flush with the top surface of the light-emitting chip 12. At this time, there is no interference fit between the second transparent adhesive layer 35 and the light-emitting chip 12, and the installation of the second transparent adhesive layer 35 can be completed by directly bonding the second transparent adhesive layer 35 to the bottom film 20.

[0058] It should be noted that when the top surface of the light-emitting chip 12 protrudes from the bottom film 20, when the second transparent adhesive layer 35 is disposed on the bottom film 20, a part of the light-emitting chip 12 extends into the interior of the second transparent adhesive layer 35. The top surface of the light-emitting chip 12 extending into the interior of the second transparent adhesive layer 35 is conducive to improving the connection stability between the second transparent adhesive layer 35 and the light-emitting chip 12, and further improving the fastening property of the installation of the facial mask 30.

[0059] In this embodiment, the second transparent adhesive layer 35 is bonded to the top surface of the first semi-transparent adhesive layer 22, and the second transparent adhesive layer 35 is bonded to the side of the first semi-transparent adhesive layer 22 facing away from the substrate 11. The first semi-transparent adhesive layer 22 and the second semi-transparent adhesive layer 34 are made of the same material. Both the first semi-transparent adhesive layer 22 and the second semi-transparent adhesive layer 34 include a colloid and diffusion particles disposed inside the colloid for reflecting light. The light transmittance of the first semi-transparent adhesive layer 22 and the second semi-transparent adhesive layer 34 is adjusted by adjusting the thickness, that is, the greater the thickness of the first semi-transparent adhesive layer 22 and the second semi-transparent adhesive layer 34, the smaller the light transmittance. The first semi-transparent adhesive layer 22 and the second semi-transparent adhesive layer 34 can be changed into a molten state under conditions such as high temperature or high pressure.

[0060] As Figure 4 and Figure 5 shown, the facial mask 30 further includes a coating 32 disposed on the side of the second black adhesive layer 33 facing away from the substrate 11. The coating 32 is used for anti-reflection and anti-glare. Adopting the coating 32 disposed on the side of the second black adhesive layer 33 facing away from the substrate 11 is conducive to anti-reflection and anti-glare, and can also achieve the technical effect of protecting the second black adhesive layer 33, improving the wear resistance and stain resistance of the facial mask 30, and facilitating the cleaning of stains, fingerprints and other dirty marks on the surface of the product in the later stage.

[0061] Specifically, the coating 32 can be an AG / AR composite coating 32, and of course it can also be other light-transmitting coatings 32 with anti-reflection and anti-glare functions.

[0062] Furthermore, disposing the coating 32 on the second black adhesive layer 33 is conducive to improving the overall strength of the second black adhesive layer 33, and also avoids the direct contact of the external environment with the second black adhesive layer 33, thereby avoiding scratches during the installation and use of the product, resulting in damage to the second black adhesive layer 33. The setting of the coating 32 can achieve the protection of the second black adhesive layer 33.

[0063] Furthermore, the facial mask 30 further includes a first protective film structure 31 disposed on the side of the coating 32 facing away from the substrate 11 and a second protective film structure 36 disposed on the side of the second transparent adhesive layer 35 facing away from the second black adhesive layer 33. When the facial mask 30 needs to be stacked with the bottom film 20 for installation, the second protective film structure 36 is torn off, and the first protective film structure 31 is torn off after the installation of the facial mask 30 is completed.

[0064] In this embodiment, the installation of the bottom film 20 and the surface film 30 includes the following steps.

[0065] S1: Prepare a substrate 11 having a plurality of light-emitting chips 12, a surface film 30 for preparing a composite adhesive layer, and a bottom film 20;

[0066] S2: Press the bottom film 20 onto the top surface of the light-emitting chips 12, and fill the inside of the gaps between the plurality of light-emitting chips 12 with the bottom film 20 by sequentially melting and softening the first transparent adhesive layer 24, the first black adhesive layer 23, and the first semi-transparent adhesive layer 22;

[0067] S3: Preliminarily cure the bottom film 20;

[0068] S4: Stack the surface film 30 on the bottom film 20, and bond and fix the bottom film 20 and the light-emitting chips 12 by softening the second transparent adhesive layer 35;

[0069] S5: Cure the bottom film 20 and the surface film 30.

[0070] Among them, the steps in S2 specifically include the following steps.

[0071] S21: Tear off the bottom protective film 25 on the bottom film 20;

[0072] S22: Press the bottom film 20 in a direction perpendicular to the substrate 11 under high temperature or high pressure. During the pressing process, the first transparent adhesive layer 24 is in a molten fluid state and fills the gaps between the light-emitting chips 12 and adheres to the substrate 11; subsequently, the first black adhesive layer 23 is in a molten fluid state and fills the gaps between the light-emitting chips 12; at this time, the first semi-transparent adhesive layer 22 presses down on the first black adhesive layer 23 to eject the first black adhesive layer 23 by the light-emitting chips 12; finally, the second semi-transparent adhesive layer 34 fills the gaps between the ejected light-emitting chips 12.

[0073] S23: Tear off the top protective film 21 on the bottom film 20.

[0074] Embodiment Two

[0075] This embodiment provides a display device, and the display device includes the encapsulation structure in Embodiment One.

[0076] From the above description, it can be seen that the above embodiments of the present utility model achieve the following technical effects:

[0077] 1. By providing the facial mask 30 with the second black glue layer 33, the present application not only retains the structure of the first black glue layer 23 covering the substrate 11, but also adds the structure of the second black glue layer 33, thereby realizing the formation of a double black glue layer structure in which the first black glue layer 23 and the second black glue layer 33 cooperate. The second black glue layer 33 has the effect of covering the defects of the first black glue layer 23 and the sapphire reflection effect on the top surface of the light-emitting chip 12, so as to weaken the pitting effect in sequence and is beneficial to improving the black consistency effect.

[0078] 2. The present application adopts the coating 32 provided on the side of the second black glue layer 33 facing away from the substrate 11, which is beneficial to anti-reflection and anti-glare, and can also play a technical role in protecting the second black glue layer 33, improving the wear resistance and stain resistance of the facial mask 30.

[0079] 3. The present application adopts the first transparent glue layer 24 provided between the substrate 11 and the first black glue layer 23, which is beneficial to providing a flat mounting surface for the first black glue layer 23. At the same time, the setting of the first transparent glue layer 24 is also beneficial to improving the mounting stability of the first black glue layer 23.

[0080] Obviously, the above-described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0081] It should be noted that the terms used herein are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0082] It should be noted that the terms "first", "second", etc. in the description, claims and drawings of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0083] The above are only the preferred embodiments of the present utility model, and are not used to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A packaging structure, characterized in that: include: A substrate (11) and a plurality of light-emitting chips (12) arranged at intervals on the substrate (11); A base film (20), the base film (20) filling the gaps between the plurality of light-emitting chips (12), the base film (20) comprising at least a first black glue layer (23); A mask (30), the mask (30) being stacked on a side of the base film (20) facing away from the substrate (11), the mask (30) comprising at least a second black glue layer (33), the second black glue layer (33) covering the light-emitting chip (12); The face mask (30) and the base film (20) further include a light-transmitting adhesive layer disposed between the first black adhesive layer (23) and the second black adhesive layer (33), and at least a portion of the light-transmitting adhesive layer covers the light-emitting chip (12).

2. The packaging structure according to claim 1, characterized in that: The light-transmitting adhesive layer comprises: a first semi-transparent adhesive layer (22), at least a portion of which fills the gaps between the plurality of light-emitting chips (12), and the first semi-transparent adhesive layer (22) is stacked on a side of the first black adhesive layer (23) facing away from the substrate (11); a second transparent adhesive layer (35), the second transparent adhesive layer (35) covering the light-emitting chip (12) and being stacked on a side of the first semi-transparent adhesive layer (22) facing away from the substrate (11); A second translucent adhesive layer (34), the second translucent adhesive layer (34) is stacked on a side of the second transparent adhesive layer (35) facing away from the substrate (11), and the second black adhesive layer (33) is stacked on a side of the second translucent adhesive layer (34) facing away from the substrate (11).

3. The packaging structure according to claim 2, characterized in that: The first translucent adhesive layer (22) and the second translucent adhesive layer (34) are made of the same material.

4. The packaging structure according to claim 2, characterized in that: The thickness of the second translucent adhesive layer (34) is not less than the thickness of the second transparent adhesive layer (35) and the second black adhesive layer (33).

5. The packaging structure according to claim 2, characterized in that: The bottom surface of the second transparent adhesive layer (35) is flush with the top surface of the light-emitting chip (12); or A portion of the light emitting chip (12) extends into the interior of the second transparent adhesive layer (35).

6. The packaging structure according to claim 1, characterized in that: The base film (20) also includes a first translucent adhesive layer (22) of the light-transmitting adhesive layer, at least a portion of the first translucent adhesive layer (22) fills the gaps between the plurality of light-emitting chips (12), the first translucent adhesive layer (22) is stacked on a side of the first black adhesive layer (23) facing away from the substrate (11), and the surface film (30) is stacked on a side of the first translucent adhesive layer (22) facing away from the substrate (11).

7. The packaging structure according to claim 1, characterized in that: The base film (20) further comprises a first transparent adhesive layer (24), wherein the first transparent adhesive layer (24) fills the gaps between the plurality of light-emitting chips (12), and the first transparent adhesive layer (24) is arranged between the substrate (11) and the first black adhesive layer (23).

8. The packaging structure according to claim 1, characterized in that: The mask (30) further comprises a second transparent adhesive layer (35) and a second translucent adhesive layer (34) of the light-transmitting adhesive layer, wherein the second transparent adhesive layer (35) covers the light-emitting chip (12) and is stacked on a side of the base film (20) facing away from the substrate (11), the second translucent adhesive layer (34) is stacked on a side of the second transparent adhesive layer (35) facing away from the substrate (11), and the second black adhesive layer (33) is stacked on a side of the second translucent adhesive layer (34) facing away from the substrate (11).

9. The packaging structure according to any one of claims 1 to 8, characterized in that: The first black glue layer (23) and the second black glue layer (33) are made of the same material.

10. The packaging structure according to any one of claims 1 to 8, characterized in that: The mask (30) further comprises a coating (32) for preventing reflection and glare, wherein the coating (32) is arranged on a side of the second black glue layer (33) facing away from the substrate (11).

11. A display device, characterized in that: The display device comprises the packaging structure according to any one of claims 1 to 10.

Images