Ceramic induction card

Abstract

The utility model discloses a ceramic induction card, which relates to the technical field of induction cards and comprises an upper ceramic substrate, a lower ceramic substrate and a flexible PCB (printed circuit board). A PCB groove is concavely formed in the upper surface of the lower ceramic substrate, and the lower surface of the upper ceramic substrate is adhered to the upper surface of the lower ceramic substrate so as to seal the PCB groove; the flexible PCB is in a ring shape, the flexible PCB is embedded in the PCB groove, an induction line is printed on the flexible PCB, and the induction line surrounds the flexible PCB to form a ring-shaped induction coil. The induction line is prevented from moving, and the situation that the induction effect of the induction card is weakened is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of induction cards, and particularly relates to a ceramic induction card. Background Art

[0002] In the current ceramic induction card, the induction wire is a copper wire, and the induction coil is composed of a plurality of annular induction wires stacked together. During induction use, the induction wire is likely to move inside the induction card, resulting in a weakened induction effect of the induction card. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a ceramic induction card, which overcomes the above defects and can prevent the displacement of the induction wire, thereby preventing the weakening of the induction effect of the induction card.

[0004] To achieve the above purpose, the solution of the utility model is as follows:

[0005] A ceramic induction card includes an upper ceramic substrate, a lower ceramic substrate, and a flexible PCB board; a PCB board groove is recessed on the upper surface of the lower ceramic substrate, and the lower surface of the upper ceramic substrate is bonded to the upper surface of the lower ceramic substrate to seal the PCB board groove; the flexible PCB board is in a ring shape, and the flexible PCB board is embedded in the PCB board groove, and an induction wire is printed on the flexible PCB board, and the induction wire forms a ring-shaped induction coil along the flexible PCB board.

[0006] Further, a first stabilizing layer is provided on the upper surface of the upper ceramic substrate, and a second stabilizing layer is provided on the lower surface of the lower ceramic substrate. Both the first stabilizing layer and the second stabilizing layer are made of hard materials.

[0007] Further, a first shock-absorbing layer is provided on the upper surface of the first stabilizing layer, and a second shock-absorbing layer is provided on the lower surface of the second stabilizing layer. Both the first shock-absorbing layer and the second shock-absorbing layer are made of flexible materials.

[0008] Further, a protrusion is provided on the lower surface of the upper ceramic substrate, and a limiting groove is recessed on the upper surface of the lower ceramic substrate. The limiting groove is used to place glue and for the protrusion to be embedded, so as to bond the upper ceramic substrate and the lower ceramic substrate together.

[0009] After adopting the above scheme, the beneficial effect of the utility model is as follows:

[0010] In the utility model, the flexible PCB board is in a ring shape, and the flexible PCB board is embedded in the PCB board groove, and an induction wire is printed on the flexible PCB board, and the induction wire forms a ring-shaped induction coil along the flexible PCB board to prevent the movement of the induction coil, avoid the change of the induction position, and the induction coil is formed by the induction wire winding along the flexible PCB board, preventing the displacement of the induction wire and avoiding the weakening of the induction effect of the induction card. Brief Description of the Drawings

[0011] Figure 1 is the exploded view of the overall structure of the present utility model;

[0012] Figure 2 is Figure 1 the enlarged view of part A of

[0013] Figure 3 the side view of the upper ceramic substrate of the present utility model.

[0014] Reference Numeral Description: 10, upper ceramic substrate; 11, first stabilizing layer; 12, first shock-absorbing layer; 13, protrusion; 20, lower ceramic substrate; 21, PCB board groove; 22, second stabilizing layer; 23, second shock-absorbing layer; 24, limiting groove; 30, flexible PCB board; 31, induction wire; 32, induction coil. Detailed Embodiment

[0015] The following will make a detailed description of the present utility model in conjunction with the drawings and specific embodiments.

[0016] As Figures 1 to 3 shown, the present utility model provides a ceramic induction card, which includes an upper ceramic substrate 10, a lower ceramic substrate 20, and a flexible PCB board 30;

[0017] Among them, a PCB board groove 21 is recessed on the upper surface of the lower ceramic substrate 20, and the lower surface of the upper ceramic substrate 10 is bonded to the upper surface of the lower ceramic substrate 20 to seal the PCB board groove 21; the flexible PCB board 30 is in a ring shape, and the flexible PCB board 30 is embedded in the PCB board groove 21, and an induction wire 31 is printed on the flexible PCB board 30, and the induction wire 31 forms a ring-shaped induction coil 32 along the flexible PCB board 30 to prevent the induction coil 32 from moving, avoiding the change of the induction position, and the induction coil 32 is formed by the induction wire 31 winding along the flexible PCB board 30, preventing the induction wire 31 from shifting and avoiding the weakening of the induction effect of the induction card.

[0018] Furthermore, a first stabilizing layer 11 is provided on the upper surface of the upper ceramic substrate 10, and a second stabilizing layer 22 is provided on the lower surface of the lower ceramic substrate 20. Both the first stabilizing layer 11 and the second stabilizing layer 22 are made of hard materials. Specifically, the first stabilizing layer 11 is bonded to the upper surface of the upper ceramic substrate 10 to strengthen the upper ceramic substrate 10, and the second stabilizing layer 22 is bonded to the lower surface of the second stabilizing layer 22 to strengthen the lower ceramic substrate 20. Both the first stabilizing layer 11 and the second stabilizing layer 22 are made of hard materials, such as iron, copper, or other hard materials in the prior art that can play a role in strengthening the upper ceramic substrate 10 and the lower ceramic substrate 20, so as to prevent the upper ceramic substrate 10 and the lower ceramic substrate 20 from breaking when the induction card drops.

[0019] Furthermore, a first shock-absorbing layer 12 is provided on the upper surface of the first stabilizing layer 11, and a second shock-absorbing layer 23 is provided on the lower surface of the second stabilizing layer 22. Both the first shock-absorbing layer 12 and the second shock-absorbing layer 23 are made of flexible materials. Specifically, the first shock-absorbing layer 12 is bonded to the upper surface of the first stabilizing layer 11, and the second shock-absorbing layer 23 is bonded to the lower surface of the second stabilizing layer 22. Both the first shock-absorbing layer 12 and the second shock-absorbing layer 23 are made of flexible materials, such as plastics, rubbers, or other flexible materials in the prior art, etc., so as to reduce the vibration of the induction card when the induction card drops, prevent the upper ceramic substrate 10 and the lower ceramic substrate 20 from breaking, and also be able to isolate the direct contact between the upper ceramic substrate 10 or the lower ceramic substrate 20 and other objects, so as to prevent the upper surface of the upper ceramic substrate 10 or the lower surface of the lower ceramic substrate 20 from being scratched.

[0020] Furthermore, a protrusion 13 is provided on the lower surface of the upper ceramic substrate 10, and a limiting groove 24 is recessed on the upper surface of the lower ceramic substrate 20. The limiting groove 24 is used to place glue and for the protrusion 13 to be embedded, so as to bond the upper ceramic substrate 10 and the lower ceramic substrate 20 together, making the manufacturing of the induction card of the present invention simple, and using the protrusion 13 and the limiting groove 24 for positioning can make the upper ceramic substrate 10 and the lower ceramic substrate 20 aligned and not easily misaligned; specifically, the data of the protrusion 13 and the limiting groove 24 are set according to actual needs and are not limited herein.

[0021] To further illustrate the embodiments, the present invention provides drawings. These drawings are part of the disclosure of the present invention, which are mainly used to illustrate the embodiments and can be combined with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those of ordinary skill in the art should be able to understand other possible implementation manners and the advantages of the present invention. The components in the drawings are not drawn to scale, and similar component symbols are usually used to represent similar components.

[0022] At the same time, the front, rear, left, right, etc. directions involved in this embodiment are only for reference of a direction and do not represent the directions in actual use. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0023] The above are only the preferred embodiments of the present invention and do not limit the design of this case. All equivalent changes made according to the key design of this case fall within the protection scope of this case.

Claims

1. A ceramic induction card, characterized in that: It includes an upper ceramic substrate, a lower ceramic substrate and a flexible PCB board; the upper surface of the lower ceramic substrate is concavely provided with a PCB board groove, and the lower surface of the upper ceramic substrate is bonded to the upper surface of the lower ceramic substrate to close the PCB board groove; the flexible PCB board is annular, and the flexible PCB board is embedded in the PCB board groove, and an induction line is printed on the flexible PCB board, and the induction line surrounds the flexible PCB board to form an annular induction coil.

2. A ceramic induction card as claimed in claim 1, characterized in that: A first stabilizing layer is disposed on the upper surface of the upper ceramic substrate, and a second stabilizing layer is disposed on the lower surface of the lower ceramic substrate. Both the first stabilizing layer and the second stabilizing layer are made of hard materials.

3. A ceramic induction card as claimed in claim 2, characterized in that: A first shock-absorbing layer is arranged on the upper surface of the first stabilizing layer, and a second shock-absorbing layer is arranged on the lower surface of the second stabilizing layer. Both the first shock-absorbing layer and the second shock-absorbing layer are made of flexible materials.

4. A ceramic induction card as claimed in claim 1, characterized in that: The lower surface of the upper ceramic substrate is provided with a protrusion, and the upper surface of the lower ceramic substrate is concave with a limiting groove, the limiting groove is used to put glue and for the protrusion to be embedded, so as to bond the upper ceramic substrate and the lower ceramic substrate together.

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