Ceramic identification card
By using an annular induction coil and a flexible PCB board in the ceramic identification card, the problem of easy movement of the induction coil and induction wire is solved, and the stable induction effect of the identification card and long-term use are achieved.
Patent Information
- Application Number
- CN202421561738.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-03
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-07-03
AI Technical Summary
The induction coil in the existing identification card is easy to move, causing the leads and chip to break, which makes the identification card unusable, and the induction wire is easily displaced, resulting in the gradual weakening of the induction effect of the identification card.
The ceramic identification card design is adopted, which includes the upper ceramic substrate, the lower ceramic substrate, the chip and the flexible PCB board. The induction line surrounds the flexible PCB board to form an annular induction coil, which limits the movement of the induction coil and the flexible PCB board and prevents the displacement of the induction line.
It effectively prevents the movement of the induction coil and the induction wire, avoids the weakening of the induction effect of the identification card, and ensures the stable use of the identification card.
Smart Images
Figure CN222927053U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of identification cards, and particularly relates to a ceramic identification card. Background Art
[0002] In current identification cards, the induction wire is a copper wire, and the induction coil is composed of multiple annular induction wires stacked together and is connected to the chip through a lead wire. However, for the identification card formed in this way, the induction coil will move inside the identification card, and there is a risk that the lead wire and the chip will break due to the movement of the induction coil, resulting in the inoperability of the identification card. Moreover, the induction wire is also prone to movement, which will cause the induction effect of the identification card to gradually weaken. Summary of the Utility Model
[0003] The purpose of the utility model is to provide a ceramic identification card, which overcomes the above defects and can prevent the displacement of the induction wire, thereby preventing the weakening of the induction effect of the identification card.
[0004] To achieve the above purpose, the solution of the utility model is as follows:
[0005] A ceramic identification card includes an upper ceramic substrate, a lower ceramic substrate, a chip, and a flexible PCB board; an induction window penetrating the upper ceramic substrate is provided on the upper ceramic substrate; a PCB board groove, a chip positioning groove, and two lead wire grooves are provided on the upper surface of the lower ceramic substrate; the chip entirely covers the chip positioning groove. When the lower surface of the upper ceramic substrate and the upper surface of the lower ceramic substrate are bonded together, the chip is embedded in the induction window and is exposed to the outside through the induction window; the flexible PCB board is embedded in the PCB board groove, and an induction wire is printed on the flexible PCB board. The induction wire forms a ring-shaped induction coil around the flexible PCB board. The induction coil surrounds the chip. The induction coil has a head and a tail. Its head is located inside the induction coil. The head of the induction coil extends along a lead wire groove and is connected to the chip. The tail of the induction coil is located outside the induction coil. Its tail crosses from the bottom of the flexible PCB board to the inside of the induction coil and extends along the other lead wire groove and is connected to the chip.
[0006] Further, in the PCB board groove, a jump wire groove is recessed downward at the position where the tail of the induction coil crosses the flexible PCB board for the part where the tail of the induction coil crosses the flexible PCB board to be placed.
[0007] Further, a first lead wire, a second lead wire, and a jumper are further provided on the flexible PCB board. The head of the induction coil is connected to the first lead wire and is connected to the chip through the first lead wire, and the first lead wire is placed in a lead wire groove. The tail of the induction coil crosses from the bottom of the flexible PCB board to its inside through the jumper. The other end of the jumper is connected to the second lead wire. The induction coil is connected to the chip through the jumper and the second lead wire. The jumper is placed in the jump wire groove, and the second lead wire is placed in the other lead wire groove.
[0008] Furthermore, the two lead slots are respectively communicated with the chip positioning slot. When the chip covers the chip positioning slot, the first lead and the second lead respectively extend into the chip positioning slot from the communication parts of the two lead slots with the chip positioning slot, and are connected to both sides of the bottom of the chip.
[0009] Furthermore, the depth of the chip positioning slot is greater than that of the two lead slots.
[0010] Furthermore, the area of the chip is greater than that of the chip positioning slot, and the bottom of the chip has a positioning part which is placed in the chip positioning slot.
[0011] Furthermore, the positioning part is composed of filling glue bulged from the bottom of the chip.
[0012] Furthermore, the thickness of the chip is the same as that of the upper ceramic substrate, so that when the chip is embedded in the induction window, it is flush with the upper surface of the upper ceramic substrate.
[0013] Furthermore, pattern layers are arranged on the upper surface of the upper ceramic substrate and the lower surface of the lower ceramic substrate.
[0014] After adopting the above scheme, the beneficial effects of the utility model are as follows:
[0015] The utility model embeds the flexible PCB board into the PCB board groove, and the induction line is printed on the flexible PCB board. The induction line surrounds along the flexible PCB board to form a ring-shaped induction coil, which restricts the movement of the flexible PCB board in the identification card, thereby restricting the movement of the induction coil in the identification card, preventing the situation that the induction coil moves and breaks with the chip, and the induction coil is formed by the induction line surrounding along the flexible PCB board, preventing the displacement of the induction line and avoiding the weakening of the induction effect of the identification card. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 is the exploded view of the overall structure of the utility model;
[0017] Figure 2 is Figure 1 the enlarged view of part A;
[0018] Figure 3 is the schematic diagram of the overall structure of the utility model;
[0019] Figure 4 is the schematic diagram of the internal structure of the lower ceramic substrate of the utility model;
[0020] Figure 5 is the side view of the chip.
[0021] Label description:
[0022] 10. Upper ceramic substrate; 11. Induction window; 20. Lower ceramic substrate; 21. PCB board groove; 22. Jumping wire groove; 23. Chip positioning groove; 24. Lead wire groove; 30. Chip; 31. Positioning part; 40. Flexible PCB board; 41. Induction coil; 411. Induction wire; 42. First lead wire; 43. Second lead wire; 44. Jumper wire. Detailed implementation manner
[0023] The present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.
[0024] As Figures 1 to 5 shown, the present utility model provides a ceramic identification card, which includes an upper ceramic substrate 10, a lower ceramic substrate 20, a chip 30, and a flexible PCB board 40;
[0025] Among them, an induction window 11 penetrating through the upper ceramic substrate 10 is provided on the upper ceramic substrate 10; a PCB board groove 21, a chip positioning groove 23, and two lead wire grooves 24 are provided on the upper surface of the lower ceramic substrate 20; the whole chip 30 covers the chip positioning groove 23, and when the lower surface of the upper ceramic substrate 10 and the upper surface of the lower ceramic substrate 20 are bonded together, the chip 30 is embedded in the induction window 11 and is exposed to the outside through the induction window 11; the flexible PCB board 40 is embedded in the PCB board groove 21, and induction wires 411 are printed on the flexible PCB board 40, and the induction wires 411 are wound along the flexible PCB board 40 to form a ring-shaped induction coil 41. The induction coil 41 surrounds the chip 30. The induction coil 41 has a head and a tail. Its head is located inside the induction coil 41. The head of the induction coil 41 extends along a lead wire groove 24 and is connected to the chip 30. The tail of the induction coil 41 is located outside the induction coil 41. Its tail crosses from the bottom of the flexible PCB board 40 to the inside of the induction coil 41 and extends along the other lead wire groove 24 and is connected to the chip 30;
[0026] Specifically, in the present utility model, the flexible PCB board 40 is embedded in the PCB board groove 21, and induction wires 411 are printed on the flexible PCB board 40. The induction wires 411 are wound along the flexible PCB board 40 to form a ring-shaped induction coil 41, which limits the movement of the flexible PCB board 40 in the identification card and prevents the situation that the induction coil 41 moves and breaks with the chip 30. And the induction coil 41 is formed by winding the induction wires along the flexible PCB board 40, which prevents the displacement of the induction wires 411 and avoids the weakening of the induction effect of the identification card.
[0027] Further, in the groove 21 of the PCB board, a jumper groove 22 is recessed downward at a position across the flexible PCB board 40 at the tail of the induction coil 41 for the part of the tail of the induction coil 41 that crosses the flexible PCB board 40 to be placed therein. The part of the tail of the induction coil 41 that crosses the flexible PCB board 40 is placed in the jumper groove 22 to prevent the flexible PCB board 40 from being lifted, thereby avoiding unevenness of the flexible PCB board 40 in the groove 21 of the PCB board;
[0028] In a specific embodiment, a first lead 42, a second lead 43 and a jumper 44 are further provided on the flexible PCB board 40. The head of the induction coil 41 is connected to the first lead 42 and connected to the chip 30 through the first lead 42, and the first lead 42 is placed in a lead groove 24. The tail of the induction coil 41 crosses from the bottom of the flexible PCB board 40 to the inner side through the jumper 44. The other end of the jumper 44 is connected to the second lead 43. The induction coil 41 is connected to the chip 30 through the jumper 44 and the second lead 43. The jumper 44 is placed in the jumper groove 22, and the second lead 43 is placed in another lead groove 24. It can be understood that the jumper 44 is placed in the jumper groove 22 to prevent the flexible PCB board 40 from being lifted. It can be understood that the jumper groove 22 can be provided with an inclined wedge transition surface at the position where the jumper 44 is connected to the second lead 43 to avoid the upward bending of the end of the jumper 44 connected to the second lead 43 and prevent breakage;
[0029] Specifically, the two lead grooves 24 are respectively communicated with the chip positioning groove 23. When the chip 30 covers the chip positioning groove 23, the first lead 42 and the second lead 43 respectively extend into the chip positioning groove 23 from the communication parts of the two lead grooves 24 and the chip positioning groove 23 and are connected to the bottom of the chip 30. The area of the bottom of the chip 30 is larger than that of the side wall of the chip 30. Therefore, the contact area between the first lead 42 and the second lead 43 and the bottom of the chip 30 is larger, making the connection between the first lead 42 and the second lead 43 and the chip 30 more firm; Specifically, the depth of the chip positioning groove 23 is greater than the depth of the two lead grooves 24.
[0030] Further, the area of the chip 30 is larger than the area of the chip positioning groove 23 so that the chip 30 covers the chip positioning groove 23, making the chip 30 protrude from the upper surface of the upper ceramic substrate 10. The bottom of the chip 30 has a positioning portion 31, and the positioning portion 31 is placed in the chip positioning groove 23, which helps the accurate positioning during the installation of the chip 30. And the positioning portion 31 is placed in the chip positioning groove 23, and the positioning movement is restricted by the chip positioning groove 23, thereby restricting the movement of the chip 30; Specifically, the positioning portion 31 is composed of a filling glue bulging from the bottom of the chip 30. The filling glue can improve the strength of the chip 30 and can also dissipate heat from the chip 30.
[0031] Furthermore, the thickness of the chip 30 is the same as that of the upper ceramic substrate 10, and the chip 30 covers the chip positioning groove 23 and protrudes from the upper surface of the upper ceramic substrate 10, so that when the chip 30 is embedded in the induction window 11, the upper surfaces of the chip 30 and the upper ceramic substrate 10 are flush.
[0032] Furthermore, pattern layers are provided on the upper surface of the upper ceramic substrate 10 and the lower surface of the lower ceramic substrate 20 to enhance the overall aesthetics of the identification card.
[0033] To further illustrate the embodiments, the present invention provides drawings. These drawings are a part of the disclosure of the present invention, which are mainly used to illustrate the embodiments and can be used to explain the operating principle of the embodiments in conjunction with the relevant descriptions in the specification. With reference to these contents, those of ordinary skill in the art should be able to understand other possible implementation manners and the advantages of the present invention. The components in the drawings are not drawn to scale, and similar component symbols are usually used to represent similar components.
[0034] At the same time, the front, rear, left, right and other orientations involved in this embodiment are only for reference of an orientation and do not represent the orientation in actual use. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0035] The above are only the preferred embodiments of the present utility model and do not limit the design of this case. Any equivalent changes made according to the key design of this case fall within the protection scope of this case.
Claims
1. A ceramic identification card, characterized in that: It includes an upper ceramic substrate, a lower ceramic substrate, a chip and a flexible PCB board; The upper ceramic substrate is provided with a sensing window penetrating the upper ceramic substrate; The upper surface of the lower ceramic substrate is provided with a PCB groove, a chip positioning groove and two lead grooves; The chip is entirely covered on the chip positioning groove, and when the lower surface of the upper ceramic substrate and the upper surface of the lower ceramic substrate are bonded together, the chip is embedded in the sensing window and exposed to the outside through the sensing window; The flexible PCB is embedded in the groove of the PCB, and an induction line is printed on the flexible PCB. The induction line surrounds the flexible PCB to form an annular induction coil. The induction coil surrounds the chip. The induction coil has a head and a tail. The head is located inside the induction coil. The head of the induction coil extends along a lead groove and is connected to the chip. The tail of the induction coil is located outside the induction coil. The tail spans from the bottom of the flexible PCB to the inside of the induction coil, and extends along another lead groove and is connected to the chip.
2. A ceramic identification card as claimed in claim 1, characterized in that: In the groove of the PCB board, a jumper groove is recessed downward at the position where the tail of the induction coil crosses the flexible PCB board, so that the part of the tail of the induction coil that crosses the flexible PCB board can be placed.
3. A ceramic identification card as claimed in claim 2, characterized in that: The flexible PCB board is also provided with a first lead, a second lead and a jumper. The head of the induction coil is connected to the first lead, which is connected to the chip through the first lead, and the first lead is placed in a lead groove. The tail of the induction coil spans from the bottom of the flexible PCB board to the inside thereof through the jumper. The other end of the jumper is connected to the second lead. The induction coil is connected to the chip through the jumper and the second lead. The jumper is placed in the jumper groove, and the second lead is placed in another lead groove.
4. A ceramic identification card as claimed in claim 3, characterized in that: The two lead grooves are connected to the chip positioning groove respectively. When the chip covers the chip positioning groove, the first lead and the second lead extend into the chip positioning groove from the connection between the two lead grooves and the chip positioning groove respectively, and are connected to the bottom sides of the chip.
5. A ceramic identification card as claimed in claim 4, characterized in that: The depth of the chip positioning groove is greater than the depth of the two lead grooves.
6. A ceramic identification card as claimed in claim 1, characterized in that: The area of the chip is larger than the area of the chip positioning groove. The bottom of the chip is provided with a positioning portion, which is placed in the chip positioning groove.
7. A ceramic identification card as claimed in claim 6, characterized in that: The positioning portion is formed by a filling glue bulging from the bottom of the chip.
8. A ceramic identification card as claimed in claim 1, characterized in that: The thickness of the chip is the same as that of the upper ceramic substrate, so that when the chip is embedded in the sensing window, it is flush with the upper surface of the upper ceramic substrate.
9. A ceramic identification card as claimed in claim 1, characterized in that: The upper surface of the upper ceramic substrate and the lower surface of the lower ceramic substrate are both provided with a pattern layer.