Infrared detector

Abstract

The utility model relates to the field of semiconductor packaging, in particular to an infrared detector, which comprises a ceramic tube shell and an infrared detection chip, the ceramic tube shell comprises a tube shell body and a plurality of conductive units arranged on the tube shell body, and each conductive unit comprises a conductive contact point, a conductive buried wire and an outer side electric connecting piece; the conductive contact point is electrically connected with the outer side electric connecting piece through a conductive buried wire; and the chip salient points of the infrared detection chip are fixedly connected with the corresponding conductive contact points. According to the utility model, the size of the infrared detector can be fully reduced, and the production efficiency and the product yield are improved. According to the utility model, the conductive contact points are directly and vertically connected with the chip salient points of the infrared detection chip, a lead bonding process in the horizontal direction in the related technology is replaced, and electric signals of the chip are directly conducted to the outside of the infrared detector through the conductive buried wires in the tube shell body, so that the size of the infrared detector can be fully reduced; the production cost is reduced, and the production efficiency and yield are improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor packaging, in particular to an infrared detector. Background Art

[0002] At present, infrared detectors are widely used in many fields, and their application scope may be further expanded in the future, such as in-vehicle night vision, medical care, energy, security and other fields.

[0003] At present, the vacuum packaging of infrared detectors is a relatively difficult packaging method. With the advancement of material science and technology and the continuous expansion of application scenarios, the vacuum packaging of infrared detectors may develop in the direction of smaller size and higher integration in the future. However, as the size of packaged devices decreases, the current packaging method of wire bonding chip interconnection will lead to a decrease in production speed and finished product yield, which has become an obstacle to the miniaturization of infrared detector packaging devices.

[0004] Therefore, how to further achieve the miniaturization of infrared detector packaging while ensuring high production efficiency and high yield rate is an urgent problem to be solved by technical personnel in this field. Utility Model Content

[0005] The utility model aims to provide an infrared detector, which is used to further realize the miniaturization of the infrared detector package while ensuring higher production efficiency and higher yield rate.

[0006] In order to solve the above technical problems, the utility model provides an infrared detector, including a ceramic tube shell and an infrared detection chip;

[0007] The ceramic tube shell comprises a tube shell body and a plurality of conductive units arranged on the tube shell body, wherein the conductive units comprise conductive contact points, conductive buried wires and external electrical connectors;

[0008] The conductive contact point is electrically connected to the outer electrical connector via a conductive buried wire;

[0009] The chip bumps of the infrared detection chip are fixedly connected to the corresponding conductive contact points.

[0010] Optionally, in the infrared detector, the conductive contact point is located at the bottom of the groove of the tube shell body, and a plurality of conductive contact points form an array;

[0011] The outer electrical connector is disposed on the outer side of the tube shell body and is used for electrically connecting to an external circuit;

[0012] The conductive buried wire passes through the tube shell body to electrically connect the conductive contact point with the corresponding external electrical connector.

[0013] Optionally, the infrared detector further includes a light window, which cooperates with the ceramic tube shell to form a closed chamber.

[0014] Optionally, in the infrared detector, a getter is further included, and the bottom of the groove of the tube shell body further includes a protruding table surface;

[0015] The protruding table surface does not overlap with the setting position of the infrared detection chip, and the getter is set on the protruding table surface.

[0016] Optionally, in the infrared detector, the getter is a metal sheet-like thin film getter or a sintered block getter.

[0017] Optionally, in the infrared detector, the protruding surface is a metal block.

[0018] Optionally, in the infrared detector, the getter further comprises a getter film arranged on the light emitting surface inside the light window.

[0019] Optionally, in the infrared detector, the light incident surface outside the light window is covered with an anti-reflection and anti-transmission film.

[0020] Optionally, in the infrared detector, the ceramic tube shell is a pin-type tube shell.

[0021] Optionally, in the infrared detector, the ceramic tube shell is a pinless tube shell.

[0022] Optionally, in the infrared detector, the ceramic tube shell is a ball grid array tube shell.

[0023] Optionally, in the infrared detector, a groove is provided on the top of the ceramic tube shell, and a solder area is provided at the position of the groove;

[0024] The light window is welded to the top of the groove of the ceramic tube shell through the solder area.

[0025] Optionally, in the infrared detector, each of the conductive contact points is electrically connected to a unique corresponding external electrical connector through the conductive buried wire.

[0026] Optionally, in the infrared detector, a single outer electrical connector is electrically connected to a plurality of the conductive contact points via the conductive buried wire.

[0027] The infrared detector provided by the utility model includes a ceramic tube shell and an infrared detection chip; the ceramic tube shell includes a tube shell body, and a plurality of conductive units arranged in the tube shell body, the conductive units include conductive contact points, conductive buried wires and outer electrical connectors; the conductive contact points are electrically connected to the outer electrical connectors through conductive buried wires; the chip bumps of the infrared detection chip are fixedly connected to the corresponding conductive contact points. The utility model directly interconnects the chip bumps of the infrared detection chip vertically through conductive contact points, replacing the horizontal wire bonding process in the related art, and then directly conducts the electrical signals of the chip to the outside of the infrared detector through the conductive buried wires in the tube shell body, which can fully reduce the size of the infrared detector, while reducing production costs, and improving production efficiency and product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 A schematic diagram of a top view of a specific implementation of the infrared detector provided by the utility model;

[0030] Figure 2 A partial schematic diagram of a specific implementation of the infrared detector provided by the utility model;

[0031] Figure 3 A partial schematic diagram of a specific implementation of the infrared detector provided by the utility model;

[0032] Figure 4 A schematic cross-sectional structure diagram of another specific implementation of the infrared detector provided by the utility model;

[0033] Figure 5 A schematic cross-sectional structure diagram of another specific implementation of the infrared detector provided by the utility model;

[0034] Figure 6 A schematic cross-sectional structure diagram of another specific implementation of the infrared detector provided by the utility model;

[0035] Figure 7 The present invention is a top view schematic diagram of another specific implementation of the infrared detector provided by the utility model.

[0036] In the figure, it includes 10-ceramic tube shell, 11-conductive contact point, 12-outer electrical connector, 13-protruding table, 14-solder area, 15-tube shell body, 20-infrared detection chip, 21-chip bump, 30-getter, 31-getter film, 40-light window, 50-closed chamber. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0038] The core of the utility model is to provide an infrared detector, a structural schematic diagram of a specific implementation method is shown in FIG. Figures 1 to 6 As shown, it is called the specific implementation mode 1, including a ceramic tube shell 10 and an infrared detection chip 20;

[0039] The ceramic tube shell 10 includes a tube shell body 15 and a plurality of conductive units disposed on the tube shell body 15, wherein the conductive units include conductive contact points 11, conductive buried wires and external electrical connectors 12;

[0040] The conductive contact point 11 is electrically connected to the outer electrical connector 12 via a conductive buried wire;

[0041] The chip bumps 21 of the infrared detection chip 20 are fixedly connected to the corresponding conductive contact points 11 .

[0042] From the above description, it can be seen that the conductive buried wire in the utility model is buried inside the tube shell body 15, and the conductive contact point 11 arranged on the inner side of the tube shell body 15 is electrically connected with the outer electrical connector 12 arranged on the outer side of the tube shell body 15, so that the infrared detection chip 20 arranged on the inner side of the tube shell body 15 can directly use the ceramic tube shell 10 to perform electrical connection with the external circuit with lower setting difficulty.

[0043] Preferably, the conductive contact point 11 is located at the bottom of the groove of the tube shell body 15, and a plurality of conductive contact points 11 form an array;

[0044] The outer electrical connector 12 is disposed on the outer side of the tube shell body 15 and is used for electrically connecting to an external circuit;

[0045] The conductive buried wire passes through the tube shell body 15 to electrically connect the conductive contact point 11 with the corresponding external electrical connector 12 .

[0046] The tube shell body 15 is provided with a groove for accommodating the infrared detection chip 20, which can further improve the working stability of the chip, adapt to more usage scenarios, and improve the versatility of the utility model.

[0047] In addition, a light window 40 is included, and the light window 40 cooperates with the ceramic tube shell 10 to form a closed chamber 50. The closed chamber 50 can provide more comprehensive protection for the infrared detection chip 20, further eliminate external interference, and improve the working stability and reliability of the chip.

[0048] The infrared detector provided by the utility model includes a ceramic tube shell 10 and an infrared detection chip 20; the ceramic tube shell 10 includes a tube shell body 15, and a plurality of conductive units arranged in the tube shell body 15, the conductive units include conductive contact points 11, conductive buried wires and outer electrical connectors 12; the conductive contact points 11 are electrically connected to the outer electrical connectors 12 through conductive buried wires; the chip bumps 21 of the infrared detection chip 20 are fixedly connected to the corresponding conductive contact points 11. The utility model directly interconnects the chip bumps 21 of the infrared detection chip 20 vertically through the conductive contact points 11, replacing the horizontal wire bonding process in the related art, and then directly conducts the electrical signals of the chip to the outside of the infrared detector through the conductive buried wires in the tube shell body 15, which can fully reduce the size of the infrared detector, while reducing production costs, and improving production efficiency and product yield.

[0049] On the basis of the specific implementation mode 1, further combined with the above-mentioned improvement scheme, a specific implementation mode 2 can be obtained. Please also refer to Figures 1 to 6 , including a ceramic tube shell 10, an infrared detection chip 20 and a light window 40;

[0050] The light window 40 cooperates with the ceramic tube shell 10 to form a closed chamber 50;

[0051] The ceramic tube shell 10 includes a tube shell body 15 and a plurality of conductive units disposed on the tube shell body 15, wherein the conductive units include conductive contact points 11, conductive buried wires and external electrical connectors 12;

[0052] The conductive contact point 11 is located at the bottom of the groove of the tube shell body 15, and a plurality of conductive contact points 11 form an array;

[0053] The outer electrical connector 12 is disposed on the outer side of the tube shell body 15 and is used for electrically connecting to an external circuit;

[0054] The conductive buried wire passes through the tube shell body 15 to electrically connect the conductive contact point 11 with the corresponding external electrical connector 12;

[0055] The chip bumps 21 of the infrared detection chip 20 are fixedly connected to the corresponding conductive contact points 11 .

[0056] Of course, the light window 40 is an infrared radiation transmission plate, and external infrared radiation is emitted into the closed chamber 50 through the light window 40 and is received by the infrared detection chip 20 located at the bottom of the closed chamber 50, that is, at the bottom of the groove.

[0057] The chip bumps 21 of the infrared detection chip 20 are aligned one by one with the conductive contact points 11, and the bump solder is melted and connected under certain pressure and temperature conditions. The infrared detection chip 20 is connected to the output pins of the ceramic tube shell 10 through the internal wiring of the ceramic tube shell 10 (that is, the conductive buried wire).

[0058] The getter 30 further includes a getter film 31 disposed on the light-emitting surface of the inner side of the light window 40. In this specific embodiment, the getter 30 can be in the form of a getter film 31, which exists on the inner side of the light window 40, absorbs the gas in the closed chamber 50, and realizes vacuum packaging. Of course, the getter 30 can also be disposed elsewhere in the closed chamber 50 in other forms, which is not limited in the present invention.

[0059] Of course, the inner side of the light window 40 refers to a side surface of the light window 40 in the closed chamber 50 .

[0060] Furthermore, the light incident surface outside the light window 40 is covered with an anti-reflection film. The anti-reflection film is arranged inside and outside the light window 40. The anti-reflection film can be a coating prepared by physical vapor deposition, or a structural layer that can achieve anti-reflection effect can be arranged on the surface of the light window 40 by a semiconductor microstructure preparation process. The anti-reflection film can make more infrared radiation incident on the closed chamber 50 and received by the infrared detection chip 20, thereby improving the infrared detection efficiency.

[0061] Figure 1 The top view of the infrared detector provided by the utility model, wherein the location of the chip bump 21 which is partially blocked is outlined by a dotted line. Figure 2 is a schematic diagram of the back side of the infrared detection chip 20, Figure 3 It is a partial enlarged schematic diagram of the connection between the chip bump 21 and the conductive contact point 11. Since the conductive buried wire is buried in the ceramic tube shell 10, it is not drawn in the figure.

[0062] As a specific implementation, the ceramic tube shell 10 is a pin-type tube shell. Figure 4 The outer electrical connector 12 of the pin-type shell is a pin.

[0063] As a specific implementation, the ceramic tube shell 10 is a leadless tube shell. Figure 5 The outer electrical connector 12 of the pin-type housing is a LCC (Leadless Chip Carrier) pad.

[0064] As a specific implementation, the ceramic tube shell 10 is a ball grid array tube shell. Figure 6 The outer electrical connector 12 of the pin-type tube shell is a BGA (Ball Grid Array) pad.

[0065] The three types of tube shells listed above greatly improve the applicable scenarios of the infrared detector provided by the utility model and enhance its versatility.

[0066] Furthermore, a groove is provided on the top of the ceramic tube shell 10, and a soldering area 14 is provided at the position of the groove;

[0067] The light window 40 is soldered to the top of the groove of the ceramic tube shell 10 through the solder area 14 .

[0068] That is, the light window 40 is soldered to the solder area 14 of the ceramic tube shell 10 by soldering, which greatly improves the bonding tightness between the two, and at the same time ensures the sealing of the closed chamber 50, thereby improving the working stability of the packaged device.

[0069] As a specific implementation, each of the conductive contact points 11 is electrically connected to a unique corresponding outer electrical connector 12 via the conductive buried wire.

[0070] In this specific embodiment, the conductive contact points 11 correspond one-to-one with the outer electrical connectors 12, which facilitates the chip bumps 21 of the infrared detection chip 20 to be led out separately, realizes the expansion of the connection method of the infrared detection chip through the outer electrical connectors 12, reduces the process difficulty of the chip installation process, and facilitates the installation of the chip.

[0071] As a specific implementation, the single outer electrical connector 12 is electrically connected to the plurality of conductive contact points 11 through the conductive buried wires.

[0072] In this specific embodiment, there are multiple conductive contact points 11 connected to the same outer connector through the conductive buried wire. In actual production, it is often necessary to connect different pins of the infrared detection chip 20 to the same position of the external circuit (such as multiple pins grounded). Therefore, the use of this specific embodiment can greatly simplify the complexity of connecting the infrared detector to the external circuit and further reduce the difficulty of installation. The connection method of multiple conductive contact points 11 and a single outer electrical connector 12 can be through multiple conductive buried wires, or multiple conductive contact points 11 can be electrically connected on the groove surface of the shell body 15, and then led to the corresponding outer electrical connector 12 through a single conductive buried wire. The utility model is not limited here.

[0073] It should be noted that, in this specific embodiment, only some of the outer electrical connectors 12 may correspond to the plurality of conductive contact points 11, or all of the outer electrical connectors 12 may correspond to the plurality of conductive contact points 11, and the present invention is not limited thereto.

[0074] Of course, according to actual conditions, a single conductive contact point 11 may be connected to a plurality of outer electrical connectors 12 , and the present invention does not limit this.

[0075] The infrared detector provided by the utility model includes a ceramic tube shell 10, an infrared detection chip 20 and a light window 40; the light window 40 cooperates with the ceramic tube shell 10 to form a closed chamber 50; the ceramic tube shell 10 includes a tube shell body 15, and a plurality of conductive units arranged on the tube shell body 15, the conductive units include conductive contact points 11, conductive buried wires and external electrical connectors 12; the conductive contact points 11 are located at the bottom of the groove of the tube shell body 15, and the array is composed of a plurality of conductive contact points 11; the external electrical connector 12 is arranged on the outside of the tube shell body 15 for electrically connecting to an external circuit; the conductive buried wire passes through the tube shell body 15 to electrically connect the conductive contact points 11 with the corresponding external electrical connectors 12; the chip bumps 21 of the infrared detection chip 20 are fixedly connected to the corresponding conductive contact points 11. The utility model directly interconnects vertically with the chip bumps 21 of the infrared detection chip 20 through the conductive contact points 11, replacing the horizontal wire bonding process in the related art, and then transmits the electrical signals of the chip directly to the outside of the infrared detector through the conductive buried wires in the tube shell body 15, which can fully reduce the size of the infrared detector, while reducing production costs and improving production efficiency and product yield.

[0076] On the basis of the second specific implementation mode, the configuration of the getter 30 is further improved to obtain a third specific implementation mode, the corresponding structural diagram of which is as follows: Figure 7As shown, it includes a ceramic tube shell 10, an infrared detection chip 20 and a light window 40;

[0077] The light window 40 cooperates with the ceramic tube shell 10 to form a closed chamber 50;

[0078] The ceramic tube shell 10 includes a tube shell body 15 and a plurality of conductive units disposed on the tube shell body 15, wherein the conductive units include conductive contact points 11, conductive buried wires and external electrical connectors 12;

[0079] The conductive contact point 11 is located at the bottom of the groove of the tube shell body 15, and a plurality of conductive contact points 11 form an array;

[0080] The outer electrical connector 12 is disposed on the outer side of the tube shell body 15 and is used for electrically connecting to an external circuit;

[0081] The conductive buried wire passes through the tube shell body 15 to electrically connect the conductive contact point 11 with the corresponding external electrical connector 12;

[0082] The chip bumps 21 of the infrared detection chip 20 are fixedly connected to the corresponding conductive contact points 11;

[0083] It also includes a getter 30, and the bottom of the groove of the tube shell body 15 also includes a protruding table 13;

[0084] The protruding table 13 does not overlap with the location where the infrared detection chip 20 is disposed, and the getter 30 is disposed on the protruding table.

[0085] The difference between this embodiment and the above embodiment is that the protruding table 13 is additionally provided in this embodiment, and the rest of the structures are the same as those in the above embodiment, which will not be described in detail here.

[0086] In this specific embodiment, a protruding table 13 is provided for placing the getter 30, and the protruding table 13 does not overlap with the setting position of the infrared detection chip 20, so that a certain distance is maintained between the getter 30 and the infrared detection chip 20 to prevent the high temperature generated by the getter 30 during the activation process from affecting the chip.

[0087] The getter 30 is a metal sheet-shaped film getter 30 or a sintered block getter 30. The above two getters 30 can be fixed on the protruding table 13, work stably, and have low cost.

[0088] Figure 7 The getter 30 is disposed on the protruding surface 13 and overlaps with the protruding surface 13 .

[0089] Furthermore, the protruding platform 13 is a metal block. The metal block has good thermal conductivity and can quickly conduct away the heat emitted by the getter 30 when it takes effect, further reducing the impact of heat generation on the infrared detection chip 20.

[0090] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0091] It should be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0092] The infrared detector provided by the utility model is introduced in detail above. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiment is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. An infrared detector, characterized in that: It comprises a ceramic tube shell (10) and an infrared detection chip (20); The ceramic tube shell (10) comprises a tube shell body (15) and a plurality of conductive units arranged on the tube shell body (15), wherein the conductive units comprise conductive contact points (11), conductive buried wires and external electrical connectors (12); The conductive contact point (11) is electrically connected to the outer electrical connection piece (12) via a conductive buried wire; The chip bumps (21) of the infrared detection chip (20) are fixedly connected to the corresponding conductive contact points (11).

2. The infrared detector according to claim 1, characterized in that: The conductive contact point (11) is located at the bottom of the groove of the tube shell body (15), and a plurality of conductive contact points (11) form an array; The outer electrical connector (12) is arranged on the outer side of the tube shell body (15) and is used for electrically connecting to an external circuit; The conductive buried wire passes through the tube shell body (15) to electrically connect the conductive contact point (11) with the corresponding external electrical connector (12).

3. The infrared detector according to claim 1, characterized in that: It also comprises a light window (40), wherein the light window (40) cooperates with the ceramic tube shell (10) to form a closed chamber (50).

4. The infrared detector according to claim 1, characterized in that: It also includes a getter (30), and the bottom of the groove of the tube shell body (15) also includes a protruding table (13); The protruding surface (13) does not overlap with the location where the infrared detection chip (20) is arranged, and the getter (30) is arranged on the protruding surface.

5. The infrared detector according to claim 4, characterized in that: The getter (30) is a metal sheet-shaped thin film getter (30) or a sintered block getter (30); and the protruding table surface (13) is a metal block.

6. The infrared detector according to claim 4, characterized in that: The getter (30) further comprises a getter film (31) arranged on the inner light-emitting surface of the light window (40); and the outer light-incident surface of the light window (40) is covered with an anti-reflection and anti-transmission film.

7. The infrared detector according to claim 1, characterized in that: The ceramic tube shell (10) is a pin-type tube shell, a pinless tube shell, or a ball grid array tube shell.

8. The infrared detector according to any one of claims 1 to 7, characterized in that: The top of the ceramic tube shell (10) is provided with a groove, and a soldering area (14) is provided at the position of the groove; The light window (40) is welded to the top of the groove of the ceramic tube shell (10) through the solder area (14).

9. The infrared detector according to any one of claims 1 to 7, characterized in that: Each of the conductive contact points (11) is electrically connected to a unique corresponding outer electrical connection piece (12) via the conductive buried wire.

10. The infrared detector according to any one of claims 1 to 7, characterized in that: The single outer electrical connector (12) is electrically connected to the plurality of conductive contact points (11) via the conductive buried wires.

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